Frequency converter system

Abstract

The utility model relates to a frequency converter system, which comprises at least two heating elements and at least two heat dissipation plates, and is characterized in that the at least two heat dissipation plates are respectively and correspondingly attached to the at least two heating elements one by one; a heat dissipation flow channel is arranged in the heat dissipation plate, and the heat dissipation flow channel is configured to convey a refrigerant; and the centralized heat dissipation assembly is connected with the at least two heat dissipation plates, and the centralized heat dissipation assembly is configured to control the amount of refrigerants conveyed to the at least two heat dissipation plates according to the heat productivity of the at least two heating pieces. The heat dissipation plate adopts a split type layout mode, adaptive heat dissipation ways can be provided for different heating pieces, and the adaptability and efficiency of the heat dissipation device are greatly improved; the radiating plate is attached to the heating element, so that the occupied space is small, and the volume of the frequency converter is not excessively enlarged; a heat dissipation runner is arranged in the heat dissipation plate, so that the cooling uniformity of the heating element can be improved; the centralized heat dissipation assembly can control the amount of the refrigerant conveyed to the corresponding heat dissipation plate according to the heating value of each heating piece, and the cooling uniformity, the cooling efficiency and the cooling accuracy are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of frequency converters, in particular to a frequency converter system. Background Art

[0002] With the rapid development of the renewable energy industry, inverters, as key devices connecting energy production and consumption, play a vital role in energy storage and conversion. However, some related technologies suffer from large inverter heat dissipation devices, complex structures, and poor heat dissipation. This results in the entire inverter system occupying a large space and having low heat dissipation efficiency. Utility Model Content

[0003] Some embodiments of the present invention provide an inverter system to alleviate the problems of large space occupation and low heat dissipation efficiency.

[0004] In one aspect of the present invention, a frequency converter system is provided, comprising:

[0005] At least two heating elements;

[0006] At least two heat dissipation plates are respectively arranged in correspondence with the at least two heat generating elements; a heat dissipation channel is provided in the heat dissipation plate, and the heat dissipation channel is configured to transport a refrigerant; and

[0007] The centralized heat dissipation component is connected to the at least two heat dissipation plates, and the centralized heat dissipation component is configured to control the amount of refrigerant delivered to the at least two heat dissipation plates according to the heat generation of the at least two heating elements.

[0008] In some embodiments, the centralized heat dissipation assembly includes a centralized heat dissipation element, wherein a collecting channel is provided in the centralized heat dissipation element, and the collecting channel is configured to collect the refrigerant in the heat dissipation channel and transport the refrigerant to the heat dissipation channel.

[0009] In some embodiments, the centralized heat dissipation assembly includes a main circuit and at least two branches, the main circuit is connected in parallel to the at least two branches, and each of the at least two branches is connected to at least one heat dissipation plate of the at least two heat dissipation plates.

[0010] In some embodiments, the centralized heat dissipation assembly further includes a liquid separation pump, and the liquid separation pump is provided at the connection between at least one of the at least two branches and the main line.

[0011] In some embodiments, the centralized heat dissipation component also includes a radiator and a fan. The radiator is arranged in contact with the centralized heat dissipation component, fins are provided inside the radiator, and the fan is arranged at the air inlet of the radiator. The air outlet direction of the fan is consistent with the direction from the air inlet to the air outlet of the radiator.

[0012] In some embodiments, the at least two heat-generating elements include a first heat-generating element and a second heat-generating element; the centralized heat-dissipating assembly includes a centralized heat-dissipating element, and the second heat-generating element, the first heat-generating element and the centralized heat-dissipating element are spaced apart along a first direction.

[0013] In some embodiments, the number of the first heating elements is at least two, and the at least two first heating elements are spaced apart along the second direction. The at least two heat dissipation plates include a first heat dissipation plate, and the first heat dissipation plate is arranged in contact with the at least two first heating elements, and the first direction intersects with the second direction.

[0014] In some embodiments, the number of the second heating elements is at least two, and the at least two second heating elements are arranged at intervals along the second direction. The at least two heat dissipation plates include at least two second heat dissipation plates, each second heat dissipation plate is arranged in contact with a second heating element, and the first direction intersects with the second direction.

[0015] In some embodiments, the centralized heat dissipation assembly further includes a radiator, which is arranged in contact with the centralized heat dissipation element, and the radiator and the centralized heat dissipation element are arranged along a third direction, and the first direction intersects the third direction.

[0016] In some embodiments, the centralized heat dissipation component also includes a fan, which is arranged at the air inlet of the radiator. The air outlet direction of the fan is consistent with the direction from the air inlet to the air outlet of the radiator, and the direction from the air inlet to the air outlet is parallel to the first direction.

[0017] In some embodiments, the at least two heat-generating components include a power semiconductor device and a reactor.

[0018] In some embodiments, the number of the power semiconductor devices is three, and the at least two heat dissipation plates include a first heat dissipation plate, which is arranged to fit the three power semiconductor devices.

[0019] In some embodiments, the number of the reactors is at least two, the at least two heat sinks include at least two second heat sinks, and each reactor is correspondingly provided with a second heat sink.

[0020] Based on the above technical solution, the present invention has at least the following beneficial effects:

[0021] In some embodiments, at least two heat sinks are respectively arranged to correspond to at least two heating elements, and the heat sinks adopt a split layout, which can provide suitable heat dissipation paths for different heating elements, greatly improving the adaptability and efficiency of the heat dissipation device; the heat sinks are arranged to fit the heating elements, occupying a small space and not expanding the volume of the inverter too much; a heat dissipation flow channel is provided in the heat sink, and a refrigerant is transported in the heat dissipation flow channel. The refrigerant flows in the heat sink and exchanges heat with the heating elements, which can improve the cooling uniformity of the heating elements; the centralized heat dissipation component can control the amount of refrigerant delivered to the corresponding heat sink according to the heat generation of each heating element, ensuring that each heating element can obtain sufficient cooling, improving the cooling uniformity, cooling efficiency and cooling accuracy, and reducing the overall energy consumption of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0023] Figure 1 A schematic diagram of a three-dimensional structure of a frequency converter system provided in accordance with some embodiments of the present invention from a first perspective;

[0024] Figure 2 A schematic diagram of a three-dimensional structure of a frequency converter system provided according to some embodiments of the present invention from a second perspective;

[0025] Figure 3 A schematic diagram of the exploded structure of a frequency converter system provided according to some embodiments of the present invention;

[0026] Figure 4 The figure is a plan view of a frequency converter system according to some embodiments of the present invention.

