Heat dissipation protection shell of electronic equipment and electronic equipment
By designing a heat dissipation protection housing in electronic equipment and utilizing cooling air ducts and a multi-air outlet structure, the problems of reduced wind speed and hot air backflow in traditional heat dissipation methods are solved, achieving more efficient heat dissipation and circuit protection.
Patent Information
- Application Number
- CN202422623324.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-29
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-10-29
AI Technical Summary
The heat dissipation method of traditional electronic equipment leads to reduced wind speed, increased possibility of hot air backflow, and reduced reliability of circuit protection.
A heat dissipation protection housing is designed, which includes an outer shell and a wind shield to form a cooling air duct. Through the combination of main air outlet, side air outlet and exhaust outlet, the distance of cooling air flowing to heat-generating electronic components is shortened, and the flow direction of hot air is restricted to prevent hot air backflow.
It improves the heat dissipation effect, enhances the reliability of circuit protection, improves the temperature distribution of electronic equipment, and improves portability.
Smart Images
Figure CN223428742U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a circuit protection device for electronic equipment, in particular to a heat dissipation protection shell of the electronic equipment and the electronic equipment. Background Art
[0002] Traditional electronic devices, such as servers, desktop computers, and laptops, use fans as the circuit heat dissipation protection method. The air outlet is usually set at the hinge of the laptop. Although this method allows the cold air to directly contact the heat-generating electronic components, the path from the fan outlet to the heat-generating electronic components is very long. In addition, there are other electronic devices and obstructions at the hinge on the flow path, which greatly reduces the wind speed reaching the heat-generating electronic components and increases the possibility of hot air backflow, thereby greatly weakening the heat dissipation performance of the electronic equipment and reducing the reliability of circuit protection. Utility Model Content
[0003] The purpose of the utility model is to provide a heat dissipation protection housing which can improve the circuit heat dissipation protection performance of electronic equipment and improve the reliability of circuit protection.
[0004] Another object of the present invention is to provide an electronic device with good circuit heat dissipation effect and high reliability.
[0005] In order to achieve the above-mentioned purpose, the heat dissipation protection shell of the electronic device provided by the utility model includes an outer shell and a plurality of windshields, two fan installation areas are provided at intervals in the outer shell, and the bottom of the outer shell is provided with an air inlet connected to the fan installation area at a position corresponding to each of the fan installation areas, and the two fan installation areas are respectively provided with a main air outlet connected to their respective interiors, and the opposite side of the two fan installation areas is provided with a side air outlet connected to their respective interiors; the windshield is provided between the two side air outlets, and the windshield forms a cooling air duct; a heating element installation area is provided in the cooling air duct, and the bottom of the outer shell is provided with an air outlet connected to the cooling air duct.
[0006] Compared with the prior art, the present invention dissipates heat from the inside of the shell by providing main air outlets connected to the respective interiors in the two fan installation areas, and at the same time, side air outlets connected to the respective interiors are provided on the opposite side of the two fan installation areas, and a wind shield is provided between the two side air outlets. The wind shield is used to form a cooling air duct for the cooling air of the side air outlets to circulate, and an exhaust outlet is provided in the middle of the cooling air duct, so that a heat dissipation path from the side air outlet to the cooling air duct and then to the exhaust outlet can be formed, and the heat-generating electronic components and processors are then arranged in the cooling air duct. Therefore, on the one hand, the cooling air blown out by the fans can be guided, which not only can provide heat dissipation protection for the heat-generating electronic components, but also effectively shortens the distance that the cooling air flows to the heat-generating electronic components, avoids the cooling air being blocked by other electronic components, and greatly improves the heat dissipation protection effect. On the other hand, the flow direction of the hot air inside the heat dissipation shell can be limited to prevent the hot air from flowing near the battery, which is beneficial to improving the shell temperature of the palm rest and touchpad of the electronic device, thereby improving the reliability of the circuit protection of the electronic device.
[0007] Preferably, the windshield is made of foam. Using the foam as a windshield can effectively reduce the weight of the electronic device and improve portability.
[0008] Preferably, the air inlet direction of the air inlet is perpendicular to the air outlet direction of the main air outlet or the side air outlet.
[0009] Preferably, the air outlet direction of the main air outlet is perpendicular to the air outlet direction of the side air outlet.
[0010] Preferably, the air outlet direction of the main air outlet is opposite to the air outlet direction of the side air outlet.
