Grinding device for grinding semiconductor wafer

Abstract

A grinding device for semiconductor wafer grinding comprises a T-shaped main shaft, a fixing disc and a planetary gear train system, the fixing disc is used for bearing the T-shaped main shaft, and a mounting hole for the T-shaped main shaft to penetrate through is formed in the fixing disc; the lower edge of the horizontal section of the T-shaped spindle is in sliding fit with the upper edge of the fixing disc. A grinding disc is fixed to the upper end of the T-shaped spindle through a connecting flange. The vertical section of the T-shaped main shaft penetrates through the mounting hole and then is connected with a planetary gear train system used for driving the T-shaped main shaft to rotate in multiple directions, and one planetary gear shaft in the planetary gear train system is fixedly connected with the bottom of the vertical section of the T-shaped main shaft. The wafer grinding device can move in multiple directions to grind wafers, and the grinding efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor wafer grinding technical equipment field, specifically speaking, a kind of grinding device for semiconductor wafer grinding. BACKGROUND

[0002] Semiconductor wafer refers to the silicon wafer used to make silicon semiconductor circuit, and its raw material is silicon. The manufacturing method is to dissolve high-purity polysilicon into silicon crystal seed, then slowly pull out to form cylindrical monocrystalline silicon. After grinding, polishing and slicing, the silicon rod is ground again on both sides of the slice, and finally a smooth silicon wafer, i.e. semiconductor wafer, is obtained.

[0003] In the prior art, the grinding wheel is installed on the conventional grinding shaft, and the grinding shaft itself is fixed and unchanged while driving the grinding wheel to rotate to grind the workpiece. However, since the grinding shaft itself is fixed and unchanged, the grinding wheel can only perform single-direction grinding motion on the workpiece, and the grinding efficiency is not high. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of grinding device for semiconductor wafer grinding, can carry out multi-direction motion grinding wafer, improve grinding efficiency.

[0005] In order to solve the above technical problems, the utility model adopts the specific scheme of a kind of grinding device for semiconductor wafer grinding, including T-shaped spindle, fixed disc and planetary gear system, the fixed disc is used to bear T-shaped spindle, fixed disc is opened and is equipped with the installation hole for T-shaped spindle to pass through;The horizontal section of T-shaped spindle is slidably connected with the upper edge of fixed disc, and the grinding disc is fixed on the upper end of T-shaped spindle through the connecting flange;The vertical section of T-shaped spindle is connected with the planetary gear system for driving its multi-direction rotation after passing through the installation hole, and one of the planetary gear system is fixedly connected with the bottom of the vertical section of T-shaped spindle.

[0006] As another optimization scheme of the above-mentioned grinding device for semiconductor wafer grinding: T-shaped spindle includes spindle shell and grinding shaft rotatingly arranged in spindle shell, and flange is fixedly connected to the side surface of grinding shaft protruding from spindle shell.

[0007] As another optimization scheme of the above-mentioned grinding device for semiconductor wafer grinding: coaxially provided with thrust plate at the front end of grinding shaft, annular containing groove for containing thrust plate is formed on the inner wall of the front end of spindle shell, and axial air bearing is arranged on the outer periphery of thrust plate.

[0008] As another optimization scheme of the above-mentioned grinding device for semiconductor wafer grinding, a power assembly for driving the rotation of the grinding rotating shaft is arranged between the grinding rotating shaft and the main shaft shell, the power assembly comprises a motor rotor and a motor stator which are fitted and installed, the motor rotor is fixed to the outer periphery of the grinding rotating shaft, and the motor stator is fixed to the inner periphery of the main shaft shell.

[0009] As another optimization scheme of the above-mentioned grinding device for semiconductor wafer grinding, the motor rotor is fixed to the middle part of the grinding rotating shaft, and the circumferential air floating bearings for supporting the grinding rotating shaft are arranged on both sides of the motor rotor in the main shaft shell.

[0010] As another optimization scheme of the above-mentioned grinding device for semiconductor wafer grinding, the end cover is arranged on the bottom of the main shaft shell, a base is fixed on the end cover through bolts, and the planetary wheel shaft is fixed to the base.

[0011] As another optimization scheme of the above-mentioned grinding device for semiconductor wafer grinding, the main flow channel for conveying cooling water is arranged in the grinding rotating shaft and is distributed along the axial direction of the grinding rotating shaft, the lower end of the main flow channel is communicated with the water conveying channel arranged in the end cover, and the upper end of the main flow channel is communicated with the branch flow channel arranged in the connecting flange.

[0012] As another optimization scheme of the above-mentioned grinding device for semiconductor wafer grinding, the branch flow channels arranged in the connecting flange are arranged in multiple and are distributed in a radial manner.

