Ceramic electrode holder

Abstract

The utility model provides a ceramic electrode holder. The ceramic electrode holder comprises a ceramic holder body, a binding post mounting hole, a first metallization layer and a second metallization layer, the binding post mounting holes are formed in the thickness direction of the ceramic seat body; the binding post mounting hole is provided with a top surface which extends towards the length direction of the ceramic seat body by a preset width, the top surface of the binding post mounting hole is higher than the top surface of the ceramic seat body, and an inclined surface is connected between the top surface of the binding post mounting hole and the top surface of the ceramic seat body; a boss which is gradually narrowed from the top surface of the ceramic seat body to the top surface of the binding post mounting hole is formed on the top surface of the ceramic seat body; the first metallization layer is arranged on the inner wall of the binding post mounting hole, and the second metallization layer is arranged on the top surface of the binding post mounting hole. According to the ceramic electrode holder, the production efficiency and the product reliability of the ceramic electrode holder can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of ceramic electrode seat. BACKGROUND

[0002] With the continuous progress of communication, medical, aviation and laser technology, the traditional metal electrode seat has been unable to meet the requirements of high-power and high-voltage insulation performance in the industry, and the electrode seat using ceramic instead of metal material can well solve the industry pain points. In the manufacturing process of the existing ceramic electrode seat, the metalization is only perpendicular to the thickness direction of the ceramic electrode seat, and the metalization pattern needs to be concentric with the terminal post mounting hole (i.e. the existing ceramic electrode seat only forms a metalization layer on the top surface of the ceramic electrode seat at the top edge of the terminal post mounting hole). There are alignment accuracy, low production efficiency, high equipment function requirement, and only the metalization area is small in the contact area with the terminal post plane, which leads to small soldering contact area of the terminal post, small terminal post ejection force, and other adverse phenomena such as easy terminal post ejection, which has great reliability risk.

[0003] It should be noted that the information disclosed in the above background section is only for understanding the background of the present application, and therefore can include information that does not constitute prior art known to those skilled in the art. CONTENT OF THE UTILITY MODEL

[0004] In order to make up for the shortcomings of the above prior art, the utility model provides a ceramic electrode seat.

[0005] The technical solution of the utility model comprises:

[0006] A ceramic electrode seat comprises a ceramic seat body, a terminal post mounting hole, a first metalization layer and a second metalization layer. The terminal post mounting hole is arranged in the thickness direction of the ceramic seat body. The terminal post mounting hole has a top surface extending in the length direction of the ceramic seat body by a predetermined width. The top surface of the terminal post mounting hole is higher than the top surface of the ceramic seat body, and a bevel is connected between the top surface of the terminal post mounting hole and the top surface of the ceramic seat body to form a boss on the top surface of the ceramic seat body, which gradually narrows from the top surface of the ceramic seat body to the top surface of the terminal post mounting hole. The first metalization layer is arranged on the inner wall of the terminal post mounting hole, and the second metalization layer is arranged on the top surface of the terminal post mounting hole.

[0007] Further, the top surface of the terminal post mounting hole is 0.5-1mm higher than the top surface of the ceramic seat body.

[0008] Further, the angle of the bevel is 30°-60°.

[0009] Further, the angle of the bevel is 45°.

[0010] Furthermore, the first metallization layer on the inner wall of the terminal mounting hole is formed by pumping.

[0011] Furthermore, the second metallization layer on the top surface of the terminal mounting hole is formed by screen printing.

[0012] Furthermore, the thickness of the first metallization layer is 12-25 μm.

[0013] Furthermore, the thickness of the second metallization layer is 12-25 μm.

[0014] Furthermore, the first metallization layer and the second metallization layer are made of the same material and / or have the same thickness.

[0015] Furthermore, the boss is truncated cone-shaped.

