Chip

Abstract

The utility model discloses a chip. The chip comprises a first plate, a second plate, a first packaging adhesive and a second packaging adhesive, the second plate and the first plate are oppositely arranged, the first packaging adhesive is arranged between the first plate and the second plate, a channel is formed in the first packaging adhesive, and the second packaging adhesive is arranged around the edge of the channel. Therefore, the first packaging adhesive can form a stable channel for biochemical reaction of the reagent, and the second packaging adhesive can isolate the first packaging adhesive from the channel, so that the influence of special molecules released by the first packaging adhesive on the biochemical reaction in the channel is reduced or avoided, and the sequencing quality is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of gene sequencing, especially a chip. BACKGROUND

[0002] The chip adapted to the sequencing platform is a reaction device that can carry the nucleic acid to be tested and can accommodate a solution to provide a reaction environment or a detection environment for the nucleic acid to be tested, also known as a flow cell or a flow chamber.

[0003] On a platform (sometimes referred to as a sequencer) for detecting a chip to achieve sequencing based on an optical imaging system, the base sequence order of the nucleic acid to be tested is identified and determined based on the information of the images obtained by imaging the specific position of the chip (the position connected with the nucleic acid molecule to be tested, sometimes referred to as the reaction area or the fluid channel). For example, specifically, in a platform for sequencing based on the principle of sequencing by synthesis using nucleotides with optical labels, in the sequencing, the sequencer irradiates the labels in the reagent solution and excites the labels to emit optical signals, and then collects the optical signals, for example, takes pictures to obtain images, and identifies and determines the base sequence order based on the information on the images to achieve the purpose of sequencing.

[0004] In the related art, the chip includes a substrate and a cover plate, and the substrate and the cover plate are packaged by adhesive material. The channel formed between the substrate and the cover plate is unstable, and there is a large problem of adhesive material release, which affects the biochemical reaction. UTILITY MODEL CONTENT

[0005] The utility model provides a chip.

[0006] The chip provided by the present application includes a first plate material, a second plate material, a first packaging adhesive, and a second packaging adhesive. The second plate material is arranged opposite to the first plate material. The first packaging adhesive is arranged between the first plate material and the second plate material. The first packaging adhesive forms a channel. The second packaging adhesive is arranged around the edge of the channel.

[0007] In this way, the first packaging adhesive can form a stable channel for biochemical reactions of reagents. The second packaging adhesive can isolate the first packaging adhesive from the channel, reduce or avoid the influence of special molecules released by the first packaging adhesive on the biochemical reactions in the channel, and thus improve the sequencing quality.

[0008] In some embodiments, the outer edge of the first packaging adhesive is flush with the outer edges of the first plate material and the second plate material.

[0009] In some embodiments, the second packaging adhesive is in contact with the edge of the channel.

[0010] In some embodiments, the first packaging adhesive and the second packaging adhesive do not coincide in the thickness direction of the first plate material.

[0011] In some embodiments, the second encapsulant connects the first board and the second board.

[0012] In certain embodiments, the first packaging adhesive is a pressure sensitive adhesive.

[0013] In some embodiments, the second packaging adhesive is UV adhesive.

[0014] In certain embodiments, the thickness of the first sheet is less than the thickness of the second sheet.

[0015] In some embodiments, the mutually facing surfaces of the first plate and the second plate are both planar.

[0016] In certain embodiments, the distance between the first plate and the second plate is 50 μm to 200 μm.

[0017] In some embodiments, the second packaging adhesive has a width ranging from 0.2 mm to 0.3 mm.

[0018] In certain embodiments, the width of the channel ranges from 3 mm to 15 mm; and / or the length of the channel ranges from 50 mm to 200 mm.

[0019] In some embodiments, the ends of the channel in the length direction are convergent.

