Pumping source device for laser

Abstract

The utility model provides a pumping source device for a laser, which relates to the technical field of laser welding, and comprises a core copper assembly and an aluminum shell assembly, the core copper assembly integrates a heat dissipation structure and a chip working structure into a whole, and the overall structure ensures the stability of the strength and the size in high heat and high water pressure states. The size deformation of the working surface is within 3 microns; no other materials are used for blocking, the heat conduction efficiency of a working area is improved, T2 red copper is used, the process stability of nickel plating and gold plating is facilitated, and therefore the high reliability of a core assembly is achieved; the upper and lower aluminum covers adopt a micro-arc oxidation treatment process to form an appearance surface of which the coloring reflectivity is lower than 2.5%, so that the interference on a laser light path can be reduced to the greatest extent; the core copper assembly and the aluminum shell part are fastened through screws to form a pumping source finished body for the laser, the heat conductivity is high, heat dissipation is uniform, and the structure can be used for preparing a single-chip 32-55W high-power high-performance high-reliability pumping source for the laser.

Description

Technical Field

[0001] The utility model relates to the technical field of laser welding, and specifically provides a pump source device for a laser. Background Art

[0002] Existing laser pump source structures fall into two main categories: the first, a pure copper chip working structure combined with an aluminum-based water-cooling plate; and the second, a copper-aluminum composite integral structure. However, these laser pump sources still have the following disadvantages: The first, a pure copper chip working structure combined with an aluminum-based water-cooling plate, has poor thermal conductivity due to the separate heating element and cooling plate components, making it suitable only for low-power pump sources. The overall design is complex, consisting of multiple pump sources connected in series. This makes it difficult to simplify high-power lasers, leading to high costs.

[0003] The second type, the copper-aluminum composite integrated structure has solved the problem of simplifying the design structure and greatly improving the cooling efficiency. However, in the working environment of the chip and during the preparation process, the expansion coefficients of copper and aluminum are inconsistent, resulting in insufficient dimensional stability of the chip working surface and the possibility of variation, or better process control conditions are required to meet the above requirements, resulting in high costs; it is difficult to resolve the process contradictions of nickel plating and gold plating on the surface of copper parts and anodizing treatment on the surface of aluminum parts during the overall surface treatment, which either leads to low reliability yield of nickel plating and gold plating, or causes the anodizing treatment of aluminum to fail reliability tests, such as 24h neutral salt spray, high temperature and high humidity, high temperature baking, hot and cold shock, alcohol resistance test, 3M coating peeling test and other performance requirements. The overall process yield is not high, which leads to high costs.

[0004] Accordingly, the art requires a new laser pump source device and preparation method to solve the above technical problems. Utility Model Content

[0005] The utility model aims to solve the above technical problem, that is, to solve the problem that the existing pump source device has poor cooling effect and high cost.

[0006] In a first aspect, the present invention provides a pump source device for a laser, the pump source device comprising a core copper component and an aluminum shell component, wherein;

[0007] The core copper component includes a chip workbench, a first connecting plug and a second connecting plug, and a plurality of working chip groups are arranged and distributed on the chip workbench; the vertical direction of the working chip groups is the first direction, and the horizontal direction of the working chip groups is the second direction; a cooling water channel is formed in the chip workbench, and two adjacent cooling water channel openings are provided with connected countersunk holes, and the cooling water channels are correspondingly arranged directly below the working chip groups, and the cooling water channels pass through the chip workbench along the first direction, and a plurality of cooling water channels are formed in groups along the second direction; the first connecting plug connects and seals the adjacent cooling water channels, and the second connecting plug connects and seals the adjacent cooling water channels, and the first connecting plug and the second connecting plug are staggered so that water flows in the plurality of plug cooling water channels in sequence;

[0008] The aluminum housing assembly is configured to wrap the chip workbench to provide protection and support for the chip workbench and assembly of other structural parts.

