Substrate bearing assembly
By providing a non-adhesive area and an independent isolation portion in the substrate carrier assembly, the problem of residual film cutting is solved, ensuring that the central area of the substrate is not affected, and achieving smooth process progress.
Patent Information
- Application Number
- CN202422380784.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-09-29
AI Technical Summary
In the semiconductor product manufacturing process, the residual adhesive layer generated during the film cutting process will adhere to the central area of the substrate, affecting subsequent processes.
A substrate supporting assembly is designed, including a rubber strip with a non-adhesive area. By providing an independent isolation portion or a material-free area on the rubber strip, it is prevented that cutting residues contact the critical area of the substrate.
This effectively avoids the residue of the cut adhesive strips in specific areas of the substrate, ensuring the normal progress of subsequent processes.
Smart Images
Figure CN223427469U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor preparation, in particular to a substrate carrying component. Background Art
[0002] In the manufacturing process of semiconductor products, the substrate needs to be bonded to the film first. For some products, the central area of the substrate cannot have any residue, so the film needs to be kept away from these areas. The current practice is to first cut the film to form the corresponding shape and then bond it to the corresponding area of the substrate. However, the film will produce residue at the cutting edge during the cutting process, and the residual film will adhere to the central area of the substrate, thereby affecting subsequent processes. Utility Model Content
[0003] The present invention aims to solve at least one of the technical problems in the prior art. To this end, the present invention provides a substrate supporting assembly that can prevent cut residues of the adhesive strip from contacting the substrate.
[0004] According to the first embodiment of the present invention, the substrate supporting assembly includes:
[0005] The substrate comprises a first region and a second region disposed on at least one side of the first region.
[0006] a material frame, wherein the material frame has a through area;
[0007] a rubber strip, wherein a portion of the rubber strip is adhered to the material frame and another portion is exposed from the through-area, the exposed portion of the rubber strip is adhered to the second area, and the first area of the substrate is exposed from the through-area;
[0008] The side of the adhesive strip facing the substrate has a bonding area and a non-bonding area arranged in parallel, the non-bonding area is arranged closer to the first area than the bonding area, and the non-bonding area extends a set distance in a direction away from the substrate.
[0009] The substrate supporting assembly according to the first embodiment of the present invention has at least the following beneficial effects:
[0010] In this embodiment, the non-adhesive area is provided so that there is no adhesive layer in the area adjacent to the first area, thereby preventing the cut residue of the adhesive strip from contacting the first area.
[0011] In other embodiments of the present invention, the adhesive strip further includes a main body and an isolation portion connected to the main body, the main body having the bonding area on the side facing the substrate and in contact with the substrate, the isolation portion having the non-bonding area on the side facing the substrate and in contact with the substrate, and the main body and the isolation portion are configured as independent structures.
[0012] In other embodiments of the present invention, the main body includes a first portion and a second portion, the first portion is arranged in parallel with the isolation portion, and the second portion is adhered to a side of the isolation portion facing away from the substrate.
[0013] In other embodiments of the present invention, both the first portion and the second portion include a first adhesive layer facing the substrate and a first base material layer facing away from the substrate.
[0014] In other embodiments of the present invention, the material of the first adhesive layer is silicone, and the material of the first base material layer is polyimide.
[0015] In other embodiments of the present invention, the thickness of the isolation portion is equal to or greater than the maximum length of the cutting residue of the second portion.
[0016] In other embodiments of the present invention, the adhesive strip includes a second adhesive layer facing the substrate and a second base material layer facing away from the substrate, and the width of the second adhesive layer is smaller than the width of the second base material layer to form a material-free area on the side of the second adhesive layer close to the first area, and the material-free area constitutes the non-adhesive area.
[0017] In other embodiments of the present invention, the width of the material-free area is equal to or greater than the maximum length of the cutting residue of the second adhesive layer.
[0018] In other embodiments of the present invention, the substrate has the second area on both sides of the first area, two adhesive strips are provided, and the exposed portions of the two adhesive strips are respectively adhered to the second areas on both sides.
[0019] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:
[0021] Figure 1 is a schematic diagram of a cutting residue contacting a first area on a substrate;
[0022] Figure 2 This is a schematic diagram of a substrate supporting assembly in the first embodiment of the present invention;
[0023] Figure 3 for Figure 2 A partial schematic diagram of the middle base plate supporting assembly;
[0024] Figure 4 is a schematic view of the substrate carrying assembly in the second embodiment of the present application;
[0025] Figure 5 is Figure 4 is a partial schematic view of the substrate carrying assembly.