[0020] In certain embodiments, the minimum distance between two adjacent channels is 2.0 mm.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments with reference to the following drawings, in which:

[0023] Figure 1 It is a schematic structural diagram of a chip according to an embodiment of the present utility model;

[0024] Figure 2 yes Figure 1 Schematic cross-sectional view along the AA direction;

[0025] Figure 3 This is a performance comparison chart of chips using different types of plastic packaging;

[0026] Figure 4 It is a flow chart of a chip packaging method according to an embodiment of the present utility model;

[0027] Figure 5It is a flow chart of a chip packaging method according to an embodiment of the present utility model;

[0028] Figure 6 It is a flow chart of a chip packaging method according to an embodiment of the present utility model;

[0029] Figure 7 It is a flow chart of a chip packaging method according to an embodiment of the present utility model;

[0030] Figure 8 It is a flow chart of a chip packaging method according to an embodiment of the present utility model;

[0031] Figure 9 It is a flow chart of a chip packaging method according to an embodiment of the present invention.

[0032] Explanation of the reference numerals: 100, chip; 10, first plate; 20, second plate; 21, inlet; 22, outlet; 30, first packaging glue; 31, channel; 32, middle section; 33, first end; 34, second end; 40, second packaging glue. DETAILED DESCRIPTION

[0033] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0035] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, or mutual communication; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0036] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0037] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will recognize the application of other processes and / or the use of other materials.

[0038] See also Figure 1 and Figure 2 The present application provides a chip 100, which includes a first plate 10, a second plate 20, a first encapsulant 30 and a second encapsulant 40. The second plate 20 is arranged opposite to the first plate 10, the first encapsulant 30 is arranged between the first plate 10 and the second plate 20, the first encapsulant 30 forms a channel 31, and the second encapsulant 40 is arranged around the edge of the channel 31.

[0039] In this way, the first encapsulant 30 can form a stable channel 31 for the reagent to perform biochemical reactions, and the second encapsulant 40 can isolate the first encapsulant 30 from the channel 31, reducing or avoiding the impact of special molecules released by the first encapsulant 30 on the biochemical reactions in the channel 31, thereby improving sequencing quality.

[0040] Specifically, the chip 100 may be a reactor having fixed thereon nucleic acid molecules to be tested with optical detection labels, and has a space for accommodating liquids and can be used to fix samples to be tested, also referred to as a flow cell or flow chamber.

[0041] The first plate 10 and the second plate 20 can be made of glass, silicon dioxide, crystal, quartz glass, plastic, ceramic, PET (polyethylene terephthalate), PMMA (polymethyl methacrylate), etc. In one embodiment, the first plate 10 and the second plate 20 are optically transparent, such as glass sheets or glass layers, so that the optical system can collect optical signals generated on the surface of the chip 100. The thickness directions of the first plate 10, the second plate 20, and the first encapsulant 30 can be aligned.

[0042] The first encapsulant 30 is arranged between the first plate 10 and the second plate 20, and one or more channels 31 can be formed between the first plate 10 and the second plate 20 through a partial hollowing design, for example, 1, 2, 3, 4, 6, 8, etc. The channel 31 has a space for accommodating liquid, which can accommodate the sample to be tested and the reagent, so that the sample to be tested and the reagent undergo a biochemical reaction. The arrangement of the channel 31 in the chip 100 can be adjusted based on different needs. In one embodiment, the channel 31 can extend along the length direction of the first encapsulant 30, and the plurality of channels 31 can be arranged at intervals along the width direction of the first encapsulant 30. In another embodiment, the channel 31 can be set as a U-shaped channel with the opening facing the same end.

[0043] The second encapsulant 40 is disposed around the edge of the channel 31. That is, the shape of the second encapsulant 40 can be consistent with the shape formed by the edge of the channel 31. For example, if the channel 31 is rectangular, the second encapsulant 40 is disposed in a rectangular ring shape.

[0044] See also Figure 2 In some embodiments, the outer edge of the first packaging adhesive 30 is flush with the outer edges of the first plate 10 and the second plate 20 .

[0045] In this way, the bonding area between the first packaging adhesive 30 and the first plate 10 and the second plate 20 can be increased, thereby improving the stability of the chip 100 package.