[0013] Compared with the prior art, the present application has the following beneficial effects:

[0014] The T-shaped main shaft front end can fix the grinding disc through the connecting flange, the vertical section bottom of the T-shaped main shaft is connected with one of the planetary wheel shafts in the planetary gear system, the T-shaped main shaft has the same structure as the grinding shaft in the prior art, and the difference is that the T-shaped main shaft is connected with one of the planetary wheel shafts in the planetary gear system, the T-shaped main shaft can revolve and rotate under the driving of the planetary wheel shaft, and then the grinding disc can generate more grinding angles in more directions when grinding the to-be-ground parts, and the grinding efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a sectional view structure schematic diagram of the present application;

[0016] Figure numerals: 1. T-shaped spindle, 101. Spindle housing, 1011. End cover, 1012. Water supply channel, 1013. Base, 102. Grinding shaft, 1021. Main flow channel, 1022. Air inlet end, 103. Connecting flange, 104. Circumferential air bearing, 2. Fixed plate, 201. Mounting hole, 3. Sliding bearing, 4. Thrust plate, 401. Axial air bearing, 5. Grinding plate, 6. Part to be ground, 7. Planetary gear system, 701. Planetary gear, 7011. Planetary gear shaft, 702. Sun gear, 8. Power assembly, 801. Motor rotor, 802. Motor stator. DETAILED DESCRIPTION

[0017] The technical solution of the present invention is further elaborated in detail below in conjunction with specific embodiments. Parts not described in detail in the following embodiments of the present invention, such as the structure of the planetary gear system, the coordination between the motor stator and the motor rotor in the power assembly, etc., should be immediately known to those skilled in the art or should be known to the prior art.

[0018] A grinding device for grinding semiconductor wafers, such as Figure 1 As shown, the device comprises a T-shaped spindle 1, a fixed plate 2, and a planetary gear system 7. A mounting hole 201 is defined in the center of the fixed plate 2, into which the T-shaped spindle 1 is inserted. The horizontal section of the T-shaped spindle 1 slides with the outer periphery of the fixed plate 2 via a sliding bearing 3. A connecting flange 103 is secured to the side of the T-shaped spindle 1 opposite the sliding bearing 3. This flange 103 is used to securely mount a grinding plate 5 capable of grinding a workpiece 6 into a wafer.

[0019] The fixed plate 2 can support the T-shaped main shaft 1 so that after the vertical section of the T-shaped main shaft 1 passes through the mounting hole 201 on the fixed plate 2, its bottom is connected to any planetary gear 701 in the planetary gear system 7 through the planetary gear shaft 7011 for multi-directional movement.

[0020] The T-shaped spindle 1 includes a spindle housing 101 and a grinding shaft 102. The grinding shaft 102 is rotatably arranged in the spindle housing 101. The grinding shaft 102 is T-shaped. A part of the front end of the horizontal section of the grinding shaft 102 protrudes from the front end surface of the spindle housing 101. A connecting flange 103 is set in the middle of a side surface of the protruding front end of the grinding shaft 102, and the grinding disc 5 is fixed on the connecting flange 103.

[0021] The bottom of the main shaft shell 101 is provided with an end cover 1011, and the outside of the end cover 1011 is fixed with a base 1013 by bolts. The planetary gear system 7 is fixedly connected with the base 1013 through a planetary gear shaft 7011. The planetary gear system 7 comprises a ring gear, a plurality of planetary gears 701 and a sun gear 702. The sun gear 702 is fixedly connected with an output shaft of a driving motor for driving the rotation of the sun gear 702 through a sun gear shaft. One end of the planetary gear shaft 7011 fixed in the middle of the base 1013 is connected with one of the planetary gears 701. Under the driving of the driving motor, the planetary gears 701 connected with the base 1013 rotate in meshing with the ring gear and the sun gear 702, and drive the T-shaped main shaft 1 to move in multiple directions to quickly grind the workpiece 6 into a wafer.

[0022] Further, a main flow channel 1021 for conveying cooling water is formed in the grinding shaft 102 along the axis thereof. A water conveying channel 1012 is formed in the end cover 1011 along the radial direction thereof. The water conveying channel 1012 is in communication with the lower end of the main flow channel 1021, and a water conveying joint is mounted at the port of the water conveying channel 1012 for connecting an external water conveying pipe. The upper end of the water conveying channel 1012 is in communication with a plurality of branch flow channels arranged in the connecting flange 103. The branch flow channels are arranged radially so that the cooling water conveyed through the water conveying pipe, the main flow channel 1021 and the branch flow channels can flow onto the grinding surface of the grinding disc 5 when the workpiece 6 is being ground.

[0023] Further, the outer periphery of the front end of the horizontal section of the grinding shaft 102 in the main shaft shell 101 is provided with a thrust plate 4. A corresponding annular accommodating groove for accommodating the thrust plate 4 is formed in the inner wall of the horizontal section of the main shaft shell 101. An axial air floating bearing 401 is mounted on the outer periphery of the thrust plate 4, and a gap is formed between the axial air floating bearing 401 and the groove wall of the corresponding side of the main shaft shell 101.

