Molding press for diode processing
By introducing the automatic ejection function in the molding machine, the problem of product quality degradation caused by the lack of automatic ejection in traditional devices is solved. The diode can be removed quickly and accurately, avoiding physical damage and improving product quality.
Patent Information
- Application Number
- CN202423016896.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-12-09
AI Technical Summary
Traditional diode processing equipment lacks an automatic ejection function, resulting in reduced product quality.
A molding machine including an ejector support rod, an ejector slide rod, an ejector spring, an ejector guide plate and an ejector plate was designed. The automatic ejection function was realized through the cooperation of the electric telescopic rod and the ejector spring, ensuring that the diode was quickly and accurately removed from the mold after the molding was completed.
It avoids physical damage caused by manual operation and improves the quality and precision of diode products.
Smart Images
Figure CN223442758U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to diode processing technical field especially relates to a moulding press for diode processing. BACKGROUND
[0002] Diode is one of the most commonly used electronic components, and it is due to the utility model of diode and other components that we have the birth of the present colorful electronic information world, and diode can be used in various electronic devices, and the moulding press plays a crucial role in the production and processing of diode.
[0003] When taking materials manually, the inaccuracy of human operation is inevitable, which may cause physical damage to diode, for example, uneven force in the taking process may scratch the surface of diode or cause diode to be improperly extruded and damage its internal structure, and for some diode products with extremely high precision requirements, these slight damages may cause the performance of the products to decline or even fail, which greatly reduces the product quality.
[0004] Therefore, it is necessary to provide a moulding press for diode processing to solve the above technical problems. UTILITY MODEL CONTENTS
[0005] The utility model provides a moulding press for diode processing, which solves the problem of great decline in product quality caused by the lack of automatic ejection function of the traditional device.
[0006] To solve the above technical problems, the utility model provides a moulding press for diode processing, which comprises a device main body, a forming die arranged on the device main body, a forming groove formed in the forming die, a ejection supporting rod fixedly connected to the device main body, a ejection sliding rod fixedly connected to the ejection supporting rod, a ejection spring arranged on the ejection sliding rod, a vertical sliding rod slidingly connected to the ejection sliding rod, a ejection guide plate fixedly connected to the vertical sliding rod, a ejection plate fixedly connected to the ejection guide plate, a ejection block fixedly connected to the ejection plate, a downward pressing connecting block arranged on the device main body, a downward pressing rod fixedly connected to the downward pressing connecting block, one end of the ejection spring fixedly connected to the ejection supporting rod, and the other end of the ejection spring fixedly connected to the ejection guide plate.
[0007] Preferably, a top plate supporting rod is fixedly connected to the device main body, a top plate is fixedly connected to the top plate supporting rod, an installation plate is fixedly connected to the top plate, an electric telescopic rod is installed on the installation plate, and a telescopic connecting block is fixedly connected to the electric telescopic rod.
[0008] Preferably, an installation sliding groove is formed in the device main body, an installation block is fixedly connected to the forming die, and the installation block is slidingly connected to the installation sliding groove.
[0009] Preferably, a discharge port is provided on the downward pressing connecting block, a heating block is fixedly connected to the downward pressing connecting block, a feed pipe is fixedly connected to the downward pressing connecting block, a pipe fixing frame is fixedly connected to the top plate, and the pipe fixing frame is fixedly connected to the feed pipe.
[0010] Preferably, a device door is provided on the device body, and a handle is provided on the device door.
[0011] Preferably, a device support rod is fixedly connected to the device body, and an anti-slip pad is fixedly connected to the device support rod.
[0012] Preferably, a controller is fixedly connected to the device body, and the telescopic connecting block is fixedly connected to the downward pressing connecting block.
[0013] Compared with the related art, the molding machine for diode processing provided by the present invention has the following beneficial effects:
[0014] The utility model provides a molding machine for diode processing. When the device is used, the controller can be used to control the electric telescopic rod to start, and the electric telescopic rod will drive the downward pressing connecting block to move downward, and at the same time, the downward pressing connecting block will drive the downward pressing rod to move downward, and at this time, the downward pressing rod will drive the ejection plate to move. After molding, the electric telescopic rod will drive the downward pressing rod to return to its original position, and at the same time, the ejection spring will use elastic force to push the ejection block to eject the molded workpiece out of the molding groove. The device has an automatic ejection function. The automatic ejection function can ensure that the diode can be quickly and accurately removed from the mold after the molding is completed. Compared with manual operation, which may cause physical damage to the diode due to uneven force or improper operation, such as scratches, indentations, etc., the device can avoid the occurrence of these situations, thereby achieving the effect of improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 A schematic structural diagram of a preferred embodiment of a molding machine for diode processing provided by the present invention;
[0016] Figure 2 for Figure 1 The schematic diagram of the device body shown is viewed from below;
[0017] Figure 3 for Figure 1 A schematic cross-sectional view of the device body shown;
[0018] Figure 4 for Figure 1 An enlarged schematic diagram of part A is shown;
[0019] Figure 5 forFigure 3 An enlarged schematic diagram of part B is shown.
