Paddle structure, transportation device and processing equipment
By introducing a connection layer and a surface layer with matching expansion coefficients into the paddle structure, the problems of polysilicon deposition and erosion are solved, and the paddle structure is made resistant to high temperature, corrosion and thermal shock, extending its service life and reducing process pollution.
Patent Information
- Application Number
- CN202422807499.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-11-15
AI Technical Summary
Existing paddle structures cannot effectively prevent the deposition and erosion of polysilicon during the processing of semiconductor or photovoltaic materials, resulting in a shortened service life and process contamination.
A paddle structure was designed, including a paddle body and a connecting layer. The expansion coefficient of the connecting layer is between that of the paddle body and polysilicon, with good thermal expansion coefficient matching. A surface layer is provided to reduce the deposition and erosion of polysilicon and improve high temperature resistance and corrosion resistance.
It effectively prevents polysilicon from corroding the paddle body, prolongs its service life, reduces the risk of process contamination, and improves the reliability of processing equipment.
Smart Images

Figure CN223427473U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor or photovoltaic device processing technology, and in particular to a paddle structure, a transport device, and a processing device. Background Art
[0002] Semiconductor and photovoltaic devices are widely used in industries such as electronics and new energy. Semiconductor and photovoltaic materials typically require chemical processing before they can be used in products. Processing of these materials typically involves feeding sheet materials into a furnace, where they react under certain conditions of temperature and pressure. During this process, paddle structures are often used to load or move the materials to be processed, in-process, or after processing. However, due to limitations in related technologies, current paddle structures still cannot meet these requirements. Summary of the Invention
[0003] In view of this, embodiments of the present application provide a paddle structure, a transport device, and processing equipment.
[0004] In a first aspect, the present application provides a paddle structure configured to carry a boat support; the paddle structure includes:
[0005] paddle body;
[0006] The connection layer is located on at least a portion of the surface of the paddle body, and the expansion coefficient of the connection layer is less than or equal to the expansion coefficient of the paddle body and greater than or equal to the expansion coefficient of the polysilicon.
[0007] In one embodiment, the expansion coefficient of the connecting layer is greater than or equal to 2.5×10 -6 / ℃, and less than or equal to 4.4×10 -6 / ℃.
[0008] In one embodiment, the connecting layer includes a plurality of first regions and a plurality of second regions, and the first regions and the second regions are alternately arranged in sequence;
[0009] The thickness of the connecting layer in the first region is smaller than the thickness of the connecting layer in the second region.
[0010] In one embodiment, the thickness of the connection layer is greater than or equal to 10 μm and less than or equal to 100 μm.
[0011] In one embodiment, the paddle body comprises silicon carbide.
[0012] In one embodiment, the invention further comprises: a surface layer located on at least a portion of the surface of the connecting layer facing away from the paddle body, wherein the friction coefficient of the surface layer is 0.1-0.2;
[0013] Preferably, the density of the surface layer is 95%-99%.
[0014] In one embodiment, the surface layer has a thickness greater than or equal to 10 μm and less than or equal to 100 μm.
[0015] In one embodiment, the paddle body comprises:
[0016] a paddle stem;
[0017] a paddle blade connected to the paddle stem, the paddle blade configured to carry a boat support, wherein the boat support is configured to carry a boat structure, and the boat structure is configured to carry a sheet material.
[0018] The connecting layer is located on at least a portion of a surface of the paddle stem, and / or the connecting layer is located on at least a portion of a surface of the paddle blade.
[0019] The second aspect of the present application provides a transport device, comprising:
[0020] The paddle structure as above, the paddle structure configured to carry the boat support, the boat support configured to carry the boat structure, and the boat structure configured to carry the sheet material.
[0021] a paddle seat connected to the paddle structure, configured to carry the paddle structure;
[0022] a driving structure connected to the paddle seat, configured to drive the paddle seat and the paddle structure to move, so as to transport the boat support, the boat structure and the sheet material.
[0023] The third aspect of the present application provides a processing equipment, comprising:
[0024] a frame;
[0025] a reaction system arranged in the frame;
[0026] and the transport device as above, the transport device arranged in the frame, the transport device transporting the boat support, the boat structure and the sheet material into the reaction system for processing.
