Film coating support plate, film coating equipment and battery piece

Abstract

The embodiment of the utility model provides a coating carrier plate, coating equipment and a battery piece, and relates to the technical field of solar batteries. The film-coated carrier plate comprises a frame and a supporting piece, the supporting piece is positioned on the inner side of the frame and is suitable for placing a silicon substrate; the supporting piece comprises a supporting body and a protruding part arranged on the inner side of the supporting body. The supporting part is reused for a mask of a silicon substrate to be coated, the supporting main body is used for enabling the silicon substrate to be coated to form an edge isolation area after a coating process, the protruding part is used for enabling the silicon substrate to be coated to form a protruding isolation area after the coating process, and the protruding isolation area corresponds to a harpoon of a grid line formed by the silicon substrate to be coated in the coating process. According to the film coating support plate, the film coating equipment and the battery piece provided by the embodiment of the invention, the film coating support plate can obtain balance between increasing the film coating area and providing effective support, so that the film coating area of the battery piece is increased, and the power generation efficiency is high.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solar cells, in particular to a coating carrier plate, a coating equipment and a cell. BACKGROUND

[0002] In the preparation of heterojunction solar cells, the formation of a transparent conductive layer (TCO layer) is crucial. The transparent conductive layer is provided with a grid line structure. Currently, the grid line structure is usually provided with a fish-tailed grid line at the edge, which can make the grid line structure have advantages in stability, current collection, etc. The fish-tailed grid line cancels part of the fine grid lines to form a fish-tailed place without grid lines, which helps to reduce shading, reduce paste consumption and simplify the process. Since the photoelectric conversion efficiency is proportional to the light intensity and the effective area of the heterojunction solar cell, increasing the coating area of the transparent conductive layer can improve the cell efficiency. The grid line structure on the surface of the transparent conductive layer can collect and transmit current. Increasing the coating area can also provide more space for the grid line structure, which helps to optimize current collection and reduce resistance loss.

[0003] The coating carrier plate has a dual role in the preparation of heterojunction solar cells: it supports and fixes the silicon substrate during the coating process, and also serves as a mask to ensure accurate coating of the transparent conductive layer. To increase the area of the transparent conductive layer, the support area of the coating carrier plate needs to be reduced. However, narrowing the support surface will reduce the support effect, making the silicon substrate prone to shaking, displacement or even falling, which will affect the coating quality and uniformity, and even damage the surface of the silicon substrate.

[0004] As can be seen, the existing coating carrier plate generally has a support width of more than 0.7 mm to ensure support performance, and it is difficult to achieve narrow design, resulting in a small coating area of the processed cell and low power generation efficiency. Utility model content

[0005] The present application provides a coating carrier plate, a coating equipment and a cell. The coating carrier plate can balance between increasing the coating area and providing effective support, so that the coating area of the cell is increased and the power generation efficiency is high.

[0006] In a first aspect, the present application provides a coating carrier plate, which comprises a frame and a support piece; wherein the support piece is located on the inner side of the frame and is adapted to place a silicon substrate to be coated; the support piece comprises a support body and a protruding part arranged on the inner side of the support body.

[0007] The support piece is used as a coating mask for the silicon substrate to be coated. The support body is used to form an edge isolation zone after the coating process of the silicon substrate to be coated. The protruding part is used to form a protruding isolation zone after the coating process of the silicon substrate to be coated. The protruding isolation zone corresponds to the fish-tailed place of the grid line formed in the coating process of the silicon substrate to be coated.

[0008] As an optional implementation, in a cross section parallel to the support, the protruding portion is shaped as one of an arc, a triangle, and a trapezoid.

[0009] As an optional implementation, in a cross section parallel to the support, the protruding portion includes a first arc and a second arc;

[0010] The first arc is protruding towards the support body, and the second arc is protruding towards the support body;

[0011] A first end of the first arc is connected to the support body, and a second end of the first arc extends to an inner side of the support body;

[0012] A first end of the second arc is connected to the support body, and a second end of the second arc extends to an inner side of the support body;

[0013] The second end of the first arc and the second end of the second arc are connected.

[0014] As an optional implementation, a width of the support body is greater than or equal to 0.35 mm and less than or equal to 0.5 mm, and a maximum dimension of the protruding portion protruding from the support body is greater than or equal to 0.05 mm and less than or equal to 0.3 mm.

