Bone conduction MEMS microphone

Abstract

The utility model relates to the technical field of acoustics, in particular to a bone conduction MEMS microphone. Comprising a shell, a first PCB, a second PCB and a third PCB, a vibrating diaphragm assembly is arranged on the upper end face of the first PCB, an electro-acoustic conversion chip MEMS and an electric signal processing chip ASIC are arranged on the lower end face of the first PCB, the electro-acoustic conversion chip MEMS is electrically connected with the electric signal processing chip ASIC through a gold wire, when a wearer makes a sound, vibration is transmitted to the microphone through a skeleton, and the microphone is electrically connected with the microphone through the gold wire. When the vibrating diaphragm assembly starts to vibrate, the pressure in the cavity is changed, the changed pressure is transmitted into the vibrating diaphragm assembly, so that the vibrating diaphragm assembly vibrates, a vibration signal is converted into an electric signal through the electro-acoustic conversion chip MEMS, and the electric signal is amplified by the electric signal processing chip ASIC and then output. Therefore, the production process of the bone conduction MEMS microphone is simpler, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of acoustics, and in particular to a bone conduction MEMS microphone. Background Art

[0002] Bone conduction microphones transmit sound signals by picking up the speaker's own bone vibrations. Unlike traditional air conduction microphones, bone conduction microphones do not rely on sound waves in the air, but capture sound by detecting vibrations of the skull and other body parts. They are widely used in the field of smart wearables.

[0003] However, the current bone conduction MEMS microphone has a relatively complex structure and is difficult to package. Utility Model Content

[0004] The purpose of the present invention is to provide a bone conduction MEMS microphone, aiming to solve the technical problems in the prior art that the bone conduction MEMS microphone has a relatively complex structure and is difficult to package.

[0005] To achieve the above objectives, the present invention adopts a bone conduction MEMS microphone, comprising a housing, a first PCB board, a second PCB board, and a third PCB board. A diaphragm assembly is provided on the upper end surface of the first PCB board, and an electroacoustic conversion chip MEMS and an electrical signal processing chip ASIC are provided on the lower end surface of the first PCB board. The electroacoustic conversion chip MEMS and the electrical signal processing chip ASIC are electrically connected via gold wires. The housing is bonded to the first PCB board and covers the top of the first PCB board, and the diaphragm assembly is located within the housing. The first PCB board is bonded to the second PCB board and is located above the second PCB board. The electroacoustic conversion chip MEMS and the electrical signal processing chip are located within the second PCB board. The second PCB board is bonded to the third PCB board and is located above the third PCB board.

[0006] Wherein, a plurality of first air leakage holes are connected in the shell.

[0007] Wherein, the first PCB board has a sound hole therein.

[0008] The bone conduction MEMS microphone further includes a PAD, which is bonded to the third PCB and located below the third PCB.

[0009] Wherein, the PAD is a pad.

[0010] Among them, the diaphragm assembly includes a diaphragm, a mass block and a support ring, the diaphragm is arranged on the mass block, the mass block is bonded to the support ring and is located inside the support ring, and the support ring is bonded to the first PCB board and is located on the upper end surface of the first PCB board.

[0011] Wherein, a second air leakage hole is opened at the center of the mass block and the diaphragm, and the second air leakage holes between the mass block and the diaphragm are connected.

[0012] Wherein, the shell is made of metal.

[0013] The utility model discloses a bone conduction MEMS microphone, comprising a housing, a first PCB board, a second PCB board and a third PCB board, wherein a diaphragm assembly is provided on the upper end surface of the first PCB board, an electroacoustic conversion chip MEMS and an electrical signal processing chip ASIC are provided on the lower end surface of the first PCB board, and the electroacoustic conversion chip MEMS and the electrical signal processing chip ASIC are electrically connected via a gold wire, the housing is bonded to the first PCB board and covers the upper part of the first PCB board, the diaphragm assembly is located in the housing, the first PCB board is bonded to the second PCB board and is located above the second PCB board, and the electroacoustic conversion chip MEMS is electrically connected to the electrical signal processing chip ASIC via a gold wire, The MEMS chip and the electrical signal processing chip are located within the second PCB board. The second PCB board is bonded to the third PCB board and located above the third PCB board. When the wearer speaks, the vibration is transmitted to the microphone through the bones, causing the diaphragm assembly to vibrate, thereby causing the pressure in the cavity to change. The changed pressure is transmitted to the diaphragm assembly, causing it to vibrate. The vibration signal is converted into an electrical signal by the electroacoustic conversion chip MEMS, and then amplified and processed by the electrical signal processing chip ASIC before output. This design utilizes mature packaging technology to simplify the production process of the bone conduction MEMS microphone and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0015] Figure 1 This is a schematic diagram of the internal structure of the bone conduction MEMS microphone of the present invention.

[0016] 1-housing, 2-first PCB board, 3-second PCB board, 4-third PCB board, 5-electroacoustic conversion chip MEMS, 6-electrical signal processing chip ASIC, 7-gold wire, 8-first air vent, 9-PAD, 10-diaphragm, 11-mass block, 12-support ring, 13-second air vent. DETAILED DESCRIPTION

[0017] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0018] See also Figure 1 The present invention provides a bone conduction MEMS microphone, comprising a housing 1, a first PCB board 2, a second PCB board 3 and a third PCB board 4. A diaphragm assembly is provided on the upper end surface of the first PCB board 2, and an electroacoustic conversion chip MEMS 5 and an electrical signal processing chip ASIC 6 are provided on the lower end surface of the first PCB board 2. The electroacoustic conversion chip MEMS 5 and the electrical signal processing chip ASIC 6 are electrically connected via a gold wire 7. The housing 1 is bonded to the first PCB board 2 and covers the top of the first PCB board 2, and the diaphragm assembly is located in the housing 1, the first PCB board 2 is bonded to the second PCB board 3 and is located above the second PCB board 3, and the electroacoustic conversion chip MEMS 5 and the electrical signal processing chip are located in the second PCB board 3, and the second PCB board 3 is bonded to the third PCB board 4 and is located above the third PCB board 4.