[0009] The aforementioned structural setup, combined with a core copper component and aluminum housing, effectively improves the heat dissipation efficiency of the laser pump source. A cooling water channel, located directly below the active chipset and running through the chip workbench, allows the cooling water to quickly dissipate the chipset's heat during operation, maintaining a stable operating temperature and enhancing the device's operational stability.

[0010] In the preferred technical solution of the above-mentioned laser pump source device, the cooling water channel can be set as multiple water supply pipes corresponding to directly below the working chip group, and the multiple water supply pipes are connected by a U-shaped connecting pipe to form an M-shaped curved folding structure, or the cooling water channel can also be set to occupy an independent cooling space inside the entire chip workbench, and the two sides of the cooling space are respectively sealed by the first connecting plug and the second connecting plug, and the first connecting plug and the second connecting plug are small copper parts with a circular arc contour design.

[0011] Based on the above structural setting, if the cooling water channel is an M-shaped structure composed of multiple water supply pipes, the water circulation in multiple curved water supply pipes improves the fluidity of the cooling water, thereby improving the heat dissipation efficiency. If the cooling water channel is set as a whole in the chip workbench, the structural complexity is reduced and the production efficiency is improved. In summary, the flexible use of multiple structures in this application greatly improves the scope of application of the overall device.

[0012] In the preferred technical solution of the above-mentioned laser pump source device, the aluminum shell assembly includes an upper shell and a lower shell. The upper shell is wrapped and arranged on the upper side of the chip workbench where the working chipset is set. The area of ​​the upper shell corresponding to the working chipset is arranged into an open structure so that the working chipset can contact the outside world; the lower shell is wrapped and arranged on the lower side of the chip workbench, and the upper shell and the lower shell are fixed and installed by bolts.

[0013] Based on this structural setup, the chip workbench is enclosed in an upper and lower shell. The upper shell's opening allows the chipset to be directly connected to other components. Bolts secure the upper and lower shells, enhancing the device's structural stability and ensuring the pump source's safety in various operating environments.

[0014] In the preferred technical solution of the above-mentioned laser pump source device, the cross-section of the cooling water channel is a circular, serrated or irregular hole structure, and the first connecting plug and the second connecting plug are set to a circular, serrated or irregular structure corresponding to the cooling water channel.

[0015] Based on the above structural setting, the cross-section of the cooling water channel is designed as a circular or serrated or special-shaped hole structure, which increases the contact area between water and the cooling water channel, that is, the effective heat dissipation area of ​​the cooling water channel is increased, thereby improving the heat dissipation efficiency.

[0016] In the preferred technical solution of the above-mentioned laser pump source device, the core copper component also includes a water inlet and a water outlet, the water inlet is arranged on one side of the chip workbench, and the water inlet is connected to the first end of the cooling water channel on one edge side; the water outlet is arranged on the other side of the chip workbench, and the water outlet is connected to the first end of the cooling water channel on the other edge side.

[0017] Based on the above structural setting, by setting water inlet and outlet on both sides of the chip workbench, a design is realized in which cooling water enters from one side and flows out from the other side, so that the water flow can run through the entire working chipset area, ensuring uniform distribution and timely dissipation of heat, and improving the overall cooling efficiency of the device.

[0018] In the preferred technical solution of the above-mentioned laser pump source device, the water inlet end, the cooling water channel, the first connecting plug channel, the second connecting plug channel and the water outlet end are combined to form an M-shaped flow channel structure.

[0019] Based on the above structural setting, the M-shaped flow channel structure design of the water inlet, cooling water channel, first connecting plug channel, second connecting plug channel and water outlet end optimizes the water flow path, so that the cooling water can be fully circulated in the chip workbench, further improving the heat dissipation effect and ensuring long-term stable operation of the device.

