Silicon wafer extraction device and solar cell production equipment

Abstract

The utility model relates to a silicon wafer extraction device and solar cell production equipment. The silicon wafer extracting device comprises a base, a driving mechanism, a material taking mechanism and a rotating mechanism, the driving mechanism is installed on the base and connected with the material taking mechanism, and under driving of the driving mechanism, the material taking mechanism can move to the position where the flower basket is located so as to extract the silicon wafers in the flower basket. The rotating mechanism is mounted on the base, the rotating mechanism is connected with the material taking mechanism, and the rotating mechanism is used for driving the material taking mechanism to rotate, so that the material taking mechanism places the silicon wafers extracted from the flower basket in the sampling placement area. In the production process, the silicon wafers in the basket can be automatically taken out through the silicon wafer extracting device, and production personnel do not need to manually take the silicon wafers, so that the safety risk existing when the production personnel take the silicon wafers from the cleaning tank in the production process can be avoided.

Description

Technical Field

[0001] The present application relates to the technical field of solar cell processing, and in particular to a silicon wafer extraction device and solar cell production equipment. Background Art

[0002] During the production of TOPCon (Tunnel Oxide Passivated Contact) cells, production personnel must measure the thickness of the borosilicate glass (BSG) and phosphosilicate glass (PSG) layers on the front and back sides of silicon wafers to ensure that the BSG layer protecting the front PN junction and the PSG layer protecting the POLYZER are removed during alkaline etching. Therefore, after removing the silicon wafers from the alkaline etching tank and before entering the hydrofluoric acid tank, production personnel must remove at least one wafer from the basket to test the thickness of the BSG and PSG layers. However, removing wafers from the cleaning tank during production presents a safety risk. Utility Model Content

[0003] Based on this, it is necessary to provide a silicon wafer extraction device and solar cell production equipment, which does not require production personnel to manually extract silicon wafers, thereby avoiding the safety risks of production personnel extracting silicon wafers from the cleaning tank during production.

[0004] In a first aspect, the present application provides a silicon wafer extraction device, comprising:

[0005] base;

[0006] a driving mechanism, the driving mechanism being mounted on the base;

[0007] a material taking mechanism, the material taking mechanism being connected to the driving mechanism and being driven by the driving mechanism so as to move to the position of the flower basket in the cleaning tank to extract the silicon wafers in the flower basket; and

[0008] A rotating mechanism is installed on the base and connected to the material taking mechanism. The rotating mechanism is used to drive the material taking mechanism to rotate so that the material taking mechanism can place the silicon wafers extracted from the flower basket in the sampling placement area.

[0009] In one embodiment, the material taking mechanism includes a first base body, the first base body is connected to the driving mechanism, the first base body has an adsorption surface for contacting the silicon wafer, and the adsorption surface is provided with adsorption holes.

[0010] In one of the embodiments, the driving mechanism is further connected with a second base body, the first base body and the second base body are oppositely spaced, the spacing between the first base body and the second base body is greater than or equal to the thickness of the silicon wafer, and the adsorption surface is arranged on the side of the first base body facing the second base body.

[0011] In one of the embodiments, the silicon wafer has opposite first and second surfaces; the first and second base bodies are each provided with a drying mechanism, the drying mechanism on the first base body is used for drying the first surface of the silicon wafer, and the drying mechanism on the second base body is used for drying the second surface of the silicon wafer.

[0012] In one of the embodiments, the silicon wafer has opposite first and second sides; the drying mechanism includes a first blowing assembly, the first base body and the second base body are each provided with the first blowing assembly on the side away from the driving mechanism, the first blowing assembly on the first base body is used for blowing gas towards the first surface of the silicon wafer in the direction from the first side to the second side, and the first blowing assembly on the second base body is used for blowing gas towards the second surface of the silicon wafer in the direction from the first side to the second side.

