Improved heat pipe rolling type radiator

Abstract

The utility model discloses an improved heat pipe rolling type radiator which comprises a radiating seat and a first heat conduction pipe, a mounting groove for placing the first heat conduction pipe is arranged below the radiating seat, the mounting groove penetrates from one end of the radiating seat to the other end of the radiating seat, one end of the first heat conduction pipe is of a rectangular structure, and the other end of the first heat conduction pipe is of a flat structure. The rectangular structure part of the first heat conduction pipe is placed in the installation groove, and the upper end face of the first heat conduction pipe is attached to the upper inner end face of the installation groove. The LED lamp is simple in structure and convenient to produce, the installation groove is formed in the lower end of the heat dissipation base, the flat heat conduction pipes are vertically arranged and stacked in the installation groove, the upper ends and the lower ends of the heat conduction pipes are machined into planes, the heat conduction pipes are of a rectangular structure, and the embedded groove in the upper end is communicated with the installation groove below. The first heat conduction pipe can be in contact with the second heat conduction pipe, and the contact area of the heat conduction pipes is increased, so that the heat conduction transfer effect is improved, and the heat dissipation performance is enhanced.

Description

TECHNICAL FIELD

[0001] The utility model relates to heat pipe roller pressing type radiator technical field especially a kind of improved heat pipe roller pressing type radiator. BACKGROUND

[0002] With the continuous development of science and technology, electronic products are also constantly innovated, and their performance is also constantly upgraded, but performance improvement is often accompanied by serious heating phenomenon, if heat cannot be conducted and dissipated in time, it will cause electronic products to appear lag, dead, even cause internal core components to be damaged, scrapped, therefore, heat sink needs to be set on its upper end, heat generated can be conducted and dissipated in time, so as to reduce the temperature of chip, so that it can be used in better working environment.

[0003] However, the heat pipe above the existing heat pipe roller radiator is mostly oval, which is flattened and then laid flat on the heat dissipation base to conduct heat, but laying heat pipe in this way can easily deform or recess the heat pipe, resulting in poor flatness and poor heat conduction effect.

[0004] Therefore, a new technical solution needs to be researched to solve the problem of heat pipe roller of the above heat sink. UTILITY MODEL CONTENTS

[0005] Therefore, the utility model provides an improved heat pipe roller pressing type radiator to solve the problem of heat pipe roller of the above heat sink.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme:

[0007] An improved heat pipe roller pressing type radiator, comprising a heat dissipation seat and a first heat pipe, the lower side of the heat dissipation seat is provided with a mounting groove for placing the first heat pipe, the mounting groove penetrates from one end to the other end of the heat dissipation seat, one end of the first heat pipe is provided with a rectangular structure, and the other end is provided with a flat structure, the rectangular structure part of the first heat pipe is placed in the mounting groove and the upper end face is attached to the upper inner end face of the mounting groove.

[0008] As a preferred, the rectangular structure of the first heat pipe is provided as a vertical rectangular structure, the flat structure of the other end is provided as a horizontally extending flat structure, the middle end of the first heat pipe is provided with a connecting part, the connecting part is in arc shape, the arc-shaped connecting part is connected to the vertical rectangular structure and the horizontal flat structure at its left and right ends and gradually changes from the rectangular structure to the horizontal flat structure, and the first heat pipe is made of copper material and is integrally processed and formed.

[0009] As a kind of preferred, the installation groove is arranged at the lower end center of the heat dissipation seat, and the upper end surface of the heat dissipation seat is also provided with downwardly recessed embedding groove, the embedding groove is longitudinally arranged and located above the installation groove, and the embedding groove and the installation groove are in upper and lower communication structure.

[0010] As a kind of preferred, the number of embedding grooves is set to multiple, and the multiple embedding grooves are arranged in intervals on the upper end surface of the heat dissipation seat and located directly above the installation groove.

[0011] As a kind of preferred, the embedding groove is also provided with a second heat pipe, the overall shape of the second heat pipe is set to U-shaped structure, one end of the second heat pipe is set to flat, and the flat second heat pipe is embedded and installed in the embedding groove.