[0020] In a second aspect, the present invention provides a preparation method for the laser pump source device described in any one of the above items, the preparation method comprising the following steps:

[0021] S1: The copper block is mechanically added to the chip workbench shape, and the flow channel holes are processed by deep hole drilling;

[0022] S2: Welding the processed copper block and the copper plug to form a chip workbench with a cooling water channel;

[0023] S3: The welded chip workbench is machined and milled to form a high-precision working chip set installation position;

[0024] S4: The working chip group mounting position of the core copper component after structural processing is subjected to sandblasting surface treatment, and then the core copper component is nickel-plated as a whole, and the chip working surface is partially gold-plated;

[0025] S5: Machining the aluminum upper shell and the aluminum lower shell to form a high-precision assembly size structure;

[0026] S6: After the aluminum upper shell and the aluminum lower shell that have been structurally processed are degreased and cleaned, the entire surface is subjected to micro-arc oxidation treatment;

[0027] S7: Assemble the surface-treated core copper component, the aluminum upper shell, and the aluminum lower shell together to form a complete laser pump source.

[0028] Based on the above structural setting, the preparation method has rigorous steps, which enables the processing, welding, assembly and other processes of the copper material to be precisely controlled, thereby improving the overall manufacturing accuracy of the device and ensuring the cooling performance and working stability of the pump source device.

[0029] In the preferred technical solution of the above preparation method, in step S1, the deep hole drill uses an internally cooled drill bit.

[0030] Based on the above structural setting, the use of internal cooling drill bits for deep hole drilling improves processing efficiency and flow channel smoothness, can effectively reduce the heat and debris generated during the drilling process, improve processing efficiency and accuracy, ensure the smoothness and consistency of the cooling water channel, and provide a reliable channel for the subsequent cooling system.

[0031] In the preferred technical solution of the above preparation method, in step S4, the chip workbench roughness is maintained at Ra0.4-0.8 by sandblasting surface treatment, and then the entire nickel plating is used to prevent the product from being oxidized and serve as a connecting layer for subsequent local gold plating. Then, local gold plating is performed on the working chipset installation position for welding and assembling the subsequent working chipset.

[0032] Based on the above structural setting, the surface roughness of the chip workbench is maintained at Ra0.4-0.8 through sandblasting, and then the entire nickel plating and local gold plating are performed. This not only improves the reliability of the installation position of the working chipset, but also effectively prevents the oxidation corrosion of the copper material, thereby improving the durability and performance stability of the pump source device.

[0033] In the preferred technical solution of the above preparation method, in step S2, the chip workbench and the cooling water channel are both made of T2 copper.

[0034] Based on the above structural settings, T2 copper material is used to manufacture the chip workbench and cooling water channels, which ensures the high thermal conductivity and corrosion resistance of the components, significantly improves the heat dissipation efficiency of the device, and extends the service life of the pump source device.

[0035] In summary, the present invention forms a cooling water channel by drilling holes below the working chipset. The cooling water channel is connected to a first connecting plug and a second connecting plug made of the same material to form an "M"-shaped coolant circulation channel in the chip working area. After the core copper component is assembled with the aluminum upper and lower shells, the coolant inlet and outlet of the pump source are connected to the external coolant supply system through threads, forming a single T2 copper heat dissipation and heat exchange fully enclosed cooling circulation system, which solves the problems of water electrolysis, microbial growth, and flow channel oxidation or corrosion during coolant use.

[0036] The core copper components are made of T2 copper, a high-heat dissipation material. The water supply pipes are made into round hole / sawtooth shapes to further improve heat dissipation efficiency while meeting the flow resistance requirements.

[0037] The heat dissipation structure is integrated with the chip workbench structure. The overall structure ensures the stability of strength and size under heat and pressure conditions. Without other materials blocking it, the heat conduction and evacuation efficiency of the working area is increased.

[0038] The cooling circulation channel and the chip workbench are connected by the same material, which avoids electrolytic corrosion in the circulation system and increases service life;

[0039] The core copper components are designed in an integrated manner and use T2 copper, which is conducive to the process stability of nickel and gold plating on the surface, thereby achieving high reliability of the core components;

[0040] The aluminum upper and lower shells are treated with micro-arc oxidation to form a colored surface with a reflectivity of less than 2.5%, which can minimize the interference of the cover on the laser light path. The excellent performance greatly improves the service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0042] The preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:

[0043] Figure 1 Shows a schematic diagram of the overall structure of the utility model;

[0044] Figure 2 A schematic diagram of the combined structure of the chip workbench, the first connecting plug, and the second connecting plug of the present invention is shown;

[0045] Figure 3 Shown is a flow chart of the preparation method of the utility model;

[0046] Figure 4 Shown is a schematic diagram of the specific structure of Example 2 of the present utility model.