[0013] In one of the embodiments, the first base body and the second base body are used for accommodating a vertical silicon wafer having opposite top and bottom parts; the drying mechanism further includes a second blowing assembly and a third blowing assembly, the first base body is provided with at least one second blowing assembly and at least one third blowing assembly, the second blowing assembly on the first base body is used for blowing gas towards the top part of the first surface of the silicon wafer, and the third blowing assembly on the first base body is used for blowing gas towards the bottom part of the first surface of the silicon wafer; the second base body is provided with at least one second blowing assembly and at least one third blowing assembly, the second blowing assembly on the second base body blows gas towards the top part of the second surface of the silicon wafer, and the third blowing assembly on the second base body blows gas towards the bottom part of the second surface of the silicon wafer.

[0014] In one of the embodiments, the driving mechanism includes a lifting assembly and a translation assembly, the lifting assembly is drivingly connected with the rotating mechanism, the translation assembly is drivingly connected with the lifting assembly, and the material taking mechanism is drivingly connected with the translation assembly.

[0015] In one of the embodiments, the translation assembly includes a lead screw module and a cylinder body, the lead screw module is drivingly connected with the lifting assembly, the cylinder body is drivingly connected with the lead screw module, the cylinder body is connected with a telescopic shaft, and one end of the telescopic shaft away from the cylinder body is connected with the material taking mechanism.

[0016] In one embodiment, the silicon wafer extraction device also includes a camera and a PLC controller. The camera is used to correspond to the cleaning tank setting, and the camera is used to capture images inside the cleaning tank. The PLC controller is configured with an information input unit for inputting a material picking position. The PLC controller is communicatively connected with the camera and the driving mechanism, and the PLC controller is used to control the action of the driving mechanism according to the image captured by the camera.

[0017] In a second aspect, the present application further provides a solar cell production device, comprising:

[0018] a cleaning device, the cleaning device being provided with a cleaning tank for containing a cleaning liquid;

[0019] a lifting device, the lifting device being disposed in the cleaning tank, the lifting device being provided with a supporting portion for placing a flower basket, the lifting device being used to drive the flower basket to rise above the liquid level of the cleaning liquid; and

[0020] In any of the above-mentioned silicon wafer extraction devices, the base is arranged outside the cleaning device, the driving mechanism is used to drive the material-retrieving mechanism to move to the position of the flower basket in the cleaning tank, the material-retrieving mechanism is used to extract the silicon wafers in the flower basket, and the rotating mechanism is used to drive the material-retrieving mechanism to rotate so that the material-retrieving mechanism places the silicon wafers extracted from the flower basket in the sampling placement area.

[0021] In the aforementioned silicon wafer extraction device and solar cell production equipment, during production, a drive mechanism drives the material-retrieving mechanism to move into the cleaning device. Specifically, the drive mechanism drives the material-retrieving mechanism to move to the location of the flower basket in the cleaning tank, so that the material-retrieving mechanism can remove silicon wafers from the flower basket. Then, a rotary mechanism drives the material-retrieving mechanism to rotate, causing the material-retrieving mechanism to rotate to the location of the sampling placement area, where the material-retrieving mechanism places the silicon wafers extracted from the flower basket in the sampling placement area. In this way, during the production process, the silicon wafer extraction device can automatically extract silicon wafers from the flower basket, eliminating the need for production personnel to manually extract silicon wafers, thereby avoiding the safety risks associated with production personnel extracting silicon wafers from the cleaning tank during production. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a side view of a solar cell production device according to an embodiment of the present application.

[0023] Figure 2 for Figure 1 A top view of a solar cell production facility is shown.

[0024] Figure 3 This is a top view of the material taking mechanism and the drying mechanism according to an embodiment of the present application.

[0025] Figure 4 This is a schematic diagram of a drying mechanism according to an embodiment of the present application drying silicon wafers before taking out the material.

[0026] Figure 5 This is a schematic diagram of a material taking mechanism taking materials and a drying mechanism drying silicon wafers according to an embodiment of the present application.