[0046] Specifically, the first encapsulant 30, the first plate 10, and the second plate 20 all have the same shape and size. For example, the first encapsulant 30, the first plate 10, and the second plate 20 are all rectangular with four right angles, and the first encapsulant 30, the first plate 10, and the second plate 20 have the same length and width. For another example, the first encapsulant 30, the first plate 10, and the second plate 20 are all rectangular with four rounded or chamfered corners, and the first encapsulant 30, the first plate 10, and the second plate 20 have the same length and width, and the radius of the rounded corners or the shape and size of the chamfers are also the same.

[0047] See also Figure 1 In some embodiments, the second encapsulant 40 contacts the edge of the channel 31 .

[0048] The second encapsulant 40 can be arranged inside the channel 31 and around the edge of the channel 31. In this way, a gap can be prevented from forming between the second encapsulant 40 and the inner edge of the first encapsulant 30, and the overflow of the first encapsulant 30 along the direction of the gap can be reduced, so that the channel 31 has a stable depth.

[0049] See also Figure 2 In some embodiments, the first packaging adhesive 30 and the second packaging adhesive 40 do not overlap in the thickness direction of the first plate 10 .

[0050] In this way, the first packaging glue 30 can form a channel 31 with a stable depth, thereby preventing the depth variation of the channel 31 from affecting the imaging of the optical system.

[0051] Specifically, the first packaging adhesive 30 connects the first plate 10 and the second plate 20 , and the second packaging adhesive 40 is disposed around the inner side of the channel 31 , with the outer edge of the second packaging adhesive 40 contacting the inner edge of the first packaging adhesive 30 .

[0052] See also Figure 2 In some embodiments, the second packaging adhesive 40 connects the first plate 10 and the second plate 20 .

[0053] In this way, the second encapsulant 40 can isolate the inner edge of the first encapsulant 30 from the interior of the channel 31, preventing the formation of gaps between the second encapsulant 40 and the first plate 10 or the second plate 20. Special molecules released by the first encapsulant 30 can pass through the gaps to influence biochemical reactions within the channel 31, thereby improving sequencing quality. Specifically, the thickness of the second encapsulant 40 can be the distance between the first plate 10 and the second plate 20.

[0054] In some embodiments, the first packaging adhesive 30 is a pressure sensitive adhesive.

[0055] The pressure-sensitive adhesive can form a stable channel 31. Specifically, the main material of the pressure-sensitive adhesive can be a resin-type pressure-sensitive adhesive, including polyacrylate, polyurethane, polyvinyl chloride, polyvinyl ether, etc., or a rubber-type pressure-sensitive adhesive, including styrene-butadiene rubber, polyisoprene rubber, polyisobutylene and butyl rubber, as well as chloroprene rubber, nitrile rubber, etc.

[0056] Methods for processing and cutting the pressure-sensitive adhesive having the channel 31 include laser cutting, die-cutting, and other methods. Laser cutting and die-cutting methods offer high processing precision and efficiency. The processed pressure-sensitive adhesive is protected on both sides by release films, which prevent adhesion between the release films and the pressure-sensitive adhesive. In other words, when unused, the pressure-sensitive adhesive is protected from external damage. During use, the release films on both sides of the pressure-sensitive adhesive are removed sequentially as needed, and the object to be adhered is attached to the pressure-sensitive adhesive. Under the action of external forces, the object will be firmly adhered to the pressure-sensitive adhesive.

[0057] In some embodiments, the second packaging adhesive 40 is UV adhesive.

[0058] The UV glue has strong adhesion and stable properties, and will not release special molecules to affect the biochemical reaction of the reagent in the channel 31.

[0059] Specifically, UV glue can be epoxy UV glue, acrylic UV glue, silicone UV glue, etc. UV glue needs to be loaded through corresponding equipment through dispensing, spin coating, spraying, etc., and then the objects to be bonded are bonded and fixed. Then, UV light is used to cure the UV glue, thereby achieving the purpose of bonding and fixing.

[0060] Figure 3 Chips 100 numbered 1-6 are a comparison of the effects of packaging the first plate 10 and the second plate 20 using different types of pressure-sensitive adhesives, and chips 100 numbered 7-12 are a comparison of the effects of packaging the first plate 10 and the second plate 20 using different types of pressure-sensitive adhesives and UV adhesives. As can be seen from the figure, when the first encapsulation adhesive 30 is OCA adhesive and the second encapsulation adhesive 40 is epoxy UV adhesive DELO OB749, the chip 100 has good pressure resistance, low adhesive release, good stability of the channel 31, and good appearance of the adhesive line.

