Structure capable of increasing fixing performance of side-standing antenna

Abstract

The utility model relates to a structure capable of increasing the connectivity of a side vertical antenna. The structure comprises an antenna structure and a main board, the antenna structure comprises a circuit board, an electrode layer and at least one half-hole electrode layer, and the electrode layer and the half-hole electrode layer are arranged on the circuit board. The mainboard is at least provided with a first bonding pad and a second bonding pad. Wherein the first electrode layer and the second electrode layer of the electrode layer and the half-hole electrode layer on the circuit board are electrically and fixedly connected with the first bonding pad and the second bonding pad. When the antenna structure is welded with the main board, the welding stability and stability of the antenna structure can be improved, the antenna structure is prevented from moving and deviating in the surface mounting technology manufacturing process, the number of bonding pads for grabbing the antenna structure body can be increased, and the falling problem in the falling process is solved.

Description

Technical Field

[0001] The present application relates to an antenna, and more particularly to a structure that can increase the solidity of a side-standing antenna. Background Art

[0002] With the increasing popularity of the internet and people's growing reliance on it, a growing number of connected devices have been developed, including Wi-Fi products, network communication products, the Internet of Things (IoT), network cameras (IP CAMs), routers, and modems. The antenna structures used in these devices are mostly made by etching copper foil on a circuit board to create different radiating layer patterns for signal reception and transmission.

[0003] The antenna structure currently used in the aforementioned devices is soldered sideways to the motherboard of the electronic device. When soldering the antenna structure to the motherboard, the electrode layer on the antenna structure's circuit board is soldered to the motherboard's solder pads, and then the antenna structure is soldered sideways to one side of the circuit board.

[0004] During motherboard manufacturing, the copper foil on the motherboard is etched into large, square pads. Because the pads are solid squares of copper foil, if the antenna structure shifts during surface mount technology (SMT) soldering, the solid copper pads on the motherboard will not securely bond the antenna structure. This can cause the antenna structure to lose its secure connection to the motherboard, potentially causing it to fall off if dropped. This creates manufacturing difficulties and can lead to poor contact or short circuits in the finished product.

[0005] Therefore, how to improve the side-standing antenna structure during the soldering process with the motherboard so that the antenna structure does not move or deviate when it is dropped, and how to ensure that the solder pads on the motherboard can firmly fix the antenna structure, is the main issue to be solved by this application. Utility Model Content

[0006] Therefore, the main purpose of this application is to solve the traditional deficiencies. This application redesigns the soldering pads on the motherboard. During the soldering process between the antenna structure and the motherboard, the soldering stability and firmness of the antenna structure can be increased, preventing the antenna structure from shifting during surface mount technology (SMT) production. The soldering pads can also be increased to firmly grasp or fix the antenna structure body, thereby improving the problem of falling when it falls.

[0007] To achieve the above object, the present application provides a structure for increasing the fixation of a side-standing antenna, comprising an antenna structure and a main board. The antenna structure comprises a circuit board, an electrode layer, and at least one half-hole electrode layer. The circuit board is a square body with a front surface, a back surface, a top edge, a bottom edge, and two side edges. The electrode layer comprises a first electrode layer and a second electrode layer, which are arranged on the front surface and the back surface of the circuit board and located at the intersection of the bottom edge and the front surface and the back surface. The half-hole electrode layer is arranged on the bottom edge of the circuit board and electrically connected to the first electrode layer and the second electrode layer of the front surface and the back surface of the circuit board through the bottom edge. The main board has at least a first pad and a second pad. The first electrode layer, the second electrode layer, and the half-hole electrode layer are electrically connected to the first pad and the second pad.

[0008] In an embodiment of the present application, the first pad and the second pad are in the shape of an I or a horizontally lying H.

[0009] In an embodiment of the present application, the first pad and the second pad each have two parallel horizontal lines, and a vertical line electrically connected between the two horizontal lines. The first electrode layer and the second electrode layer of the front surface and the back surface of the circuit board are electrically connected to the two parallel horizontal lines of the first pad and the second pad, and the half-hole electrode layer is electrically connected to the vertical line.