[0019] In this embodiment, when the wearer speaks, the vibration is transmitted to the microphone through the bones, and the diaphragm assembly begins to vibrate, thereby causing the pressure in the cavity to change. The changed pressure is transmitted to the diaphragm assembly, causing the diaphragm assembly to vibrate, and the vibration signal is converted into an electrical signal by the electroacoustic conversion chip MEMS5, and then amplified and processed by the electrical signal processing chip ASIC6 for output. This design utilizes mature packaging technology to make the production process of bone conduction MEMS microphones simpler and improve production efficiency.

[0020] Furthermore, a plurality of first air leakage holes 8 are connected in the housing 1 .

[0021] In this embodiment, the first air leakage hole 8 can facilitate the balance of the internal and external air pressures of the housing 1, ensuring clear sound quality without noise.

[0022] Furthermore, the first PCB board 2 has a sound hole therein.

[0023] In this embodiment, the sound can be easily picked up through the sound hole.

[0024] Furthermore, the bone conduction MEMS microphone further includes a PAD 9 , which is bonded to the third PCB board 4 and is located below the third PCB board 4 .

[0025] In this embodiment, the PAD 9 can be used to reduce the strength of the input signal to protect subsequent devices from being damaged by excessively high signal levels, while also providing support and protection for internal structures such as chips and leads.

[0026] Furthermore, the PAD9 is a welding pad.

[0027] Furthermore, the diaphragm assembly includes a diaphragm 10, a mass block 11 and a support ring 12, the diaphragm 10 is arranged on the mass block 11, the mass block 11 is bonded to the support ring 12 and is located inside the support ring 12, and the support ring 12 is bonded to the first PCB board 2 and is located on the upper end surface of the first PCB board 2.

[0028] In this embodiment, the diaphragm 10 captures sound fluctuations and converts them into mechanical motion. When the sound waves reach the diaphragm 10, it moves with the change of sound pressure. This movement is usually very small, but it is enough to cause the sensor connected to the diaphragm 10 to generate a changing electrical signal. A closed chamber can be formed between the mass block 11 and the diaphragm 10 to provide necessary support for the diaphragm 10 and limit the range of motion of the diaphragm 10, thereby controlling the dynamic response of the microphone.

[0029] Furthermore, a second air leakage hole 13 is formed at the center of each of the mass block 11 and the diaphragm 10 , and the second air leakage holes 13 between the mass block 11 and the diaphragm 10 are connected.

[0030] In this embodiment, the second air leakage hole 13 can facilitate balancing the internal and external air pressures of the mass block 11 and the diaphragm 10, ensuring clear sound quality without noise.

[0031] Furthermore, the housing 1 is made of metal.

[0032] In this embodiment, the beneficial effect of using the metal material for the shell 1 is that it has good heat dissipation performance, which helps electronic products dissipate heat and maintain stable operation of the equipment. It also has strong corrosion resistance and is not easy to rust, and can maintain good performance even in a humid environment.

[0033] In this embodiment, the diaphragm assembly is bonded to the upper end surface of the first PCB board 2, the electroacoustic conversion chip MEMS5 and the electrical signal processing chip ASIC6 are bonded to the lower end surface of the first PCB board 2, and electrically connected through gold wires 7. Finally, the housing 1, the first PCB board 2, the second PCB board 3 and the third PCB board 4 are combined by stacking to form a bone conduction microphone device. This design is simple, has low packaging difficulty, and is conducive to improving production efficiency and reducing production costs.

[0034] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made in accordance with the claims of the present invention are still within the scope of the utility model.

Claims

1. A bone conduction MEMS microphone, characterized in that: It includes a shell, a first PCB board, a second PCB board and a third PCB board. A diaphragm assembly is provided on the upper end surface of the first PCB board, and an electroacoustic conversion chip MEMS and an electrical signal processing chip ASIC are provided on the lower end surface of the first PCB board. The electroacoustic conversion chip MEMS and the electrical signal processing chip ASIC are electrically connected via gold wires. The shell is bonded to the first PCB board and covers the top of the first PCB board, and the diaphragm assembly is located in the shell. The first PCB board is bonded to the second PCB board and is located above the second PCB board, and the electroacoustic conversion chip MEMS and the electrical signal processing chip are located in the second PCB board. The second PCB board is bonded to the third PCB board and is located above the third PCB board.

2. The bone conduction MEMS microphone according to claim 1, wherein: A plurality of first air leakage holes are connected in the shell.

3. The bone conduction MEMS microphone according to claim 2, wherein: The first PCB board has a sound hole therein.

4. The bone conduction MEMS microphone according to claim 3, wherein: The bone conduction MEMS microphone further includes a PAD, which is bonded to the third PCB and located below the third PCB.

5. The bone conduction MEMS microphone according to claim 4, wherein: The PAD is a solder pad.

6. The bone conduction MEMS microphone according to claim 5, wherein: The diaphragm assembly includes a diaphragm, a mass block and a support ring. The diaphragm is arranged on the mass block. The mass block is bonded to the support ring and is located inside the support ring. The support ring is bonded to the first PCB board and is located on the upper end surface of the first PCB board.

7. The bone conduction MEMS microphone according to claim 6, wherein: A second air leakage hole is formed at the center of each of the mass block and the diaphragm, and the second air leakage holes between the mass block and the diaphragm are communicated with each other.

8. The bone conduction MEMS microphone according to claim 7, wherein: The shell is made of metal.

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