[0061] See also Figure 2 In some embodiments, the thickness of the first plate 10 is less than the thickness of the second plate 20 .

[0062] Specifically, the first plate 10 can be a cover plate of the chip 100, and the second plate 20 can be a substrate of the chip 100. The cover plate can provide protection for the substrate, and after the analysis process is completed, the sample located in the channel 31 may leak. The cover plate can prevent the sample from overflowing the chip 100.

[0063] The first plate 10 can be made of a transparent material to ensure that when the imaging mechanism takes a picture of the sample, a clear picture can be obtained smoothly without blurring the picture due to the first plate 10. For example, the thickness of the first plate 10 is 0.1 mm to 0.5 mm, and the thickness of the second plate 20 is 0.5 mm to 1 mm.

[0064] In order to form a flow channel 31 between the first plate 10 and the second plate 20 of the chip 100, an inlet 21 and an outlet 22 can be opened on the second plate 20. The inlet 21 and the outlet 22 are connected to the channel 31, so that the biochemical reaction sequencing reagents can flow into the channel 31 from the inlet 21 and flow out from the outlet 22, forming a smooth flow channel.

[0065] In some embodiments, the surfaces of the first plate 10 and the second plate 20 facing each other are both flat.

[0066] During the theoretical simulation of the fluid within the simulated chip 100, it was discovered that fluid flow can include laminar flow, turbulent flow, and turbulent flow. Furthermore, factors influencing the uniformity of fluid flow and distribution are not limited to the flow velocity and streamline distribution within the flow channel, but also include the pressure distribution within channel 31 and the stress distribution within channel 31 and within the first plate 10. Therefore, to ensure uniform fluid flow and distribution, the height of channel 31 is the same as the height of the first encapsulant 30, thereby creating a planar structure on the opposing surfaces of the first plate 10 and the second plate 20. This facilitates processing and helps reduce costs. Furthermore, the planar structure helps reduce resistance to the flow of biochemical reagents within channel 31, ensuring uniform pressure on the opposing surfaces of the first plate 10 and the second plate 20, thereby improving the accuracy of gene sequencing.

[0067] In some embodiments, the distance between the first plate 10 and the second plate 20 is 50 μm to 200 μm.

[0068] Specifically, the distance between the first plate 10 and the second plate 20 is the thickness of the first packaging glue 30, that is, the depth of the channel 31. When the depth of the channel 31 is within the above range, biochemical reactions are facilitated in the channel 31 and double-sided imaging is also facilitated.

[0069] The distance between the first plate 10 and the second plate 20 can be 70 μm, 72 μm, 74 μm, 76 μm, 78 μm, 80 μm, etc. The thickness of the first encapsulant 30 can be selected to form channels 31 of varying depths to meet different sequencing requirements. The distance between the first plate 10 and the second plate 20 can be uniform throughout and within the aforementioned range, or can be within the aforementioned range throughout.

[0070] In some embodiments, the width of the second packaging adhesive 40 is in the range of 0.2 mm to 0.3 mm.

[0071] Thus, when the width of the second packaging glue 40 is within the above range, the first packaging glue 30 can be isolated from the channel 31 , while the width of the channel 31 surrounded by the second packaging glue 40 is convenient for biochemical reactions.

[0072] Specifically, the width of the second encapsulant 40 is the distance between the inner and outer edges of the second encapsulant 40, that is, the distance between the inner edge of the second encapsulant 40 and the edge of the channel 31. The width of the second encapsulant 40 can be 0.2 mm, 0.22 mm, 0.24 mm, 0.26 mm, 0.28 mm, 0.3 mm, etc. The amount of the second encapsulant 40 can be set based on the width, thickness, and length of the second encapsulant 40. The length of the second encapsulant 40 is the circumference of the center loop.