[0016] The beneficial effects of the present invention include: the present invention can improve the efficiency of the product metallization process, reduce the difficulty of metallization, can be implemented with lower-cost tooling and equipment, and can increase the ejection force of the terminal of the finished ceramic electrode holder, thereby improving the reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of the ceramic electrode holder before metallization in a specific embodiment of the present invention;

[0018] Figure 2 This is a top view of the structure of the metallized ceramic electrode base in a specific embodiment of the present invention;

[0019] Figure 3 yes Figure 2 AA section view in;

[0020] Figure 4 It is a structural diagram of the combination of a ceramic electrode holder and a terminal in a specific embodiment of the present invention. DETAILED DESCRIPTION

[0021] The present invention will be further described below with reference to the accompanying drawings and in combination with preferred embodiments. It should be noted that, unless there is a conflict, the embodiments and features in the embodiments of the present application can be combined with each other.

[0022] It should be noted that the directional terms such as left, right, up, down, top, and bottom in this embodiment are merely relative concepts, or are based on the normal use status of the product, and should not be considered as restrictive.

[0023] The present invention provides a ceramic electrode holder. Figures 1-4As shown, it includes a ceramic base 1, a terminal mounting hole 2, a first metallization layer 3 and a second metallization layer 4; wherein the terminal mounting hole 2 is arranged in the thickness direction of the ceramic base 1 (i.e., the vertical direction in the figure), and the terminal mounting hole 2 has a top surface 21 extending in the length direction of the ceramic base 1 (i.e., the horizontal direction in the figure) with a predetermined width, and the top surface 21 of the terminal mounting hole 2 is higher than the top surface 11 of the ceramic base 1, and an inclined surface 22 is connected between the top surface 21 of the terminal mounting hole 2 and the top surface 11 of the ceramic base 1 to form a boss on the top surface 11 of the ceramic base 1 that gradually narrows from the top surface 11 of the ceramic base to the top surface 21 of the terminal mounting hole; the first metallization layer 3 is arranged on the inner wall of the terminal mounting hole 2, and the second metallization layer 4 is arranged on the top surface 21 of the terminal mounting hole 2 (i.e., the top surface of the boss).

[0024] In some embodiments, as Figure 3 As shown, the top surface 21 of the terminal mounting hole is 0.5-1 mm higher than the top surface of the ceramic base body, that is, the height difference h between the top surface 21 of the terminal mounting hole and the top surface 22 of the ceramic base body is 0.5-1 mm.

[0025] In some embodiments, as Figure 3 As shown, the angle α of the inclined surface 22 is 30°-60°.

[0026] In some embodiments, the angle α of the inclined surface 22 is 45°.

[0027] In some embodiments, the first metallization layer 3 on the inner wall of the terminal mounting hole 2 is formed by pumping. The first metallization layer 3 can be formed by pumping using silver paste, molybdenum-manganese paste, or other metal paste. After drying and sintering, it serves as a seed layer for subsequent processes (such as electroplating) to enable rapid growth of other metal plating layers.

[0028] In some embodiments, the second metallization layer 4 on the top surface 21 of the terminal mounting hole is formed by screen printing. The second metallization layer 4 can be formed by screen printing using silver paste, molybdenum-manganese paste, or other metal paste. After drying and sintering, it serves as a seed layer for subsequent processes (such as electroplating) to enable rapid growth of other metal plating layers.

[0029] In some embodiments, the thickness of the first metallization layer 3 is 12-25 μm.

[0030] In some embodiments, the thickness of the second metallization layer 4 is 12-25 μm.

[0031] In some embodiments, the first metallization layer 3 and the second metallization layer 4 are made of the same material and / or have the same thickness.

[0032] In some embodiments, the boss is in a truncated cone shape, that is, a hollow truncated cone-shaped boss is provided on the top surface 11 of the ceramic base 1 , and the boss is higher than the top surface of the ceramic base.

[0033] In a specific embodiment of the present invention, the terminal mounting hole 2 is a blind hole, and the diameter of the bottom of the inclined surface 22 (i.e., the bottom of the boss) is determined according to the product structure. The larger the diameter, the greater the structural strength of the ceramic and the positive effect on improving the terminal ejection force. Conversely, the smaller the structural strength of the ceramic and the negative effect on the magnitude of the terminal ejection force. When preparing the ceramic electrode holder of the present invention, the other parts (made of ceramic material) except the first metallization layer 3 and the second metallization layer 4, such as the ceramic seat body 1 and the terminal mounting hole 2, are first integrally formed in a mold. Then, the first metallization layer 3 is formed on the inner wall of the terminal mounting hole 2 by pumping, and the second metallization layer 4 is formed on the top surface 21 of the terminal mounting hole 2 by screen printing.