[0027] Description of Figure Numbers:

[0028] 10. Silicon wafer extraction device; 11. Base; 12. Driving mechanism; 121. Lifting assembly; 122. Translation assembly; 1221. First translation member; 1222. Second translation member; 13. Material taking mechanism; 131. First substrate; 1311. Adsorption surface; 13111. Adsorption hole; 132. Second substrate; 14. Drying mechanism; 141. First blowing assembly; 142. Second blowing assembly; 143. Third blowing assembly; 15. Sampling placement area; 16. Rotating mechanism; 20. Cleaning device; 21. Cleaning tank; 30. Lifting device; 31. Carrying part; 311. Fixed structure; 40. Flower basket; 41. Silicon wafer; 411. First side; 412. Second side; 413. Top; 414. Bottom. DETAILED DESCRIPTION

[0029] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0030] See Figure 1 One embodiment of the present application provides a solar cell production apparatus comprising a cleaning device 20. The cleaning device 20 is provided with a cleaning tank 21 for containing a cleaning solution. During production, a basket 40 containing silicon wafers 41 is placed in the cleaning tank 21, where the cleaning solution cleans the surface, etched features, and film structure of the silicon wafers 41.

[0031] It should be noted that the cleaning fluid is selected based on the production process. Optionally, the cleaning fluid is water. Alternatively, the cleaning fluid is a mixture of water and chemicals.

[0032] During the production of TOPCon (Tunnel Oxide Passivated Contact) cells, production personnel must measure the thickness of the borosilicate glass (BSG) and phosphosilicate glass (PSG) layers on the front and back sides of silicon wafers 41 to ensure that the BSG layer protecting the front PN junction and the PSG layer protecting the POLY (polyethylene glycol) are removed during alkaline etching. Therefore, after the silicon wafers 41 are removed from the alkaline etching tank and before entering the hydrofluoric acid tank, production personnel must remove at least one silicon wafer 41 from the basket 40 to test the thickness of the BSG and PSG layers. However, removing the silicon wafers 41 from the cleaning tank 21 during production presents a safety risk.

[0033] Therefore, in this embodiment, refer to Figure 1 and Figure 2 The solar cell production equipment also includes a silicon wafer extraction device 10. The silicon wafer extraction device 10 includes a base 11, a drive mechanism 12, a material removal mechanism 13, and a rotating mechanism 16. The base 11 is arranged outside the cleaning device 20, and the drive mechanism 12 is installed on the base 11. The drive mechanism 12 is connected to the material removal mechanism 13. Under the drive of the drive mechanism 12, the material removal mechanism 13 can move to the position where the flower basket 40 is located to extract the silicon wafers 41 in the flower basket 40. The rotating mechanism 16 is installed on the base 11 and is connected to the material removal mechanism 13. The rotating mechanism 16 is used to drive the material removal mechanism 13 to rotate so that the material removal mechanism 13 can place the silicon wafers 41 extracted from the flower basket 40 in the sampling placement area 15.

[0034] It should be noted that the processes of texturing, alkali polishing and RCA all involve cleaning steps. Therefore, in this embodiment, the silicon wafer extraction device 10 can be used as a cleaning device 20 for texturing equipment, alkali polishing equipment and RCA equipment.

[0035] It should be noted that the sampling placement area 15 is located outside the cleaning device, and the specific location of the sampling placement area 15 can be set according to actual needs. Optionally, the sampling placement area 15 is located on a side of the base 11 away from the cleaning device 20.

[0036] During production, the drive mechanism 12 drives the material removal mechanism 13 to move into the cleaning device 20. Specifically, the drive mechanism 12 drives the material removal mechanism 13 to move to the location of the flower basket 40 in the cleaning tank 21, so that the material removal mechanism 13 can remove the silicon wafers 41 from the flower basket 40. Then, the rotation mechanism 16 drives the material removal mechanism 13 to rotate, so that the material removal mechanism 13 rotates to the location of the sampling placement area 15. The material removal mechanism 13 places the silicon wafers 41 extracted from the flower basket 40 in the sampling placement area 15. In this way, during the production process, the silicon wafer extraction device 10 can automatically extract the silicon wafers 41 from the flower basket 40, eliminating the need for production personnel to manually extract the silicon wafers 41, thereby avoiding the safety risks associated with production personnel extracting silicon wafers 41 from the cleaning tank 21 during production.

[0037] In one embodiment, see Figure 1 The solar cell production equipment further includes a lifting device 30. Optionally, the lifting device 30 is a screw module, a conveyor belt module, or the like. The lifting device 30 is disposed within the cleaning tank 21. Optionally, the lifting device 30 is mounted to the bottom of the cleaning tank 21. The lifting device 30 includes a supporting portion 31 for placing a flower basket 40. The lifting device 30 is configured to drive the flower basket 40 to rise above the level of the cleaning solution.