[0073] In certain embodiments, the width of the channel 31 ranges from 3 mm to 15 mm; and / or the length of the channel 31 ranges from 50 mm to 200 mm.

[0074] Thus, when the width and / or length of the channel 31 is within the above range, a space of appropriate size can be provided for biochemical reactions, facilitating biochemical reactions between the sample to be tested and the reagent in the channel 31 .

[0075] Specifically, the width of the channel 31 is the maximum dimension of the channel 31 along the width direction. The width direction of the channel 31 is the direction in which multiple channels 31 are arranged at intervals. The width of the channel 31 can be 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, etc.

[0076] The length of the channel 31 is the maximum dimension of the channel 31 along the length direction. The length direction of the channel 31 is perpendicular to the width direction and thickness direction of the channel 31. The length of the channel 31 can be 70mm, 80mm, 90mm, 100mm, 110mm, 120mm, 130mm, etc.

[0077] The width of the channel 31 may be in the range of 5 mm to 12 mm, the length of the channel 31 may be in the range of 70 mm to 130 mm, or the width of the channel 31 may be in the range of 5 mm to 12 mm and the length of the channel 31 may be in the range of 70 mm to 130 mm.

[0078] See also Figure 1 In some embodiments, the ends of the channel 31 in the longitudinal direction are converged.

[0079] In this way, the reagent solution can be dispersed and flowed from the end into the channel 31 , and the reagent solution in the channel 31 can be gathered toward the end.

[0080] Specifically, the shape of the channel 31 can be irregular. For example, the channel 31 may include a middle section 32, a first end 33, and a second end 34. The first end 33 and the second end 34 are symmetrically located at opposite ends of the channel 31 and are both triangular in shape. The middle section 32 is in the shape of a long, narrow rectangle. Of course, the first end 33 and the second end 34 may also have different shapes. For example, the first end 33 may form an angle, while the second end 34 may form a rounded corner.

[0081] The first end 33, the middle section 32, and the second end 34 are sequentially arranged along the length of the first encapsulant 30. The middle section 32 is used to provide a reagent solution for the corresponding reaction; the first end 33 can be configured as a liquid inlet region for the reagent solution to flow into the channel 31, and the second end 34 can be configured as a liquid outlet region for the reagent solution to exit the channel 31. Of course, it should be understood that the positions of the first end 33 and the second end 34 can be interchanged. Therefore, the channel 31 can also be configured such that the second end 34 is the liquid inlet region for the reagent solution to flow into the channel 31, and the first end 33 is the liquid outlet region for the reagent solution to exit the channel 31.

[0082] In certain embodiments, the minimum distance between two adjacent channels 31 is 2.0 mm.

[0083] In this way, the strength of the first packaging glue 30 can be improved while reducing the risk of cross-contamination between different samples to be tested and different reagents in different channels 31 .

[0084] Specifically, the distance between two adjacent channels 31 may be the distance between the middle sections 32 of the two adjacent channels 31 . The distance between two adjacent channels 31 may be 2.0 mm, 2.2 mm, 2.4 mm, 2.6 mm, 2.8 mm, 3.0 mm, etc.

[0085] See also Figure 4 The present application provides a chip 100 packaging method, the method comprising:

[0086] S10, placing a first packaging adhesive 30 on the first plate 10, wherein the first packaging adhesive 30 forms a channel 31;

[0087] S20, placing the second packaging glue 40 on the edge of the channel 31;

[0088] S30 , laminating the first plate 10 and the second plate 20 , which are provided with the first packaging adhesive 30 and the second packaging adhesive 40 .

[0089] Specifically, in step S10 , before disposing the first packaging adhesive 30 on the first plate 10 , the first packaging adhesive 30 may be cut so as to form the channel 31 in the first packaging adhesive 30 .

[0090] In step S20 , a dispensing machine may be used to dispose the second packaging glue 40 on the edge of the channel 31 . The dispensing machine may be divided into a manual dispensing machine, a semi-automatic dispensing machine, and a fully automatic dispensing machine.

[0091] In step S30 , the first plate 10 and the second plate 20 may be laminated by pressure or vacuum.