[0047] Reference numerals:

[0048] 1. Working chipset; 2. Chip workbench; 3. Water outlet; 4. Cooling water channel; 5. First connecting plug; 6. Water inlet; 7. Second connecting plug; 8. Upper shell; 9. Lower shell; 10. U-shaped tube. DETAILED DESCRIPTION

[0049] The following describes preferred embodiments of the present invention with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely intended to illustrate the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art may adjust these embodiments as needed to suit specific applications.

[0050] It should be noted that in the description of this utility model, terms such as "center," "upper," "lower," "left," "right," "inner," and "outer" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is merely for ease of description and does not indicate or imply that the structure described must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, it should not be understood as limiting the utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be understood to indicate or imply relative importance.

[0051] Furthermore, it should be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "connected," "connected," and "connection" should be understood in a broad sense. For example, they can refer to fixed connections or detachable connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0052] The utility model provides a pump source device for laser, which includes a core copper component and an aluminum shell component, wherein;

[0053] like Figure 2 As shown, the core copper component includes a chip workbench 2, a first connecting plug 5 and a second connecting plug 7. It should be noted that the present invention does not impose any restrictions on the specific structure of the chip workbench 2. Those skilled in the art can set it according to their needs. For example, the chip workbench 2 can be a circular table. For another example, the chip workbench 2 can also be a square table, as long as the chip workbench 2 is large enough to accommodate the structure required by the overall device. There are multiple working chip groups 1 arranged and distributed on the chip workbench 2; the vertical direction of the working chip group 1 is the first direction, and the horizontal direction of the working chip group 1 is the second direction; a cooling water channel 4 is formed in the chip workbench 2, and two adjacent cooling water channel 4 openings are provided with connected countersunk holes, and the cooling water channel 4 is correspondingly arranged directly below the working chip group 1, and the cooling water channel 4 passes through the chip workbench 2 along the first direction, and multiple cooling water channels 4 are formed in groups along the second direction; the first connecting plug 5 connects and seals the adjacent cooling water channels 4, and the second connecting plug 7 connects and seals the adjacent cooling water channels 4. The first connecting plug 5 and the second connecting plug 7 are staggered so that water flows in multiple cooling water channels 4 in sequence; the aluminum shell assembly is arranged and installed on the outside of the chip workbench 2 to provide protection and support for the chip workbench 2.

[0054] It should be noted that the present invention does not impose any restrictions on the specific structure of the cooling water channel 4. Those skilled in the art can customize it according to their needs. For example, the cooling water channel 4 can be a curved structure, or a linear structure, as long as the water in the cooling water channel 4 can flow directly under each working chip group 1. In this preferred embodiment, the cooling water channel 4 can also be configured to occupy an independent cooling space within the entire chip workbench 2, and the first connecting plug 5 and the second connecting plug 7 are small copper parts with a circular arc profile design. The entire cooling water channel 4 is set in the chip workbench 2, which reduces structural complexity and improves production efficiency.

[0055] Of course, it should also be noted that the present invention does not impose any restrictions on the specific structure of the first connecting plug 5 and the second connecting plug 7. Those skilled in the art can set them according to their needs. For example, the first connecting plug 5 and the second connecting plug 7 can be circular plugs. For another example, the first connecting plug 5 and the second connecting plug 7 can also be square plugs, as long as the first connecting plug 5 and the second connecting plug 7 maintain good sealing of the cooling water channel 4. In this preferred embodiment, the first connecting plug 5 and the second connecting plug 7 are small copper parts with a circular arc contour design. Designing the first connecting plug 5 and the second connecting plug 7 as small copper parts with a circular arc contour design allows the water to circulate more smoothly in multiple cooling water channels 4, reduces the resistance to water flow turning, effectively improves the cooling efficiency, and further ensures uniform heat dissipation of the chip workbench 2.