[0038] During cleaning, the lifting device 30 is closed, i.e., it does not move, and the supporting portion 31 is close to the bottom of the cleaning tank 21. The flower basket 40 is placed on the supporting portion 31 and immersed in the cleaning liquid, which cleans the silicon wafers 41.

[0039] When extracting the silicon wafer 41, the silicon wafer extraction device 10 is activated and the lifting device 30 is started at the same time. The lifting device 30 drives the flower basket 40 to rise above the liquid level of the cleaning liquid. The cleaning liquid on the silicon wafer 41 falls back into the cleaning tank 21 under the action of its own gravity, so as to reduce the residual cleaning liquid on the silicon wafer 41, thereby saving the time required for drying the silicon wafer.

[0040] After the silicon wafers 41 are extracted, the lifting device 30 drives the basket 40 to descend into the cleaning liquid, and the silicon wafers 41 in the basket 40 continue the subsequent production process.

[0041] Further, see Figure 1 The supporting portion 31 is provided with a fixing structure 311 for fixing the flower basket 40. Optionally, the fixing structure 311 is a snap-fit ​​structure, a magnetic structure, etc. In this way, the flower basket 40 can be prevented from sliding during the lifting process, thereby improving the lifting stability of the flower basket 40.

[0042] In one embodiment, see Figure 3The material-retrieving mechanism 13 includes a first base 131, which is connected to the driving mechanism 12. The first base 131 has an adsorption surface 1311, which is used to contact the silicon wafer 41. The adsorption surface 1311 is provided with adsorption holes 13111, which are used to communicate with the negative pressure device. When extracting the silicon wafer 41, the driving mechanism 12 drives the material-retrieving mechanism 13 to move toward the flower basket 40 to the position where the silicon wafer 41 is located. Then, the negative pressure device is started, and the negative pressure device sucks the air between the adsorption surface 1311 and the silicon wafer 41 into a vacuum, so that the silicon wafer 41 is adsorbed on the material-retrieving mechanism 13. In this way, the material-retrieving mechanism 13 absorbs the silicon wafer by vacuum adsorption, which can prevent the silicon wafer 41 from being damaged.

[0043] It should be noted that the number of adsorption holes 13111 is also set according to actual needs and is not specifically limited here. Optionally, there are multiple adsorption holes 13111, and all adsorption holes 13111 are arranged in an array.

[0044] It should be noted that the area where the silicon wafer 41 contacts the adsorption surface 1311 is the material extraction area. Optionally, the material extraction area is located in the middle of the silicon wafer 41. Of course, in other embodiments, the material extraction area can also be located at other parts of the silicon wafer 41, and is not limited to this.

[0045] In one embodiment, see Figure 3 and Figure 5 The drive mechanism 12 is also connected to the second base 132. The first base 131 and the second base 132 are arranged relative to each other with a spacing therebetween being greater than or equal to the thickness of a single silicon wafer 41. The adsorption surface 1311 is provided on the side of the first base 131 facing the second base 132. When extracting the silicon wafer 41, the drive mechanism 12 drives the material removal mechanism 13 to move toward the flower basket 40 until the silicon wafer 41 is inserted between the first base 131 and the second base 132. Then, the negative pressure device is activated, which sucks the air between the adsorption surface 1311 and the silicon wafer 41 into a vacuum, so that the silicon wafer 41 is adsorbed on the adsorption surface 1311.

[0046] The silicon wafer 41 has a first side and a second side opposite to each other. Optionally, the first side of the silicon wafer 41 refers to the front side of the silicon wafer 41, and the second side of the silicon wafer 41 refers to the back side of the silicon wafer 41. Alternatively, the first side of the silicon wafer 41 refers to the back side of the silicon wafer 41, and the second side of the silicon wafer 41 refers to the front side of the silicon wafer 41.