[0015] As an optional implementation, the frame surrounds a containing space for containing the silicon substrate to be coated;

[0016] In a cross section parallel to the support, a difference between a width of the containing space and a width of the silicon substrate to be coated is greater than or equal to 0.07 mm and less than or equal to 0.15 mm.

[0017] In a second aspect, the application provides a coating device including a coating device body and any of the above coating carriers.

[0018] In a third aspect, the application provides a battery piece made of a silicon substrate to be coated by a coating process and using any of the above coating carriers, the battery piece having a grid line structure, and an edge of the grid line structure having a fish-tail.

[0019] As an optional implementation, the grid line structure includes edge sub-grid lines and intermediate sub-grid lines, and the edge sub-grid lines and the intermediate sub-grid lines are arranged at intervals along a width direction of the battery piece.

[0020] The edge sub-grid lines are located on a side of the intermediate sub-grid lines close to the edge isolation region.

[0021] The edge sub-grid line has a plurality of connection sections, and an un-penetrating area is arranged between two adjacent connection sections, and the un-penetrating area is used for forming the fish-tail.

[0022] As an optional implementation, the surface of the battery piece has a plating area and a non-plating area.

[0023] The grid line structure is arranged in the plating area.

[0024] The non-plating area includes a connected edge isolation area and a protruding isolation area, and the protruding isolation area is arranged in the length direction of the battery piece.

[0025] The edge isolation area corresponds to the position of the support body of the plating carrier plate, and the protruding isolation area corresponds to the position of the protruding part of the plating carrier plate, and at least part of the protruding isolation area extends into the fish-tail.

[0026] As an optional implementation, the edge of the grid line structure is a fish-tail-shaped grid line, and a plurality of fish-tail-shaped grid lines are arranged in the length direction of the battery piece.

[0027] The fish-tail-shaped grid line is connected with the edge sub-grid line and the middle sub-grid line.

[0028] The fish-tail-shaped grid line is connected with the end of the connection section of the edge sub-grid line, and the fish-tail-shaped grid line is connected with part of the middle sub-grid line, and the edge sub-grid line and the middle sub-grid line are conducted through the fish-tail-shaped grid line.

[0029] The plating carrier plate, the plating equipment and the battery piece provided by the embodiment of the application, the plating carrier plate includes a frame and a support, the support is located on the inner side of the frame, the silicon substrate to be plated can be placed in the frame and supported on the support, and the support can provide support for the silicon substrate to be plated. The support includes a support body and a protruding part arranged on the support body, and the support body and the protruding part jointly constitute a platform for placing the silicon substrate to be plated, so as to provide support for the silicon substrate to be plated, and the protruding part can provide additional support for the silicon substrate to be plated. When the width of the support body is reduced to reduce the width of the mask, the support effect of the support on the silicon substrate to be plated can be ensured. The protruding part can form a protruding isolation area on the silicon substrate to be plated after the deposition process, and the protruding isolation area corresponds to the fish-tail of the grid line formed on the silicon substrate to be plated. The fish-tail cancels the setting of the grid line, so that the mask of the protruding part does not affect the formation of the grid line, and does not cause significant loss of the power generation efficiency of the battery piece. Therefore, the plating carrier plate, the plating equipment and the battery piece provided by the embodiment of the application can balance between increasing the plating area and providing effective support, so that the plating area of the battery piece can be increased, and the power generation efficiency can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0030] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application.

[0031] Figure 1 A structural schematic diagram of a coated substrate provided by an embodiment of the present application;

[0032] Figure 2 A structural schematic diagram of a coated substrate provided by an embodiment of the present application; Figure 1 An enlarged view of part A in FIG. 2;

[0033] Figure 3 A structural schematic diagram of a coated substrate provided by an embodiment of the present application; Figure 1 An enlarged view of part B in FIG. 2;

[0034] Figure 4 A structural schematic diagram of a coated substrate provided by an embodiment of the present application; An enlarged view of part B in FIG. 2;

[0035] An enlarged view of part B in FIG. 2; Figure 5 An enlarged view of part B in FIG. 2; Figure 4 An enlarged view of part B in FIG. 2; Figure 1 An enlarged view of part B in FIG. 2; An enlarged view of part B in FIG. 2;

[0036] An enlarged view of part B in FIG. 2; Figure 6 An enlarged view of part B in FIG. 2; Figure 4 An enlarged view of part B in FIG. 2; Figure 2 An enlarged view of part B in FIG. 2; An enlarged view of part B in FIG. 2;

[0037] An enlarged view of part B in FIG. 2; Figure 7 An enlarged view of part B in FIG. 2; Figure 4 An enlarged view of part B in FIG. 2; Figure 3 An enlarged view of part B in FIG. 2; An enlarged view of part B in FIG. 2;

[0038] An enlarged view of part B in FIG. 2; Figure 8 An enlarged view of part C in FIG. 2. Figure 4 An enlarged view of part C in FIG. 2. An enlarged view of part C in FIG. 2.