[0027] According to the paddle structure provided by the embodiments of the present application, the expansion coefficient of the connecting layer is less than or equal to the expansion coefficient of the paddle body, which is beneficial to reduce the difference between the thermal expansion coefficients of the paddle body and the deposited layer (e.g. polysilicon), has a certain buffering effect, can realize barrier protection of the paddle body, and is beneficial to reduce stress damage to the paddle body; at the same time, the paddle structure provided by the embodiments of the present application has good high-temperature resistance, corrosion resistance and good thermal shock resistance, can effectively prevent the erosion of polysilicon to the paddle body, and improve the service life of the silicon carbide paddle boat. BRIEF DESCRIPTION OF DRAWINGS
[0028] Figure 1 FIG. 1 is a schematic view of a cross-sectional structure of a paddle structure in one embodiment of the present application.
[0029] Figure 2 FIG. 2 is a schematic view of a cross-sectional structure of a paddle structure in another embodiment of the present application.
[0030] Figure 3 This is a schematic cross-sectional view of a paddle structure in another embodiment of the present application.
[0031] Figure 4 This is a schematic diagram of the cross-sectional structure of polysilicon directly formed on the surface of the paddle body.
[0032] Figure 5 This is a schematic diagram of the cross-sectional structure of directly forming polysilicon on the surface of the paddle structure in one embodiment of the present application.
[0033] Figure 6 This is a schematic structural diagram of the paddle body in one embodiment of the present application.
[0034] Figure 7 This is a schematic structural diagram of a transport device in one embodiment of the present application. DETAILED DESCRIPTION
[0035] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0036] In addition, in order to better illustrate the present application, numerous specific details are provided in the following detailed description. Those skilled in the art will understand that the present application can be practiced without certain specific details. In some examples, methods and means well known to those skilled in the art are not described in detail in order to highlight the main purpose of the present application.
[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.
[0038] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.
[0039] The core process for manufacturing current photovoltaic devices, such as TOPCon cells, involves forming a tunneling oxide layer and a polysilicon layer. This is accomplished by depositing a 1-2nm thick silicon oxide film and a 100-150nm thick doped amorphous silicon film on the backside of an N-type silicon wafer. During a subsequent annealing process, the crystallinity of the doped amorphous silicon film changes from a microcrystalline-amorphous mixed phase to a polycrystalline layer, activating the passivation properties of the stacked film. Metal deposition on the stacked film then creates a passivated contact structure without the need for openings. Methods for forming the tunneling oxide and polysilicon layers include low-pressure chemical vapor deposition (LPCVD), plasma-enhanced chemical vapor deposition (PECVD), and physical vapor deposition (PVD). Among them, LPCVD is to add P diffusion and cleaning processes after the tunnel oxide layer and intrinsic amorphous silicon layer are prepared. Specifically, LPCVD equipment is used to grow a silicon oxide layer and deposit polysilicon through thermal oxidation, and then phosphorus is doped into the polysilicon to form a PN junction to form a passivated contact structure.
[0040] In the LPCVD process, the paddle structure (usually a silicon carbide boat paddle) and the furnace door move synchronously. The paddle structure is used to support and carry the boat support, which is loaded with silicon wafers. The conveying mechanism controls the boat support's input or output of the quartz tube by driving the paddle structure back and forth. During the use of the paddle structure, the polysilicon layer produced during each process will be deposited on the paddle structure. Since the paddle structure and the furnace door are fixed and cannot be removed for cleaning, more and more polysilicon will be produced as the process progresses. The continuous deposition of polysilicon on the paddle structure will cause serious erosion to the paddle structure substrate, which is prone to fracture and failure, affecting its service life. Moreover, as polysilicon is deposited on the paddle structure, polysilicon will continue to fall off the paddle structure, which will cause process pollution and affect the silicon wafer coating process.
[0041] In view of this, the first aspect of the present application provides a paddle structure, which is configured to carry a boat support; Figure 1 The structural schematic diagram of the paddle structure shown in the figure includes: a paddle body 100; a connecting layer 200, which is located on at least part of the surface of the paddle body 100, and the expansion coefficient of the connecting layer 200 is less than or equal to the expansion coefficient of the paddle body 100 and greater than or equal to the expansion coefficient of polysilicon.
[0042] According to the paddle structure provided in the embodiment of the present application, the expansion coefficient of the connecting layer 200 is less than or equal to the expansion coefficient of the paddle body 100, which is beneficial to reducing the difference in thermal expansion coefficients between the paddle body 100 and the deposited layer (such as polysilicon), and has a certain buffering effect, which can achieve barrier protection for the paddle body and help reduce stress damage to the paddle body; at the same time, the paddle structure provided in this embodiment has good high temperature resistance, corrosion resistance and good thermal shock resistance, which can effectively prevent the erosion of the paddle body by polysilicon, improve the life of the silicon carbide boat paddle, and can also achieve a buffering effect on the paddle body 100 when a boat support is placed on the paddle structure.