[0047] In one embodiment, see Figure 3 、 Figure 4 and Figure 5The silicon wafer extraction device 10 further includes a drying mechanism 14. The drying mechanism 14 is provided on both the first base 131 and the second base 132. The drying mechanism 14 on the first base 131 is used to dry the first side of the silicon wafer 41, and the drying mechanism 14 on the second base 132 is used to dry the second side of the silicon wafer 41.

[0048] Before extracting silicon wafer 41, drying mechanism 14 dries the retrieving area of ​​silicon wafer 41 to ensure that retrieving mechanism 13 can extract silicon wafer 41 and improve the stability of retrieving mechanism 13 in extracting silicon wafer 41. After extracting silicon wafer 41, drying mechanism 14 also dries the entire silicon wafer 41, which helps to improve the accuracy of the film thickness test results of silicon wafer 41.

[0049] In one embodiment, see Figure 3 and Figure 4 The drying mechanism 14 includes a first air blowing assembly 141. Optionally, the first air blowing assembly 141 includes a first air blowing pipe, a first air blowing nozzle, and an air source, with one end of the first air blowing pipe connected to the first air blowing nozzle, and the other end of the first air blowing pipe connected to the air source. Of course, in other embodiments, the first air blowing assembly 141 may also include a first air blowing pipe and an air source, with the first air blowing pipe connected to the air source.

[0050] The gas stored in the gas source is nitrogen. Of course, in other embodiments, the gas stored in the gas source may also be other inert gases, and the present invention is not limited thereto.

[0051] Further, see Figure 3 and Figure 4 A first blowing assembly 141 is provided on both the first base 131 and the second base 132 on the side facing away from the drive mechanism 12. During material removal, the drive mechanism 12 drives the material removal mechanism 13 to move toward the first side 411 of the silicon wafer 41, approaching the silicon wafer 41. Then, the first blowing assembly 141 is activated. The first blowing assembly 141 on the first base 131 blows a purge gas toward the first side of the silicon wafer 41 from the first side 411 to the second side 412 to remove the cleaning liquid from the material removal area of ​​the silicon wafer 41. This ensures that the material removal mechanism 13 can pick up the silicon wafer 41 and improves the stability of the material removal mechanism 13 in picking up the silicon wafer 41. Simultaneously, the first blowing assembly 141 on the second base 132 blows a purge gas toward the second side of the silicon wafer 41 from the first side 411 to the second side 412 to remove the cleaning liquid on the second side of the silicon wafer 41.

[0052] In one embodiment, see Figure 3 、 Figure 4 and Figure 5 The drying mechanism 14 further includes a second blowing component 142 and a third blowing component 143 .

[0053] Optionally, the second air blowing assembly 142 includes a second air blowing pipe and a second air blowing nozzle, one end of the second air blowing pipe is connected to the second air blowing nozzle, and the other end of the second air blowing pipe is connected to an air source. The third air blowing assembly 143 includes a third air blowing pipe and a third air blowing nozzle, one end of the third air blowing pipe is connected to the third air blowing nozzle, and the other end of the third air blowing pipe is connected to an air source.

[0054] Further, see Figure 3 、 Figure 4 and Figure 5 The first base 131 is provided with at least one second blowing assembly 142 and at least one third blowing assembly 143. Optionally, the second blowing assembly 142 is arranged at the top of the first base 131, and the third blowing assembly 143 is arranged at the bottom of the first base 131. The second blowing assembly 142 is used to blow gas toward the top 413 of the first surface of the silicon wafer 41, and the third blowing assembly 143 is used to blow gas toward the bottom 414 of the first surface of the silicon wafer 41.

[0055] It should be noted that in the cleaning tank 21 , the silicon wafer 41 is vertically arranged in the basket 40 , such that the silicon wafer 41 has a top 413 and a bottom 414 opposite to each other.

[0056] After the silicon wafer 41 is removed, it is placed vertically between the first base 131 and the second base 132. The first air blowing assembly 141 on the first base 131 blows purge gas toward the second side 412 of the first surface of the silicon wafer 41. The second air blowing assembly 142 blows purge gas toward the top 413 of the first surface of the silicon wafer 41. The third air blowing assembly 143 blows purge gas toward the bottom 414 of the first surface of the silicon wafer 41. In this way, the first, second, and third air blowing assemblies 141, 142, and 143 on the first base 131 work together to dry the first surface of the silicon wafer 41, thereby improving the accuracy of the film thickness test results of the silicon wafer 41.