[0039] An enlarged view of part C in FIG. 2. An enlarged view of part C in FIG. 2.

[0040] 100 - frame;

[0041] 200 - support; 210 - support body; 220 - protrusion; 221 - first circular arc; 222 - second circular arc;

[0042] 300 - accommodation space; 400 - avoidance area;

[0043] 500 - non-coated area; 510 - edge isolation area; 520 - protrusion isolation area;

[0044] 600 - grid line structure; 610 - edge auxiliary grid line; 611 - connecting segment;

[0045] 620 - intermediate auxiliary grid line;

[0046] 630 - harpoon-shaped grid line; 631 - first harpoon-shaped grid line; 632 - second harpoon-shaped grid line;

[0047] 700 - non-penetrated region

[0048] 10 - silicon substrate to be coated.

[0049] By means of the above figures, the explicit embodiments of the present application have been shown, and will be described in more detail hereinafter. These figures and the written description are not intended to limit the scope of the present application concept in any way, but to illustrate the present application concept to those skilled in the art by means of a specific embodiment. DETAILED DESCRIPTION

[0050] For the purpose of making the objects, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be described clearly and completely below in conjunction with the accompanying drawings in the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of the present application.

[0051] The terms "first", "second", "third", "fourth" and the like in the description and claims of the present application and the above figures (if any) are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence. It should be understood that the data thus used can be interchanged, where appropriate, so that the embodiments of the present application described herein can be carried out in other than the order shown or described herein.

[0052] In the preparation process of a heterojunction solar cell, the formation of a transparent conductive layer (TCO layer) is a crucial link. The transparent conductive layer not only has excellent conductivity, but also can ensure the transmittance of sunlight, thereby ensuring the photoelectric conversion efficiency of the solar cell.

[0053] Since the photoelectric conversion efficiency is directly proportional to the light intensity and area received by the cell, the increase of the coating area of the transparent conductive layer can directly improve the photoelectric conversion efficiency of the cell. This means that under the same sunlight conditions, the cell with a larger coating area can generate more electrical energy.

[0054] The transparent conductive layer has a grid line structure on its surface. The grid line structure can collect and transmit the current generated by the photo-generated electrons to ensure that the current can be effectively transmitted from the active area to the edge of the cell. The increase of the coating area can also provide more space for the layout of the grid line structure, so as to flexibly increase the number of grid lines, adjust the pitch and width of the grid lines, etc. according to the needs, which helps to optimize the current collection efficiency of the grid lines, reduce resistance loss, and improve the photoelectric conversion performance of the cell.

[0055] In the edge position of the battery piece, the main grid lines of the grid line structure are usually provided as the fish-tail grid lines. The fish-tail grid lines have certain advantages in stability, current collection efficiency, light shielding area and process adaptability of the grid line structure. In the design of the grid line structure, in order to reduce the light shielding area, reduce the paste consumption and simplify the production process of the grid line structure, the part of the fine grid lines connecting the fish-tail grid lines can be cancelled, and the fish-tail grid lines can form the fish-tail part after the fine grid lines are cancelled.

[0056] The coating carrier board plays a dual role in the preparation process of the heterojunction solar cell. On the one hand, the coating carrier board serves as a support and fixing structure for the silicon substrate to be coated, which can ensure the stability and accuracy of the silicon substrate to be coated in the coating process. On the other hand, the coating carrier board can also serve as a mask for the silicon substrate to be coated, which can shield the area of the silicon substrate to be coated that does not need to be coated during the coating process, thereby ensuring the accurate position and shape of the transparent conductive layer.

[0057] In order to reduce the shielding of the coating carrier board to the silicon substrate to be coated, the support area of the coating carrier board can be reduced to increase the area of the transparent conductive layer and improve the effective light exposure area and conversion efficiency of the battery. However, due to the narrow support surface, the support effect of the coating carrier board to the silicon substrate to be coated will be poor, and the silicon substrate to be coated may shake, displace or even fall during the coating process, which not only affects the quality and uniformity of the coating, but also may cause damage to the surface of the silicon substrate to be coated.

