Rapid multilayer composite spot welding plate

Abstract

The utility model discloses a fast multilayer composite spot welding plate, which comprises a circuit board, a bottom plate, a protective cover and a mounting piece, a chip is arranged at the top end of the circuit board, a heat dissipation piece is arranged in the bottom plate, heat dissipation holes are formed in the top end of the protective cover, a pressing piece is arranged in the protective cover, and the mounting piece is arranged on the bottom plate. And the mounting piece is arranged at the top end of the bottom plate and is used for fixedly mounting the protective cover and the circuit board. By utilizing the design of the circuit board, the protective cover, the heat dissipation holes, the pressing piece and the heat dissipation piece, the circuit board is protected by covering the protective cover outside the circuit board, heat generated by the circuit board and the chip can be quickly dissipated between the circuit board and the protective cover through the heat dissipation holes, the circuit board is cooled, and the service life of the circuit board is prolonged. And the radiating fins are arranged at the bottom end of the circuit board, so that the bottom of the circuit board can be cooled, and the circuit board is ensured to be in a proper temperature range during working.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a fast multi-layer composite spot welding board. Background Art

[0002] When installing the chip, you need to use soldering to solder the chip pins to the circuit board, and use the chip through the circuit on the circuit board.

[0003] The announcement number is CN216162931U, a plug-in multilayer circuit board, including an upper plate and a lower plate, the lower plate is located below the upper plate, a support base is provided below the lower plate, a top cover of the upper plate is provided with a protective cover, and a chip is provided near the middle position of the upper surface of the upper plate, plug connectors are fixedly installed near both sides of the upper surface of the upper plate, the interior of the protective cover is provided with a plug slot matching the plug connector, a buffer support mechanism is connected to the outer side of the lower plate, and a heat conduction mechanism is connected between the lower plate and the support base, the buffer support mechanism includes a support seat, a fixing pin, a guide column, a support plate, a buffer seat and a buffer spring. The plug-in multilayer circuit board described in the utility model can perform shock absorption and buffering after the circuit board is hit, and can also conduct heat to the circuit board to prevent the circuit board from overheating and affecting its use.

[0004] The buffer support mechanism is used to achieve shock absorption and buffering of the circuit board. However, the top of the protective cover is closed, exposing only the chip. However, when the circuit board is working, in addition to the chip, the power conversion module, high-power resistors or high-current paths and other parts will generate a lot of heat. The heat generated on the surface of the circuit board cannot be dissipated in time due to the limitation of the protective cover. The heat accumulated between the top of the circuit board and the protective cover cannot be quickly dissipated through the thermal pad at the bottom of the circuit board, which eventually causes the temperature of the circuit board to rise, affecting the use of the circuit board and the chip. Utility Model Content

[0005] The purpose of the utility model is to provide a fast multi-layer composite spot welding plate to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a fast multi-layer composite spot welding plate, comprising a circuit board, a chip being provided on the top of the circuit board, and further comprising:

[0007] A bottom plate, the bottom plate being arranged at the bottom end of the circuit board, and a heat sink for assisting heat dissipation of the circuit board being arranged inside the bottom plate;

[0008] A protective cover is provided on the outer wall of the circuit board, a heat dissipation hole is provided on the top of the protective cover for dissipating heat from the circuit board, and a pressing member is provided inside the protective cover for stabilizing the circuit board;

[0009] The mounting piece is arranged on the top of the base plate and is used for fixing the protective cover and the circuit board.

[0010] Preferably, an exposure hole for exposing the chip is provided at the top end of the protective cover, a receiving groove for receiving the circuit board is provided at the bottom end of the protective cover, and the pressing member is arranged inside the receiving groove.

[0011] Preferably, the pressing member includes a pressing block, and the top end of the pressing block is fixedly connected to the top end of the inner wall of the accommodating groove.

[0012] Preferably, a mounting block for connecting to a mounting piece is fixedly connected to one side of the protective cover, and a circular groove for inserting the mounting piece is formed on the top of the mounting block.

[0013] Preferably, the mounting member comprises a plug connector, the bottom end of the plug connector is fixedly connected to the top end of the base plate.

[0014] Preferably, a rectangular through-groove is formed at the top of the bottom plate, the heat sink comprises a heat dissipation fin, and the inner wall of the rectangular through-groove is fixedly connected to the outer wall of the heat dissipation fin.

[0015] Preferably, a circular hole is provided at the top of the circuit board, a positioning column is fixedly connected to the top of the base plate for inserting into the circular hole, a threaded hole is provided at the top of the base plate, and a mounting bolt for fixing the base plate is inserted into the inside of the threaded hole.