[0011] Preferably, the extension direction of the cooling air duct is in the same direction as the air outlet direction of the side air outlet, which can minimize the distance the cooling air flows to the heat-generating electronic components, avoid the cooling air being blocked by other electronic components, and greatly improve the heat dissipation protection effect.
[0012] Preferably, a partition bar is provided on a side of the housing where the air outlet is provided, and the partition bar is located between the air outlet and the air inlet. By providing the partition bar, the hot air discharged from the air outlet can be prevented from being directly sucked into the air inlet by the fan, thereby ensuring the cooling effect of the cooling air.
[0013] Preferably, a first heating element installation area is provided in the cooling air duct at positions close to the two side air outlets, and a second heating element installation area is provided in the middle position of the cooling air duct.
[0014] Specifically, the second heating element installation area is directly opposite to the air outlet.
[0015] An electronic device comprises a heat dissipation fan, a circuit element and a heat dissipation protection shell, wherein the heat dissipation fan is respectively arranged in two fan installation areas; and the circuit element is arranged in the heating element installation area. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a three-dimensional diagram of the internal structure of the circuit heat dissipation of the electronic equipment of the utility model.
[0017] Figure 2 It is an internal structure diagram of the circuit heat dissipation of the electronic equipment of the utility model.
[0018] Figure 3 It is a structural diagram of the bottom of the heat dissipation protection shell of the electronic equipment of the present invention.
[0019] Figure 4 This is a wind path diagram for heat dissipation of a circuit of an electronic device of the utility model. DETAILED DESCRIPTION
[0020] In order to explain the technical content, structural features and effects achieved by the present invention in detail, the following is a detailed description in conjunction with the embodiments and the accompanying drawings.
[0021] like Figures 1 to 3As shown, the electronic device 100 of the present invention is a laptop computer, and may also be a server, a desktop computer host, etc. The electronic device 100 includes a heat dissipation protection housing 1, a heat dissipation fan 2, and circuit components (not shown). The heat dissipation protection housing 1 includes an outer shell 11 and a plurality of windshields 12. Two fan mounting areas 111 are provided at intervals in the outer shell 11, and the heat dissipation fans 2 are respectively provided in the two fan mounting areas 111; an air inlet 11a connected to the fan mounting areas 111 is provided at the bottom of the outer shell 11 corresponding to the positions of the fan mounting areas 111; the two fan mounting areas 111 are respectively provided with a main air outlet 111a connected to their respective interiors, and a side air outlet 111b connected to their respective interiors is provided on the opposite side of the two fan mounting areas 111; if the heat dissipation fan 2 is a heat dissipation device including a fan housing, the main air outlet 111a and the side air outlet 111b may also be provided on the fan housing. The windshield 12 is provided between the two side air outlets 111b, and the windshield 12 forms a cooling duct 121. The two ends of the cooling duct 121 are respectively connected to the two side air outlets 111b. A heating element installation area is provided in the cooling duct 121. Specifically, in this embodiment, a first heating element installation area 121a is provided in the cooling duct 121 near the two side air outlets 111b, and some circuit components are arranged in the first heating element installation area 121a. A second heating element installation area is provided in the middle of the cooling duct 121, and the second heating element installation area is the processor installation area 121b. The bottom of the housing 11 is provided with an exhaust port 11b that is connected to the cooling duct 121, and the exhaust port 11b is directly opposite the processor installation area 121b.
[0022] See also Figure 2 The windshield 12 is made of foam. Using the foam as the windshield 12 can effectively reduce the weight of the electronic device and improve portability.
[0023] See also Figure 1 and Figure 2 , the air inlet direction of the air inlet 11a is perpendicular to the air outlet direction of the main air outlet 111a or the side air outlet 111b. The air outlet direction of the main air outlet 111a is perpendicular to the air outlet direction of the side air outlet 111b. Of course, the air outlet direction of the main air outlet 111a and the air outlet direction of the side air outlet 111b can also be opposite or set at an angle, and the air outlet directions of the two can be determined according to the layout position of the electronic components inside the heat dissipation protection shell 1. The extension direction of the cooling air duct 121 is in the same direction as the air outlet direction of the side air outlet 111b. In this way, the distance that the cooling air flows to the heat-generating electronic components can be shortened to the maximum extent, and the cooling air can be prevented from being blocked by other electronic components, which greatly improves the effect of heat dissipation protection.
[0024] See also Figure 3 A partition bar 13 is provided on the side of the housing 11 where the exhaust port 11b is located. The partition bar 13 is located between the exhaust port 11b and the air inlet 11a. The partition bar has a bent right-angle structure. The provision of the partition bar 13 prevents the hot air exhausted from the exhaust port 11b from being directly drawn into the air inlet 11a by the cooling fan 2, thereby ensuring the cooling effect of the cooling air.