[0027] The reference numerals in the accompanying drawings are described as follows:

[0028] 1-heating element; 11-first heating element; 111-power semiconductor device; 12-second heating element; 121-reactor; 13-capacitor;

[0029] 2- heat sink; 21- first heat sink; 22- second heat sink;

[0030] 3- centralized heat dissipation assembly; 31- centralized heat dissipation element; 32- main line; 33- branch line; 34- liquid separation pump; 35- radiator; 351- fin; 36- fan; 37- drive pump;

[0031] 4- Temperature detection element;

[0032] 5- Shell.

[0033] It should be understood that the size of each part shown in the drawings is not drawn according to the actual proportional relationship.In addition, the same or similar reference numerals represent the same or similar components. DETAILED DESCRIPTION

[0034] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is in no way intended to limit the present invention and its application or use. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present invention thorough and complete and to fully convey the scope of the present invention to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, the composition of materials, numerical expressions, and numerical values ​​set forth in these embodiments should be interpreted as merely exemplary and not as limiting.

[0035] The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are simply used to distinguish different parts. Terms such as "include" or "comprising" mean that the elements preceding the term include the elements listed after the term, and do not exclude the possibility of also including other elements. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0036] In the present invention, when a specific device is described as being located between a first device and a second device, an intervening device may or may not be present between the specific device and the first device or the second device. When a specific device is described as being connected to another device, the specific device may be directly connected to the other device without an intervening device, or may be connected to the other device without an intervening device but with an intervening device.

[0037] All terms (including technical or scientific terms) used in this utility model have the same meaning as understood by one of ordinary skill in the art to which this utility model belongs, unless otherwise specifically defined. It should also be understood that terms defined in common dictionaries, for example, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealized or highly formal sense, unless explicitly defined herein.

[0038] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0039] Among related technologies, air cooling is widely used due to its simple structure and low cost. However, its heat dissipation efficiency is limited by the heat capacity and heat transfer capacity of air, making it difficult to meet the heat dissipation requirements of high-power density equipment. Direct liquid cooling achieves efficient heat dissipation through the high thermal conductivity of the liquid medium, but traditional liquid cooling systems are often bulky, which is not conducive to miniaturization of equipment. While phase change cooling has significant heat dissipation effects, its high cost and complex system make it difficult to widely use.

[0040] When it comes to heat dissipation in miniaturized three-level inverters, it's difficult to simultaneously balance heat dissipation efficiency, system integration, and economic costs. Space constraints, particularly in miniaturized devices, pose a significant challenge to the design of the cooling system. Furthermore, the varying thermal characteristics of various heat-generating components within the inverter also require the cooling system to provide customized solutions. For example, IGBTs (Insulated Gate Bipolar Transistors) typically operate in high-current and high-voltage environments, generating large and concentrated amounts of heat, requiring efficient localized heat dissipation measures. The heat distribution and generation mechanisms of reactors and capacitors differ from those of IGBTs, requiring a cooling system optimized for their varying heat dissipation characteristics.

[0041] Based on this, an embodiment of the present invention provides an inverter system, which can not only meet the miniaturization design requirements of the inverter, but also effectively manage the heat dissipation requirements of different heating components in a targeted manner.

[0042] refer to Figure 1 and Figure 2 In some embodiments, a frequency converter system includes a frequency converter and a heat sink.

[0043] The frequency converter includes at least two heating elements 1 , and the heat dissipation device includes at least two heat dissipation plates 2 and a centralized heat dissipation component 3 .

[0044] At least two heat dissipation plates 2 are respectively arranged in correspondence with at least two heating elements 1; a heat dissipation channel is provided in the heat dissipation plate 2, and the heat dissipation channel is configured to transport a refrigerant.

[0045] The centralized heat dissipation assembly 3 is connected to at least two heat dissipation plates 2 , and is configured to control the amount of refrigerant delivered to the at least two heat dissipation plates 2 according to the heat generation of the at least two heating elements 1 .

[0046] In the above embodiment, at least two heat sinks 2 are respectively arranged to correspond to at least two heating elements 1. The heat sinks 2 adopt a split layout, which can provide suitable heat dissipation paths for different heating elements 1, greatly improving the adaptability and efficiency of the heat dissipation device. The heat sinks 2 are arranged to fit the heating elements 1, occupying a small space. Compared with the method of cooling the heating elements 1 by setting air ducts in the related art, no space is required for setting air ducts, and the volume of the inverter will not be excessively expanded. The heat sinks 2 are provided with heat dissipation channels, and the heat dissipation channels carry refrigerant. The refrigerant flows through the heat sinks 2, exchanges heat with the heating elements 1, and absorbs the heat generated by the heating elements 1, thereby improving the cooling uniformity of the heating elements 1. The centralized heat dissipation assembly 3 can control the amount of refrigerant delivered to the corresponding heat sink 2 according to the heat output of each heating element 1, and dynamically adjust the refrigerant flow rate according to the actual heat output of each heating element 1, so that each heating element 1 can obtain sufficient cooling. This can prevent equipment damage caused by local overheating and prevent unnecessary energy waste, improve cooling uniformity, cooling efficiency and cooling accuracy, and reduce the overall energy consumption of the system.