[0043] It can be understood that in the process of processing semiconductor or photovoltaic materials, some devices are usually used to load or move materials to be processed, in processing or after processing. The loading or moving device can be called a boat structure, and the device that loads multiple boat structures is usually called a boat support (or support assembly), and the device that supports and carries the boat support can be called a paddle structure.
[0044] It is understandable that when a paddle structure is used to process semiconductor or photovoltaic materials, polysilicon will be deposited on the surface of the paddle structure.
[0045] For example, the paddle body 100 comprises silicon carbide, and the thermal expansion coefficient of silicon carbide is about 4.4×10 -6 / ℃; the thermal expansion coefficient of polysilicon is about 2.5×10 -6 / ℃.
[0046] In one embodiment, the expansion coefficient of the connection layer 200 is greater than or equal to 2.5×10 -6 / ℃, and less than or equal to 4.4×10 -6 / ℃, for example, it can be 2.5×10 -6 / ℃、3.0×10 -6 / ℃、3.5×10 -6 / ℃、4×10 -6 / ℃ or 4.4×10 -6 Therefore, the thermal expansion coefficient of the connection layer 200 is between silicon carbide and polysilicon, and the thermal expansion coefficient is adjustable, which reduces the difference in thermal expansion coefficients between the paddle body 100 and the polysilicon deposition layer, and reduces stress damage to the paddle body 100.
[0047] For example, the connecting layer 200 can have good thermal shock resistance and good adhesion. The connecting layer can be prepared by coating, such as spraying or brushing. The connecting layer 200 is primarily composed of corundum, silicon carbide, silicon dioxide, cordierite, zirconium tungstate, silica sol, chromium oxide powder, sodium silicate, phosphate, and organic silicate. Corundum, silicon carbide, and silica dioxide primarily serve as the coating's base materials. Cordierite and zirconium tungstate primarily serve as thermal expansion modifiers, theoretically enabling a wide range of adjustable thermal expansion coefficients. This allows the thermal expansion coefficients of the connecting layer 200 and the paddle body 100 to match, minimizing differences in thermal expansion coefficients. Silica sol, chromium oxide powder, sodium silicate, phosphate, and organic silicate primarily serve as adhesives. The addition of adhesives can significantly alter the microstructure between the coating base material and the thermal expansion modifier powder, making the microstructure more compact and effectively improving thermal shock resistance.
[0048] In one embodiment, the thickness of the connection layer 200 is greater than or equal to 10 μm and less than or equal to 100 μm, for example, it can be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm,
[0049] 80 μm, 90 μm or 100 μm, etc. Thus, the thickness of the connecting layer 200 is appropriate, which has an excellent effect of reducing stress damage to the paddle body 100, is conducive to achieving barrier protection between the polysilicon and the paddle body 100, and has an excellent buffering effect on the paddle body 100 when a boat support is placed on the paddle structure.
[0050] In one embodiment, referring to Figure 2 In the schematic diagram of the paddle structure shown, the connecting layer 200 includes a plurality of first regions 210 and a plurality of second regions 220, which are arranged alternately. The thickness of the connecting layer 200 in the first region 210 is less than the thickness of the connecting layer 200 in the second region 220. As a result, the structural design of the connecting layer 200 is more conducive to reducing stress concentration and effectively buffering the stress difference between the deposited layer and the paddle body 100.
[0051] Illustratively, the surface of the connection layer 200 facing away from the paddle body 100 includes a plurality of raised portions, with recessed portions formed between adjacent raised portions. Optionally, the surface of the connection layer 200 facing away from the paddle body 100 is wavy.
[0052] Exemplarily, the thickness of the connection layer 200 in the first region 210 refers to the maximum thickness of the connection layer 200 in the first region 210 ; the thickness of the connection layer 200 in the second region 220 refers to the maximum thickness of the connection layer 200 in the second region 220 .
[0053] In one embodiment, referring to Figure 3The paddle structure shown in the figure further includes a surface layer 300 located on at least a portion of the surface of the connecting layer 200 facing away from the paddle body 100. The friction coefficient of the surface layer 300 is 0.1-0.2, for example, 0.1, 0.12, 0.14, 0.16, 0.18, or 0.2. Thus, the surface layer 300 seals the pores and lubricates the surface, resulting in a paddle structure with a dense and lubricated coating. It also effectively prevents polysilicon from depositing on the surface of the surface layer 300, reducing polysilicon erosion on the paddle structure, lowering the probability of failure, and increasing the life of the paddle structure.
