Heat dissipation structure of very high frequency data exchange system equipment
By introducing a combined structure of heat sinks, heat pipes, and multi-stage heat dissipation fins into the VHF data exchange system equipment, the problem of uneven heat distribution inside the equipment is solved, efficient heat transfer is achieved, and the equipment is ensured to operate normally in a 55°C environment.
Patent Information
- Application Number
- CN202422606670.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-10-28
AI Technical Summary
The existing VHF data exchange system equipment has uneven internal heat distribution and cannot effectively dissipate heat, resulting in it not being able to work properly in a 55°C environment, and chip performance degradation or even damage.
The heat dissipation structure consists of a heat sink, heat pipes, multi-stage heat dissipation fins and a fan. The heat pipes and multi-stage heat dissipation fins form a multi-stage air duct, which is combined with the fan for efficient heat dissipation, and silicone pads and silicone grease are used to improve heat conduction efficiency.
The heat transfer efficiency inside the device is improved, and the chip surface temperature is reduced to 71°C, which can meet the requirements of long-term operation in a 55°C environment and avoid chip damage.
Smart Images
Figure CN223428740U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation of very high frequency data exchange system equipment, in particular to a heat dissipation structure of very high frequency data exchange system equipment. Background Art
[0002] The Very High Frequency Data Exchange System (VDES) is a communication device used in inland waterways, coastal areas, and offshore platforms. It features full-channel communication for AIS, ASM, and VDE, as well as the ability to receive ship messages and broadcast maritime information.
[0003] Existing VDES equipment is typically installed in dedicated computer rooms and cabinets, providing a relatively comfortable environment. However, with market expansion and increased functionality, product operating environments are becoming increasingly demanding, with operating temperatures exceeding 55°C. Furthermore, products are moving towards high power, standardization, and integration. The heat dissipation of key chips and modules within the equipment, such as amplifiers, FPGAs, DDR, AD, DA, and power supplies, is high, numerous, and unevenly distributed. Therefore, heat dissipation has become a pressing issue in this field.
[0004] During the use of existing VDES equipment, heat can only be dissipated through external heat exchange by fans. The heat dissipation method is single, and under normal circumstances, the convection heat transfer coefficient of fan heat dissipation is 20-300W / (m 2 k) Due to the device's size and internal space limitations, a large fan was not an option. This resulted in uneven heat distribution within the device. Heat was difficult to dissipate away from areas away from the fan, and the fan could not dissipate heat from components that required shielding and were not exposed. Consequently, effective cooling of a specific overheating chip was impossible, and the device could not meet the operating requirements of a 55°C environment. Utility Model Content
[0005] The utility model provides a heat dissipation structure for a very high frequency data exchange system device, which solves the technical problem in the prior art that the internal heat distribution of the device is uneven, a certain overheated chip cannot be effectively dissipated, and the heat cannot be dissipated in time when working in a 55°C environment, resulting in chip performance degradation or even damage.
[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:
[0007] A heat dissipation structure for a very high frequency data exchange system device comprises: a chassis housing, a heat dissipation module, and a circuit board; heat dissipation holes are provided on both side walls of the chassis housing; dust screens are provided on the heat dissipation holes; a fan is fixed inside the heat dissipation hole at one end of the chassis housing via a fan bracket; and a system power switch is provided on the front housing of the chassis housing;
[0008] A heat dissipation module is provided on the inner bottom shell of the chassis shell; the heat dissipation module consists of a heat dissipation plate, an RF power radiator, a baseband power radiator, multi-stage heat dissipation fins and a heat pipe; the heat dissipation plate is fixed on the inner bottom shell of the chassis shell; the top of the heat dissipation plate is tightly connected to the bottom of the circuit board; the bottom surfaces of the RF power radiator and the baseband power radiator are coated with silicone grease and connected to the top of the RF power module and the baseband power module; the multi-stage heat dissipation fins and the fan are fixed to the right side of the fan bracket.
[0009] Furthermore, a heat pipe groove is provided at the bottom of the heat dissipation plate; a heat pipe is welded in the heat pipe groove; the other end of the heat pipe is embedded in the interior of the multi-stage heat dissipation fin; a heat dissipation boss is provided at the top of the heat dissipation plate; the top of the heat dissipation boss is contacted and connected to the chip on the circuit board through an adhered silicone pad.