[0056] The combined design of a core copper component and an aluminum housing effectively improves the heat dissipation efficiency of the laser pump source device. The cooling water channel 4, located directly below the active chipset 1 and running through the chip workbench 2, allows the cooling water to quickly dissipate the heat generated by the chipset during operation, maintaining a stable operating temperature and enhancing the device's operational stability.

[0057] Furthermore, if Figure 1 As shown, the aluminum housing assembly includes an upper shell 8 and a lower shell 9. The upper shell 8 is wrapped around the side of the chip workbench 2 where the working chipset 1 is set. The area of ​​the upper shell 8 corresponding to the working chipset 1 is set into an open structure so that the working chipset 1 can be connected to other devices; the lower shell 9 is wrapped around the other side of the chip workbench 2, and the upper shell 8 and the lower shell 9 are fixed together by bolts. The upper and lower shells 9 are used to wrap the chip workbench 2, wherein the open structure of the upper shell 8 enables the working chipset 1 to be directly connected to other devices. The upper and lower shells 9 are fixed together by bolts, which increases the structural stability of the device and ensures the safety of the pump source device in different working environments. It should be noted that the present invention does not impose any restrictions on the specific structure of the upper shell 8 and the lower shell 9. Those skilled in the art can set it according to their needs. For example, the upper shell 8 and the lower shell 9 can be an integrated structure. For another example, the upper shell 8 and the lower shell 9 can also be a detachable structure, as long as it is ensured that the upper shell 8 and the lower shell 9 can provide good protection and support for the chip workbench 2.

[0058] Furthermore, the core copper component also includes a water inlet 6 and a water outlet 3. The water inlet 6 is arranged on one side of the chip workbench 2 and is connected to the first end of the cooling water channel 4 on one edge side; the water outlet 3 is arranged on the other side of the chip workbench 2 and is connected to the first end of the cooling water channel 4 on the other edge side. By arranging the water inlet 6 and the water outlet 3 on both sides of the chip workbench 2, a design is achieved in which cooling water enters from one side and flows out from the other side, so that the water flow can penetrate the entire working chip group 1 area, ensuring uniform distribution and timely dissipation of heat, and improving the overall cooling efficiency of the device. It should be noted that the present invention does not impose any restrictions on the connection structure of the water inlet 6 and the water outlet 3. Those skilled in the art can set it according to their needs. For example, the water inlet 6 and the water outlet 3 can be connected to the external circulating water source through threads. For example, the water inlet 6 and the water outlet 3 can also be connected to the external circulating water source through flanges. As long as the connection between the water inlet 6 and the water outlet 3 and the outside world is sufficiently sealed, it will be sufficient.

[0059] As a preferred embodiment, the water inlet 6, the cooling water channel 4, the first connecting plug channel, the second connecting plug channel and the water outlet 3 are combined to form an M-shaped flow channel structure. The M-shaped flow channel structure design of the water inlet 6, the cooling water channel 4, the first connecting plug channel, the second connecting plug channel and the water outlet 3 optimizes the water flow path, so that the cooling water can be fully circulated in the chip workbench 2, further improving the heat dissipation effect and ensuring the long-term stable operation of the device. Of course, the present invention does not impose any restrictions on the structure of the overall water flow channel. Those skilled in the art can set it according to their needs, as long as it is ensured that there is a cooling water channel 4 for circulating cooling water directly below each group of working chips 1.