[0012] As a kind of preferred, the upper end surface of the heat dissipation seat is provided with a second heat dissipation fin, and the second heat dissipation fin is provided with a second fixing groove for the first end of the second heat pipe to extend into.

[0013] As a kind of preferred, one side end of the heat dissipation seat is provided with an extension platform, the extension platform is arranged in the direction of the first heat pipe extension and located directly below, the extension platform is provided with a first heat dissipation fin, and the first heat dissipation fin is provided with a first fixing groove arranged transversely.

[0014] As a kind of preferred, the number of first heat pipes is set to multiple, and the multiple first heat pipes are assembled together and placed in the installation groove, so that the upper end surface of the multiple first heat pipes is attached to the inner upper end surface of the installation groove, and the lower end surface of the first heat pipe extends to the direction of the connecting part and is in the same plane.

[0015] As a kind of preferred, the heat dissipation seat is provided with a plurality of mounting holes for mounting and fixing around, and the mounting hole is provided with a fixing bolt for penetrating through and fixed on the mainboard.

[0016] As a kind of preferred, the heat dissipation seat and the extension platform are fixed together by screw and located at the lower end edge of the heat dissipation seat, and the extension platform is also provided with a supporting stud for supporting and fixing, and the supporting stud is provided with a fixing bolt for penetrating through and mounted on the mainboard.

[0017] The utility model has obvious advantages and beneficial effects compared with prior art, specifically speaking, from the above technical scheme can know:

[0018] The utility model discloses simple structure, convenient production passes through the installation groove who has been set up in the lower end of the heat dissipation seat, and the vertical arrangement of several flat heat pipes is stacked in the installation groove, still through the upper and lower end of heat pipe is processed into plane, makes heat pipe present rectangular structure, and let the upper end face adhere to the inner upper end face of installation groove, the lower end face adheres to the chip, and still the embedded groove of upper end and the installation groove below are set as the structure that communicates, makes first heat pipe and second heat pipe can contact each other, increase the contact area between heat pipe, thereby increase the heat transfer effect, make the heat dissipation performance enhance, and adopt the heat dissipation fin to cooperate heat pipe and carry out the heat dissipation, make the whole heat dissipation effect enhance, can quickly transfer and radiate the heat generated, guarantee its work in the better temperature environment, avoid the influence electronic component's work use state. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to make the technical problems, technical schemes and beneficial effects of the present application more clear, the following will further describe the present application in detail with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application, and are not intended to limit the present application.

[0020] Figure 1 It is the overall structure schematic diagram of the utility model.

[0021] Figure 2 It is the exploded structure schematic diagram of the utility model.

[0022] Figure 3 It is the use state schematic diagram of the utility model.

[0023] Figure 4 It is the use state schematic diagram of another view of the utility model.

[0024] Among them, the reference signs in the drawing are:

[0025] 100, heat dissipation seat, 110, installation groove, 120, embedded groove, 130, extension platform, 200, first heat pipe, 210, rectangular structure, 220, flat structure, 230, connecting part, 300, second heat pipe, 400, second heat dissipation fin, 410, second fixed groove, 500, first heat dissipation fin, 510, first fixed groove. DETAILED DESCRIPTION

[0026] In order to make the technical problems, technical schemes and beneficial effects of the present application more clear, the following will further describe the present application in detail with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application, and are not intended to limit the present application.

[0027] It is to be noted that when an element is referred to as being "fixed" or "set" on another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or indirectly connected to the other element.

[0028] It is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like, indicate directions or positions based on the directions or positions shown in the drawings, and are used for convenience of description and simplification of description only, and do not indicate or imply that the referred device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as limiting the application.

[0029] In addition, the terms "first", "second", "third", etc. are used only for descriptive purposes and cannot be construed as indicating or implying relative importance or an implied indication of the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0030] In order to make the purpose, technical scheme and advantages of the utility model more clear, the utility model is further described in detail below with reference to the drawings and examples.