[0058] It can be seen that the existing coating carrier board, due to the need to ensure sufficient support performance, is difficult to achieve a more compact narrow width requirement in size design, which will result in a small coating area of the processed battery piece and low power generation efficiency.

[0059] Therefore, the present application provides a coating carrier board, a coating equipment and a battery piece. The coating carrier board provides support for the silicon substrate to be coated through a support member. The support member includes a support body and a protruding part provided on the support body. The support body and the protruding part together form a platform for placing the silicon substrate to be coated to provide support for the silicon substrate to be coated. The protruding part can provide additional support for the silicon substrate to be coated, which can ensure the support effect of the support member to the silicon substrate to be coated when the width of the support body is reduced to reduce the mask width. The protruding part can form a protruding isolation area on the silicon substrate to be coated after the deposition process, and the protruding isolation area corresponds to the fish-tail part when the grid lines are formed on the silicon substrate to be coated. The fish-tail part cancels the setting of the grid lines, so that the mask of the protruding part at this part does not affect the formation of the grid lines, and does not cause significant loss of power generation efficiency of the battery piece. The coating carrier board, the coating equipment and the battery piece provided by the embodiments of the present application achieve a balance between increasing the coating area and providing effective support, so that the coating area of the battery piece processed by the coating carrier board is increased, and the power generation efficiency is increased.

[0060] The technical solution of the present application is described in detail below with reference to the accompanying drawings and specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0061] Combine Figures 1 to 3 As shown, the first aspect of an embodiment of the present application provides a coating carrier, which includes a frame 100 and a support member 200; the support member 200 is located on the inner side of the frame 100, and is suitable for placing the silicon substrate 10 to be coated; the support member 200 includes a support body 210 and a protrusion 220 arranged on the inner side of the support body 210; the support member 200 is reused as a coating mask for the silicon substrate 10 to be coated, the support body 210 is used to form an edge isolation area 510 on the silicon substrate 10 to be coated after the coating process, and the protrusion 220 is used to form a protruding isolation area 520 on the silicon substrate 10 to be coated after the coating process, and the protruding isolation area 520 corresponds to the harpoon of the gate line formed on the silicon substrate 10 to be coated during the coating process.

[0062] Among them, the frame 100 can be a square annular body, and the frame 100 can be enclosed to form an accommodating space 300. When the silicon substrate 10 to be coated is placed on the support 200, the silicon substrate 10 to be coated is located in the accommodating space 300. The frame 100 can cover the four sides of the silicon substrate to be coated 10, limit the position of the silicon substrate to be coated 10, so as to prevent the silicon substrate to be coated 10 from sliding relative to the support 200 and falling during the transmission of the coating carrier, thereby ensuring that the position of the silicon substrate to be coated 10 is stable during the coating process.

[0063] The support member 200 is arranged on the inner side of the frame 100, that is, the support member 200 is arranged on the side of the frame 100 facing the accommodating space 300, and the silicon substrate 10 to be coated is placed on the support member 200. The support member 200 can provide supporting force for the silicon substrate 10 to be coated from the bottom of the silicon substrate 10 to be coated, so that the silicon substrate 10 to be coated remains stable during the coating process and prevents the silicon substrate 10 to be coated from falling.

[0064] The support member 200 can also be a square annular body, and the side of the support member 200 facing away from the frame 100 can be enclosed as an avoidance area 400. When the silicon substrate 10 to be coated is placed on the support member 200, a transparent conductive film layer can be coated on the position of the silicon substrate 10 to be coated corresponding to the avoidance area 400 by chemical vapor deposition or sputtering coating.

[0065] The protruding portion 220 is arranged on the support body 210 and extends away from the side of the support body 210 facing away from the frame 100. The support body 210 and the protruding portion 220 can jointly form a platform for placing the silicon substrate 10 to be plated, so as to provide support for the silicon substrate 10 to be plated. The protruding portion 220 can provide additional support for the silicon substrate 10 to be plated, and the width of the support body 210 can be reduced to reduce the mask width while ensuring the support effect of the support 200 on the silicon substrate 10 to be plated.

[0066] The protruding portion 220 can be arranged in multiple numbers and arranged at least on a pair of sides of the silicon substrate 10 to be plated. The protruding portions 220 on each side can be arranged at intervals. At the position of the protruding portion 220, an additional support point can be formed to provide support for the silicon substrate 10 to be plated, so that the position of the silicon substrate 10 to be plated in the accommodating space 300 is stable and not easy to fall off.