[0047] The heat dissipation device provided in this embodiment of the utility model has efficient heat dissipation capabilities, significantly improving the operating environment of the main heat-generating components (electronic components) within the inverter, effectively extending the inverter's service life, reducing maintenance requirements, and improving overall stability and reliability. Experimental data and simulation results demonstrate that the inverter system provided in this embodiment of the utility model can achieve precise control of device temperature under various operating conditions and maintain excellent heat dissipation performance even under high power density operating conditions.

[0048] In some embodiments, the heat sink 2 is in the shape of a flat plate. The size of the heat sink 2 is set according to the size of the heating element 1. The heat sink 2 is placed on a relatively flat surface of the heating element 1.

[0049] In some embodiments, the heat dissipation channel within the heat dissipation plate 2 can be a channel dug within the heat dissipation plate 2, through which refrigerant is passed to form the heat dissipation channel. The heat dissipation channel within the heat dissipation plate 2 can also be formed by leaving space within the heat dissipation plate 2 for arranging pipes, arranging the pipes within the heat dissipation plate 2, and passing refrigerant through the pipes to form the heat dissipation channel.

[0050] The heat sink 2 is generally mounted on a component in the inverter that generates a large amount of heat. The component in the inverter that generates a large amount of heat is the heating element 1.

[0051] In some embodiments, the heating element 1 includes electronic components in a frequency converter. In some specific embodiments, the heating element 1 includes a power semiconductor device 111, a reactor 121, and a capacitor 13.

[0052] In some embodiments, at least two heat sinks 2 and a centralized heat dissipation assembly 3 constitute a heat dissipation device of the inverter, and a liquid cooling circulation system is formed in the heat dissipation device.

[0053] In some embodiments, the power semiconductor device 111 includes an IGBT.

[0054] The main power components of a frequency converter include IGBTs, reactors, and capacitors. These components generate a large amount of heat during operation. If this heat is not dissipated promptly and effectively, it will cause component temperatures to rise, affecting the converter's conversion efficiency, stability, and service life. Therefore, the heat dissipation device provided by the present invention can improve the heat dissipation effect and efficiency of the frequency converter without significantly increasing the converter's size, minimizing the space occupied by the entire frequency conversion system.

[0055] In some embodiments, the inverter includes a two-level inverter and a three-level inverter. A three-level inverter uses three different voltage levels to generate an output waveform, resulting in a smoother output voltage and lower harmonic distortion. Compared to a two-level inverter, a three-level inverter offers higher voltage levels and better performance.

[0056] In some embodiments, the centralized heat dissipation assembly 3 includes a centralized heat dissipation element 31 , in which a collecting channel is provided. The collecting channel is configured to collect the refrigerant in the heat dissipation channel and transport the refrigerant to the heat dissipation channel.

[0057] In the above embodiment, the collecting flow channel in the centralized heat dissipation element 31 can collect the refrigerant in the heat dissipation flow channel of each heat dissipation plate 2, and can also transport the refrigerant to the heat dissipation flow channel of each heat dissipation plate 2. Therefore, the refrigerant can form a circulation flow, providing a circulating cooling flow path for each heating element 1, and can continuously provide refrigerant to the heating element 1, so that the refrigerant evenly covers each heating element 1, ensuring that each heating element 1 is always within the appropriate temperature range, avoiding local overheating, and improving cooling efficiency and cooling uniformity.

[0058] In some embodiments, the collection channel within the centralized heat sink 31 can be a channel excavated within the centralized heat sink 31, into which refrigerant is passed to form the collection channel. The collection channel within the centralized heat sink 31 can also be formed by leaving space within the centralized heat sink 31 for arranging pipes, arranging the pipes within the centralized heat sink 31, and passing refrigerant into the pipes to form the collection channel.

[0059] refer to Figures 1 to 4 In some embodiments, the centralized heat dissipation assembly 3 includes a main circuit 32 and at least two branches 33 , the main circuit 32 is connected in parallel with the at least two branches 33 , and each of the at least two branches 33 is connected to at least one heat dissipation plate 2 of the at least two heat dissipation plates 2 .

[0060] In the above embodiment, the main line 32 of the centralized heat dissipation component 3 is connected in parallel with at least two branch lines 33, which enables the centralized heat dissipation component 3 to be connected in parallel with at least two heat dissipation plates 2. This can be beneficial for controlling the amount of refrigerant delivered to the corresponding heat dissipation plate 2 according to the heat generation of each heating element 1, thereby achieving the purpose of dynamically adjusting the amount of refrigerant delivered to each heat dissipation plate 2, so that each heating element 1 can obtain sufficient cooling, thereby improving cooling uniformity, cooling efficiency and cooling accuracy.

[0061] In some embodiments, the outlet of the collecting flow channel in the centralized heat sink 31 is connected to the main line 32, the main line 32 is connected to each branch line 33, each branch line 33 is respectively connected to the inlet of the heat dissipation flow channel in at least one heat sink 2, the outlet of the heat dissipation flow channel of each heat sink 2 is connected to another branch line, another main line is connected to another main line, and another main line is connected to the inlet of the collecting flow channel in the centralized heat sink 31, so that the refrigerant forms a circulation.

[0062] In one embodiment, the collection channels within the centralized heat sink 31 and the heat dissipation channels of each heat sink 2 can be formed by pipes running through the plate-like structure. The pipes within the centralized heat sink 31 can be connected to the main pipe or formed integrally with the main pipe. The pipes within each heat sink 2 can be connected to the branch pipe or formed integrally with the branch pipe.

[0063] In some embodiments, the concentrated heat dissipating member 31 is configured as a flat plate.

[0064] In some embodiments, the centralized heat dissipation assembly 3 further includes a liquid separation pump 34 , and a liquid separation pump 34 is provided at the connection between at least one branch 33 of the at least two branches 33 and the main line 32 .