[0054] In one embodiment, the density of the surface layer 300 is 95%-99%, for example, 95%, 96%, 97%, 98%, or 99%. This effectively prevents polysilicon from being deposited on the surface of the surface layer 300, reduces polysilicon erosion of the paddle structure, reduces the probability of failure, and increases the life of the paddle structure.
[0055] In one embodiment, the thickness of the surface layer 300 is greater than or equal to 10 μm and less than or equal to 100 μm, for example, it can be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm,
[0056] 80 μm, 90 μm or 100 μm, etc. Thus, the surface layer 300 has an appropriate strength and has an excellent effect of preventing polysilicon from being deposited on the surface of the surface layer 300 .
[0057] For example, the surface layer 300 can have good surface lubricity and good pore sealing properties. It can be prepared by coating, such as spraying or brushing. The surface layer 300 is primarily composed of boron oxide, boron nitride, molybdenum disulfide, an alkali metal silicate binder, mica powder, and silica nanoparticles. Boron oxide, boron nitride, and molybdenum disulfide primarily provide lubrication and pore sealing, resulting in a denser coating. The alkali metal silicate binder, mica powder, and silica nanoparticles primarily serve as coating fillers, enhancing the strength and hardness of the surface layer 300.
[0058] In one embodiment, referring to Figure 6 As shown in the structural schematic diagram of the paddle body, the paddle body 100 includes: a paddle handle 110; a blade 120, the blade 120 is connected to the paddle handle 110, and the blade 120 is configured to carry a boat support, wherein the boat support is configured to carry a boat structure, and the boat structure is configured to carry a sheet material; the connecting layer 200 is located on at least a portion of the surface of the paddle handle 110, and / or the connecting layer 200 is located on at least a portion of the surface of the blade 120.
[0059] For example, the paddle handle and blades in the paddle body are conventional structures and are not improvements of the present application, so they will not be described in detail here.
[0060] For example, the boat structure and sheet material are conventional structures and are not improvements of the present application, so they will not be described in detail here.
[0061] For example, key components of a clean bench used in processes such as LPCVD include a paddle structure, a boat support, and a boat structure. The paddle structure generally consists of a paddle handle and paddle blades, and the paddle blades are used to support the boat support and the boat structure.
[0062] For example, the cross-sectional view of the structure after the polysilicon 400 is deposited directly on the paddle body 100 is as follows: Figure 4 As shown, the thermal expansion coefficients of polysilicon 400 and paddle body 100 are greatly different, and polysilicon 400 will erode into paddle body 100 during the process, causing stress damage. Figure 5 As shown, there are two coatings, a surface layer 300 and a connecting layer 200, between the paddle body 100 and the polysilicon 400. The coatings can provide barrier protection between the polysilicon 400 and the paddle body 100, reduce the deposition of polysilicon, and achieve a cushioning effect on the paddle body 100 when placed on a boat support. The paddle structure of the embodiment of the present application has good high temperature resistance, corrosion resistance, and good thermal shock resistance, which can effectively prevent the polysilicon 400 from corroding the paddle body 100 and improve the life of the paddle structure. The paddle structure of the embodiment of the present application can effectively reduce the deposition of polysilicon on the paddle structure surface and reduce the process contamination of the cavity caused by the shedding of surface polysilicon.
[0063] For example, the manufacturing process of the connecting layer 200 and the surface layer 300 in the paddle structure of the embodiment of the present application is spraying or dipping, etc. There are no special requirements for the structure and size of the paddle body 100, and it has strong machinability, so it can be used in complex and large structures such as boat paddles.
[0064] The second aspect of the present application provides a transport device, referring to Figure 7 The structural schematic diagram of the transport device shown in the figure, the transport device includes: the paddle structure 10 as above, the paddle structure 10 is configured to carry the boat support, the boat support is configured to carry the boat structure, and the boat structure is configured to carry the sheet material; the paddle seat 20, connected to the paddle structure 10, is configured to carry the paddle structure 10; the driving structure 30, connected to the paddle seat 20, is configured to drive the paddle seat 20 and the paddle structure 10 to move, so as to transport the boat support, the boat structure and the sheet material.