[0067] The cross-sectional area of the protruding portion 220 can be gradually reduced in the direction away from the support body 210, so that the area of the protruding portion 220 can be reduced, thereby reducing the shielding area of the protruding portion 220 on the surface of the silicon substrate 10 to be plated, and the area of the transparent conductive layer plated on the surface of the silicon substrate 10 to be plated can be increased.

[0068] Specifically, the plating carrier provided by the embodiment of the present application is arranged with the protruding portion 220 on the support body 210, which helps to reduce the width of the support body 210 to reduce the mask width and increase the plating area of the silicon substrate 10 to be plated. The support body 210 and the protruding portion 220 jointly form a platform for placing the silicon substrate 10 to be plated to provide support for the silicon substrate 10 to be plated. When the width of the support body 210 is reduced, the protruding portion 220 can provide additional support for the silicon substrate 10 to be plated to ensure the support effect of the support 200 on the silicon substrate 10 to be plated.

[0069] The protruding portion 220 can form a protruding isolation area 520 on the silicon substrate 10 to be plated after the deposition process, and the protruding isolation area 520 corresponds to the fishhook position when the grid lines are formed on the silicon substrate 10 to be plated. Since the area of the fishhook position is usually small and the grid lines are not arranged at the fishhook position, the mask of the protruding portion 220 at this position will not affect the formation of the grid lines and will not cause significant loss of the power generation efficiency of the battery piece.

[0070] Therefore, the plating carrier, the plating equipment and the battery piece provided by the embodiment of the present application achieve a balance between increasing the plating area and providing effective support, so that the plating area of the battery piece processed by the plating carrier is increased and the power generation efficiency is increased.

[0071] In some embodiments, the shape of the protruding portion 220 is set as an arc shape in a cross section parallel to the support 200; the protruding portion 220 comprises a first circular arc 221 and a second circular arc 222; the first circular arc 221 is protrudingly arranged towards the support body 210, and the second circular arc 222 is protrudingly arranged towards the support body 210; a first end of the first circular arc 221 is connected with the support body 210, and a second end of the first circular arc 221 extends to the inner side of the support body 210; a first end of the second circular arc 222 is connected with the support body 210, and a second end of the second circular arc 222 extends to the inner side of the support body 210; the second end of the first circular arc 221 and the second end of the second circular arc 222 are connected.

[0072] It can be understood that the plane of the support 200 is parallel to Figure 1 the plane where the X-axis and the Y-axis are located.

[0073] When the length of the protruding portion 220 is constant in the width direction of the frame 100, the shape of the protruding portion 220 is set as an arc shape, and the first circular arc 221 and the second circular arc 222 are both protrudingly arranged towards the support body 210, which can minimize the shielding area of the protruding portion 220 to the to-be-coated silicon substrate 10, and help to increase the area of the to-be-coated silicon substrate 10 for film coating.

[0074] It should be noted that the sizes of the first circular arc 221 and the second circular arc 222 can be designed according to actual needs, and the embodiments of the present application do not make any limitation in this regard.

[0075] In other embodiments, the shape of the protruding portion 220 is set as a triangular shape in a cross section parallel to the support 200.

[0076] It can be understood that when the length of the protruding portion 220 is constant in the width direction of the frame 100, the shape of the protruding portion 220 is set as a triangular shape, which can increase the area of the protruding portion 220 extending to the inner side of the support 200, thereby increasing the support area of the to-be-coated silicon substrate 10 and improving the stability of the to-be-coated silicon substrate 10.

[0077] In other embodiments, the shape of the protruding portion 220 is set as a trapezoidal shape in a cross section parallel to the support 200.

[0078] It can be understood that when the length of the protruding portion 220 is constant in the width direction of the frame 100, the shape of the protruding portion 220 is set as a trapezoidal shape, so that the area of the protruding portion 220 is larger, and the support area of the to-be-coated silicon substrate 10 by the protruding portion 220 is also larger, which helps to improve the stability of the to-be-coated silicon substrate 10 and prevent the to-be-coated silicon substrate 10 from falling off.

[0079] In other embodiments, the shape of the protruding portion 220 can also be other shapes in the plane parallel to the support 200, which can achieve effective support of the to-be-coated silicon substrate 10 without greatly reducing the coating area of the to-be-coated silicon substrate 10, i.e., within the protection scope of the embodiments of the present application.

[0080] In some embodiments, the width dimension of the support body 210 is greater than or equal to 0.35 mm and less than or equal to 0.5 mm.