[0034] like Figure 4 The figure shows a schematic diagram of the ceramic electrode holder and the terminal 5, which is inserted into the terminal mounting hole of the ceramic electrode holder. When used, the ceramic electrode holder is locked to the application scene through the screw hole 6 provided on the ceramic electrode holder.

[0035] In a specific embodiment of the present invention, a boss is formed on the top surface 11 (non-metallized area) of the ceramic base, and the top surface 21 and inner wall of the boss (the inner wall of the boss is also part of the inner wall of the terminal mounting hole 2) are metallized, so that the top surface 21 (metallized area) of the boss and the top surface 11 (non-metallized area) of the ceramic base have a height difference. Such a structure can eliminate the need for alignment of the screen and the ceramic base during printing, greatly reducing the requirements for the production of the printed screen pattern. Even without the need for a screen pattern, metallization can be achieved through blind printing. At the same time, the requirements for metallization equipment and screen are greatly reduced, and low-cost tooling and equipment can be used to achieve it, thereby reducing the difficulty of metallization and greatly improving production efficiency. In order to increase the welding area of ​​the terminal, a metallized layer is attached to the inner wall and top surface of the terminal mounting hole, so that when the terminal is subsequently welded, the welding area between the terminal and the ceramic can be increased, greatly improving the terminal ejection force and eliminating reliability risks. Therefore, the ceramic electrode holder of the present invention can achieve rapid metallization and improve the ejection force of the terminal on the ceramic electrode holder, thereby improving the production efficiency of the electrode holder and improving product reliability.

[0036] The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For those skilled in the art of the present invention, it is possible to make several equivalent substitutions or obvious modifications without departing from the concept of the present invention, and the performance or use are the same, and all of them should be considered to fall within the scope of protection of the present invention.

Claims

1. A ceramic electrode holder, characterized in that: It includes a ceramic base, a terminal mounting hole, a first metallization layer and a second metallization layer; The terminal mounting hole is arranged in the thickness direction of the ceramic base; The terminal mounting hole has a top surface extending in a length direction of the ceramic base with a predetermined width, the top surface of the terminal mounting hole being higher than the top surface of the ceramic base, and an inclined surface is connected between the top surface of the terminal mounting hole and the top surface of the ceramic base, so as to form a boss on the top surface of the ceramic base that gradually narrows from the top surface of the ceramic base to the top surface of the terminal mounting hole; The first metallization layer is arranged on the inner wall of the terminal mounting hole, and the second metallization layer is arranged on the top surface of the terminal mounting hole.

2. The ceramic electrode holder according to claim 1, wherein: The top surface of the terminal mounting hole is 0.5-1 mm higher than the top surface of the ceramic base.

3. The ceramic electrode holder according to claim 1, wherein: The angle of the inclined surface is 30°-60°.

4. The ceramic electrode holder according to claim 1, wherein: The angle of the inclined surface is 45°.

5. The ceramic electrode holder according to claim 1, wherein: The first metallization layer on the inner wall of the terminal mounting hole is formed by pumping.

6. The ceramic electrode holder according to claim 1, wherein: The second metallization layer on the top surface of the terminal mounting hole is formed by screen printing.

7. The ceramic electrode holder according to claim 1, wherein: The thickness of the first metallization layer is 12-25 μm.

8. The ceramic electrode holder according to claim 1, wherein: The thickness of the second metallization layer is 12-25 μm.

9. The ceramic electrode holder according to claim 1, wherein: The first metallization layer and the second metallization layer are made of the same material and / or have the same thickness.

10. The ceramic electrode holder according to claim 1, wherein: The boss is in a truncated cone shape.

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