Heat-conducting silica gel pad for electronic appliances

Abstract

The utility model relates to the technical field of electronic appliances, and discloses a heat conduction silica gel pad for electronic appliances, which comprises a first silica gel layer, and the upper surface of the first silica gel layer is fixedly connected with a first adhesive pad. The soaking layer can balance and adjust heat and avoid local heat accumulation, a plurality of holes are formed in the surface of the first heat conduction layer, the holes can increase the surface area of the heat conduction layer and facilitate rapid passing and diffusion of the heat, and due to the design of the position below the soaking layer, the heat can pass through the first silica gel layer before being conducted to the soaking layer from the first silica gel layer. And primary dispersion and rapid conduction are carried out through the hole structure of the first heat conduction layer, so that the heat conduction efficiency of the whole heat conduction silica gel pad is further improved, damage to electronic components due to excessive concentration of heat is prevented, and the service life of electronic appliances is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic appliances, in particular to a thermally conductive silica gel pad for electronic appliances. Background Art

[0002] With the rapid development of electronic and electrical technology, electronic and electrical devices are constantly evolving towards high performance. For example, the computing power of smartphone processors continues to increase. The evolution from single-core to multi-core processors enables them to respond quickly when multitasking and running complex image or video processing software. However, this high performance comes at the cost of a significant increase in chip power consumption, which generates a lot of heat.

[0003] Traditional metal heat dissipation materials, such as copper and aluminum, are widely used in the heat dissipation of electronic and electrical equipment. Metal has good thermal conductivity and can conduct heat away from the heat source. However, there are some problems with metal heat dissipation materials. On the one hand, the fit between the metal and the surface of the electronic component is difficult to achieve an ideal state. Due to factors such as surface roughness, contact thermal resistance is generated at the contact interface between the two, which will hinder the effective conduction of heat. On the other hand, the weight of metal is relatively large. For some portable electronic devices that are sensitive to weight, it will increase the overall weight of the device and affect the user experience. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a thermally conductive silicone pad for electronic appliances.

[0005] The utility model is implemented by the following technical solution: a thermally conductive silicone pad for electronic appliances includes a first silicone layer, the upper surface of the first silicone layer is fixedly connected to a first viscose pad, the upper surface of the first silicone layer is provided with a heat-averaging layer through the first viscose pad, and the upper surface of the first silicone layer is fixedly connected to a first heat-permeable layer.

[0006] Through the above technical solution, this structural design can ensure that heat is evenly distributed in the thermally conductive silicone pad for electronic appliances by providing a heat-averaging layer and a first heat-transmitting layer. The heat-averaging layer can evenly regulate the heat to avoid local heat accumulation, while the first heat-transmitting layer helps to conduct heat. The two work together to dissipate heat more effectively, thereby improving the heat dissipation efficiency of electronic appliances, preventing damage to electronic components due to excessive heat concentration, and extending the service life of electronic appliances. The first adhesive pad is connected to the first silicone layer to provide the heat-averaging layer and the first heat-transmitting layer. This connection method helps to stabilize the combination of the layers, ensure the structural integrity of the thermally conductive silicone pad during operation, and ensure the stability of the heat conduction path.

[0007] As a further improvement of the above solution, there are four first adhesive pads, which are respectively located at the four corners of the upper surface of the first silicone layer.

[0008] Through the above technical solution, the number of the first adhesive pads is set to four and they are located at the four corners of the upper surface of the first silicone layer. This layout can make the fixation of the heat-distributing layer on the first silicone layer more stable and flat. The four-corner fixing method can evenly disperse the pressure of the heat-distributing layer on the first silicone layer, avoiding separation between layers or deformation of the thermal conductive silicone pad due to excessive local pressure during use, thereby ensuring the normal thermal conductivity of the thermal conductive silicone pad.

[0009] As a further improvement of the above solution, a plurality of holes are provided on the surface of the first heat-permeable layer, and the first heat-permeable layer is located below the heat-absorbing layer.