[0057] Further, see Figure 3 、 Figure 4 and Figure 5 The second base 132 is provided with at least one second blowing assembly 142 and at least one third blowing assembly 143. Optionally, the second blowing assembly 142 is arranged at the top of the second base 132, and the third blowing assembly 143 is arranged at the bottom of the second base 132. The second blowing assembly 142 blows gas toward the top 413 of the second side of the silicon wafer 41, and the third blowing assembly 143 is used to blow gas toward the bottom 414 of the second side of the silicon wafer 41.

[0058] After the silicon wafer 41 is extracted, the silicon wafer 41 is vertically arranged between the first base 131 and the second base 132, the first blowing assembly 141 on the second base 132 blows gas towards the second side 412 of the second surface of the silicon wafer 41, the second blowing assembly 142 blows gas towards the top 413 of the second surface of the silicon wafer 41, and the third blowing assembly 143 blows gas towards the bottom 414 of the second surface of the silicon wafer 41. In this way, the first blowing assembly 141, the second blowing assembly 142 and the third blowing assembly 143 on the second base 132 cooperate to dry the second surface of the silicon wafer 41, which is conducive to improving the accuracy of the film thickness test result of the silicon wafer 41.

[0059] In one embodiment, the silicon wafer extraction device 10 further comprises a camera and a PLC controller. The camera is arranged corresponding to the cleaning tank 21, and is optionally arranged directly above the cleaning tank 21, and is used to capture images in the cleaning tank 21. The PLC controller is provided with an information input part for inputting the taking position, and is in communication connection with the camera and the driving mechanism 12.

[0060] It should be noted that the taking position is determined according to the information input by the production personnel, i.e. the taking position each time can be the same position or different positions. Of course, in other embodiments, a fixed taking position can also be set.

[0061] When taking, the production personnel sets the taking position in the PLC controller through the information input part, and the PLC controller controls the lifting device 30 of the taking position to drive the flower basket 40 to rise above the liquid level of the cleaning liquid. The camera captures images in the cleaning tank 21 to determine the position of the flower basket 40 located above the liquid level of the cleaning liquid. Then, the camera sends the images to the PLC controller, and the PLC controller controls the driving mechanism 12 to act, and the driving mechanism 12 drives the taking mechanism 13 to move towards the direction close to the flower basket 40. Then, the camera captures images in the cleaning tank 21 again to determine whether the taking mechanism 13 moves to the set taking position. If the taking mechanism 13 does not reach the set taking position, the PLC controller controls the driving mechanism 12 to act according to the images until the taking mechanism 13 moves to the set taking position.

[0062] In one embodiment, referring to Figure 1 and Figure 2 , the driving mechanism 12 comprises a lifting assembly 121 and a translation assembly 122. The lifting assembly 121 is in driving connection with the rotating mechanism 16, the translation assembly 122 is in driving connection with the lifting assembly 121, and the taking mechanism 13 is in driving connection with the translation assembly 122. Optionally, the lifting assembly 121 is a lead screw module.

[0063] When extracting a silicon wafer 41, the translation assembly 122 drives the pick-up mechanism 13 to translate toward the basket 40. Once the pick-up mechanism 13 has translated into position, the lifting assembly 121 drives the translation assembly 122 and the pick-up mechanism 13 up and down, moving the pick-up mechanism 13 to a designated location on the silicon wafer 41 for removal. In this way, through the coordination of the lifting assembly 121 and the translation assembly 122, the pick-up mechanism 13 can accurately retrieve wafers from any location.

[0064] Further, see Figure 1 and Figure 2 The translation assembly 122 includes a first translation member 1221 and a second translation member 1222. The first translation member 1221 is drivingly connected to the lifting assembly 121. The second translation member 1222 is drivingly connected to the first translation member 1221, and the material picking mechanism 13 is drivingly connected to the second translation member 1222.

[0065] Optionally, the first translation member 1221 is a screw module. Of course, the first translation member 1221 can also be other components.

