Packaging structure for power supply chip

Abstract

The utility model discloses a packaging structure for a power supply chip, and relates to the technical field of chip packaging. Comprising a lower shell, a circuit board body is arranged on the lower surface of the lower shell, limiting mechanisms are arranged between the front and rear positions of the lower surface of the lower shell and the circuit board body, pins are evenly embedded in the left and right side walls of the lower shell, and a first protection mechanism is arranged on the inner wall of the lower side of the lower shell; and an upper shell is fixedly installed on the upper surface of the lower shell in a hot melting mode, a second protection mechanism is fixedly installed at the position, corresponding to the first protection mechanism, of the inner wall of the upper side of the upper shell, and damping rubber pads are fixedly installed at the four corners of the upper surface of the first protection mechanism and the four corners of the lower surface of the second protection mechanism in a rectangular mode. According to the utility model, a limiting function is added between the lower shell and the circuit board main body, so that the chip is not easy to deviate after being installed, the pins are effectively prevented from being damaged, the heat dissipation performance of the lower shell and the upper shell is improved, the chip main body operates at a reasonable temperature, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a packaging structure for a power chip. Background Art

[0002] Power chip packaging is a technology that assembles the power chip and seals it in an insulator. The power chip is installed on the circuit board of the electronic equipment system and is responsible for the conversion, distribution, detection and other power management of electric energy. It is an important component in electronic equipment. The power chip cannot be installed directly on the circuit board. The power chip needs to be packaged and then the pins on the power chip are soldered to the contacts on the circuit board.

[0003] In the prior art, conventional power chip packaging structures are mostly connected and fixed between pins and circuit boards, lacking a limiting function for the power chip. When the power chip is accidentally displaced, it is easy to cause damage to the pins. In addition, due to the packaging of the power chip, the heat dissipation is poor, causing it to work at high temperatures for a long time, reducing its service life. At the same time, the chips are rigidly installed in the packaging structure and are easily damaged by bumps. Utility Model Content

[0004] The utility model provides a packaging structure for a power chip to solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a packaging structure for a power chip, comprising a lower shell, a circuit board body is provided on the lower surface of the lower shell, a limiting mechanism is provided between the front and rear positions of the lower surface of the lower shell and the circuit board body, pins are evenly embedded on the left and right side walls of the lower shell, a first protective mechanism is provided on the lower inner wall of the lower shell, an upper shell is fixedly installed on the upper surface of the lower shell by hot melting, a second protective mechanism is fixedly installed on the upper inner wall of the upper shell at a position corresponding to the first protective mechanism, shock-absorbing rubber pads are fixedly installed on the four corners of the upper surface of the first protective mechanism and the lower surface of the second protective mechanism in a rectangular shape, and a chip body is installed between the upper and lower shock-absorbing rubber pads, and the chip body is electrically connected to the pins through wires.

[0006] Furthermore, the limiting mechanism includes a rubber column and a through hole. The rubber column is fixedly installed on the lower surface of the lower shell. A through hole is opened on the circuit board body corresponding to the rubber column, and the rubber column is inserted into the through hole.

[0007] Furthermore, the first protective mechanism includes an insulating rubber pad, a metal shielding frame, a sealant and a heat dissipation copper tube. The insulating rubber pad is fixedly installed between the four inner walls of the shell. The metal shielding frame is fixedly installed on the inner wall of the insulating rubber pad. The heat dissipation copper tube is fixedly embedded between the front and rear inner walls of the lower shell on the lower surface of the metal shielding frame through sealant.

[0008] Furthermore, the insulating rubber pad and the metal shielding frame both adopt a grid structure, and the front and rear side surfaces of the heat dissipation copper tube are vertically flush with the front and rear side surfaces of the lower shell and the upper shell.

[0009] Furthermore, the second protection mechanism has the same structure as the first protection mechanism.

[0010] Furthermore, the cross section of the shock-absorbing rubber pad is an L-shaped structure.

[0011] Compared with the prior art, the present invention provides a packaging structure for a power chip, which has the following beneficial effects:

[0012] 1. The power chip packaging structure increases the limiting function between the lower shell and the circuit board body by setting a limiting mechanism, so that the chip is not easily offset after installation, effectively avoiding pin damage.