[0010] Through the above technical solution, a number of holes are opened on the surface of the first heat-transmitting layer. These holes can increase the surface area of ​​the heat-transmitting layer, which is conducive to the rapid passage and diffusion of heat. The position design below the heat-equalizing layer allows the heat to be initially dispersed and quickly conducted through the hole structure of the first heat-transmitting layer before being conducted from the first silicone layer to the heat-equalizing layer, further improving the thermal conductivity efficiency of the entire thermally conductive silicone pad.

[0011] As a further improvement of the above solution, a second viscose pad is fixedly connected to the upper surface of the heat-leveling layer, and a second silicone layer is provided on the upper surface of the heat-leveling layer through the second viscose pad.

[0012] With the above technical solution, the second silicone layer is connected to the upper surface of the heat-balancing layer through the second adhesive pad. This connection method ensures a tight connection between the second silicone layer and the heat-balancing layer.

[0013] As a further improvement of the above solution, there are four second adhesive pads, which are respectively located at the four corners of the upper surface of the heat-dissipating layer.

[0014] Through the above technical solution, it can be ensured that the second silicone layer is firmly fixed on the heat-dissipating layer and is evenly stressed, preventing the second silicone layer from shifting or falling off during use, thereby ensuring the stability of the overall structure of the thermally conductive silicone pad and the continuity of its thermal conductivity.

[0015] As a further improvement of the above solution, a second heat-permeable layer is fixedly connected to the upper surface of the heat-balancing layer, and the second heat-permeable layer is located below the second silicone layer.

[0016] Through the above technical solution, a second heat-permeable layer is set on the upper surface of the heat-averaging layer and is located below the second silicone layer, which helps to conduct heat from the heat-averaging layer to the second silicone layer more efficiently. The second heat-permeable layer can serve as a bridge for heat conduction. On the basis of the heat balance layer having balanced heat, the heat is quickly and evenly conducted to the second silicone layer, further improving the overall thermal conductivity efficiency of the thermal conductive silicone pad.

[0017] As a further improvement of the above solution, the surface material of the heat-balancing layer is boron nitride, and the surfaces of the first heat-permeable layer and the second heat-permeable layer are both made of aluminum oxide.

[0018] Through the above technical solution, the material of the surface of the heat-balancing layer is boron nitride, which has good thermal conductivity and thermal stability, can effectively balance heat and ensure that heat is evenly distributed in the heat-balancing layer. The surface material of the first heat-passing layer and the second heat-passing layer are both alumina, which is a commonly used high thermal conductivity material. Its high thermal conductivity can make heat pass through the heat-passing layer quickly, thereby improving the thermal conductivity of the entire thermal conductive silicone pad, which helps to efficiently conduct and diffuse heat in the thermal conductive silicone pad.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] The utility model can ensure that heat is evenly distributed in the thermally conductive silicone pad for electronic appliances by arranging a heat-averaging layer and a first heat-transmitting layer. The heat-averaging layer can evenly regulate heat to avoid local heat accumulation, and a plurality of holes are opened on the surface of the first heat-transmitting layer. These holes can increase the surface area of ​​the heat-transmitting layer, which is conducive to the rapid passage and diffusion of heat. The position design below the heat-averaging layer allows the heat to be initially dispersed and quickly transmitted through the hole structure of the first heat-transmitting layer before being transmitted from the first silicone layer to the heat-averaging layer, thereby further improving the thermal conductivity efficiency of the entire thermally conductive silicone pad, preventing damage to electronic components due to excessive heat concentration, and extending the service life of electronic appliances. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the explosion structure of the second silicone layer of the utility model;

[0023] Figure 3 This is a schematic diagram of the explosion structure of the heat soaking layer of the utility model;

[0024] Figure 4 This is a schematic diagram of the explosion structure of the first heat-passing layer of the utility model.