[0016] Technical effects and advantages of this utility model:

[0017] The utility model utilizes the design of a circuit board, a protective cover, heat dissipation holes, a pressing piece and a heat dissipation piece. The protective cover is covered on the outside of the circuit board to protect the circuit board. The heat generated by the circuit board and the chip can be quickly dissipated from between the circuit board and the protective cover through the heat dissipation holes to cool the circuit board. The heat dissipation fins are arranged at the bottom end of the circuit board to cool the bottom of the circuit board, thereby ensuring that the circuit board is within a suitable temperature range when working. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the front cross-sectional structure of the utility model.

[0019] Figure 2 This is one of the schematic diagrams of the overall three-dimensional structure of the utility model.

[0020] Figure 3This is the second schematic diagram of the overall three-dimensional structure of the utility model.

[0021] Figure 4 This is a schematic diagram of the three-dimensional structure of the base plate and heat dissipation fins of the utility model.

[0022] Figure 5 This is a schematic diagram of the three-dimensional structure of the circuit board and chip of the utility model.

[0023] Figure 6 This is a schematic diagram of the three-dimensional structure of the protective cover of the utility model.

[0024] In the figure: 1. Circuit board; 2. Chip; 3. Base plate; 4. Protective cover; 5. Heat dissipation hole; 6. Press block; 7. Heat dissipation fin; 8. Mounting block; 9. Plug connector; 10. Mounting bolt; 11. Positioning column. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] The utility model provides Figure 1-6 The fast multi-layer composite spot welding plate shown includes a circuit board 1, a chip 2 is provided on the top of the circuit board 1, and further includes:

[0027] The bottom plate 3 is arranged at the bottom end of the circuit board 1, and a heat sink for assisting heat dissipation of the circuit board 1 is arranged inside the bottom plate 3;

[0028] A protective cover 4 is provided on the outer wall of the circuit board 1. A heat dissipation hole 5 is provided on the top of the protective cover 4 for dissipating heat from the circuit board 1. A pressing member for stabilizing the circuit board 1 is provided inside the protective cover 4.

[0029] The mounting piece is arranged on the top of the base plate 3 and is used for fixing the protective cover 4 and the circuit board 1 .

[0030] Specifically, an exposure hole for exposing the chip 2 is provided at the top of the protective cover 4, and a receiving groove for accommodating the circuit board 1 is provided at the bottom of the protective cover 4. The pressing piece is arranged inside the receiving groove, and the pressing piece includes a pressing block 6. The top of the pressing block 6 is fixedly connected to the top of the inner wall of the receiving groove. One side of the protective cover 4 is fixedly connected to a mounting block 8 for connecting to the mounting piece. The top of the mounting block 8 is provided with a circular groove for inserting the mounting piece. The top of the circuit board 1 is provided with a circular hole, and the top of the base plate 3 is fixedly connected to a positioning column 11 for inserting into the circular hole.

[0031] Furthermore, multiple exposure holes are provided, and the positions and number of the exposure holes correspond to the positions and number of the chips 2. The heat dissipation holes 5 are strip holes, and multiple heat dissipation holes 5 are provided, which are arranged in a straight line at equal intervals on the top of the protective cover 4. The size of the accommodating groove is 1.2 times the size of the circuit board 1. The pressing block 6 is made of elastic rubber. Two pressing blocks 6 are provided, which are symmetrically arranged on both sides of the top of the inner wall of the accommodating groove and do not contact the circuits, resistors, chips and other components of the circuit board 1. The contact part of the mounting block 8 with the protective cover 4 is fixed by gluing. Two mounting blocks 8 are provided, which are symmetrically arranged on both sides of the protective cover 4. Four circular holes are provided, which are respectively located at the four corners of the top of the circuit board 1. The position of the positioning column 11 corresponds to the position of the circular hole. The bottom end of the positioning column 11 is bonded and fixed to the top of the base plate 3. The diameter of the positioning column 11 is adapted to the diameter of the circular hole. When the circuit board 1 is placed on the top of the base plate 3, the positioning column 11 is inserted The PCB 1 is fixed at the top of the base plate 3 in the circular hole of the circuit board 1, and then the plug connector 9 is inserted into the circular groove of the mounting block 8, and the protective cover 4 is sleeved on the outside of the circuit board 1 to protect the circuit board 1. At the same time, the pressing block 6 will be squeezed by the circuit board 1 and the protective cover 4, so that the pressing block 6 will be deformed, pushing the circuit board 1 toward the base plate 3. Therefore, when shaking occurs, the circuit board 1 will not be significantly displaced under the action of the restoring force of the pressing block 6. At the same time, under the pushing action of the pressing block 6, the bottom end of the circuit board 1 is in contact with the top of the heat dissipation fin 7, and under the action of the pressing block 6, there is a gap between the circuit board 1 and the top of the inner wall of the accommodating groove. Therefore, when the circuit board 1 and the chip 2 are working, the heat generated will be gathered in the gap and quickly dissipated through the heat dissipation hole 5 to cool the top of the circuit board 1 and the chip 2.