[0065] In some embodiments, the centralized heat dissipation element 31 includes a main line 32 and two or more branches 33. The number of liquid separation pumps 34 can be one less than the number of branches 33. The liquid separation pumps 34 are connected in series on the main line 32 in sequence. Each liquid separation pump 34 is respectively connected to a branch 33, and the liquid separation pump 34 located at the downstream end is connected to two branches 33.

[0066] For example: the centralized heat dissipation element 31 includes a main line 32 and two branches 33, the number of the liquid separation pump 34 is one, and the liquid separation pump 34 includes three interfaces, the first interface is connected to the main line 32, the second interface is connected to one of the two branches 33, and the third interface is connected to the other of the two branches 33.

[0067] In the above embodiment, by setting a liquid separation pump 34 at the connection between the branch 33 and the main line 32, the amount of refrigerant entering each branch 33 can be adjusted by adjusting the opening of each interface of the liquid separation pump 34, thereby adjusting the amount of refrigerant entering the heat sink 2.

[0068] In some embodiments, the centralized heat dissipation assembly 3 also includes a radiator 35 and a fan 36. The radiator 35 is arranged in contact with the centralized heat dissipation element 31. Fins 351 are provided inside the radiator 35. The fan 36 is arranged at the air inlet of the radiator 35. The air outlet direction of the fan 36 is consistent with the direction from the air inlet to the air outlet of the radiator 35.

[0069] Air cooling is widely used in some related technologies due to its simple structure and low cost. However, when the power density of power electronic equipment is high, air cooling cannot meet the demand due to its limited heat dissipation capacity. Direct liquid cooling, while more efficient, often has problems such as complex systems, large size, high cost, and difficult maintenance.

[0070] Based on this, in the above embodiment, a circulating heat dissipation system is formed by setting up a centralized heat dissipation element 31 to optimize the heat flow path, and combined with a fin-type heat sink 35 and a fan 36, the heat dissipation area is significantly increased with the assistance of the fin structure and the fan 36, thereby improving the heat energy emission efficiency.

[0071] In some embodiments, the inverter system further includes a controller and a temperature detection element 4, wherein the temperature detection element 4 is provided on the heating element 1 and electrically connected to the controller. An intelligent control strategy is pre-installed in the controller. By receiving information sent by the temperature detection element 4 in real time, the controller monitors the temperature of the heating element 1 and dynamically adjusts the operating status of the liquid separation pump 34 and the fan 36 based on the temperature data, thereby achieving the purpose of accurately controlling the heat dissipation effect. This intelligent adjustment mechanism not only facilitates the stable operation of the equipment within the optimal operating temperature range, but also achieves energy conservation and consumption reduction in partial load or low power consumption scenarios.

[0072] In some embodiments, the controller includes a microprocessor, a driving circuit, and a preset software algorithm to achieve precise temperature control.

[0073] refer to Figure 4 In some embodiments, at least two heating elements 1 include a first heating element 11 and a second heating element 12; the centralized heat dissipation assembly 3 includes a centralized heat dissipation element 31, and the second heating element 12, the first heating element 11 and the centralized heat dissipation element 31 are arranged at intervals along the first direction X.

[0074] In the above embodiment, the second heating element 12 and the first heating element 11 are components in the inverter and can maintain their setting positions in the inverter unchanged. The second heating element 12, the first heating element 11 and the centralized heat dissipation element 31 are arranged at intervals along the first direction X. The centralized heat dissipation element 31 has a certain distance from the first heating element 11 in the first direction X. The centralized heat dissipation element 31 can be independent of the inverter and arranged outside the inverter. It will not occupy the space in the inverter. The volume of the inverter will not increase due to the arrangement of the centralized heat dissipation element 31, and the heat dissipation plate 2 can be arranged in contact with the second heating element 12 and the first heating element 11. The heat dissipation plate 2 is plate-shaped and will not increase the volume of the inverter too much. It is suitable for inverters with smaller and smaller volumes and will not increase the occupied space of the entire inverter system too much.

[0075] In some embodiments, the inverter system includes multiple inverters, which are connected in series or in parallel. Heat sinks 2 are provided on the heating elements 1 in the multiple inverters, and each heat sink 2 is connected to the same centralized heat sink 31 .

[0076] In the above embodiment, the centralized heat sink 31 is set independently from each inverter, that is, the centralized liquid cooling part is separated independently, thereby further compressing the internal space of the inverter cabinet, realizing the string design of the inverter, and using a centralized liquid cooling system to supply heat to multiple inverters, thereby improving the utilization rate of the overall inverter system space.

[0077] In some embodiments, the number of first heating elements 11 is at least two, at least two first heating elements 11 are arranged at intervals along the second direction Y, at least two heat dissipation plates 2 include a first heat dissipation plate 21, the first heat dissipation plate 21 is arranged in contact with at least two first heating elements 11, and the first direction X intersects with the second direction Y.

[0078] In the above embodiment, for multiple first heating elements 11 with the same structural model and the same working conditions, since the heat generation is the same, the multiple first heating elements 11 can be arranged in conjunction with the first heat dissipation plate 21 to better utilize the surface area of ​​the entire heat dissipation plate, provide a larger heat dissipation area, help to distribute heat more evenly, reduce local hot spots, simplify the structure, reduce the complexity of assembly and maintenance, and reduce costs.

[0079] In some embodiments, the number of second heating elements 12 is at least two, at least two second heating elements 12 are arranged at intervals along the second direction Y, at least two heat dissipation plates 2 include at least two second heat dissipation plates 22, each second heat dissipation plate 22 is arranged in contact with a second heating element 12, and the first direction X intersects with the second direction Y.

[0080] In the above embodiment, for different structural types and different working conditions of the plurality of second heat-generating components 12, since the heat-generating amounts of the respective second heat-generating components 12 are different, each second heat-generating component 12 can be provided with a second heat-dissipating plate 22, and according to the heat-generating amount and heat-dissipating requirement of each second heat-generating component 12, the refrigerant can be provided to each second heat-generating component 12 more targetedly, so that each second heat-generating component 12 can be cooled most effectively, and each second heat-generating component 12 can be independently controlled in temperature to avoid local overheating, so that each second heat-generating component 12 can be in an optimal working temperature range.