[0010] Furthermore, the fan bracket is mounted to the left heat dissipation hole inside the chassis shell by means of pan head screws.
[0011] Furthermore, the heat dissipation plate is fixed to the bottom shell inside the chassis shell through nuts.
[0012] Furthermore, the dustproof net is adhered to the top of the heat dissipation holes on the left and right sides of the chassis shell by 3M glue.
[0013] Furthermore, a protective mesh cover is provided on the fan.
[0014] Furthermore, the RF power radiator and the baseband power radiator are respectively fixed to the top of the RF power module and the baseband power module by flat head screws; the RF power module and the baseband power module are arranged on the power board on the top of the circuit board.
[0015] Furthermore, fixing blocks are respectively provided at both ends of the front side of the chassis shell; and a chassis handle is provided on the front side of the chassis shell.
[0016] The beneficial effects of the present invention are:
[0017] The heat generated by the chip of the utility model is transferred to the fan end through the heat dissipation plate, heat pipe and multi-stage heat dissipation fins arranged inside the chassis shell, and the heat is discharged outside the product by the fan, solving the problem of low efficiency of internal temperature transfer to the outside.
[0018] The utility model vertically embeds the heat pipe into the heat dissipation fin, cuts the heat dissipation surface of the heat pipe, and forms a multi-stage air duct with the thin aluminum sheet to dissipate heat, greatly improving the heat dissipation efficiency.
[0019] The utility model solves the problem of heat dissipation for a high-temperature chip by arranging a heat dissipation boss and a silicone pad on a heat dissipation plate so as to contact the surface of the chip with high heat consumption. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model.
[0022] Figure 2 This is a schematic diagram of the internal structure of the chassis shell of the utility model.
[0023] Figure 3 This is a schematic diagram of the structure of the fan and heat dissipation module of the utility model.
[0024] Figure 4 Schematic diagram of the surface temperature of components that do not adopt the heat dissipation structure of the present invention.
[0025] Figure 5 This is a schematic diagram of the surface temperature of components after adopting the heat dissipation structure of the utility model.
[0026] Description of Figure Numbers:
[0027] 1. Chassis shell; 2. Heat dissipation module; 201. Heat sink; 202. RF power radiator; 203. Baseband power radiator; 204. Multi-stage cooling fins; 205. Heat dissipation boss; 206. Silicone pad; 3. Front case; 4. Fixing block; 5. Chassis handle; 6. System power switch; 7. Fan bracket; 701. Fan; 702. Protective mesh cover; 8. Circuit board; 9. Heat pipe; 10. Dust net; 11. RF power module; 12. Baseband power module. DETAILED DESCRIPTION
[0028] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0030] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.
[0031] Unless otherwise specifically stated, the relative arrangement of the parts and steps, the numerical expressions and the numerical values described in these embodiments do not limit the scope of the present invention. At the same time, it should be clear that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to ordinary technicians in the relevant fields may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.
[0032] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention: the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.
[0033] For ease of description, spatially relative terms such as "above," "above," "on the upper surface of," and "above" may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "on top of" another device or structure would then be positioned as "below" or "below" the other device or structure. Thus, the exemplary term "above" may include both the orientations of "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.
[0034] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.
[0035] The utility model provides a technical solution: a heat dissipation structure of a very high frequency data exchange system device, such as Figure 1-5 As shown, it includes: a chassis shell 1, a heat dissipation module 2 and a circuit board 8; a heat dissipation hole is provided on one side wall of the chassis shell 1; a dustproof net 10 is provided on the heat dissipation hole; a fan 701 is fixed inside the heat dissipation hole at the other end of the chassis shell 1 through a fan bracket 7; a system power switch 6 and an indicator light are provided on the front shell 3 of the chassis shell;
[0036] A heat dissipation module 2 is provided on the inner bottom shell of the chassis shell 1; the heat dissipation module 2 consists of a heat dissipation plate 201, an RF power radiator 202, a baseband power radiator 203, multi-stage heat dissipation fins 204 and a heat pipe 9; the heat dissipation plate 201 is fixed on the inner bottom shell of the chassis shell 1; the top of the heat dissipation plate 201 is tightly connected to the bottom of the circuit board 8; the bottom surfaces of the RF power radiator 202 and the baseband power radiator 203 are coated with silicone grease and connected to the top of the RF power module 11 and the baseband power module 12; the multi-stage heat dissipation fins 204 and the fan 701 are fixed to the right side of the fan bracket 7.