[0010] In an embodiment of the present application, another half-hole electrode layer is arranged on the bottom edge of the circuit board to form two adjacent half-hole electrode layers.

[0011] In an embodiment of the present application, the first pad and the second pad are in the shape of Roman numeral II.

[0012] In an embodiment of the present application, the first pad and the second pad each have two parallel horizontal lines, and two vertical lines electrically connected between the two horizontal lines. The first electrode layer and the second electrode layer of the front surface and the back surface of the circuit board are electrically connected to the two parallel horizontal lines of the first pad and the second pad, and the two adjacent half-hole electrode layers are electrically connected to the two vertical lines.

[0013] In an embodiment of the present application, a side edge half-hole electrode layer is arranged on the bottom edge of the circuit board, and the side edge half-hole electrode layer is located at the corner of the bottom edge and a side edge.

[0014] In an embodiment of the present application, the first pad and the second pad each have two parallel horizontal lines, and a vertical line electrically connected between the two horizontal lines, and another side edge vertical line is connected to one end of the two horizontal lines.

[0015] In an embodiment of the present application, the first and second electrode layers of the front and back surfaces of the circuit board are electrically connected to the two parallel horizontal lines of the first and second pads, and the half-hole electrode layer and the side half-hole electrode layer are electrically connected to the vertical line and the side vertical line.

[0016] In an embodiment of the present application, the front and back surfaces of the circuit board have different pattern shapes of radiation layers, which include high-frequency radiation layers or low-frequency radiation layers, or high-frequency radiation layers and low-frequency radiation layers.

[0017] In an embodiment of the present application, the front and back surfaces of the main board each have a first ground layer, a second ground layer, a first clearance area, and a second clearance area; the first and second pads are disposed on the first clearance area of the main board, and the first and second pads are electrically fixed to the first and second electrode layers, respectively; in addition, the front surface of the main board has a signal feed layer coupled to the first ground layer, and the signal feed layer is electrically connected to the first pad. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is an exploded schematic view of an antenna structure and a main board of a first embodiment of the present application;

[0019] Figure 2 is an exploded schematic view of an antenna structure and a main board of Figure 1 from another perspective;

[0020] Figure 3 is a combined schematic view in perspective of Figure 1 ;

[0021] Figure 4 is a combined schematic view in perspective of Figure 2 ;

[0022] Figure 5 is an exploded schematic view of an antenna structure and a main board of a second embodiment of the present application;

[0023] Figure 6 is an exploded schematic view of an antenna structure and a main board of Figure 5 from another perspective;

[0024] Figure 7 is an exploded schematic view of an antenna structure and a main board of a third embodiment of the present application;

[0025] Figure 8 is an exploded schematic view of an antenna structure and a main board of Figure 7 from another perspective;

[0026] In the drawings:

[0027] 10: antenna structure

[0028] 1: circuit board

[0029] 11: front side

[0030] 12: back side

[0031] 13: top side

[0032] 14: bottom side

[0033] 15: side side

[0034] 2: electrode layer

[0035] 21: first electrode layer

[0036] 22: second electrode layer

[0037] 3, 3a: half-hole electrode layer

[0038] 3b: side half-hole electrode layer

[0039] 20: main board

[0040] 201: first ground layer

[0041] 202: second ground layer

[0042] 203: first clearance

[0043] 204: second clearance

[0044] 205: first pad

[0045] 2051: horizontal line

[0046] 2052: vertical line

[0047] 2053: side vertical line

[0048] 206: second pad

[0049] 207: signal feed-in layer DETAILED DESCRIPTION

[0050] The technical content and detailed description of the present application are described as follows in conjunction with the accompanying drawings:

[0051] Please refer to Figures 1-4 is the exploded schematic diagram of the antenna structure and the main board of the first embodiment of the present application, Figure 1 is the exploded schematic diagram of the antenna structure and the main board from another perspective, Figure 1 is the three-dimensional combined schematic diagram, and Figure 2As shown in the figure: The structure of the present application for increasing the solidity of the side-standing antenna includes an antenna structure 10 and a main board 20. The antenna structure 10 includes: a circuit board 1, an electrode layer 2 and a semi-hole electrode layer 3.