[0081] In some embodiments, one branch 33 is connected to at least two second heat-dissipating plates 22 in parallel through pipelines. A flow control valve can be arranged on the pipeline through which the branch 33 is connected to each second heat-dissipating plate 22.

[0082] In some embodiments, the first direction X is perpendicular to the second direction Y.

[0083] In some embodiments, the first heat-dissipating plate 21 and the first heat-generating component 11 are arranged along a third direction Z.

[0084] In some embodiments, the second heat-generating component 12 and the second heat-dissipating plate 22 are arranged along the third direction Z.

[0085] In some embodiments, the first direction X intersects the third direction Z. Optionally, the first direction X is perpendicular to the third direction Z, and the first direction X is perpendicular to the second direction Y, and the third direction Z is perpendicular to the second direction Y.

[0086] In some embodiments, the centralized heat-dissipating assembly 3 further comprises a heat sink 35, the heat sink 35 is arranged in contact with the centralized heat-dissipating component 31, and the heat sink 35 and the heat-dissipating plate 2 are arranged along the third direction Z, and the first direction X intersects the third direction Z.

[0087] In the above embodiment, the second heat-generating component 12, the first heat-generating component 11 and the centralized heat-dissipating component 31 are arranged along the first direction X, in the case of a plurality of second heat-generating components 12 and a plurality of first heat-generating components 11, the plurality of second heat-generating components 12 are arranged along the second direction Y in sequence, and the plurality of first heat-generating components 11 are arranged along the second direction Y in sequence, in order to more reasonably arrange the heat-dissipating plate 2, the first heat-dissipating plate 21 and the first heat-generating component 11 are arranged along the third direction Z, and the second heat-generating component 12 and the second heat-dissipating plate 22 are arranged along the third direction Z; accordingly, the heat sink 35 and the centralized heat-dissipating component 31 are arranged along the third direction Z, so that the structure of the entire frequency converter system can be arranged in order, the structure is compact, the space utilization is optimized, and the occupied space of the frequency converter system is reduced.

[0088] In some embodiments, the centralized heat dissipation component 3 also includes a fan 36, which is arranged at the air inlet of the radiator 35. The air outlet direction of the fan 36 is consistent with the direction from the air inlet to the air outlet of the radiator 35, and the direction from the air inlet to the air outlet is parallel to the first direction X.

[0089] In the above embodiment, by providing airflow to the radiator 35 through the fan 36, the convective heat dissipation effect of the radiator 35 can be enhanced, the heat dissipation efficiency can be greatly improved, and the thermal resistance between the radiator 35 and the surrounding air can be reduced, thereby removing heat more quickly. In addition, the fan 36 can provide uniform airflow to ensure that all parts of the radiator 35 can be effectively cooled to avoid local overheating. Furthermore, the wind speed of the fan 36 can be adjusted, and the heat dissipation effect can be adjusted according to actual needs. For example, under low load conditions, the wind speed can be reduced to reduce noise and energy consumption; under high load conditions, the wind speed can be increased to prevent local overheating of the system and achieve the best heat dissipation effect. Therefore, by combining the fan 36 and the radiator 35 to dissipate heat from the centralized heat dissipation element 31, the heat dissipation efficiency and heat dissipation effect can be improved, and the structure is compact, space is optimized, and volume is reduced.

[0090] In the above embodiment, the direction from the air inlet to the air outlet of the fan 36 is parallel to the first direction X, and the second heating element 12, the first heating element 11 and the centralized heat dissipation element 31 are arranged at intervals along the first direction X. The air outlet of the fan 36 enters the radiator 35, and after dissipating the heat for the centralized heat dissipation element 31, it can also flow from the air outlet to the inverter to dissipate heat for the heating element 1, thereby making full use of energy and reducing energy consumption.

[0091] In some embodiments, the number of the fans 36 is at least two, and the at least two fans 36 are sequentially arranged at the air inlet of the radiator 35 along the second direction Y to improve the heat dissipation effect.

[0092] In some embodiments, the inverter further includes a housing 5 , in which the heating element 1 is disposed. The heat dissipation plate 2 is disposed in the housing 5 . The centralized heat dissipation element 31 , the radiator 35 , and the fan 36 are disposed outside the housing 5 .

[0093] Because the heat sink 2 is flat and positioned in close proximity to the heating element 1, it occupies a small space within the housing 5. Compared to the related art method of cooling the heating element 1 by providing an air duct, this method does not require space for an air duct, thus minimizing the volume of the housing 5. Furthermore, the centralized heat sink 31, radiator 35, and fan 36 are positioned outside the housing 5, eliminating the need for space within the housing 5. This makes it suitable for miniaturization of inverters. Furthermore, the integrated arrangement of the centralized heat sink 31, radiator 35, and fan 36 creates a compact structure, reducing the space required for the heat sink, making it ideal for the heat dissipation needs of high-density electronic devices such as miniaturized inverters.

[0094] In some embodiments, the at least two heat-generating elements 1 include a power semiconductor device 111 and a reactor 121 .

[0095] In the above embodiment, the power semiconductor device 111 and the reactor 121 are components that generate relatively large amounts of heat in the inverter. Attaching the heat sink 2 to the power semiconductor device 111 and the reactor 121 can effectively reduce the temperature of the power semiconductor device 111 and the reactor 121, thereby preventing damage to the equipment caused by local overheating of the inverter.

[0096] In some embodiments, the number of the power semiconductor devices 111 is three, and the at least two heat dissipation plates 2 include a first heat dissipation plate 21 . The first heat dissipation plate 21 is disposed in contact with the three power semiconductor devices 111 .