[0031] Reference is made to the drawings Figures 1-2 As shown in the drawings: an improved heat pipe roller type radiator, including a heat dissipation seat 100 and a first heat pipe 200, the lower part of the heat dissipation seat 100 is provided with the installation groove 110 for the first heat pipe 200 to be placed in, the installation groove 110 penetrates from one end to the other end along the heat dissipation seat 100, one end of the first heat pipe 200 is provided with rectangular structure 210, and the other end is provided with flat structure, the rectangular structure 210 part of the first heat pipe 200 is placed in the installation groove 110 and makes its upper end face adhere to the upper inner end face of the installation groove 110.

[0032] In the embodiment, the rectangular structure 210 of the first heat pipe 200 is provided as a vertical rectangular structure, the flat structure at the other end is provided as a transversely extending flat structure 220, the middle end of the first heat pipe 200 is provided with a connecting part 230, the connecting part 230 is in arc shape, the left and right ends of the arc-shaped connecting part 230 are connected to the vertical rectangular structure and the transverse flat structure 220 and make it gradually change from the rectangular structure to the transverse flat structure 220, and the first heat pipe 200 is integrally processed and formed by using copper material.

[0033] In the embodiment, the mounting groove 110 is arranged at the center of the lower end of the heat dissipation base 100, and the upper end surface of the heat dissipation base 100 is further provided with a downwardly recessed embedding groove 120 arranged longitudinally and above the mounting groove 110.

[0034] In the embodiment, the number of the embedding grooves 120 is set to be multiple, and the multiple embedding grooves 120 are arranged in intervals on the upper end surface of the heat dissipation base 100 and above the mounting groove 110.

[0035] In the embodiment, the embedding groove 120 is further provided with a second heat conduction pipe 300, the overall shape of the second heat conduction pipe 300 is set to be a U-shaped structure, one end of the second heat conduction pipe 300 is set to be flat, and the flat second heat conduction pipe 300 is embedded and mounted into the embedding groove 120, wherein the upper embedding groove 120 and the lower mounting groove 110 are in communication, so that the first heat conduction pipe 200 and the second heat conduction pipe 300 can contact and fit with each other for heat conduction after being mounted in place, thereby increasing the heat conduction effect and enhancing the heat dissipation performance.

[0036] Referring to the accompanying drawings Figures 3-4 In the embodiment, the upper end surface of the heat dissipation base 100 is provided with a second heat dissipation fin 400, and the second heat dissipation fin 400 is provided with a second fixing groove 410 for the one end of the second heat conduction pipe 300 to extend into.

[0037] In the embodiment, one side end of the heat dissipation base 100 is provided with an extension platform 130 arranged in the direction of the extension of the first heat conduction pipe 200 and below the first heat conduction pipe 200, the extension platform 130 is provided with a first heat dissipation fin 500, and the first heat dissipation fin 500 is provided with a first fixing groove 510 arranged transversely.

[0038] In the embodiment, the number of the first heat conduction pipes 200 is set to be multiple, the multiple first heat conduction pipes 200 are assembled together and placed in the mounting groove 110, and the adjacent first heat conduction pipes are tightly fitted together, thereby increasing the heat conduction and making the upper end surface of the multiple first heat conduction pipes 200 fit with the inner upper end surface of the mounting groove 110, and the lower end surface of the first heat conduction pipe 200 extends to the direction of the connecting part 230 and is on the same plane with the connecting part 230.

[0039] In the embodiment, the heat dissipation base 100 is provided with multiple mounting holes for mounting and fixing, and the mounting holes are provided with fixing bolts for penetrating through and being fixed to the mainboard.

[0040] In the embodiment, the heat dissipation seat 100 and the extension platform 130 are fixed together by screws and are located at the lower end edge of the heat dissipation seat 100, the extension platform 130 is further provided with support studs for supporting and fixing, and the support studs are provided with fixing bolts for penetrating through the support studs and being fixed to the mainboard.