[0026] Reference signs:
[0027] substrate 100, first region 110, second region 120;
[0028] frame 200, through region 210;
[0029] adhesive tape 300, adhesive region 301, non-adhesive region 302, material-free region 303, main body portion 310, first portion 311, first adhesive layer 311a, first base material layer 311b, second portion 312, separation portion 320, second adhesive layer 330, second base material layer 340;
[0030] cutting residue 400. DETAILED DESCRIPTION
[0031] Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are for the purpose of explaining the present application only and should not be understood as limiting the present application.
[0032] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings and is only for the purpose of facilitating the description of the present application and simplifying the description and therefore should not be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation and therefore should not be understood as limiting the present application.
[0033] In the description of the present application, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. is understood as not including the number, above, below, etc. is understood as including the number. If it is described as first, second, etc. is only for the purpose of distinguishing technical features and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of technical features indicated.
[0034] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be understood in a broad sense and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.
[0035] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
[0036] Reference Figure 1 , shows a schematic diagram of a substrate 100 carried by a material frame 200 as a carrier. Specifically, a glue strip 300 is adhered to the material frame 200, and the substrate 100 is adhered to the glue strip 300. As mentioned above, a part of the substrate 100 (i.e. Figure 1 The first area 110 in the embodiment of the present invention requires that no adhesive layer should remain, so the adhesive layer is usually removed by removing the adhesive layer from the part of the area not required (i.e. Figure 1 The second area 120 in the substrate is bonded to the adhesive strip 300. However, the adhesive strip 300 is typically cut from a whole sheet of film using a cutting tool. Due to the adhesive nature of the adhesive strip, when the cutting tool completes the cut and separates the adhesive strip, a portion of the adhesive layer of the adhesive strip will adhere to the tool and be stretched as the tool moves, forming a cutting residue 400. This cutting residue 400 will adhere to the first area 110 of the substrate, affecting subsequent processing. Based on this, the present invention proposes a substrate support assembly that prevents the cutting residue 400 from contacting the first area 110. This is described below in conjunction with the accompanying drawings and specific embodiments.
[0037] Reference Figure 2 、 Figure 3 , respectively show a schematic diagram and a partially enlarged schematic diagram of the substrate supporting assembly in the first embodiment of the present invention. As shown in the figure, the substrate supporting assembly includes a substrate 100, a material frame 200 and a rubber strip 300, and the substrate 100 is bonded to the material frame 200 through the rubber strip 300.
[0038] Reference Figure 2 The substrate 100 has a first area 110 and a second area 120 disposed on at least one side of the first area 110. For ease of understanding, the figure roughly illustrates the range of the first area 110 and the second area 120 through dotted lines. The first area 110 must not have any adhesive layer remaining to allow for subsequent connection to other structures. The second area 120 does not have the aforementioned requirement and can therefore be bonded to the adhesive strip 300. In some specific embodiments, the first area 110 is located in the center area of the substrate 100, and the second area 120 is disposed around the first area 110. It should be noted that Figure 2 Only a partial structure of the substrate 100 is shown.
[0039] Referring to Figure 2 , the frame 200 has a through area 210, and the frame 200 includes a rectangular annular frame body, and the through area 210 is formed by the annular frame body. It should be noted that Figure 2 only part of the structure of the frame 200 is shown.
[0040] Referring to Figure 2 , Figure 3 , a part of the adhesive tape 300 is bonded to the frame 200, and the other part is exposed from the through area 210. For example, the frame 200 includes the aforementioned rectangular annular frame body, and the two ends of the adhesive tape 300 are bonded to the two side edges of the annular frame body arranged opposite to each other, and the middle part of the adhesive tape 300 is exposed. The second area 120 of the substrate 100 is bonded to the exposed part of the adhesive tape 300, so that the substrate 100 can be indirectly connected to the frame 200 through the adhesive tape 300, so that the substrate 100 can be transferred through the frame 200 as a carrying unit. When the substrate 100 is bonded to the adhesive tape 300, the first area 110 of the substrate 100 is exposed from the through area 210, that is, the first area 110 is neither in contact with the adhesive tape 300 nor in contact with the frame 200, so as to avoid the first area 110 from being contaminated.