[0025] Description of main symbols:

[0026] 1. First silicone layer; 2. First viscose pad; 3. Heat-dissipating layer; 4. First heat-permeable layer; 5. Second viscose pad; 6. Second silicone layer; 7. Second heat-permeable layer. DETAILED DESCRIPTION

[0027] Below, the present invention is further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0028] Example:

[0029] Please combine Figures 1-4 The thermally conductive silicone pad for electronic appliances of this embodiment includes a first silicone layer 1, a first adhesive pad 2 is fixedly connected to the upper surface of the first silicone layer 1, a heat-dissipating layer 3 is provided on the upper surface of the first silicone layer 1 through the first adhesive pad 2, a first heat-permeable layer 4 is fixedly connected to the upper surface of the first silicone layer 1, and the first silicone layer 1 is the base layer of the thermally conductive silicone pad. The first adhesive pad 2 connects the heat-dissipating layer 3 to the upper surface of the first silicone layer 1. This connection method enables the heat-dissipating layer 3 to be stably located on the first silicone layer 1. The first heat-permeable layer 4 is fixedly connected to the upper surface of the first silicone layer 1. The heat-permeable layer and the heat-dissipating layer 3 work together. The heat-dissipating layer can quickly conduct heat, while the heat-dissipating layer 3 is responsible for evenly distributing heat to prevent heat from gathering locally.

[0030] Four first adhesive pads 2 are provided, located at the four corners of the upper surface of the first silicone layer 1. This arrangement provides a relatively stable fixation for the heat-spreading layer 3, ensuring a firm connection between the heat-spreading layer 3 and the first silicone layer 1. This prevents the layers from shifting easily when heat is conducted by the electronic device, thereby ensuring proper heat conduction and heat-spreading functions.

[0031] The surface of the first heat-permeable layer 4, located below the soaking layer 3, is perforated with several holes. This helps improve heat conduction efficiency because the holes increase the surface area for heat exchange, allowing heat to flow through the layer more quickly. The first heat-permeable layer 4 is located below the soaking layer 3. After heat is transferred from the first silicone layer 1 below, it is first rapidly conducted through the first heat-permeable layer 4 before being evenly distributed by the soaking layer 3.

[0032] A second adhesive pad 5 is fixedly attached to the upper surface of the heat-diffusion layer 3. A second silicone layer 6 is also provided on the upper surface of the heat-diffusion layer 3 via the second adhesive pad 5. The second adhesive pad 5 connects the second silicone layer 6 to the upper surface of the heat-diffusion layer 3. Its function is similar to that of the first adhesive pad 2, primarily to stabilize the connection and ensure that the second silicone layer 6 is tightly connected to the heat-diffusion layer 3 during operation of the electronic device. This allows for smooth heat transfer between the layers and ensures the integrity of the entire thermally conductive silicone pad structure.

[0033] Four second adhesive pads 5 are provided, located at the four corners of the upper surface of the thermal soaking layer 3. This arrangement ensures that the second silicone layer 6 is stably connected to the thermal soaking layer 3. During the heat generation and conduction process of the electronic device, relative displacement between the second silicone layer 6 and the thermal soaking layer 3 is prevented, ensuring smooth heat conduction from the thermal soaking layer 3 to the second silicone layer 6.

[0034] A second heat-permeable layer 7 is fixedly connected to the upper surface of the heat-permeable layer 3 and is located below the second silicone layer 6. The second heat-permeable layer 7 is fixedly connected to the upper surface of the heat-permeable layer 3 and is located below the second silicone layer 6. Its function is similar to that of the first heat-permeable layer 4, mainly to accelerate heat conduction. After heat is conducted from the heat-permeable layer 3, it is further rapidly conducted through the second heat-permeable layer 7 and then transferred to the second silicone layer 6.

[0035] The surface material of the heat-dissipating layer 3 is boron nitride, while the surfaces of the first and second heat-dissipating layers 4 and 7 are both made of alumina. Boron nitride has excellent thermal conductivity and heat-dissipating properties, effectively distributing heat evenly. The surfaces of the first and second heat-dissipating layers 4 and 7 are both made of alumina, an excellent thermally conductive material that can quickly conduct heat, helping the entire thermally conductive silicone pad achieve efficient heat conduction and heat-dissipating functions.