[0052] The circuit board 1 is a rectangular solid having a front surface 11, a back surface 12, a top edge 13, a bottom edge 14, and two side edges 15. Radiating layers (not shown) with different patterns are located on the front surface 11 and back surface 12. These radiating layers may include high-frequency radiating layers, low-frequency radiating layers, or both high-frequency and low-frequency radiating layers, for receiving and transmitting signals. In this figure, the circuit board 1 is a printed circuit board.

[0053] The electrode layer 2 is disposed on the front surface 11 and back surface 12 of the circuit board 1, and is located at the intersection of the bottom edge 14 with the front surface 11 and back surface 12. The electrode layer 2 is electrically connected to the radiating layer. The electrode layer 2 includes a first electrode layer 21 and a second electrode layer 22. The first electrode layer 21 and the second electrode layer 22 provide electrical connection to the first solder pad 205 and the second solder pad 206 on the mainboard 20.

[0054] The semi-hole electrode layer 3 is disposed on the bottom edge 14 of the circuit board 1 and extends through the bottom edge of the circuit board 1, electrically connecting the semi-hole electrode layer 3 to the first electrode layer 21 and the second electrode layer 22 on the front surface 11 and the back surface 12 of the circuit board 1, respectively. In the present figure, the semi-hole electrode layer 3 is semicircular, semi-elliptical, or polygonal in shape.

[0055] It is worth mentioning that the design of the semi-hole electrode layer 3 reduces the production cost of the antenna structure 10, and can electrically connect the antenna structure 10 to the first solder pad 205 and the second solder pad 206 on the motherboard 20 without destroying the original structure of the motherboard 20.

[0056] When the antenna structure 10 of the present application is used with a motherboard 20 of an electronic device, the front and back surfaces of the motherboard 20 each have a symmetrical first ground layer 201, a second ground layer 202, a first clear area 203, and a second clear area 204. The first clear area 203 of the motherboard 20 has a first solder pad 205 and a second solder pad 206. Furthermore, a signal feed layer 207 coupled to the first ground layer 201 is provided on the front surface of the motherboard 20. The signal feed layer 207 is electrically connected to the first solder pad 205. Furthermore, the second solder pad 206 can be electrically connected to the first ground layer 201 via a matching component (not shown) to adjust the antenna's frequency characteristics.

[0057] It is worth noting that the first solder pad 205 and the second solder pad 206 of the present application are both in an I-shape or a horizontal H-shape. The first solder pad 205 (the second solder pad 206) each has two parallel horizontal lines 2051, and the two horizontal lines 2051 are electrically connected to a vertical line 2052 that is perpendicular to the two horizontal lines 2051. When the antenna structure 10 is electrically connected to the first solder pad 205 and the second solder pad 206 of the motherboard 20, the first electrode layer 21 and the second electrode layer 22 on the front surface 11 and the back surface 12 of the circuit board 1 are electrically connected to the two parallel horizontal lines 2051 of the first solder pad 205 and the second solder pad 206, respectively, and the two half-hole electrode layers 3 are electrically connected to the vertical lines 2052.

[0058] The design of the first solder pad 205 and the second solder pad 206 of the motherboard 20 can increase the welding stability and firmness of the antenna structure 10, preventing the antenna structure 10 from shifting during surface mount technology (SMT) manufacturing. The first solder pad 205 and the second solder pad 206 can also firmly grasp or fix the antenna structure 10 body, thereby improving the problem of falling when it falls.