[0041] In this embodiment, referring to Figure 2 , Figure 3 , the adhesive tape 300 has a bonding area 301 and a non-bonding area 302 arranged side by side on the side (for example, the upper side in the figure) facing the substrate 100, and the non-bonding area 302 is arranged closer to the first area 110 than the bonding area 301, that is, the bonding area 301 and the first area 110 are separated by the non-bonding area 302, and in addition, the non-bonding area 302 extends in a direction away from the substrate 100 by a certain distance. For example, Figure 2 , the first area 110 of the substrate 100 is arranged on the right side of the second area 120, and the non-bonding area 302 is correspondingly arranged on the right side of the bonding area 301, and the non-bonding area 302 extends downward by a certain distance. It should be noted that the non-bonding area 302 means that this area does not need to have bonding ability, so the range of the non-bonding area 302 does not have a glue layer, that is, there is no glue layer in the adjacent area of the first area 110, so that the cutting residue 400 of the adhesive tape 300 can be prevented from contacting the first area 110.
[0042] Based on the first embodiment, some embodiments of the utility model, referring to Figure 3 , the adhesive tape 300 further includes a main body part 310 and a separation part 320, wherein the main body part 310 and the separation part 320 are arranged as independent structures, and the separation part 320 is connected to the main body part 310 by means of, for example, bonding or the like.
[0043] The main body 310 faces the substrate 100 and is attached to the side of the second region 120 (eg Figure 3 The upper side of the substrate 100 has a bonding area 301, and the isolation portion 320 faces the side of the substrate 100 and is attached to the second area 120 (for example Figure 3 The upper side of the isolation portion 320 has a non-adhesive area 302. In some specific embodiments, along the thickness direction of the isolation portion 320, part of the isolation portion 320 constitutes the non-adhesive area 302. For example, the upper portion of the isolation portion 320 does not have the adhesive ability, thereby being able to play an isolation role, and the lower portion of the isolation portion 320 has the adhesive ability, thereby being able to be bonded to the main body 310. In other specific embodiments, the isolation portion 320 as a whole is constituted as the non-adhesive area 302, which is connected to the main body 310 via the adhesive layer on the main body 310.
[0044] When the rubber strip 300 further includes a main body 310 and an isolation portion 320, in some specific embodiments of the present invention, Figure 3 The main body 310 includes a first part 311 and a second part 312 along the width direction. The first part 311 and the isolation part 320 are arranged in parallel, and the second part 312 is bonded to the side of the isolation part 320 away from the second area 120. That is, in this embodiment, a part of the main body 310 with bonding ability is used to bond the substrate 100, and the other part is used to bond the isolation part 320 to achieve the connection and fixation of the isolation part 320 and the main body 310. At this time, the isolation part 320 as a whole can be made of an isolation material that does not have bonding ability; on the other hand, the cutting residue 400 in this embodiment is mainly formed at the edge of the second part 312. Since the cutting residue 400 and the first area 110 are separated by the isolation part 320 with a certain thickness, it is difficult for the cutting residue 400 to contact the first area 110.
[0045] When the main body 310 includes the first portion 311 and the second portion 312, in some specific embodiments of the present invention, Figure 3 The first portion 311 and the second portion 312 each include a first adhesive layer 311a facing toward the substrate 100 and a first base material layer 311b facing away from the substrate 100. The first base material layer 311b serves as a support. The first adhesive layer 311a of the first portion 311 is used to adhere to the second region 120 of the substrate 100, while the first adhesive layer 311a of the second portion 312 is used to adhere to the isolation portion 320. Exemplarily, the material of the first adhesive layer 311a is silicone, and the material of the first base material layer 311b is polyimide.
[0046] In the above embodiment, the first adhesive layer 311a of the first portion 311 and the first adhesive layer 311a of the second portion 312 can be connected as an integral structure, and the first substrate layer 311b of the first portion 311 and the first substrate layer 311b of the second portion 312 can be connected as an integral structure.
[0047] When the adhesive strip 300 further includes a main body portion 310 and an isolation portion 320 , in some specific embodiments of the present invention, the thickness of the isolation portion 320 is equal to or greater than the maximum length of the cutting residue 400 of the second portion 312 . In this way, even if the cutting residue 400 bends toward the substrate 100 , it will not contact the first area 110 of the substrate 100 .