[0025] Combine the above and combine Figure 2 and Figure 4 The circuit heat dissipation principle of the electronic device 100 of the present invention is as follows: when the temperature of the circuit or heat-generating electronic components is too high or when the high-performance mode is used, the fan starts and draws cooling air from the air inlet 11a. Then, a portion of the cooling air flows into the interior of the housing 11 from the main air outlet 111a to dissipate heat from the interior of the housing 11. Another portion of the cooling air flows into the cooling air duct 121 from the side air outlet 111b, thereby cooling the heat-generating electronic components and processors in the cooling air duct 121. Finally, after heat exchange, the hot air is discharged from the exhaust port 11b to the outside of the housing 11.
[0026] Compared with the prior art, the present invention dissipates heat from the inside of the housing 11 by providing main air outlets 111a communicating with the respective interiors in the two fan installation areas 111, and at the same time, providing side air outlets 111b communicating with the respective interiors on opposite sides of the two fan installation areas 111, and then providing an air shield 12 between the two side air outlets 111b, utilizing the air shield 12 to form a cooling air duct 121 for the cooling air of the side air outlets 111b to circulate, and providing an exhaust port 11b in the middle of the cooling air duct 121, thereby forming a cooling air duct 121 from the side air outlet 111b to the cooling air duct 121 and then to the exhaust port 11b. 1b, and then the heat-generating electronic components and processors are arranged in the cooling air duct 121. Therefore, on the one hand, the cooling air blown out by the fan can be diverted, which not only can provide heat dissipation protection for the heat-generating electronic components, but also effectively shortens the distance for the cooling air to flow to the heat-generating electronic components, avoiding the cooling air from being blocked by other electronic devices, greatly improving the effect of heat dissipation protection, and on the other hand, it can limit the flow direction of the hot air inside the shell 11, preventing the hot air from flowing near the battery, which is beneficial to improving the shell temperature of the palm rest and touchpad of the electronic device, thereby improving the reliability of the circuit protection of the electronic device.
[0027] The above disclosure is only a preferred embodiment of the present invention and certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.
Claims
1. A heat dissipation protective housing for an electronic device, characterized in that: It includes an outer shell and a plurality of wind shields, two fan installation areas are provided at intervals in the outer shell, and air inlets connected to the fan installation areas are provided at the bottom of the outer shell corresponding to the positions of the fan installation areas, the two fan installation areas are respectively provided with main air outlets connected to their respective interiors, and the opposite sides of the two fan installation areas are provided with side air outlets connected to their respective interiors; the wind shield is provided between the two side air outlets, and the wind shield forms a cooling air duct; a heating element installation area is provided in the cooling air duct, and an air exhaust connected to the cooling air duct is provided at the bottom of the outer shell.
2. The heat dissipation protective housing for an electronic device according to claim 1, wherein: The windshield is made of foam.
3. The heat dissipation protective housing for an electronic device according to claim 1, wherein: The air inlet direction of the air inlet is perpendicular to the air outlet direction of the main air outlet or the side air outlet.
4. The heat dissipation protective housing for an electronic device according to claim 1, wherein: The air outlet direction of the main air outlet is perpendicular to the air outlet direction of the side air outlet.
5. The heat dissipation protective housing for electronic equipment according to claim 1, wherein: The air outlet direction of the main air outlet is opposite to the air outlet direction of the side air outlet.
6. The heat dissipation protective housing for an electronic device according to claim 1, wherein: The extending direction of the cooling air duct is the same as the air outlet direction of the side air outlet.
7. The heat dissipation protective housing for an electronic device according to claim 1, wherein: A partition bar is provided on a side of the housing where the air outlet is located, and the partition bar is located between the air outlet and the air inlet.
8. The heat dissipation protective housing for an electronic device according to claim 1, wherein: A first heating element installation area is provided in the cooling air duct at positions close to the two side air outlets, and a second heating element installation area is provided in the middle position of the cooling air duct.
9. The heat dissipation protective housing for an electronic device according to claim 8, wherein: The second heating element installation area is directly opposite to the air outlet.
10. An electronic device, characterized in that: It comprises a heat dissipation fan, a circuit element and the heat dissipation protection housing according to any one of claims 1 to 9, wherein the heat dissipation fan is respectively arranged in the two fan installation areas; the circuit element is arranged in the heating element installation area.