[0066] Optionally, the second translation member 1222 includes a cylinder and a telescopic shaft. The cylinder is connected to the screw module, one end of the telescopic shaft is connected to the cylinder, and the other end of the telescopic shaft is connected to the material removal mechanism 13. For example, the second translation member 1222 is a pneumatic cylinder, a hydraulic cylinder, or an electric cylinder.

[0067] The process of extracting silicon wafers by the silicon wafer extraction device 10 of this embodiment is as follows:

[0068] Production personnel input material removal instructions into the PLC controller through the information input unit. The material removal instructions include the material removal location and the material removal quantity. After receiving the material removal instructions, the PLC controller controls the lifting device 30 to drive the flower basket 40 upward, so that the flower basket 40 is above the liquid level of the cleaning liquid.

[0069] The silicon wafer extraction device 10 is activated, and the drive mechanism 12 drives the material retrieving mechanism 13 toward the basket 40 above the liquid level of the cleaning liquid. When the material retrieving mechanism 13 moves to the first side 411 of the silicon wafer 41, the first air blowing assembly 141 is activated, sweeping air toward the silicon wafer 41 from the first side 411 to the second side 412 of the silicon wafer 41. After the material retrieving area of ​​the silicon wafer 41 is dried, the drive mechanism 12 drives the material retrieving mechanism 13 to continue moving toward the silicon wafer 41 until the silicon wafer 41 is inserted between the first base 131 and the second base 132. The negative pressure device is activated, which draws the air between the suction surface 1311 and the silicon wafer 41 into a vacuum, thereby adsorbing the silicon wafer 41 to the suction surface 1311.

[0070] The driving mechanism 12 drives the material taking mechanism 13 to move in a direction away from the flower basket 40. Then, the lifting device 30 drives the flower basket 40 to descend into the cleaning liquid, and the flower basket 40 continues the subsequent process.

[0071] The first, second, and third blowing assemblies 141, 142, and 143 blow purge gas, drying the entire silicon wafer 41. Simultaneously, the drive mechanism 12 drives the retrieving mechanism 13 to move outside the cleaning apparatus 20. The rotating mechanism 16 rotates the drive mechanism 12 and the retrieving mechanism 13. When the retrieving mechanism 13 rotates to the sampling placement area 15, it places the silicon wafer 41 removed from the basket 40 in the sampling placement area 15. The rotating mechanism 16 then drives the drive mechanism 12 to rotate in the opposite direction, returning the retrieving mechanism 13 to its original position.

[0072] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0073] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0074] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0075] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0076] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0077] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A silicon wafer extraction device (10), characterized in that: include: base (11); A driving mechanism (12), the driving mechanism (12) being mounted on the base (11); A material taking mechanism (13), the material taking mechanism (13) being connected to the driving mechanism (12), and under the drive of the driving mechanism (12), the material taking mechanism (13) can move to the position where the flower basket (40) in the cleaning tank (21) is located to extract the silicon wafers (41) in the flower basket (40); and A rotating mechanism (16) is installed on the base (11), the rotating mechanism (16) is connected to the material taking mechanism (13), and the rotating mechanism (16) is used to drive the material taking mechanism (13) to rotate so that the material taking mechanism (13) can place the silicon wafer (41) extracted from the flower basket (40) in the sampling placement area (15).

2. The silicon wafer extraction device (10) according to claim 1, characterized in that: The material taking mechanism (13) comprises a first base (131), the first base (131) is connected to the driving mechanism (12), the first base (131) has an adsorption surface (1311) for contacting the silicon wafer (41), and the adsorption surface (1311) is provided with adsorption holes (13111).

3. The silicon wafer extraction device (10) according to claim 2, characterized in that: The driving mechanism (12) is further connected to a second substrate (132), the first substrate (131) and the second substrate (132) are arranged relative to each other, the interval between the first substrate (131) and the second substrate (132) is greater than or equal to the thickness of the silicon wafer (41), and the adsorption surface (1311) is arranged on the side of the first substrate (131) facing the second substrate (132).