[0097] In the above embodiment, the number of power semiconductor devices 111 is three, the inverter is a three-level inverter, and the three power semiconductor devices 111 are of the same model, started and shut down at the same time. Therefore, the heat generation is the same. The first heat sink 21 is set to fit the three power semiconductor devices 111, which can better utilize the surface area of ​​the entire first heat sink 21, provide a larger heat dissipation surface, help to distribute heat more evenly, reduce local hot spots, simplify the structure, reduce the complexity of assembly and maintenance, and reduce costs.

[0098] The embodiments of the present invention can provide an integrated, intelligent, and energy-efficient liquid cooling device for a miniaturized three-level inverter, thereby significantly improving the performance and reliability of the device.

[0099] In some embodiments, the number of power semiconductor devices 111 may be an integer multiple of three, for example, six, nine, or twelve power semiconductor devices 111 .

[0100] In some embodiments, the power semiconductor device 111 includes an IGBT.

[0101] In some embodiments, the number of the reactors 121 is at least two, the at least two heat sinks 2 include at least two second heat sinks 22 , and each reactor 121 is correspondingly provided with a second heat sink 22 .

[0102] In the above embodiment, since the models of the reactors 121 may be different and the heat generation may be different, a second heat sink 22 is correspondingly provided for each reactor 121. According to the heat generation and heat dissipation requirements of each reactor 121, a refrigerant can be provided to each reactor 121 in a more targeted manner, so that each reactor 121 can be cooled most effectively, and each reactor 121 can be independently temperature controlled to avoid local overheating, so that each reactor 121 is within the optimal operating temperature range.

[0103] In some embodiments, the at least two heat-generating components 1 further comprise a capacitor 13, and the capacitor 13 and the power semiconductor device 111 are respectively arranged on two sides of the first heat-dissipating plate 21.

[0104] In the above embodiments, the first heat-dissipating plate 21 dissipates heat for the capacitor 13 while dissipating heat for the power semiconductor device 111, and the branch 33 connected with the first heat-dissipating plate 21 passes through the capacitor 13, and the refrigerant in the branch 33 can also dissipate heat for the capacitor 13, thereby improving the heat-dissipating effect of each component in the frequency converter.

[0105] In the above embodiments, the first heat-dissipating plate 21 and the second heat-dissipating plate 22 can meet the individual heat-dissipating requirements of the power semiconductor device 111 and the reactor 121, and the branches arranged around the power semiconductor device 111 and the reactor 121 can also cool other heat-generating components, thereby realizing more uniform and effective temperature control at the system level.

[0106] In some embodiments, the centralized heat-dissipating assembly 3 further comprises a driving pump 37 arranged on a pipeline connecting the centralized heat-dissipating component 31 and each heat-dissipating plate 2, and the driving pump 37 is used to provide power to enable the refrigerant to flow from each heat-dissipating plate 2 to the centralized heat-dissipating component 31 and to flow from the centralized heat-dissipating component 31 to each heat-dissipating plate 2.

[0107] In the above embodiments, the driving pump 37 provides power for the refrigerant in the entire system to flow in a circulating manner, and the heat of the heat-generating components 1 is concentrated on the centralized heat-dissipating component 31 for unified heat dissipation.

[0108] Each heat-generating component 1 in the entire system has a temperature detection element 4, and the temperature of each heat-generating component 1 is monitored in real time by a controller, and the opening degree of each interface of the distribution pump 34 is automatically matched with the best algorithm according to the temperature of each heat-generating component 1, thereby realizing optimal heat dissipation of the heat-generating components 1.

[0109] Reference Figures 1 to 4In some specific embodiments, the inverter system includes an inverter and a heat dissipation device. The inverter includes a housing 5, within which are disposed a plurality of power semiconductor devices 111, a plurality of reactors 121, and a plurality of capacitors 13. The plurality of power semiconductor devices 111 are arranged in a row along the second direction Y, and the plurality of reactors 121 are arranged in a row along the second direction Y. The row formed by the plurality of reactors 121 is spaced apart from the row formed by the plurality of power semiconductor devices 111 along the first direction X. The heat dissipation device includes a centralized heat dissipation element 31, a first heat dissipation plate 21, a second heat dissipation plate 22, a radiator 35, and a fan 36. The first heat dissipation plate 21 is disposed within the housing 5 and is positioned in contact with the plurality of power semiconductor devices 111. The first heat dissipation plate 21 and the power semiconductor devices 111 are positioned in a third direction Z. The second heat dissipation plate 22 is disposed within the housing 5. Each of the plurality of reactors 121 is positioned in contact with a second heat dissipation plate 22. The reactors 121 and the second heat dissipation plate 22 are positioned in the third direction Z. A centralized heat sink 31 is disposed outside the housing 5. A row of power semiconductor devices 111 is spaced apart from the centralized heat sink 31 along a first direction X. The outlet of the centralized heat sink 31 is connected to a main line 32, which extends into the housing 5 and connects to two branch lines 33. The first branch line 33 connects to the inlet of the first heat sink 21. A liquid separation pump 34 is located at the junction of the branch line 33 and the main line 32. The second branch line 33 connects to the inlet of the plurality of second heat sinks 22. The outlets of the first heat sink 21 and the plurality of second heat sinks 22 are each connected to another main line via another branch line. The other main line extends outside the housing 5 and is provided with a drive pump 37. This other main line finally connects to the inlet of the centralized heat sink 31 to circulate the refrigerant. A fan 36 and a radiator 35 are disposed outside the housing 5. The radiator 35 is positioned adjacent to the centralized heat sink 31, and the radiator 35 and the centralized heat sink 31 are arranged along a third direction Z. The fan 36 is disposed at an air inlet of the radiator 35 located in the first direction X.