[0060] The utility model also provides a preparation method, such as Figure 3 As shown, the preparation method of the laser pump source device used in the above-mentioned method includes the following steps:

[0061] S1: The copper block is mechanically added to the chip workbench 2 to form the shape, and the flow channel holes are processed by deep hole drilling;

[0062] S2: The processed copper block and the copper plug are welded to form a chip workbench 2 with a cooling water channel 4;

[0063] S3: The welded chip workbench 2 is machined and milled to form a high-precision working chip set 1 mounting position;

[0064] S4: sandblasting the chip workbench 2 of the structurally processed core copper component, then nickel-plating the entire core copper component, and then partially gold-plating the chip working surface;

[0065] S5: The aluminum upper shell 8 and the aluminum lower shell 9 are formed into a high-precision assembly size structure through mechanical processing;

[0066] S6: After the aluminum upper shell 8 and the aluminum lower shell 9 are cleaned and degreased, the entire surface is subjected to micro-arc oxidation treatment;

[0067] S7: Assemble the surface-treated core copper component, the aluminum upper shell 8 and the aluminum lower shell 9 together to form a complete pump source for the laser.

[0068] The preparation method has rigorous steps, which enables precise control of the processing, welding, and assembly of the copper material, thereby improving the overall manufacturing accuracy of the device and ensuring the cooling performance and working stability of the pump source device.

[0069] In step S1, the deep hole drill uses an internally cooled drill bit. Of course, it should be noted that the present invention does not impose any restrictions on the specific working method of the deep hole drill. Those skilled in the art can set it according to their needs. For example, the deep hole drill can be processed by a gun drill, or by a twist drill, as long as the accuracy of the processed cooling water channel 4 can meet the cooling requirements. Using an internally cooled drill bit for deep hole drilling can effectively reduce the heat and debris generated during the drilling process, improve processing efficiency and accuracy, ensure the smoothness and consistency of the cooling water channel 4, and provide a reliable channel for the subsequent cooling system.

[0070] In step S2, the chip workbench 2 and the cooling water channel 4 are both made of T2 copper. The use of T2 copper material to manufacture the chip workbench 2 and the cooling water channel 4 ensures the high thermal conductivity and corrosion resistance of the components, significantly improves the heat dissipation efficiency of the device, extends the service life of the pump source device, and ensures that the same material of the circulation circuit solves the problem of electrolytic corrosion of the flow channel, while having high temperature resistance.

[0071] In step S3, the relative height of the chip working surface and the chip gasket surface in the chip working group can be guaranteed to be within + / - 0.01mm; the chip workbench 2 has a dimensional deformation of less than 3um under normal power-on and long-term operation at a water pressure of 0.35Mpa. At the same time, the structural design of the circular hole and the serrated cooling water channel 4 ensures the uniformity of the overall temperature of the working area, ensuring the stability and consistency of the laser chip during operation.

[0072] In step S4, the chip workbench 2 is roughened by sandblasting to a roughness of Ra 0.4-0.8, then is entirely plated with nickel to prevent oxidation of the product and serve as a connecting layer for subsequent partial plating with gold, and then is partially plated with gold at the mounting position of the working chip set 1 for soldering and assembling the subsequent working chip set 1. By roughening the surface of the chip workbench 2 to a roughness of Ra 0.4-0.8, and then entirely plating with nickel and partially plating with gold, the reliability of the mounting position of the working chip set 1 is improved, and oxidation and corrosion of the red copper material are effectively prevented, so that the durability and performance stability of the pump device are improved. Of course, it should be noted that the specific method of sandblasting is not limited in any way in the present application, and can be set by the person skilled in the art as required, for example, the sandblasting can be dry sandblasting, and for example, the sandblasting can also be wet sandblasting, as long as the roughness after sandblasting meets the requirements.

[0073] In step S5, the upper shell 8 and the lower shell 9 are support and protection components of the chip workbench 2, and reasonable structural design and high-precision processing ensure assembly with the copper heat dissipation assembly. The high-hardness outer surface makes it difficult to deform and prevents impact, and the upper shell 8 and the lower shell 9 are made of 6013 aluminum.