[0037] A heat pipe groove is provided at the bottom of the heat dissipation plate 201; a heat pipe 9 is welded in the heat pipe groove; the other end of the heat pipe 9 is embedded in the interior of the multi-stage heat dissipation fin 204; a heat dissipation boss 205 is provided at the top of the heat dissipation plate 201; the top of the heat dissipation boss 205 is contacted and connected to the chip on the circuit board 8 through an adhered silicone pad.
[0038] The fan bracket 7 is mounted to the left heat dissipation hole inside the chassis shell 1 by means of pan head screws.
[0039] The heat sink 201 is fixed to the bottom shell inside the chassis shell by nuts.
[0040] The dustproof net 10 is attached to the top of the heat dissipation holes on the left and right sides of the chassis shell 1 by 3M glue.
[0041] The fan 701 is provided with a protective mesh cover 702 .
[0042] The RF power radiator 202 and the baseband power radiator 203 are respectively fixed to the top of the RF power module 11 and the baseband power module 12 by flat head screws; the RF power module 11 and the baseband power module 12 are arranged on the power board on the top of the circuit board 8.
[0043] A fixing block 4 is provided at both ends of the front side of the chassis shell 1 ; a chassis handle 5 is provided on the front side of the chassis shell 1 .
[0044] During device operation, the junction temperature of the chip on circuit board 8 gradually rises, and the heat is dissipated through the chip housing. Most of the heat accumulates on the upper surface of the chip, which is tightly fitted to the heat dissipation boss 205 via the silicone pad, reducing the contact thermal resistance between the chip and the heat dissipation boss 205. This prevents heat from accumulating on the chip surface and allows it to be quickly transferred to the heat sink 201. A small amount of heat is directly contacted with the circuit board 8 through the lower surface of the chip housing, distributing the heat to the circuit board surface. Circuit board 8, with a 50% copper coating ratio, has good thermal conductivity, and heat is transferred to the heat sink 201 through the contact between circuit board 8 and the heat sink 201.
[0045] Since the chips on the circuit board 8 are clustered on the right side of the circuit board 8, when the heat from the chips is transferred to the heat sink 201, the heat conduction capacity of the heat sink 201 is insufficient to quickly transfer the accumulated heat, which also causes the surface temperature of the chips to be too high. Therefore, four heat pipes 9 are soldered in the heat pipe grooves on the back of the heat sink 201 using solder paste, and the gaps between the heat pipes 9 and the heat sink 201 are filled with solder paste to reduce the contact thermal resistance between the heat pipes 9 and the heat sink 201. The convection heat transfer coefficient of a simple aluminum plate is only 231W / (m 2 k), after welding the heat pipe 9, the heat transfer mode changes from heat conduction inside the aluminum plate to steam and liquid phase change heat transfer through the heat pipe, and its convection heat transfer coefficient can reach up to 10000W / (m 2 k), greatly improving the heat transfer efficiency.
[0046] Heat is avoided from gathering on the right side of the heat sink 201. The other end of the heat pipe 9 is connected to the lower half of the fan 701 using multi-stage heat dissipation fins 204, the thickness of the multi-stage heat dissipation fins 204 adopts multi-layer 0.5mm aluminum sheet, and the heat pipe 9 is embedded in the multi-stage heat dissipation fins 204 in an interference fit. Heat on the heat pipe 9 can be quickly transferred to the entire surface of the multi-stage heat dissipation fins 204. By vertically embedding the heat pipe 9 in the multi-stage heat dissipation fins 204, the heat pipe 9 is formed in multiple stages, and the fan 701 forms a multi-stage air duct to transfer heat outside the case shell 1.
[0047] The lower surface of the radio frequency power supply radiator 202 and the baseband power supply radiator 203 is coated with silicone grease and fixed to the upper surface of the baseband power supply module and the radio frequency power supply module by flat head screws. The use of silicone grease can reduce the contact thermal resistance between the radiator and the power supply module to 0.001 (km 2 / w), improving heat conduction efficiency.