[0059] See also Figure 5 、 6 , is a schematic diagram of the antenna structure and the mainboard of the second embodiment of the present application. Figure 5 Another perspective of the antenna structure and the decomposition diagram of the motherboard, refer to Figures 1-4 As shown in the figure, the antenna structure 10 and the mainboard 20 of this embodiment are substantially the same as those of the first embodiment. The difference is that another half-hole electrode layer 3a is added to the bottom edge 14 of the circuit board 1 of the antenna structure 10 to form a design of two adjacent half-hole electrode layers 3 and 3a. The two half-hole electrode layers 3 and 3a are respectively electrically connected to the first electrode layer 21 and the second electrode layer 22 on the front side 11 and the back side 12 of the circuit board 1.

[0060] In contrast, the first solder pad 205 (second solder pad 206) of the mainboard 20 is shaped like the Roman numeral II. Each of the first solder pad 205 (second solder pad 206) has two parallel horizontal lines 2051, electrically connected to two vertical lines 2052 perpendicular to the horizontal lines 2051. When the antenna structure 10 is electrically connected to the first solder pad 205 and the second solder pad 206 of the mainboard 20, the first electrode layer 21 and the second electrode layer 22 on the front surface 11 and back surface 12 of the circuit board 1 are electrically connected to the two parallel horizontal lines 2051 of the first solder pad 205 and the second solder pad 206, respectively, while the two semi-hole electrode layers 3 and 3a are electrically connected to the two vertical lines 2052.

[0061] Similarly, the design of the first solder pad 205 and the second solder pad 206 of the motherboard 20 can increase the welding stability and firmness of the antenna structure 10, preventing the antenna structure 10 from shifting during surface mount technology (SMT) manufacturing, and can also increase the first solder pad 205 and the second solder pad 206 to firmly grasp or fix the antenna structure 10 body, thereby improving the problem of falling when it falls.

[0062] See also Figure 7 、 8 , is a schematic diagram of the antenna structure and the mainboard of the third embodiment of the present application. Figure 7 Another perspective of the antenna structure and the decomposition diagram of the motherboard, refer to Figures 1-6 As shown in the figure, the antenna structure 10 and mainboard 20 of this embodiment are substantially the same as those of the first and second embodiments. The difference is that a side half-hole electrode layer 3b is additionally provided on the bottom edge 14 of the circuit board 1 of the antenna structure 10. The side half-hole electrode layer 3b is located at the corner of the bottom edge 14 and the side edge 15. The half-hole electrode layer 3 and the side half-hole electrode layer 3b are electrically connected to the first electrode layer 21 and the second electrode layer 22 on the front side 11 and the back side 12 of the circuit board 1, respectively.

[0063] At the same time, the first pad 205 (second pad 206) of the mainboard 20 each has two parallel horizontal lines 2051, a vertical line 2052 electrically connected to the two horizontal lines 2051, and a side vertical line 2053 connected to one end of the two horizontal lines 2051. When the antenna structure 10 is electrically connected to the first pad 205 and the second pad 206 of the mainboard 20, the first electrode layer 21 and the second electrode layer 22 on the front surface 11 and the back surface 12 of the circuit board 1 are electrically connected to the two parallel horizontal lines 2051 of the first pad 205 and the second pad 206, respectively, while the half-hole electrode layer 3 and the side half-hole electrode layer 3b are electrically connected to the vertical lines 2052 and the side vertical lines 2053.

[0064] Similarly, the design of the first solder pad 205 and the second solder pad 206 of the motherboard 20 can increase the welding stability and firmness of the antenna structure 10, prevent the antenna structure from shifting during surface mount technology (SMT) manufacturing, and also increase the first solder pad 205 and the second solder pad 206 to firmly grasp or fix the antenna structure 10 body, thereby improving the problem of falling when it falls.

[0065] However, the above description is only a preferred embodiment of the present application and is not intended to limit the scope of patent protection of the present application. Therefore, any equivalent changes made by using the contents of the description or drawings of the present application are also included in the scope of protection of the present application and are hereby stated.