[0020] Numbers in the figure: 1. Device body, 2. Anti-slip pad, 3. Handle, 4. Device support rod, 5. Device door, 6. Controller, 7. Top plate support rod, 8. Heating block, 9. Molding mold, 10. Feed pipe, 11. Pipe fixing frame, 12. Down-press connecting block, 13. Down-press rod, 14. Discharge port, 15. Mounting plate, 16. Electric telescopic rod, 17. Telescopic connecting block, 18. Rotating slide, 19. Molding groove, 20. Top plate, 21. Mounting block, 22. Down-press groove, 23. Vertical slide rod, 24. Ejector guide plate, 25. Ejector spring, 26. Ejector slide rod, 27. Ejector plate, 28. Ejector block, 29. Ejector support rod. DETAILED DESCRIPTION
[0021] The present invention will be further described below with reference to the accompanying drawings and implementation examples.
[0022] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 ,in, Figure 1 A schematic structural diagram of a preferred embodiment of a molding machine for diode processing provided by the present invention; Figure 2 for Figure 1 The schematic diagram of the device body shown is viewed from below; Figure 3 for Figure 1 A schematic cross-sectional view of the device body shown; Figure 4 for Figure 1 An enlarged schematic diagram of part A is shown; Figure 5 for Figure 3 A die press for diode processing comprises: a device body 1, a forming die 9 provided on the device body 1, a forming groove 19 provided on the forming die 9, an ejection support rod 29 fixedly connected to the device body 1, an ejection slide 26 fixedly connected to the ejection support rod 29, an ejection spring 25 provided on the ejection slide 26, a vertical slide 23 slidably connected to the ejection slide 26, an ejection guide plate 24 fixedly connected to the vertical slide 23, and an ejection guide plate 26 fixedly connected to the ejection guide plate 26. 4 is fixedly connected to an ejector plate 27, to which an ejector block 28 is fixedly connected. A downward pressing connecting block 12 is provided on the device body 1, to which a downward pressing rod 13 is fixedly connected. One end of the ejector spring 25 is fixedly connected to the ejector support rod 29, and the other end of the ejector spring 25 is fixedly connected to the ejector guide plate 24. The ejector spring 25 has the function of using its own elastic force to push the ejector guide plate 24 to reset, thereby achieving the function of ejecting the formed workpiece.
[0023] The device body 1 is fixedly connected with a top plate support rod 7, the top plate support rod 7 is fixedly connected with a top plate 20, the top plate 20 is fixedly connected with a mounting plate 15, the mounting plate 15 is installed with an electric telescopic rod 16, the electric telescopic rod 16 is fixedly connected with a telescopic connecting block 17, the electric telescopic rod 16 has the effect of driving the heating block 8 to ascend and descend, and can press the mold to a certain extent after injection molding is completed, and the heating block 8 has the effect of accelerating the forming of the workpiece.
[0024] The device body 1 is provided with a mounting sliding groove 18, the forming mold 9 is fixedly connected with a mounting block 21, the mounting block 21 is in sliding connection with the mounting sliding groove 18, and the mounting sliding groove 18 has the effect of facilitating replacement of a new forming mold 9.
[0025] The lower pressing connecting block 12 is provided with a discharge port 14, the lower pressing connecting block 12 is fixedly connected with a heating block 8, the lower pressing connecting block 12 is fixedly connected with a material conveying pipe 10, the top plate 20 is fixedly connected with a pipe fixing frame 11, the pipe fixing frame 11 is fixedly connected with the material conveying pipe 10, and the pipe fixing frame 11 has the effect of fixing the material conveying pipe 10.
[0026] The device body 1 is provided with a device door 5, the device door 5 is provided with a handle 3, the handle 3 has the effect of facilitating opening of the device door 5, and the handle 3 can quickly put the articles into the storage space in the interior.
