High-efficiency heat dissipation packaging structure

Abstract

The utility model discloses an efficient heat dissipation packaging structure, which comprises a packaging body, the packaging body comprises a frame, a chip and a plastic packaging material layer from bottom to top, the contact part of the frame and the chip is provided with a combination material for supporting and fixing, and the chip and the frame are connected through a bonding wire; the upper part of the plastic package material layer is provided with pit slots arranged in an array, and a projection is arranged between adjacent pit slots. According to the scheme, the pit slots are designed on the surface of the plastic packaging material layer of the packaging body, and the bulges are added to increase the contact area with air, so that the heat dissipation capability is greatly improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing, in particular to a packaging structure with high-efficiency heat dissipation capability. Background Art

[0002] In recent years, with the increasing market demand for semiconductor miniaturization and reliability, the value of packaging in semiconductor products has become increasingly higher. The packaging structure generates heat during actual operation, and this heat needs to be transferred to the surrounding environment through the plastic package. Figures 1-4 The surface of the conventional packaging structure is smooth, the thermal conductivity of the plastic is limited, and the smooth surface may not be conducive to the rapid dissipation of heat. Using ANSYS simulation model to conduct thermal simulation analysis, it is found that at 15W / (m 2 ·℃) film coefficient under natural convection, the chip temperature rises from 22℃ to 62.27℃, so the heat dissipation design of the plastic package structure is urgent.

[0003] In the prior art, in order to reduce the temperature of the plastic package of the packaging structure, the current common practice is to add forced convection, heat pipes and other structures outside the packaging structure to improve the heat dissipation performance. Although this existing design alleviates the situation of rapid increase in chip temperature to a certain extent, it increases the cost and the heat dissipation effect is not satisfactory. Utility Model Content

[0004] The following is a brief overview of embodiments of the present invention to provide a basic understanding of certain aspects of the invention. It should be understood that the following summary is not an exhaustive overview of the invention. It is not intended to identify key or important aspects of the invention, nor is it intended to limit the scope of the invention. Its purpose is simply to present certain concepts in a simplified form as a prelude to the more detailed description discussed later.

[0005] In order to improve the heat dissipation capacity of the existing packaging structure plastic package, this application optimizes the existing packaging structure, designs pits on the surface of the plastic package, and adds bumps to increase the area in contact with the air to improve the heat dissipation capacity.

[0006] Specifically, the utility model provides a packaging structure with high efficiency in heat dissipation, including a packaging body, which includes a frame, a chip and a plastic packaging material layer from bottom to top. The contact part between the frame and the chip has a binding material for support and fixation, and the chip and the frame are also connected by bonding wires; the upper part of the plastic packaging material layer is provided with array-arranged pits, and there are protrusions between adjacent pits.

[0007] As a further solution, considering that the packaging restrictions do not allow the wire to be exposed, the depth of the groove is less than the preset height, and the preset height = the total thickness of the plastic package - the thickness of the frame - the thickness of the bonding material between the frame and the chip - the arc height of the bonding wire - 0.10mm.

[0008] As a further solution, considering that the protrusion is too weak and easily breaks during subsequent use, the aspect ratio (width-to-height ratio) of the protrusion is greater than 0.8 to ensure the strength of the plastic package protrusion and prevent breakage during subsequent use.

[0009] As a further solution, the shape of the protrusion is a cuboid, a cylinder or a prism.

[0010] As a further solution, the edges of the molding compound layer are designed with a smooth, continuous profile to ensure a good seal with the surrounding environment and mechanical stability. This smooth design helps reduce stress concentration caused by edge irregularities, thereby extending the service life of the molding compound. Furthermore, the smooth edges facilitate precise positioning and assembly during manufacturing, improving the efficiency and reliability of the entire packaging process.

[0011] Through the above-mentioned solution, the utility model designs grooves on the surface of the plastic packaging material layer of the package body and adds protrusions (bumps) to increase the area in contact with the air, thereby greatly improving the heat dissipation capacity. Using ANSYS simulation to establish a model for thermal simulation analysis, it is found that under natural convection conditions with a film coefficient of 15W / (m2·℃), the chip temperature rises from 22℃ to 54.707℃. Compared with the temperature of the conventional packaging structure, the chip temperature increases by 18.785% less. The heat generated by the chip can be better conducted into the air through the improved packaging structure of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present invention can be better understood by referring to the following description in conjunction with the accompanying drawings, wherein the same or similar reference numerals are used throughout the drawings to represent the same or similar components. The accompanying drawings, together with the following detailed description, are incorporated into and form a part of this specification and are used to further illustrate the preferred embodiments of the present invention and to explain the principles and advantages of the present invention. In the drawings:

[0013] Figure 1 This is a schematic diagram of the top of a conventional packaging structure plastic package in the prior art;

[0014] Figure 2 This is a schematic diagram of the bottom of a conventional packaging structure plastic package in the prior art;

[0015] Figure 3This is a left side view of a conventional packaging structure plastic package in the prior art;

[0016] Figure 4 This is a front view of a conventional packaging structure plastic package in the prior art;