[0092] See also Figure 5 In some embodiments, before disposing the first packaging adhesive 30 on the first plate 10, the method includes:

[0093] S01, cleaning the first plate 10 and the second plate 20;

[0094] S02, performing surface treatment on the cleaned first plate 10 and second plate 20;

[0095] S03, drying the first plate 10 and the second plate 20 after the surface treatment.

[0096] Specifically, in step S01 , cleaning may be performed by immersion cleaning, ultrasonic cleaning, plasma cleaning, etc., the purpose of which is to remove impurities on the first plate 10 and the second plate 20 and provide a clean surface for subsequent surface treatment.

[0097] In step S02, since the second plate 20 and first plate 10 of chip 100 are the core components of the entire chip 100, their primary function is to capture DNA through their specific surface properties, allowing the DNA to react with the biochemical reaction sequencing reagents in chip 100, and finally, the instrument detects the signal on the second plate 20 or first plate 10. The performance of the second plate 20 and first plate 10 directly affects the biochemical reaction effect and test results. Therefore, surface treatment of the second plate 20 and first plate 10 is a very important step.

[0098] Specifically, the surface treatment of the second plate 20 and the first plate 10 can be performed using chemical vapor deposition. This treatment method ensures that the desired functional groups are evenly distributed on the surfaces of the second plate 20 and the first plate 10 of the chip 100. The surface treatment can result in a hydrophilic or hydrophobic surface, or specific functional groups such as hydroxyl groups, carboxyl groups, ether bonds, aldehyde groups, and carbonyl groups, depending on the specific needs. The purpose of these treatments is to effectively connect and immobilize the DNA, while also enabling the biochemical reaction sequencing reagents to react more efficiently within the flow channel. The surface treatment temperature range is 25°C to 50°C, and the surface treatment time is 5 to 60 minutes.

[0099] The surface treatment method of the second plate 20 and the first plate 10 may also be a liquid phase immersion method, a surface spin coating method, a surface spray coating method, etc.

[0100] In step S03 , nitrogen may be used to remove moisture from the first plate 10 and the second plate 20 to reduce oxidation of the first plate 10 and the second plate 20 .

[0101] See also Figure 6 In some embodiments, disposing the first packaging adhesive 30 on the first plate 10 (step S10) includes:

[0102] S11, placing the first plate 10 on the carrying platform;

[0103] S12, placing the first packaging glue 30 on the conveying device;

[0104] S13, driving the carrying platform and the conveying device to move relative to each other, so that the carrying platform and the conveying device approach each other, thereby driving the first packaging glue 30 and the first plate 10 to approach each other;

[0105] S14, using a positioning device to assist in positioning the first plate 10 and the first packaging adhesive 30;

[0106] S15 , controlling the pressing device to attach the first packaging adhesive 30 to the first plate 10 .

[0107] In this way, by driving the conveying device and the carrying platform to move relative to each other, the positioning device is used to assist in the precise positioning of the first plate 10 and the first packaging glue 30, thereby improving the fitting accuracy of the first packaging glue 30 and the first plate 10 after being pressed by the pressing device, thereby reducing defects of the first plate 10 and the first packaging glue 30.

[0108] Specifically, in step S11, a supporting platform can provide support for the first plate 10. The supporting platform is provided with an installation position, and the supporting platform can generate negative pressure to adsorb the first plate 10 to the installation position. The surface shape of the supporting platform is not strictly limited. For example, the supporting platform can be a substantially rectangular plate-shaped structure.

[0109] In step S12 , a mounting position is provided on the conveying device, and the conveying device can generate negative pressure to adsorb the first packaging adhesive 30 at the mounting position.

[0110] In step S13, the conveying device can move or rotate to convey the first encapsulant 30 from a loading position away from the carrier platform to a bonding position close to the carrier platform. The distance between the conveying device and the carrier platform can be adjusted according to actual needs.

[0111] In step S14, the positioning device may include a camera and a display screen, which may be located above the carrier platform, and the conveying device may be located between the carrier platform and the positioning device. Positioning may involve diagonally aligning the first encapsulant 30 and the first plate 10 to ensure fitting accuracy.