[0027] The device body 1 is fixedly connected with a device support rod 4, the device support rod 4 is fixedly connected with an anti-skid pad 2, and the device support rod 4 has the effect of supporting the device body 1.
[0028] The device body 1 is fixedly connected with a controller 6, the telescopic connecting block 17 is fixedly connected with the lower pressing connecting block 12, and the controller 6 has the effect of controlling the operation of the device.
[0029] The working principle of the die press machine for diode processing provided by the utility model is as follows:
[0030] When using the device, the electric telescopic rod 16 can be started by the controller 6, and the downward connecting block 12 is driven to move downward, and the downward rod 13 is driven to move downward by the downward connecting block 12, and the downward rod 13 slowly enters the downward slot 22, and then the downward rod 13 extrudes the vertical slide rod 23, and the vertical slide rod 23 drives the ejection plate 27 to move, and when reaching a certain position, the raw material enters the forming groove 19 from the discharge port 14 along the feeding pipe 10, and then is shaped, and after shaping, the downward rod 13 is restored to the original position by the electric telescopic rod 16, and the ejection spring 25 restores the ejection guide plate 24 to the original position by the elastic force, and the ejection block 28 is driven by the ejection guide plate 24 to eject the formed workpiece from the forming groove 19, and the operator can take it out.
[0031] Compared with the related art, the die press machine for diode processing has the following beneficial effects:
[0032] When using the device, the electric telescopic rod 16 can be started by the controller 6, and the downward connecting block 12 is driven to move downward, and the downward rod 13 is driven to move downward by the downward connecting block 12, and the downward rod 13 drives the ejection plate 27 to move, and after shaping, the downward rod 13 is restored to the original position by the electric telescopic rod 16, and the ejection block 28 is pushed out of the forming groove 19 by the ejection spring 25 by the elastic force, the device increases the automatic ejection function, and the automatic ejection function can ensure that the diode is quickly and accurately removed from the mold after die pressing, compared with manual operation, the diode can be physically damaged, such as scratching and indentation, due to uneven force or improper operation, and the device can avoid these situations, thereby achieving the effect of improving product quality.
[0033] The above is only an embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent process conversion or direct or indirect application in other related technical fields is included in the patent protection range of the utility model.
Claims
1. A molding machine for diode processing, characterized in that: include: The cam is fixedly provided with a push-button that is fixed to the push-button support rod, and the push-button support rod is fixedly connected to the push-button slide rod, and the push-button slide rod is provided with a push-out spring. The push-button slide rod is slidably connected to a vertical slide rod, and the vertical slide rod is fixedly connected to an ejection guide plate, and the ejection guide plate is fixedly connected to the ejection plate, and the ejection plate is fixedly connected to an ejection block. The cam is provided with a downward pressing connecting block, and the downward pressing connecting block is fixedly connected to the downward pressing rod, one end of the ejection spring is fixedly connected to the ejection support rod, and the other end of the ejection spring is fixedly connected to the ejection guide plate.
2. A die stamping machine for diode processing according to claim 1, characterized in that: The device body is fixedly connected to a top plate support rod, the top plate support rod is fixedly connected to a top plate, the top plate is fixedly connected to a mounting plate, the mounting plate is mounted with an electric telescopic rod, and the electric telescopic rod is fixedly connected to a telescopic connecting block.
3. The die stamping machine for diode processing according to claim 1, characterized in that: The device body is provided with a mounting slot, the forming die is fixedly connected with a mounting block, and the mounting block is slidably connected to the mounting slot.
4. A die stamping machine for diode processing according to claim 2, characterized in that: The downward pressing connecting block is provided with a discharge port, the downward pressing connecting block is fixedly connected to a heating block, the downward pressing connecting block is fixedly connected to a material delivery pipe, the top plate is fixedly connected to a pipe fixing frame, and the pipe fixing frame is fixedly connected to the material delivery pipe.
5. The die stamping machine for diode processing according to claim 1, characterized in that: A device door is provided on the device body, and a handle is provided on the device door.
6. A die stamping machine for diode processing according to claim 1, characterized in that: A device support rod is fixedly connected to the device main body, and an anti-slip pad is fixedly connected to the device support rod.
7. A die stamping machine for diode processing according to claim 2, characterized in that: The device body is fixedly connected with a controller, and the telescopic connecting block is fixedly connected with the downward pressing connecting block.