[0065] It should be noted that the boat structure, boat support, paddle seat and drive structure are conventional structures and are not improvements of this application, so they will not be described in detail here.
[0066] It should be noted that the structure of the transport device of the present embodiment can be combined with the structure of the paddle structure as a whole or in part, and will not be described in detail herein.
[0067] Exemplarily, the transport device is used to transport the sheet material from the cleaning station to the reaction furnace for heat processing, and the processing process can be exemplarily PECVD, LPCVD or PVD, etc.
[0068] In one embodiment, the driving structure can be a linear module. Alternatively, the driving structure comprises a guide rail and a sliding block, and the paddle seat is connected with the sliding block. In a specific example, the driving structure is used to horizontally transport the sheet material to the horizontal reaction furnace for processing, and the guide rail extends in the horizontal direction to drive the sliding block to move in the horizontal direction, thereby driving the paddle seat and the paddle structure to move horizontally.
[0069] The third aspect of the present application provides a processing equipment, comprising: a frame; a reaction system, the reaction system being arranged in the frame; and a transport device as above, the transport device being arranged in the frame, and the transport device transporting the boat holder, the boat structure and the sheet material to the reaction system for processing.
[0070] Exemplarily, the structure of the processing equipment of the present embodiment can be combined with the structure of the transport device as a whole or in part, and will not be described in detail herein.
[0071] The above describes the basic principles of the present application in combination with specific embodiments, but it should be noted that the advantages, advantages, effects, etc. mentioned in the present application are only examples and are not limited, and these advantages, advantages, effects, etc. cannot be considered as the must-have of each embodiment of the present application. In addition, the above disclosed specific details are only for the purpose of example and understanding, and are not limited to the above specific details, and the above specific details do not limit the present application to be realized by the above specific details.
[0072] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although the above has discussed a plurality of example aspects and embodiments, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations.
Claims
1. A paddle structure, characterized in that: The paddle structure is configured to carry a boat support; the paddle structure comprises: paddle body; A connecting layer is located on at least a portion of the surface of the paddle body, and an expansion coefficient of the connecting layer is less than or equal to the expansion coefficient of the paddle body and greater than or equal to the expansion coefficient of polysilicon.
2. The paddle structure according to claim 1, characterized in that: The expansion coefficient of the connecting layer is greater than or equal to 2.5×10 -6 / ℃, and less than or equal to 4.4×10 -6 / ℃.
3. The paddle structure according to claim 1, characterized in that: The connection layer includes a plurality of first regions and a plurality of second regions, wherein the first regions and the second regions are alternately arranged in sequence; A thickness of the connection layer in the first region is smaller than a thickness of the connection layer in the second region.
4. The paddle structure according to any one of claims 1 to 3, characterized in that: The thickness of the connecting layer is greater than or equal to 10 μm and less than or equal to 100 μm.
5. The paddle structure according to claim 1, characterized in that: The paddle body comprises silicon carbide.
6. The paddle structure according to claim 1, characterized in that: Also includes: The surface layer is located on at least a portion of the surface of the connecting layer away from the paddle body, and the friction coefficient of the surface layer is 0.1-0.
2.
7. The paddle structure according to claim 6, characterized in that: The density of the surface layer is 95%-99%.
8. The paddle structure according to claim 6, characterized in that: The thickness of the surface layer is greater than or equal to 10 μm and less than or equal to 100 μm.
9. The paddle structure according to claim 1, characterized in that: The paddle body comprises: oar handle; a paddle blade connected to the paddle handle, the paddle blade being configured to carry a boat support, wherein the boat support is configured to carry a boat structure, and the boat structure is configured to carry a sheet material; The connecting layer is located on at least a portion of the surface of the paddle handle, and / or the connecting layer is located on at least a portion of the surface of the paddle blade.
10. A transport device, characterized in that: include: The paddle structure according to any one of claims 1 to 9, wherein the paddle structure is configured to carry a boat support, the boat support is configured to carry a boat structure, and the boat structure is configured to carry a sheet material; a paddle seat connected to the paddle structure and configured to support the paddle structure; The driving structure is connected to the paddle seat and is configured to drive the paddle seat and the paddle structure to move so as to transport the boat support, the boat structure and the sheet material.
11. A processing equipment, characterized in that, include: frame; a reaction system, wherein the reaction system is disposed within the frame; And the transport device according to claim 10, wherein the transport device is arranged in the frame, and the transport device transports the boat support, the boat structure and the sheet material to the reaction system for processing.