[0112] In step S15, the pressing device can be a roller for rolling pressing or a plate-like structure for pressing pressing. The pressing device can roll along the length of the supporting platform or move up and down along the height of the supporting platform to securely attach the first sheet 10 to the first encapsulant 30. During attachment, the film of the first encapsulant 30 can be removed first, and then the side of the first encapsulant 30 located on the film can be attached to the first sheet 10.

[0113] In some embodiments, before disposing the second encapsulant 40 at the edge of the channel 31 , the method includes:

[0114] The first plate 10 provided with the first packaging adhesive 30 is subjected to a degassing process by using a degassing device.

[0115] In this way, bubbles generated when the first packaging adhesive 30 and the first plate 10 are attached can be removed, the adhesion between the first packaging adhesive 30 and the first plate 10 can be increased, and the structural stability of the chip 100 can be improved.

[0116] Specifically, the degassing process may include placing the first board 10 with the first packaging adhesive 30 in a degassing machine and performing a degassing operation for 3 minutes at a temperature of 40° C. and an air pressure of 0.45 MPa.

[0117] See also Figure 7 In some embodiments, disposing the second encapsulant 40 at the edge of the channel 31 (step S20) includes:

[0118] S21, placing the first plate 10 on a dispensing jig;

[0119] S22, positioning using a first packaging adhesive 30;

[0120] S23 , applying the second packaging adhesive 40 to the edge of the channel 31 .

[0121] Specifically, in step S21, the first plate 10 can be placed on the dispensing jig manually or by a robot. The dispensing jig can be located on a supporting platform of a dispensing machine, and a mounting space is formed on the dispensing jig. The supporting platform of the dispensing machine can generate negative pressure to adsorb the first plate 10 into the mounting space.

[0122] In step S22 , the positioning points on the first packaging glue 30 are used to perform rough positioning of the glue dispensing, and the glue edge is grasped at each intermediate point of the glue dispensing to provide a certain glue dispensing offset.

[0123] In step S23 , the second packaging glue 40 may be applied to a position 0.1 mm to 0.15 mm away from the edge of the channel 31 . Before applying the glue, the thick film of the second packaging glue 40 may be torn off.

[0124] See also Figure 8 In some embodiments, laminating the first plate 10 and the second plate 20 provided with the first encapsulating adhesive 30 and the second encapsulating adhesive 40 (step S30) includes:

[0125] S31, placing the first plate 10 and the second plate 20 provided with the first packaging adhesive 30 and the second packaging adhesive 40 on a bonding jig;

[0126] S32: Laminating the first plate 10 and the second plate 20 using a vacuum laminating machine.

[0127] Specifically, in step S31, the bonding jig can be located on the carrying platform of the vacuum bonding machine, and the bonding jig forms an installation space. The first plate 10 is placed in the installation space, and the second plate 20 is located on the side of the first plate 10 away from the carrying platform. Alternatively, the second plate 20 can be placed in the installation space, and the first plate 10 is located on the side of the second plate 20 away from the carrying platform.

[0128] In step S32, the bonding principle of the vacuum bonding machine is to place the first plate 10 and the second plate 20 in a vacuum box in a vacuum environment, use the cylinder pressure of the machine to lower the inner mold of the vacuum cylinder, and completely press the glass cover plate and the LCD screen placed on the lower mold of the vacuum cylinder.

[0129] The vacuum degree during lamination can be 10 Pa to 50 Pa, such as 10 Pa, 20 Pa, 30 Pa, 40 Pa, 50 Pa, etc. The air pressure can be 0.05 MPa to 0.1 MPa, such as 0.05 MPa, 0.06 MPa, 0.07 MPa, 0.08 MPa, 0.09 MPa, 0.1 MPa, etc. The lamination time can be 10 seconds to 30 seconds, such as 10 seconds, 15 seconds, 20 seconds, 25 seconds, 30 seconds. The parameters can be set according to different vacuum laminating machines, and the lamination pressure can be around 50 N, such as 45 N, 47 N, 49 N, 51 N, 53 N, 55 N, etc.