[0074] In step S6, after the upper shell 8 and the lower shell 9 are cleaned after oil and dirt removal, the entire surface is treated by micro-arc oxidation to form a dense oxide film on the surface to prevent corrosion. The oxide film meets the performance requirements of salt spray, high temperature and humidity, high temperature baking, cold and hot impact, alcohol resistance test, 3M plating layer peeling test, etc.

[0075] Embodiment 1:

[0076] Manufacture of the core copper assembly:

[0077] The core copper assembly is made of T2 red copper material to ensure high thermal conductivity, and the implementation steps are as follows:

[0078] High-purity T2 red copper is selected and processed into a block structure with a designed size;

[0079] A deep hole drilling technology is used to manufacture a cooling water channel 4 at a depth of 3-5 mm below the chip working surface; the cooling water channel 4 is designed as a circular hole structure with a diameter of 9 mm, or can be zigzag-shaped to increase the heat dissipation contact area and improve the heat dissipation efficiency;

[0080] The processed copper block and T2 red copper plugs (first connecting plug, second connecting plug) of the same material are welded to form an integrated cooling circulation channel; the channel structure is designed as an "M" shape to ensure the circulation efficiency of the cooling liquid.

[0081] After processing is completed, the two chip workbenches are sandblasted to ensure that the surface roughness is within the range of Ra0.4-0.8, which facilitates the subsequent nickel plating and gold plating surface treatment and improves corrosion resistance and reliability.

[0082] Surface treatment process:

[0083] After the initial processing, the chip workbench 2 needs to be surface treated to improve its durability:

[0084] First, the entire chip workbench 2 is nickel-plated to ensure that the copper surface is not corroded and to improve the durability of the component.

[0085] Partial gold plating is applied to the chip mounting area to improve welding stability and meet high conductivity requirements to adapt to long-term high-power working environments.

[0086] Production and surface treatment of upper shell 8 and lower shell 9:

[0087] The upper shell 8 and lower shell 9 of the pump source are made through micro-arc oxidation surface treatment to enhance their mechanical strength and corrosion resistance. The implementation steps are as follows:

[0088] 6013 aluminum alloy material is selected and formed through mechanical processing to form a support structure that meets the size of the pump source.

[0089] After processing, the aluminum upper shell 8 and aluminum lower shell 9 are pre-treated by cleaning and degreasing, and then micro-arc oxidation treatment is performed to form a dense oxide film on the surface. The reflectivity of this film is less than 2.5%, thereby reducing interference with the laser light path.

[0090] The aluminum cover after micro-arc oxidation has high hardness and corrosion resistance. It can withstand salt spray for up to 1000 hours, can withstand UV light above 500°C, and has a hardness of 1000HV, which greatly extends the service life of the component.

[0091] Assembly of core copper components and shell components:

[0092] The surface-treated core copper component and the aluminum upper shell 8 and aluminum lower shell 9 are assembled by screw fastening;

[0093] Place the core copper component on the aluminum lower shell 9 and fix it with screws to ensure the stability of the structure;

[0094] The aluminum upper shell 8 is assembled on the core copper component and fits tightly with the lower shell 9, and is assembled by screws to form a complete structure;

[0095] The final laser pump source structure has a heat dissipation capacity of 2.6KW to 5.2KW, is compact and adaptable to various working environments;

[0096] The coolant inlet 6 and outlet 3 are designed outside the pump source and are connected to the coolant supply system through threads. The coolant circulates in the flow channel of the core copper component, thereby achieving efficient heat dissipation.

[0097] The flow channel structure design ensures that the pressure drop of the coolant when flowing through is less than 62kPa, and the temperature difference between the inlet and outlet water is controlled at around 2°C. When the cooling water channel 4 adopts a flow channel structure with a circular saw-shaped cross-section, compared with the circular hole design, it increases the contact area, improves the heat dissipation capacity by about 1°C, and reduces the thermal expansion effect of the chip working surface.

[0098] Performance testing:

[0099] In order to verify the durability and heat dissipation effect of the pump source components, this utility model adopts a series of rigorous tests:

[0100] After 24-hour salt spray test, high temperature and high humidity test, hot and cold shock test and alcohol resistance test;

[0101] In the long-term working test with water and power supply under 0.35MPa water pressure, the dimensional variation of the core components was less than 3um, ensuring the welding accuracy and optical path stability of the laser chip.