Claims

1. A structure for increasing the connection strength of a side-standing antenna, characterized in that: include: An antenna structure and a main board; The antenna structure comprises: A circuit board is in the shape of a square and has a front surface, a back surface, a top edge, a bottom edge and two side edges; an electrode layer comprising a first electrode layer and a second electrode layer, wherein the first electrode layer and the second electrode layer are disposed on the front and back surfaces of the circuit board and are located at the intersection of the bottom edge and the front and back surfaces; At least one half-hole electrode layer is respectively provided on the bottom edge of the circuit board and penetrates the bottom edge to be electrically connected to the first electrode layer and the second electrode layer on the front side and the back side of the circuit board respectively; and The mainboard at least comprises: a first soldering pad and a second soldering pad; The first electrode layer, the second electrode layer and the half-hole electrode layer are electrically fixed to the first pad and the second pad.

2. The structure for increasing the solidity of a side-standing antenna according to claim 1, wherein: The first pad and the second pad are in an I-shape or a horizontal H-shape.

3. The structure for increasing the solidity of a side-standing antenna according to claim 2, wherein: The first soldering pad and the second soldering pad respectively have two parallel horizontal lines, and the two horizontal lines are electrically connected to a vertical line perpendicular to the two horizontal lines. The first electrode layer and the second electrode layer on the front and back of the circuit board are respectively electrically connected to the two parallel horizontal lines of the first soldering pad and the second soldering pad, and the half-hole electrode layer is electrically connected to the vertical line.

4. The structure for increasing the solidity of a side-standing antenna according to claim 1, wherein: Another half-hole electrode layer is respectively provided on the bottom edge of the circuit board to form two adjacent half-hole electrode layers.

5. The structure for increasing the solidity of a side-standing antenna according to claim 4, wherein: The first pad and the second pad are in the shape of Roman numeral II.

6. The structure for increasing the solidity of a side-standing antenna according to claim 5, wherein: The first soldering pad and the second soldering pad respectively have two parallel horizontal lines, and the two horizontal lines are electrically connected to two vertical lines that are perpendicular to the two horizontal lines. The first electrode layer and the second electrode layer on the front and back of the circuit board are respectively electrically connected to the two parallel horizontal lines of the first soldering pad and the second soldering pad, and the two adjacent half-hole electrode layers are electrically connected to the two vertical lines.

7. The structure for increasing the solidity of a side-standing antenna according to claim 1, wherein: A side half-hole electrode layer is additionally provided on the bottom edge of the circuit board, and the side half-hole electrode layer is located at the corner of the bottom edge and the side edge.

8. The structure for increasing the solidity of a side-standing antenna according to claim 7, wherein: The first pad and the second pad each have two parallel horizontal lines. The two horizontal lines are electrically connected to a vertical line perpendicular to the two horizontal lines. One end of the two horizontal lines is connected to another side vertical line.

9. The structure for increasing the solidity of a side-standing antenna according to claim 8, wherein: The first electrode layer and the second electrode layer on the front and back sides of the circuit board are electrically connected to the two horizontal lines parallel to the first pad and the second pad, respectively, and the half-hole electrode layer and the side half-hole electrode layer are electrically connected to the vertical line and the side vertical line.

10. The structure for increasing the solidity of a side-standing antenna according to claim 1, wherein: The front and back surfaces of the circuit board respectively have radiation layers with different pattern shapes, and the radiation layers include high-frequency radiation layers or low-frequency radiation layers, or high-frequency radiation layers and low-frequency radiation layers.

11. The structure for increasing the solidity of a side-standing antenna according to claim 1, wherein: The front and back sides of the motherboard each include a symmetrical first ground layer, a second ground layer, a first clearance area, and a second clearance area; the first clearance area of ​​the motherboard has the first solder pad and the second solder pad, and the first solder pad and the second solder pad are electrically fixed to the first electrode layer and the second electrode layer, respectively; the front side of the motherboard has a signal feed layer coupled to the first ground layer, and the signal feed layer is electrically connected to the first solder pad.

Images