[0130] See also Figure 9 In some embodiments, after laminating the first plate 10 provided with the first encapsulant 30 and the second encapsulant 40 to the second plate 20, the method includes:

[0131] S33, using a pressure holding device to hold the chip 100 after the first plate 10 and the second plate 20 are bonded together;

[0132] S34, curing the chip 100 after pressure maintenance using a curing device;

[0133] S35 , performing a degassing process on the cured chip 100 using a degassing device.

[0134] Specifically, in step S33, the holding pressure and holding time can be determined based on the actual holding effect, ensuring that the second encapsulant 40 is not subjected to excessive impact during the holding process, which could cause it to explode. At the same time, a certain holding pressure is maintained to re-press the chip 100, removing any large bubbles formed during the bonding of the first and second sheets 10 and 20, or reducing them to smaller bubbles. In one embodiment, the holding pressure is 0.3 MPa, and the holding time is 30 seconds.

[0135] In step S34, the curing time and curing power can be determined based on the curing energy of the second encapsulant 40 and the power of the curing equipment. In one embodiment, the curing time is 20 seconds, the curing power is 90%, and the energy of the curing equipment is greater than 7000 mj / cm 2 .

[0136] In step S35, the cured chip 100 is defoamed to remove small bubbles left by the pressure-maintaining curing process. In one embodiment, the defoaming time is 15 minutes and the defoaming pressure is 0.45 MPa.

[0137] In some embodiments, curing the chip 100 after pressure maintenance using a curing device includes:

[0138] The curing device is used to emit ultraviolet rays to the second packaging adhesive 40 so as to cure the second packaging adhesive 40 .

[0139] Specifically, the second packaging glue 40 can be UV glue, which is also called ultraviolet curing glue. UV glue is a type of glue that needs to be irradiated by ultraviolet light to be cured. It can be used as an adhesive, and can also be used as a glue for paints, coatings, inks, etc. The curing principle of UV glue is that the photoinitiator (or photosensitizer) in the UV curing material absorbs ultraviolet light under ultraviolet light to produce active free radicals or cations, which trigger monomer polymerization and cross-linking chemical reactions, so that the adhesive is converted from liquid to solid within seconds. The stronger the ultraviolet light, the faster the curing speed.

[0140] Throughout this specification, reference to terms such as "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0141] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A chip, characterized in that: include: First Plate; a second plate, the second plate being arranged opposite to the first plate; a first packaging adhesive, the first packaging adhesive being disposed between the first plate and the second plate, the first packaging adhesive forming a channel; and A second packaging glue is disposed around the edge of the channel.

2. The chip according to claim 1, characterized in that The outer edge of the first packaging adhesive is flush with the outer edges of the first plate and the second plate.

3. The chip according to claim 1, characterized in that The second packaging adhesive contacts an edge of the channel.

4. The chip according to claim 1, characterized in that The first packaging adhesive and the second packaging adhesive do not overlap in a thickness direction of the first plate.

5. The chip according to claim 1, characterized in that The second packaging adhesive connects the first plate and the second plate.

6. The chip according to claim 1, characterized in that The first packaging adhesive is a pressure-sensitive adhesive.

7. The chip according to claim 1, characterized in that The second packaging glue is UV glue.

8. The chip according to any one of claims 1 to 7, characterized in that: The thickness of the first plate is smaller than the thickness of the second plate.

9. The chip according to any one of claims 1 to 8, characterized in that: The surfaces of the first plate and the second plate facing each other are both planes.

10. The chip according to any one of claims 1 to 9, characterized in that: The distance between the first plate and the second plate is 50 μm to 200 μm.

11. The chip according to any one of claims 1 to 10, characterized in that: The width of the second packaging glue ranges from 0.2 mm to 0.3 mm.

12. The chip according to any one of claims 1 to 11, characterized in that: The width of the channel ranges from 3 mm to 15 mm; and / or the length of the channel ranges from 50 mm to 200 mm.

13. The chip according to any one of claims 1 to 12, characterized in that: The ends of the channel in the length direction are gathered.

14. The chip according to any one of claims 1 to 13, characterized in that: The minimum distance between two adjacent channels is 2.0 mm.

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