[0048] Heat gathered on the upper surface of the power supply module is transferred to the radiator, which is made into a tooth shape to increase the heat exchange area. Through the upper half of the fan 701 and the right side of the case shell 1, a heat dissipation hole is formed to quickly transfer heat outside the device.
[0049] The heat dissipation structure of the utility model, the highest temperature of the chip surface on the circuit board is 71 DEG C, and the junction temperature is 85 DEG C, which can meet the long-time use in 55 DEG C environment, and the simulation result is as Figure 4-Figure 5 shown. Through the utility model structure, the problem that the VDES device cannot work under the harsh condition of 55 DEG C is solved.
[0050] The above is only a preferred specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the technical field can make equivalent replacement or change according to the technical scheme and the inventive concept of the utility model within the technical range disclosed by the utility model, which should be covered in the protection scope of the utility model.
Claims
1. A heat dissipation structure of a very high frequency data exchange system device, characterized in that: include: A chassis shell (1), a heat dissipation module (2) and a circuit board (8); heat dissipation holes are provided on both end side walls of the chassis shell (1); a dust screen (10) is provided on the heat dissipation holes; a fan (701) is provided inside the heat dissipation hole at one end of the chassis shell (1) and is fixed by a fan bracket (7); a system power switch (6) is provided on the front housing (3) of the chassis shell; A heat dissipation module (2) is provided on the inner bottom shell of the chassis shell (1); the heat dissipation module (2) is composed of a heat dissipation plate (201), a radio frequency power supply heat sink (202), a baseband power supply heat sink (203), multi-stage heat dissipation fins (204) and a heat pipe (9); the heat dissipation plate (201) is fixed on the inner bottom shell of the chassis shell (1); the top of the heat dissipation plate (201) is tightly connected to the bottom of the circuit board (8); the bottom surfaces of the radio frequency power supply heat sink (202) and the baseband power supply heat sink (203) are coated with silicone grease and connected to the top of the radio frequency power supply module (11) and the baseband power supply module (12); the multi-stage heat dissipation fins (204) and the fan (701) are fixed to the right side of the fan bracket (7).
2. The heat dissipation structure of a very high frequency data exchange system device according to claim 1, characterized in that: A heat pipe groove is provided at the bottom of the heat dissipation plate (201); a heat pipe (9) is welded in the heat pipe groove; the other end of the heat pipe (9) is embedded in the interior of the multi-stage heat dissipation fin (204); a heat dissipation boss (205) is provided at the top of the heat dissipation plate (201); the top of the heat dissipation boss (205) is contact-connected with the chip on the circuit board (8) via an adhered silicone pad (206).
3. The heat dissipation structure of a very high frequency data exchange system device according to claim 1, characterized in that: The fan bracket (7) is mounted to the left heat dissipation hole inside the chassis shell (1) by means of pan head screws.
4. The heat dissipation structure of a very high frequency data exchange system device according to claim 1, characterized in that: The heat dissipation plate (201) is fixed to the bottom shell inside the chassis shell via nuts.
5. The heat dissipation structure of a very high frequency data exchange system device according to claim 1, characterized in that: The dustproof net (10) is adhered to the top of the heat dissipation holes on the left and right sides of the chassis shell (1) by 3M glue.
6. The heat dissipation structure of a very high frequency data exchange system device according to claim 1, characterized in that: The fan (701) is provided with a protective mesh cover (702).
7. The heat dissipation structure of a very high frequency data exchange system device according to claim 1, characterized in that: The radio frequency power supply radiator (202) and the baseband power supply radiator (203) are respectively fixed to the top of the radio frequency power supply module (11) and the baseband power supply module (12) by flat head screws; the radio frequency power supply module (11) and the baseband power supply module (12) are arranged on the power supply board on the top of the circuit board (8).
8. The heat dissipation structure of a very high frequency data exchange system device according to claim 1, characterized in that: Fixed blocks (4) are respectively provided at both ends of the front side of the chassis shell (1); and a chassis handle (5) is provided on the front side of the chassis shell (1).