[0102] Example 2:

[0103] like Figure 4 As shown, based on Example 1, the cooling water channel 4 in the present invention can be set as multiple water supply pipes directly below the corresponding working chip group 1, the first connecting plug and the second connecting plug are removed, and a U-shaped tube 10 is installed at the gap, so that the multiple water supply pipes are directly connected through the U-shaped tube 10 to form an M-shaped curved cooling water channel 4 folding structure. If the cooling water channel 4 is an M-shaped structure composed of multiple water supply pipes, the water circulates in the multiple curved water supply pipes to improve the fluidity of the cooling water, thereby improving the heat dissipation efficiency. Of course, it should be noted that the present invention does not impose any restrictions on the cooling water channel structure formed by the connection of the water supply pipe and the U-shaped tube 10. Those skilled in the art can set it according to their needs. For example, the cooling water channel 4 can be a combination of multiple M-shaped structures. For example, the cooling water channel 4 can also be a combination of N-shaped structures, as long as it is ensured that the cooling water channel can be set one-to-one directly below each chip working group.

[0104] Thus far, the technical solutions of the present invention have been described in conjunction with the optional embodiments shown in the accompanying drawings. However, it is readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. A laser pump source device, characterized in that: The pump source device includes a core copper component and an aluminum shell component, wherein; The core copper component includes a chip workbench, a first connecting plug and a second connecting plug, and a plurality of working chip groups are arranged and distributed on the chip workbench; the vertical direction of the working chip groups is a first direction, and the horizontal direction of the working chip groups is a second direction; a cooling water channel is formed in the chip workbench, and two adjacent cooling water channel openings are provided with communicating countersunk holes, and the cooling water channels are correspondingly arranged directly below the working chips groups, and the cooling water channels pass through the chip workbench along the first direction, and the first connecting plug and the second connecting plug are respectively sealed at both ends of the cooling water channel, and the first connecting plug and the second connecting plug are staggered so that water flows in the plurality of cooling water channels in sequence; The aluminum housing assembly is configured to wrap the chip workbench to provide protection and support for the chip workbench and assembly of other structural parts.

2. The laser pump source device according to claim 1, wherein: The cooling water channel is configured to correspond to multiple water supply pipes directly below the working chip group, and the multiple water supply pipes are connected by a U-shaped connecting pipe to form an M-shaped bent and folded structure, or the cooling water channel is configured to occupy an independent cooling space inside the entire chip workbench, and the two sides of the cooling space are respectively sealed by the first connecting plug and the second connecting plug, and the first connecting plug and the second connecting plug are small copper parts with a circular arc contour design.

3. The laser pump source device according to claim 1, wherein: The aluminum shell assembly includes an upper shell and a lower shell. The upper shell is wrapped around the upper side of the chip workbench where the working chipset is set. The area of ​​the upper shell corresponding to the working chipset is set into an open structure so that the working chipset can be connected to other devices; the lower shell is wrapped around the lower side of the chip workbench, and the upper shell and the lower shell are fixed together by bolts.

4. The laser pump source device according to claim 2, wherein: The cross section of the cooling water channel is a circular, sawtooth or special-shaped hole structure, and the first connecting plug and the second connecting plug are set to a circular, sawtooth or special-shaped structure corresponding to the cooling water channel.

5. The laser pump source device according to claim 1, wherein: The core copper component also includes a water inlet and a water outlet. The water inlet is arranged on one side of the chip workbench, and the water inlet is connected to the first end of the cooling water channel on one edge side; the water outlet is arranged on the other side of the chip workbench, and the water outlet is connected to the first end of the cooling water channel on the other edge side.

6. The laser pump source device according to claim 5, characterized in that: The water inlet end, the cooling water channel, the first connecting plug, the second connecting plug and the water outlet end form an M-shaped flow channel structure.

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