[0024] An air inlet channel for conveying gas is formed in the main shaft shell 101. One end of the air inlet channel is in communication with an air inlet end 1022 for supplying gas into the air inlet channel. The other end of the air inlet channel is in communication with the gap between the axial air floating bearing 401 and the accommodating groove, so that the gas fills the gap between the axial air floating bearing 401 and the accommodating groove to form a gas film. The setting of the axial air floating bearing 401 can reduce the friction between the axial air floating bearing 401 and the accommodating groove.

[0025] Further, the outer periphery of the vertical section of the grinding shaft 102 is provided with a circumferential air floating bearing 104, the circumferential air floating bearing 104 has a gap with the inner wall of the main shaft housing 101, and the main shaft housing 101 is provided with a gas conveying passage for conveying gas, one outer port of the gas conveying passage is connected with the air inlet end 1022 for supplying air into the gas conveying passage, and one inner port of the gas conveying passage is communicated with the gap between the circumferential air floating bearing 104 and the main shaft housing 101, so that the air fills the gap to form an air film, thereby reducing the contact friction between the outer side wall of the grinding shaft 102 and the inner side wall of the main shaft housing 101.

[0026] Further, the grinding shaft 102 and the main shaft housing 101 are provided with a power assembly 8 for driving the grinding shaft 102 to rotate, the power assembly 8 comprises a motor rotor 801 and a motor stator 802, the motor rotor 801 is fixed to the outer periphery of the middle part of the grinding shaft 102, and the motor stator 802 is fixed to the inner periphery of the main shaft housing 101. The circumferential air floating bearings 104 are arranged on both sides of the motor rotor 801 on the grinding shaft 102, the circumferential air floating bearings 104 have gaps with the inner wall of the main shaft housing 101, and the air is supplied into the gaps through the gas conveying passage arranged in the main shaft housing 101 to form an air film capable of reducing the friction between the circumferential air floating bearings 104 and the main shaft housing 101.

Claims

1. A grinding device for grinding semiconductor wafers, characterized in that: The invention comprises a T-shaped main shaft (1), a fixed disk (2) and a planetary gear system (7), wherein the fixed disk (2) is used to carry the T-shaped main shaft (1), and a mounting hole (201) for the T-shaped main shaft (1) to pass through is provided on the fixed disk (2); the lower edge of the horizontal section of the T-shaped main shaft (1) is slidably matched with the upper edge of the fixed disk (2), and a grinding disk (5) is fixed to the upper end of the T-shaped main shaft (1) via a connecting flange (103); the vertical section of the T-shaped main shaft (1) passes through the mounting hole (201) and is connected to the planetary gear system (7) for driving the multi-directional rotation thereof, and one of the planetary gear shafts (7011) in the planetary gear system (7) is fixedly connected to the bottom of the vertical section of the T-shaped main shaft (1).

2. The semiconductor wafer polishing device according to claim 1, wherein: The T-shaped spindle (1) comprises a spindle housing (101) and a grinding shaft (102) rotatably arranged in the spindle housing (101); the grinding shaft (102) protrudes from one side of the spindle housing (101) and is fixedly connected to a flange (103).

3. The semiconductor wafer polishing device according to claim 2, wherein: A thrust plate (4) is coaxially arranged at the front end of the grinding shaft (102); an annular receiving groove for accommodating the thrust plate (4) is provided on the inner wall of the front end of the spindle housing (101); and an axial air bearing (401) is provided on the outer periphery of the thrust plate (4).

4. The semiconductor wafer polishing device according to claim 2, wherein: A power assembly (8) for driving the grinding shaft (102) to rotate is provided between the grinding shaft (102) and the spindle housing (101). The power assembly (8) comprises a motor rotor (801) and a motor stator (802) that are mounted in a matching manner. The motor rotor (801) is fixed to the outer periphery of the grinding shaft (102), and the motor stator (802) is fixed to the inner periphery of the spindle housing (101).

5. The semiconductor wafer polishing device according to claim 4, wherein: The motor rotor (801) is fixed to the middle of the grinding shaft (102), and circumferential air bearings (104) for supporting the grinding shaft (102) are provided on both sides of the motor rotor (801) in the spindle housing (101).

6. The semiconductor wafer polishing device according to claim 2, wherein: An end cover (1011) is installed at the bottom of the main shaft housing (101), a base (1013) is fixed on the end cover (1011) by bolts, and the planetary gear shaft (7011) is fixed on the base (1013).

7. The semiconductor wafer polishing device according to claim 6, wherein: A main flow channel (1021) for conveying cooling water is provided in the grinding shaft (102) and is distributed along its axial direction. The lower end of the main flow channel (1021) is communicated with a water conveying channel (1012) provided in the end cover (1011), and the upper end of the main flow channel (1021) is communicated with a diversion channel provided in the connecting flange (103).

8. The semiconductor wafer polishing device according to claim 7, wherein: A plurality of diversion channels are provided in the connecting flange (103) and are distributed radially.

Images