[0048] The above embodiment proposes a solution to prevent the cutting residue 400 from contacting the first area 110 by using an independent isolation portion 320. Some embodiments of the present invention also propose another solution, referring to Figure 4 、 Figure 5 The adhesive strip 300 includes a second adhesive layer 330 facing the substrate 100 and a second base material layer 340 facing away from the substrate 100. Similarly, the second base material layer 340 plays a supporting role and is used to adhere the second region 120 of the substrate 100. Exemplarily, the material of the second adhesive layer 330 is silicone, and the material of the second base material layer 340 is polyimide.
[0049] In this embodiment, the width of the second adhesive layer 330 is smaller than the width of the second base material layer 340, so as to form a material-free area 303 on the side of the second adhesive layer 330 close to the first area 110, and the material-free area 303 constitutes the non-adhesive area 302. Figure 2 The first region 110 of the middle substrate 100 is disposed to the right of the second region 120, and the material-free region 303 is formed to the right of the second adhesive layer 330. It should be noted that in some specific embodiments, the material-free region 303 can be formed by further removing a portion of the second adhesive layer 330 from the adhesive strip 300. Alternatively, a customized adhesive strip 300 can be used to ensure that the initial width of the second adhesive layer 330 is smaller than the initial width of the second substrate layer 340.
[0050] When the second adhesive layer 330 forms a material-free area 303 on one side close to the first area 110, in some embodiments of the present invention, the width of the material-free area 303 is equal to or greater than the maximum length of the cutting residue 400 of the second adhesive layer 330. In this way, even if the cutting residue 400 extends to the maximum length in the direction of the first area 110, it will not contact the first area 110.
[0051] Based on the first embodiment, in some embodiments of the present invention, the substrate 100 has a second area 120 on opposite sides of the first area 110. Correspondingly, two adhesive strips 300 are provided, and the exposed parts of the two adhesive strips 300 are respectively adhered to the second areas 120 on both sides of the substrate 100, thereby achieving a stable connection of the substrate 100.
[0052] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. In addition, the embodiments of the present invention and the features of the embodiments can be combined with each other unless there is a conflict.
Claims
1. A substrate supporting assembly, characterized in that: include: The substrate comprises a first region and a second region disposed on at least one side of the first region. a material frame, wherein the material frame has a through area; a rubber strip, wherein a portion of the rubber strip is adhered to the material frame and another portion is exposed from the through-area, the exposed portion of the rubber strip is adhered to the second area, and the first area of the substrate is exposed from the through-area; The side of the adhesive strip facing the substrate has a bonding area and a non-bonding area arranged in parallel, the non-bonding area is arranged closer to the first area than the bonding area, and the non-bonding area extends a set distance in a direction away from the substrate.
2. The substrate supporting assembly according to claim 1, wherein: The adhesive strip also includes a main body and an isolation portion connected to the main body. The main body has the bonding area on a side facing the substrate and in contact with the substrate, and the isolation has the non-bonding area on a side facing the substrate and in contact with the substrate. The main body and the isolation are configured as independent structures.
3. The substrate supporting assembly according to claim 2, wherein: The main body includes a first part and a second part. The first part is arranged in parallel with the isolation part, and the second part is adhered to a side of the isolation part away from the substrate.
4. The substrate supporting assembly according to claim 3, wherein: The first portion and the second portion both include a first adhesive layer facing toward the substrate and a first base material layer facing away from the substrate.
5. The substrate supporting assembly according to claim 4, wherein: The material of the first adhesive layer is silicone, and the material of the first base material layer is polyimide.
6. The substrate supporting assembly according to claim 3, wherein: The thickness of the separating portion is equal to or greater than a maximum length of a cutting residue of the second portion.
7. The substrate supporting assembly according to claim 1, wherein: The adhesive strip includes a second adhesive layer facing the substrate and a second base material layer facing away from the substrate. The width of the second adhesive layer is smaller than the width of the second base material layer, so as to form a material-free area on the side of the second adhesive layer close to the first area. The material-free area constitutes the non-adhesive area.
8. The substrate supporting assembly according to claim 7, wherein: The width of the material-free area is equal to or greater than the maximum length of the cutting residue of the second adhesive layer.
9. The substrate supporting assembly according to claim 1, wherein: The substrate has the second areas on both sides of the first area. Two adhesive strips are provided, and the exposed portions of the two adhesive strips are respectively adhered to the second areas on both sides.