[0013] 2. The packaging structure for the power chip improves the heat dissipation and anti-electromagnetic interference performance of the lower shell and the upper shell by setting the first protection mechanism and the second protection mechanism, so that the chip body operates at a reasonable temperature and is not easily interfered by other signals, thereby extending the service life.

[0014] 3. The power chip packaging structure is installed by setting upper and lower shock-absorbing rubber pads to increase the buffering and shock-absorbing function of the chip body, avoid rigid connection between the lower shell and the upper shell, and make the chip body less likely to be damaged by collision. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Fig. 1 It is a structural diagram of the utility model;

[0016] Fig. 2 It is a cross-sectional view of the utility model;

[0017] Fig. 3 It is a top view of the utility model.

[0018] In the figure: 1. Lower shell; 2. Circuit board body; 3. Limiting mechanism; 301. Rubber column; 302. Through hole; 4. Pin; 5. First protective mechanism; 501. Insulating rubber pad; 502. Metal shielding frame; 503. Sealant; 504. Heat dissipating copper tube; 6. Upper shell; 7. Second protective mechanism; 8. Shock-absorbing rubber pad; 9. Chip body; 10. Wire. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] See also Figs. 1-3 The utility model discloses a packaging structure for a power chip, including a lower shell 1, a circuit board body 2 is provided on the lower surface of the lower shell 1, a limiting mechanism 3 is provided between the front and rear positions of the lower surface of the lower shell 1 and the circuit board body 2, pins 4 are evenly embedded on the left and right side walls of the lower shell 1, a first protective mechanism 5 is provided on the lower inner wall of the lower shell 1, an upper shell 6 is fixedly installed on the upper surface of the lower shell 1 by hot melting, a second protective mechanism 7 is fixedly installed on the upper inner wall of the upper shell 6 at a position corresponding to the first protective mechanism 5, shock-absorbing rubber pads 8 are fixedly installed on the four corners of the upper surface of the first protective mechanism 5 and the lower surface of the second protective mechanism 7 in a rectangular shape, and a chip body 9 is installed between the upper and lower shock-absorbing rubber pads 8, and the chip body 9 is electrically connected to the pins 4 through a wire 10.

[0021] Specifically, the limiting mechanism 3 includes a rubber column 301 and a through hole 302. The rubber column 301 is fixedly installed on the lower surface of the lower shell 1. The circuit board body 2 corresponding to the rubber column 301 is provided with a through hole 302, and the rubber column 301 is inserted into the through hole 302.

[0022] In this embodiment, the rubber columns 301 in the front and rear limiting mechanisms 3 are inserted into the front and rear through holes 302 on the circuit board body 2 to limit the lower housing 1 so that the lower housing 1 will not shift.

[0023] Specifically, the first protective mechanism 5 includes an insulating rubber pad 501, a metal shielding frame 502, a sealant 503 and a heat dissipation copper tube 504. The insulating rubber pad 501 is fixedly installed between the four inner walls of the shell. The metal shielding frame 502 is fixedly installed on the inner wall of the insulating rubber pad 501. The heat dissipation copper tube 504 is fixedly embedded between the front and rear inner walls of the lower shell 1 on the lower surface of the metal shielding frame 502 through the sealant 503.

[0024] In this embodiment, the insulating rubber pad 501 and the metal shielding frame 502 increase the insulation and anti-electromagnetic interference functions, and then the heat of the chip body 9 is absorbed and discharged through the heat dissipation copper tube 504, thereby achieving the heat dissipation effect of the chip body 9 and improving the heat dissipation performance of the lower shell 1.

[0025] Specifically, the insulating rubber pad 501 and the metal shielding frame 502 are both grid type structures, and the front and back sides of the heat dissipation copper pipe 504 are vertically flush with the front and back sides of the lower shell 1 and the upper shell 6.

[0026] In this embodiment, the insulating rubber pad 501 and the metal shielding frame 502 do not affect the heat absorption of the heat dissipation copper pipe 504.

[0027] Specifically, the second protection mechanism 7 has the same structure as the first protection mechanism 5.

[0028] In this embodiment, the second protection mechanism 7 improves the heat dissipation performance of the upper shell 6.

[0029] Specifically, the cross section of the shock-absorbing rubber pad 8 is L-shaped.