[0032] Specifically, the mounting part includes a plug connector 9, the bottom end of the plug connector 9 is fixedly connected to the top of the base plate 3, a rectangular through groove is provided at the top of the base plate 3, and the heat sink includes a heat dissipation fin 7, the inner wall of the rectangular through groove is fixedly connected to the outer wall of the heat dissipation fin 7.

[0033] Furthermore, the number of the plug connectors 9 corresponds to the number of the mounting blocks 8. The plug connector 9 is composed of a cylinder and a protrusion. The size of the protrusion is 1.2 times the size of the circular hole. The size of the cylinder is adapted to the size of the circular hole. The plug connector 9 is made of rubber material as a whole. By moving the mounting block 8 toward the plug connector 9, the inner wall of the circular hole will squeeze the protrusion, causing the protrusion to deform. As the mounting block 8 is further squeezed and moved, the protrusion passes through the circular hole and moves to the top of the mounting block 8. At this time, the restoring force of the protrusion causes the protrusion to return to its original shape, thereby limiting the movement of the mounting block 8, completing the fixed installation of the protective cover 4 and the circuit board 1. The bottom end of the cylinder of the plug connector 9 is bonded and fixed to the top of the base plate 3. The heat dissipation fin 7 is an existing rectangular heat dissipation fin made of copper. The top of the heat dissipation fin 7 contacts the circuit board 1 to absorb the heat of the circuit board 1, and then the heat dissipation fin 7 is away from the circuit board 1 to exchange heat, thereby dissipating and cooling the bottom of the circuit board 1. The outer wall of the heat dissipation fin 7 is bonded and fixed to the contact area with the inner wall of the rectangular through groove.

[0034] Specifically, a threaded hole is formed at the top of the bottom plate 3 , and a mounting bolt 10 for fixing the bottom plate 3 is inserted into the threaded hole.

[0035] Furthermore, four threaded holes are opened, respectively at the four corners of the top of the base plate 3. The threads on the inner walls of the threaded holes engage with the threads on the outer wall of the base plate 3. The base plate 3 is fixedly installed by inserting the threads into the threaded holes and threading them together with the outer wall fixing device.

[0036] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A fast multi-layer composite spot welding plate, comprising a circuit board (1), a chip (2) being provided on the top of the circuit board (1), characterized in that: Also includes: A bottom plate (3), the bottom plate (3) being arranged at the bottom end of the circuit board (1), and a heat sink for assisting heat dissipation of the circuit board (1) being arranged inside the bottom plate (3); A protective cover (4), the protective cover (4) being arranged on the outer wall of the circuit board (1), a heat dissipation hole (5) for dissipating heat from the circuit board (1) being provided at the top end of the protective cover (4), and a pressing piece for stabilizing the circuit board (1) being provided inside the protective cover (4); A mounting member is provided on the top end of the base plate (3), and is used for fixing and mounting the protective cover (4) and the circuit board (1).

2. A fast multi-layer composite spot welding plate according to claim 1, characterized in that: The top end of the protective cover (4) is provided with an exposure hole for exposing the chip (2), the bottom end of the protective cover (4) is provided with a receiving groove for receiving the circuit board (1), and the pressing member is arranged inside the receiving groove.

3. A fast multi-layer composite spot welding plate according to claim 2, characterized in that: The pressing member comprises a pressing block (6), the top end of the pressing block (6) being fixedly connected to the top end of the inner wall of the accommodating groove.

4. A fast multi-layer composite spot welding plate according to claim 1, characterized in that: A mounting block (8) for connecting to a mounting piece is fixedly connected to one side of the protective cover (4), and a circular groove for inserting the mounting piece is provided at the top end of the mounting block (8).

5. A fast multi-layer composite spot welding plate according to claim 1, characterized in that: The mounting member comprises a plug connector (9), the bottom end of the plug connector (9) being fixedly connected to the top end of the base plate (3).

6. A fast multi-layer composite spot welding plate according to claim 1, characterized in that: A rectangular through slot is provided at the top of the bottom plate (3); the heat sink comprises a heat dissipation fin (7); and the inner wall of the rectangular through slot is fixedly connected to the outer wall of the heat dissipation fin (7).

7. A fast multi-layer composite spot welding plate according to claim 1, characterized in that: A circular hole is provided at the top of the circuit board (1), a positioning column (11) is fixedly connected to the top of the base plate (3) and is inserted into the circular hole, a threaded hole is provided at the top of the base plate (3), and a mounting bolt (10) for fixing the base plate (3) is inserted into the inside of the threaded hole.

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