[0017] Figure 5 This is a cross-sectional view of the structure of a conventional plastic package in the prior art;

[0018] Figure 6 This is a top schematic diagram of the packaging structure of an embodiment of the present utility model;

[0019] Figure 7 This is a bottom schematic diagram of the packaging structure of an embodiment of the utility model;

[0020] Figure 8 This is a left side view of the packaging structure of an embodiment of the utility model;

[0021] Figure 9 This is a front view of the packaging structure of an embodiment of the present utility model;

[0022] Figure 10 This is a cross-sectional view of the packaging structure of an embodiment of the present utility model. DETAILED DESCRIPTION

[0023] The following describes embodiments of the present invention with reference to the accompanying drawings. Elements and features described in one drawing or one embodiment of the present invention may be combined with elements and features shown in one or more other drawings or embodiments. It should be noted that for the sake of clarity, the drawings and descriptions omit the representation and description of components and processes that are not relevant to the present invention and are known to those of ordinary skill in the art.

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0026] See also Figure 1-Figure 5 The conventional packaging structure of the prior art includes a frame 11, a chip 12, a bonding material 13 between the frame and the chip, a bonding wire 14 connecting the chip 12 and the frame 11, and a plastic material layer 15. In the prior art, the surface of the plastic package is smooth. The thermal simulation analysis using ANSYS simulation model shows that the thermal conductivity of the plastic package is 15W / (m 2 ·℃) film coefficient under natural convection, the chip temperature rises from 22℃ to 62.27℃.

[0027] This application aims to improve the above existing structure. Figures 6-10 The embodiment of the present invention provides a packaging structure with high efficiency in heat dissipation, which includes: a packaging body, which includes, from bottom to top, a frame 1, a chip 2, a bonding material 3 for supporting and fixing the chip between the frame and the chip, a bonding wire 4 connecting the chip 2 and the frame 1, and a plastic packaging material layer 5, wherein the upper portion of the plastic packaging material layer 5 is provided with array-arranged pits 51, and protrusions 52 are provided between adjacent pits 51.

[0028] Considering the packaging restrictions that the wire cannot be exposed, the depth of the pit is less than (plastic package thickness - frame thickness - thickness of the bonding material between the frame and the chip - arc height of the bonding wire - 0.10mm), and the width-to-thickness ratio of the protrusion is greater than 0.8 to ensure the strength of the plastic package bump and prevent it from breaking during subsequent use;

[0029] In addition, the shape of the protrusion is not limited to a rectangular parallelepiped, and may also be a cylinder or a prism.

[0030] The surface of the plastic package of this new packaging structure is designed with an array of grooves. The added protrusions can increase the area in contact with the air and improve the heat dissipation capacity. Using ANSYS simulation to establish a model for thermal simulation analysis, it was found that under natural convection conditions with a film coefficient of 15W / (m2·℃), the chip temperature rose from 22℃ to 54.707℃. The chip temperature increased by 18.785% less than that of the conventional packaging structure. The heat generated by the chip is better conducted into the air through the new packaging structure.

[0031] This new type of packaging structure has grooves of a certain depth designed in the plastic package body, which not only has a unique geometric beauty, but more importantly, they effectively promote air flow and heat exchange by increasing the roughness and surface area of ​​the plastic package body surface, making it show a more excellent thermal management effect, thereby improving the heat dissipation performance of the entire packaging structure.

[0032] Furthermore, the edges of the plastic package are typically designed with a smooth, continuous contour to ensure a good seal with the surrounding environment and mechanical stability. This smooth design helps reduce stress concentration caused by edge irregularities, thereby extending the life of the plastic package. Furthermore, smooth edges facilitate precise positioning and assembly during manufacturing, improving the efficiency and reliability of the entire packaging process.

[0033] It should be emphasized that the term "include / comprises" when used herein refers to the existence of features, elements, steps or components, but does not exclude the existence or addition of one or more other features, elements, steps or components.

[0034] Although the present invention has been disclosed above through the description of specific embodiments of the present invention, it should be understood that all the above embodiments and examples are illustrative rather than restrictive. Those skilled in the art may design various modifications, improvements, or equivalents of the present invention within the spirit and scope of the appended claims. Such modifications, improvements, or equivalents should also be considered to be included within the scope of protection of the present invention.

Claims

1. A packaging structure with high efficiency heat dissipation, characterized by: The package comprises a frame, a chip, and a plastic encapsulation material layer from bottom to top. The contact portion between the frame and the chip comprises a bonding material for support and fixation. The chip and the frame are also connected by bonding wires. The upper portion of the plastic encapsulation material layer comprises an array of grooves, with protrusions between adjacent grooves. The depth of the pit is less than the preset height, where the preset height = the total thickness of the plastic package - the thickness of the frame - the thickness of the bonding material between the frame and the chip - the arc height of the bonding wire - 0.10 mm; The width-to-thickness ratio of the protrusion is greater than 0.8; The shape of the protrusion is a cuboid, a cylinder or a prism.

2. The packaging structure with high efficiency heat dissipation according to claim 1, characterized in that: The edge portion of the molding material layer is designed to have a smooth and continuous contour.

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