[0041] The above is only a preferred embodiment of the present application, and only the technical principle of the present application is specifically described, and these descriptions are only for explaining the principle of the present application, and cannot be explained as a limitation on the protection scope of the present application in any way. Based on the explanation herein, any modification, equivalent replacement and improvement within the spirit and principle of the present application, and other specific embodiments of the present application that can be thought of by those skilled in the art without creative labor, should be included in the protection scope of the present application.

Claims

1. An improved heat pipe roller-pressed radiator, characterized by: It includes a heat sink and a first heat pipe. A mounting groove for placing the first heat pipe is provided below the heat sink. The mounting groove extends from one end of the heat sink to the other end. One end of the first heat pipe is set as a rectangular structure, and the other end is set as a flat structure. The rectangular structure part of the first heat pipe is placed in the mounting groove and its upper end surface is in contact with the upper inner end surface of the mounting groove.

2. The improved heat pipe roller-pressed radiator according to claim 1 is characterized in that: The rectangular structure of the first heat pipe is set as a vertical rectangular structure, and the flat structure at the other end is set as a horizontally extending flat structure. A connecting portion is provided at the middle end of the first heat pipe, and the connecting portion is arc-shaped. The left and right ends of the arc-shaped connecting portion are connected to the vertical rectangular structure and the horizontal flat structure and gradually transform it from a rectangular structure to a horizontal flat structure. The first heat pipe is made of copper material through integral processing.

3. The improved heat pipe roller-pressed radiator according to claim 2, characterized in that: The mounting groove is arranged at the center position of the lower end of the heat sink, and the upper end surface of the heat sink is also provided with a downwardly recessed embedding groove, the embedding groove is arranged longitudinally and located above the mounting groove, and the embedding groove and the mounting groove are in a vertically connected structure.

4. The improved heat pipe roller-pressed radiator according to claim 3 is characterized in that: The number of the embedding grooves is set to be plural, and the plural embedding grooves are arranged at intervals and distributed on the upper end surface of the heat sink and are located directly above the mounting groove.

5. The improved heat pipe roller-pressed radiator according to claim 3 is characterized in that: A second heat conducting pipe is further provided in the embedding groove. The overall shape of the second heat conducting pipe is set to a U-shaped structure. One end of the second heat conducting pipe is set to a flat shape, so that the flat second heat conducting pipe is embedded and installed in the embedding groove.

6. The improved heat pipe roller-pressed radiator according to claim 5, characterized in that: The upper end surface of the heat sink is provided with a second heat dissipation fin, and the second heat dissipation fin is provided with a second fixing groove for one end of the second heat conduction pipe to extend into.

7. The improved heat pipe roller-pressed radiator according to claim 3, characterized in that: An extension platform is provided at one side end of the heat sink, and the extension platform is provided in the direction of extension of the first heat pipe and directly below it. A first heat dissipation fin is provided on the extension platform, and a first fixing groove is provided in the first heat dissipation fin.

8. The improved heat pipe roller-pressed radiator according to claim 7, characterized in that: The number of the first heat conducting tubes is set to be plural, and the plural first heat conducting tubes are assembled together and placed in the installation groove, so that the upper end surfaces of the plural first heat conducting tubes are in contact with the inner upper end surface of the installation groove, and the lower end surfaces of the first heat conducting tubes are extended and flattened in the direction of the connecting portion so that the two are on the same plane.

9. The improved heat pipe roller-pressed radiator according to claim 7, characterized in that: A plurality of mounting holes for mounting and fixing are arranged around the heat sink, and fixing bolts for passing through the mounting holes and being fixed on the mainboard are arranged on the mounting holes.

10. The improved heat pipe roller-pressed radiator according to claim 9, characterized in that: The heat sink and the extension platform are fixed together by screws and are located at the lower edge of the heat sink. The extension platform is also provided with a support stud for support and fixation, and the support stud is provided with a fixing bolt for passing through it and being installed on the motherboard.

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