[0110] The inverter system also includes a temperature sensing element 4 and a controller. The controller is electrically connected to the temperature sensing element 4, the liquid separation pump 34, the drive pump 37, and the fan 36. The temperature sensing element 4 is located within the housing 5, and each heating element 1 is provided with a temperature sensing element 4. The controller is pre-installed with an intelligent control strategy. By receiving information transmitted by the temperature sensing element 4 in real time, it monitors the temperature of each heating element 1 and dynamically adjusts the operating status of the drive pump 37, the liquid separation pump 34, and the fan 36 based on the temperature data, achieving the purpose of precisely controlling the heat dissipation effect.

[0111] In some specific embodiments, customized heat sinks and cooling pipes are provided according to the size and heat output characteristics of the main heating components 1 such as IGBTs, reactors and capacitors inside the inverter. The corresponding heat sinks and pipes are installed on each heating component to ensure good thermal contact performance. At the same time, a centralized heat sink with fins is designed and connected to the liquid cooling circulation system. Temperature detection elements are placed in appropriate positions to monitor the operating temperature of the IGBT and the remaining heating components 1. In scenarios where higher power is required, when multiple inverters are used in series or parallel, the main body of the inverter is separated from the centralized liquid cooling equipment, which can reduce the overall volume of the equipment, increase the energy density, and provide more convenient maintenance. At the same time, the operating state of the heat dissipation system is dynamically adjusted according to the actual working conditions to reduce the system energy consumption, and to avoid the fan from being in high-load operation for a long time, which can effectively increase the service life of the fan and improve the stability of the heat dissipation system.

[0112] Based on the description of the above embodiments, the embodiments of the present invention have at least the following features and beneficial effects:

[0113] 1. Split layout: Different heating elements 1 (power semiconductor device 111 and reactor 121) are installed on independent heat sinks 2 respectively, and branches are set around the heating elements 1. This layout fully considers the thermal characteristics and spatial distribution of different heating elements 1, achieves targeted heat dissipation, avoids thermal crosstalk, and optimizes the heat flow path.

[0114] 2. Circulating heat dissipation: Establish a liquid cooling circulation system that connects at least two heat sinks 2 and cooling pipes. At least two heat sinks 2 are connected in parallel, and by setting a liquid separation pump 34, each heat sink 2 can be in an independent cooling circuit. Use a drive pump 37 to drive a non-corrosive, high-heat-capacity refrigerant (such as a water-ethylene glycol mixture) to circulate. Use the same liquid cooling system to provide heat dissipation for all heating elements 1, including at least two heat sinks 2 and cooling pipes. The refrigerant is driven by the drive pump 37 to circulate between these components, effectively transferring heat to the outside of the inverter for heat exchange, and then adjusting the opening of the liquid separation pump 34 according to the temperature control information of each component to ensure the heat dissipation uniformity and efficiency of the entire system.

[0115] The total flow of the liquid cooling circulation system is adjusted according to the sum of the load conditions of each heating element 1. At the parallel node, the opening of the liquid separation pump 34 is adjusted according to the different load conditions of each heating element 1, and then the heat dissipation power ratio of each heating element 1 is controlled to meet the heat dissipation requirements under different system load conditions, thereby improving the overall heat dissipation efficiency, improving the system stability and improving the energy efficiency of the system.

[0116] 3. Centralized heat dissipation: A centralized heat sink 31 with fins is introduced into the liquid cooling circulation system. The centralized heat sink 31 is in close contact with the refrigerant and can quickly collect heat from each heat sink 2 and the cooling pipeline. The fin structure enhances the heat exchange capacity on the air side and cooperates with the fan 36 to strengthen the forced convection heat dissipation of the centralized heat sink 31, greatly improving the heat dissipation efficiency of the system.

[0117] 4. Intelligent temperature control: By setting a temperature detection element 4 on each heating element 1, the operating temperature of each heating element 1 is monitored in real time, and the operating speed of the driving pump 37 and the fan 36 is automatically adjusted according to the preset temperature range.

[0118] First of all, each heat sink 2 is designed based on its maximum operating condition when it serves as a separate heat dissipation system. The structure and size of each heat sink 2 are set according to the working condition of the heating element 1 that needs to dissipate heat. Because the heat dissipation structure and heat dissipation requirements of each heating element 1 are different, the heat dissipation demand conversion coefficient X in the total heat dissipation circuit is inconsistent, and needs to be calculated and matched according to actual conditions and built into the control system.

[0119] If there are two heating elements 1, namely heating element A and heating element B, the required total heat dissipation is: Q(total)=X1*Q(A)+X2*Q(B), and the operating speed of the driving pump 37 and the fan 36 can be adjusted according to the total heat dissipation Q(total).

[0120] In the overall system heat dissipation circuit, the operating speeds of the drive pump 37 and fan 36 are adjusted based on the total heat dissipation required by multiple systems (the temperature data from the temperature sensing element 4). This intelligent control strategy not only facilitates effective heat dissipation of equipment under different load conditions but also adjusts the heat dissipation intensity according to actual needs, thereby achieving energy conservation and consumption reduction.

[0121] Secondly, the liquid separation pump 34 can adjust the refrigerant flow rate entering the heat sink corresponding to the heating element A and the heating element B according to different working conditions. The controller adjusts the opening of each interface of the liquid separation pump 34 by receiving the working temperature and working status (on or off) of the heating element A and the heating element B. For example, when the heating element A is in full power working state, the heating element B is not working, and the temperature of the heating element B is in the normal temperature range, the interface of the liquid separation pump 34 corresponding to the heating element B is controlled to be in a completely closed state, so that the heating element A becomes an independent heat dissipation system.

[0122] This embodiment of the utility model can not only adjust the total heat dissipation power according to the total heat generation of the heating components of each system, but also adjust the interface opening of different links of the parallel node liquid separation pump according to the different heating conditions of the heating components, thereby meeting the heat dissipation requirements of each device system under different conditions. It can not only achieve the total heat dissipation power adjustment of the entire system, but also independently adjust the heat dissipation power of each heating component under different load conditions.