[0036] The implementation principle of the thermally conductive silicone pad for electronic appliances in the embodiment of the present application is as follows: heat is first transferred from the electronic and electrical equipment to the first silicone layer 1. The first silicone layer 1 as the base layer conducts the heat upward. The first heat-conducting layer 4 is fixed on the upper surface of the first silicone layer 1, and the several holes on its surface increase the heat exchange surface area, so it can quickly conduct the heat upward. Then the heat-averaging layer 3 evenly distributes the quickly conducted heat to avoid local heat accumulation. This is due to the good heat-averaging performance of the boron nitride material of the heat-averaging layer 3. The heat-averaging layer 3 conducts the evenly distributed heat upward. The second heat-conducting layer 7 is fixed on the upper surface of the heat-averaging layer 3 and below the second silicone layer 6. Its aluminum oxide material helps to quickly conduct heat. The heat is further transferred upward and finally conducted to the second silicone layer 6. The four first adhesive pads 2 are arranged at the four corners of the upper surface of the first silicone layer 1, so that the heat-equalizing layer 3 can be stably connected to the first silicone layer 1. During the heat conduction process, this stable connection ensures that the heat-equalizing layer 3 and the first silicone layer 1 will not be easily displaced, thereby ensuring the normal heat conduction and heat-equalizing functions. The four second adhesive pads 5 are arranged at the four corners of the upper surface of the heat-equalizing layer 3, which stably connects the second silicone layer 6 to the heat-equalizing layer 3. During the heat conduction process, relative displacement between the second silicone layer 6 and the heat-equalizing layer 3 can be prevented, ensuring that heat can be smoothly conducted from the heat-equalizing layer 3 to the second silicone layer 6.

[0037] The above-mentioned embodiments are only preferred embodiments of the present application, and cannot be used to limit the scope of protection of the present application. Any non-essential changes and replacements made by those skilled in the art on the basis of the present application shall fall within the scope of protection of the present application.

Claims

1. Thermal conductive silicone pad for electronic appliances, characterized in that: The invention comprises a first silicone layer (1), the upper surface of the first silicone layer (1) is fixedly connected to a first adhesive pad (2), the upper surface of the first silicone layer (1) is provided with a heat-dissipating layer (3) via the first adhesive pad (2), and the upper surface of the first silicone layer (1) is fixedly connected to a first heat-conducting layer (4).

2. The thermally conductive silicone pad for electronic appliances according to claim 1, wherein: There are four first adhesive pads (2), which are respectively located at the four corners of the upper surface of the first silicone layer (1).

3. The thermally conductive silicone pad for electronic appliances according to claim 1, wherein: A plurality of holes are provided on the surface of the first heat-permeable layer (4), and the first heat-permeable layer (4) is located below the heat-dissipating layer (3).

4. The thermally conductive silicone pad for electronic appliances according to claim 1, wherein: A second adhesive pad (5) is fixedly connected to the upper surface of the heat-dissipating layer (3), and a second silicone layer (6) is provided on the upper surface of the heat-dissipating layer (3) via the second adhesive pad (5).

5. The thermally conductive silicone pad for electronic appliances according to claim 4, wherein: There are four second adhesive pads (5), which are respectively located at the four corners of the upper surface of the heat-dissipating layer (3).

6. The thermally conductive silicone pad for electronic appliances according to claim 1, wherein: A second heat-permeable layer (7) is fixedly connected to the upper surface of the heat-dissipating layer (3), and the second heat-permeable layer (7) is located below the second silica gel layer (6).

7. The thermally conductive silicone pad for electronic appliances according to claim 1, wherein: The surface material of the heat-dissipating layer (3) is boron nitride, and the surface materials of the first heat-conducting layer (4) and the second heat-conducting layer (7) are both aluminum oxide.

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