4. The silicon wafer extraction device (10) according to claim 3, characterized in that: The silicon wafer (41) has a first surface and a second surface opposite to each other; The first substrate (131) and the second substrate (132) are both provided with a drying mechanism (14); the drying mechanism (14) on the first substrate (131) is used to dry the first surface of the silicon wafer (41); and the drying mechanism (14) on the second substrate (132) is used to dry the second surface of the silicon wafer (41).

5. The silicon wafer extraction device (10) according to claim 4, characterized in that: The silicon wafer (41) has a first side (411) and a second side (412) opposite to each other; The drying mechanism (14) includes a first blowing assembly (141), and the first blowing assembly (141) is provided on the side of the first substrate (131) and the second substrate (132) facing away from the driving mechanism (12). The first blowing assembly (141) on the first substrate (131) is used to blow gas toward the first side of the silicon wafer (41) along the direction from the first side (411) to the second side (412), and the first blowing assembly (141) on the second substrate (132) is used to blow gas toward the second side of the silicon wafer (41) along the direction from the first side (411) to the second side (412).

6. The silicon wafer extraction device (10) according to claim 4, characterized in that: A vertical silicon wafer (41) is accommodated between the first substrate (131) and the second substrate (132), wherein the vertical silicon wafer (41) has a top (413) and a bottom (414) opposite to each other; The drying mechanism (14) further comprises a second blowing assembly (142) and a third blowing assembly (143); the first substrate (131) is provided with at least one of the second blowing assembly (142) and at least one of the third blowing assembly (143); the second blowing assembly (142) on the first substrate (131) is used to blow gas toward the top (413) of the first surface of the silicon wafer (41); and the third blowing assembly (143) on the first substrate (131) is used to blow gas toward the bottom (414) of the first surface of the silicon wafer (41); The second substrate (132) is provided with at least one second blowing assembly (142) and at least one third blowing assembly (143), wherein the second blowing assembly (142) on the second substrate (132) blows gas toward the top (413) of the second surface of the silicon wafer (41), and the third blowing assembly (143) on the second substrate (132) is used to blow gas toward the bottom (414) of the second surface of the silicon wafer (41).

7. The silicon wafer extraction device (10) according to any one of claims 1 to 6, characterized in that: The driving mechanism (12) includes a lifting component (121) and a translation component (122), wherein the lifting component (121) is drivingly connected to the rotating mechanism (16), the translation component (122) is drivingly connected to the lifting component (121), and the material picking mechanism (13) is drivingly connected to the translation component (122).

8. The silicon wafer extraction device (10) according to claim 7, characterized in that: The translation assembly (122) includes a screw module and a cylinder body. The screw module is drivingly connected to the lifting assembly (121), and the cylinder body is drivingly connected to the screw module. The cylinder body is connected to a telescopic shaft, and the end of the telescopic shaft away from the cylinder body is connected to the material taking mechanism (13).

9. The silicon wafer extraction device (10) according to any one of claims 1 to 6, characterized in that: The silicon wafer extraction device (10) further includes a camera and a PLC controller. The camera is used to be set corresponding to the cleaning tank (21), and the camera is used to capture images in the cleaning tank (21). The PLC controller is configured with an information input unit for inputting a material extraction position. The PLC controller is communicatively connected with the camera and the drive mechanism (12), and the PLC controller is used to control the operation of the drive mechanism (12) according to the images captured by the camera.

10. A solar cell production device, characterized in that: include: A cleaning device (20), wherein the cleaning device (20) is provided with a cleaning tank (21) for containing a cleaning liquid; a lifting device (30), the lifting device (30) being arranged in the cleaning tank (21), the lifting device (30) being provided with a bearing portion (31) for placing a flower basket (40), and the lifting device (30) being used to drive the flower basket (40) to rise above the liquid level of the cleaning liquid; as well as The silicon wafer extraction device (10) according to any one of claims 1 to 9, wherein the base (11) is arranged outside the cleaning device (20), the driving mechanism (12) is used to drive the material removal mechanism (13) to move to the position where the flower basket (40) is located in the cleaning tank (21), the material removal mechanism (13) is used to extract the silicon wafers (41) in the flower basket (40), and the rotating mechanism (16) is used to drive the material removal mechanism (13) to rotate so that the material removal mechanism (13) places the silicon wafers (41) extracted from the flower basket (40) in the sampling placement area (15).

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