[0123] In some embodiments, during the initial operation test of the system, the working status and temperature changes of each component are monitored, and the pump speed, fan speed and temperature control parameters are fine-tuned according to actual conditions to ensure that the ideal heat dissipation effect can be achieved under different working conditions.

[0124] In some embodiments, to ensure long-term stable operation of the system, a regular maintenance plan is developed, including cleaning the heat sink and fins, checking the sealing of pipes, replacing the refrigerant, etc. At the same time, the software of the intelligent control system is regularly updated to adapt to possible changes and upgrade requirements.

[0125] This utility model integrates multiple technologies, including a split-type layout, circulating liquid cooling, centralized heat dissipation design, and intelligent temperature control, to achieve efficient and precise temperature management and control. This aims to improve the inverter's heat dissipation performance, reduce the size of the cooling system, lower energy consumption, and enhance overall device reliability and stability. By introducing intelligent elements, real-time monitoring and automatic adjustment of the cooling system's operating status are achieved, making it particularly suitable for thermal management of high-density power electronics.

[0126] In summary, the embodiments of the present invention provide a highly integrated, intelligent, energy-saving and efficient multi-component liquid cooling solution, which has important practical value in promoting the development of miniaturized inverters and related power electronic equipment.

[0127] Based on the above-mentioned embodiments of the present invention, in the absence of explicit negation or conflict, the technical features of one embodiment may be beneficially combined with one or more other embodiments.

[0128] Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art will understand that the above examples are for illustration only and are not intended to limit the scope of the present invention. Those skilled in the art will understand that the above embodiments may be modified or some technical features may be replaced with equivalents without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A frequency converter system, characterized in that: include: At least two heating elements (1); At least two heat dissipation plates (2) are respectively arranged in contact with the at least two heating elements (1); a heat dissipation channel is provided in the heat dissipation plate (2), and the heat dissipation channel is configured to transport a refrigerant; as well as A centralized heat dissipation component (3) is connected to the at least two heat dissipation plates (2), and the centralized heat dissipation component (3) is configured to control the amount of refrigerant delivered to the at least two heat dissipation plates (2) according to the heat generation of the at least two heating elements (1).

2. The frequency converter system according to claim 1, characterized in that: The centralized heat dissipation assembly (3) comprises a centralized heat dissipation element (31), wherein a collecting flow channel is provided in the centralized heat dissipation element (31), and the collecting flow channel is configured to collect the refrigerant in the heat dissipation flow channel and transport the refrigerant to the heat dissipation flow channel.

3. The frequency converter system according to claim 1, characterized in that: The centralized heat dissipation assembly (3) comprises a main circuit (32) and at least two branches (33), the main circuit (32) and the at least two branches (33) are connected in parallel, and each branch (33) of the at least two branches (33) is connected to at least one heat dissipation plate (2) of the at least two heat dissipation plates (2).

4. The frequency converter system according to claim 3, characterized in that: The centralized heat dissipation assembly (3) further includes a liquid separation pump (34), and the liquid separation pump (34) is provided at the connection between at least one branch (33) of the at least two branches (33) and the main line (32).

5. The frequency converter system according to claim 1, characterized in that: The centralized heat dissipation assembly (3) further comprises a radiator (35) and a fan (36); the radiator (35) is arranged in contact with the centralized heat dissipation element (31); fins (351) are provided in the radiator (35); the fan (36) is arranged at the air inlet of the radiator (35); and the air outlet direction of the fan (36) is consistent with the direction from the air inlet to the air outlet of the radiator (35).

6. The frequency converter system according to claim 1, characterized in that: The at least two heating elements (1) include a first heating element (11) and a second heating element (12); the centralized heat dissipation assembly (3) includes a centralized heat dissipation element (31), and the second heating element (12), the first heating element (11) and the centralized heat dissipation element (31) are arranged at intervals along a first direction (X).

7. The frequency converter system according to claim 6, characterized in that: The number of the first heating elements (11) is at least two, and the at least two first heating elements (11) are arranged at intervals along the second direction (Y). The at least two heat dissipation plates (2) include a first heat dissipation plate (21), and the first heat dissipation plate (21) is arranged in contact with the at least two first heating elements (11), and the first direction (X) intersects with the second direction (Y).

8. The frequency converter system according to claim 6, characterized in that: The number of the second heating elements (12) is at least two, and the at least two second heating elements (12) are arranged at intervals along the second direction (Y). The at least two heat dissipation plates (2) include at least two second heat dissipation plates (22), and each second heat dissipation plate (22) is arranged in contact with a second heating element (12). The first direction (X) intersects with the second direction (Y).

9. The frequency converter system according to claim 6, characterized in that: The centralized heat dissipation assembly (3) further includes a radiator (35), the radiator (35) being arranged in contact with the centralized heat dissipation element (31), and the radiator (35) and the centralized heat dissipation element (31) being arranged along a third direction (Z), and the first direction (X) intersects the third direction (Z).

10. The frequency converter system according to claim 9, characterized in that: The centralized heat dissipation assembly (3) further includes a fan (36), which is arranged at the air inlet of the radiator (35), and the air outlet direction of the fan (36) is consistent with the direction from the air inlet to the air outlet of the radiator (35), and the direction from the air inlet to the air outlet is parallel to the first direction (X).

11. The frequency converter system according to claim 1, characterized in that: The at least two heating elements (1) include a power semiconductor device (111) and a reactor (121).

12. The frequency converter system according to claim 11, characterized in that: The number of the power semiconductor devices (111) is three, and the at least two heat dissipation plates (2) include a first heat dissipation plate (21), and the first heat dissipation plate (21) is arranged to fit the three power semiconductor devices (111).

13. The frequency converter system according to claim 11, characterized in that: The number of the reactors (121) is at least two, the at least two heat dissipation plates (2) include at least two second heat dissipation plates (22), and each reactor (121) is correspondingly provided with a second heat dissipation plate (22).

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