[0030] In this embodiment, the shock-absorbing rubber pad 8 improves the cushioning and shock-absorbing function of the chip body 9, so that the chip body 9 is not easily damaged by knocking.

[0031] In use, the lower shell 1 is placed on the upper surface of the circuit board body 2, the rubber column 301 in the front and rear limiting mechanism 3 is inserted into the through hole 302 on the front and rear of the circuit board body 2, the lower shell 1 is limited, so that the lower shell 1 does not deviate from the position, and the pin 4 is electrically connected with the circuit board body 2, the limiting function between the lower shell 1 and the circuit board body 2 is increased, so that the power chip is not easily deviated after installation, the pin 4 is effectively prevented from being damaged, the insulating rubber pad 501 and the metal shielding frame 502 in the first protection mechanism 5 increase the insulation and anti-electromagnetic interference function, the heat of the chip body 9 is absorbed and discharged by the heat dissipation copper pipe 504, the heat dissipation effect of the chip body 9 is achieved, the heat dissipation performance of the lower shell 1 is improved, and the insulation and anti-electromagnetic interference function of the upper shell 6 is improved by the second protection mechanism 7, so that the chip body 9 operates at a reasonable temperature and is not easily interfered by other signals, the service life is prolonged, the chip body 9 is installed by the upper and lower shock-absorbing rubber pads 8, the cushioning and shock-absorbing function of the chip body 9 is increased, the rigid connection between the chip body 9 and the lower shell 1 and the upper shell 6 is avoided, and the chip body 9 is not easily damaged by knocking.

[0032] In summary, the power chip packaging structure increases the limiting function between the lower shell 1 and the circuit board body 2, so that the chip is not easily deviated after installation, the pin 4 is effectively prevented from being damaged, the heat dissipation performance of the lower shell 1 and the upper shell 6 is improved, the chip body 9 operates at a reasonable temperature, and the service life of the chip body 9 is prolonged.

[0033] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A packaging structure for a power chip, comprising a lower housing (1), characterized in that: A circuit board body (2) is provided on the lower surface of the lower shell (1), a limiting mechanism (3) is provided between the front and rear positions of the lower surface of the lower shell (1) and the circuit board body (2), pins (4) are evenly embedded on the left and right side walls of the lower shell (1), a first protective mechanism (5) is provided on the lower inner wall of the lower shell (1), an upper shell (6) is fixedly installed on the upper surface of the lower shell (1) by hot melting, a second protective mechanism (7) is fixedly installed on the upper inner wall of the upper shell (6) at a position corresponding to the first protective mechanism (5), a shock-absorbing rubber pad (8) is fixedly installed at the four corners of the upper surface of the first protective mechanism (5) and the lower surface of the second protective mechanism (7), and a chip body (9) is installed between the upper and lower shock-absorbing rubber pads (8), and the chip body (9) is electrically connected to the pins (4) through a wire (10).

2. The power chip packaging structure according to claim 1, wherein: The limiting mechanism (3) comprises a rubber column (301) and a through hole (302); the rubber column (301) is fixedly mounted on the lower surface of the lower shell (1); a through hole (302) is provided on the circuit board body (2) corresponding to the rubber column (301), and the rubber column (301) is inserted into the through hole (302).

3. The packaging structure for a power chip according to claim 1, wherein: The first protection mechanism (5) comprises an insulating rubber pad (501), a metal shielding frame (502), a sealant (503) and a heat dissipation copper tube (504); the insulating rubber pad (501) is fixedly mounted between the four inner walls of the shell; the metal shielding frame (502) is fixedly mounted on the inner wall of the insulating rubber pad (501); and the heat dissipation copper tube (504) is fixedly embedded between the front and rear inner walls of the lower shell (1) on the lower surface of the metal shielding frame (502) via the sealant (503).

4. The power chip packaging structure according to claim 3, wherein: The insulating rubber pad (501) and the metal shielding frame (502) both adopt a grid structure, and the front and rear side surfaces of the heat dissipation copper tube (504) are vertically aligned with the front and rear side surfaces of the lower shell (1) and the upper shell (6).

5. The packaging structure for a power chip according to claim 1, characterized in that: The second protection mechanism (7) has the same structure as the first protection mechanism (5).

6. The power chip packaging structure according to claim 1, wherein: The cross section of the shock-absorbing rubber pad (8) is an L-structure.

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