[0081] It should be noted that the length direction of the frame 100 is parallel to the X direction in the plane parallel to the support 200; and the width direction of the frame 100 is parallel to the Y direction in the plane parallel to the support 200. Figure 1 Figure 1 It should be noted that the length direction of the frame 100 is parallel to the X direction in the plane parallel to the support 200; and the width direction of the frame 100 is parallel to the Y direction in the plane parallel to the support 200.

[0082] In some embodiments, the length direction of the support body 210 is consistent with the length direction or the width direction of the frame 100; the width direction of the support body 210 is perpendicular to the length direction of the support body 210 and is parallel to the plane on which the to-be-coated silicon substrate 10 is placed.

[0083] The width dimension of the support body 210 is the width dimension of the support body 210 along the width direction thereof. The width dimension of the support body 210 is the width dimension of the edge isolation region 510 formed by the support body 210 on the to-be-coated silicon substrate 10.

[0084] When the width of the support body 210 is less than 0.35 mm, the width of the support body 210 in contact with the to-be-coated silicon substrate 10 is too narrow, the contact area is small, and the support body 210 cannot provide effective support force for the to-be-coated silicon substrate 10.

[0085] When the width of the support body 210 is greater than 0.5 mm, the width of the mask is too wide, which will excessively shield the surface of the to-be-coated silicon substrate 10, thereby reducing the coating area of the to-be-coated silicon substrate 10.

[0086] By setting the width of the support body 210 to be greater than or equal to 0.35 mm and less than or equal to 0.5 mm, the support of the to-be-coated silicon substrate 10 can be ensured, and the shielding of the support body 210 to the surface of the to-be-coated silicon substrate 10 can be minimized to increase the area of the transparent conductive layer on the surface of the to-be-coated silicon substrate 10.

[0087] In some embodiments, the maximum dimension of the protruding portion 220 protruding from the support body 210 is greater than 0.05 mm and less than or equal to 0.3 mm.

[0088] It can be understood that the dimension of the protruding portion 220 protruding from the support body 210 is the length of the protruding portion 220 extending away from the support body 210 in the plane parallel to the support 200. ​

[0089] When the length of the protrusion 220 is greater than 0.3 mm, the mask area is large, resulting in a reduced coating area on the silicon substrate 10 to be coated, affecting the conduction efficiency of the heterojunction solar cell circuit. Furthermore, when the length of the protrusion 220 is greater than 0.3 mm, the protrusion 220 makes it difficult for the protruding isolation region 520 formed after the deposition process on the silicon substrate 10 to be coated to align with the harpoon formed during the gate line formation on the silicon substrate 10 to be coated, and may even extend beyond the area where the harpoon is located.

[0090] When the length of the protrusion 220 is less than or equal to 0.05 mm, the supporting area formed by the protrusion 220 is small and cannot provide effective supporting force for the silicon substrate 10 to be coated.

[0091] By setting the length of the protrusion 220 to be greater than 0.05 mm and less than or equal to 0.3 mm, the obstruction of the surface of the silicon substrate 10 to be coated by the protrusion 220 can be reduced as much as possible while ensuring effective support for the silicon substrate 10 to be coated, thereby increasing the area of ​​the transparent conductive layer on the surface of the silicon substrate 10 to be coated.

[0092] Combine Figure 3 As shown, in some embodiments, the frame 100 is enclosed to form a accommodating space 300, which is used to accommodate the silicon substrate 10 to be coated; in a cross section parallel to the support member 200, the difference between the width of the accommodating space 300 and the width of the silicon substrate 10 to be coated is greater than or equal to 0.07 mm and less than or equal to 0.15 mm.

[0093] It can be understood that the width direction of the accommodating space 300 is consistent with the width direction of the frame 100 ; after the silicon substrate 10 to be coated is placed in the accommodating space 300 , the width direction of the silicon substrate 10 to be coated is parallel to the width direction of the frame 100 .

[0094] It should be noted that, during the processing of the silicon substrate 10 to be coated, when the silicon substrate 10 to be coated moves from the previous coating process to the coating process, the moving direction of the coating carrier is aligned with the width direction of the frame 100 ( Figure 1 The transmission speeds of the two processes may be different, so the silicon substrate 10 to be coated is prone to movement in the coating carrier.

[0095] By setting the width of the accommodating space 300 to be larger than the width of the battery cell, a distance for the battery cell to move can be reserved within the accommodating space 300, thereby reducing the possibility of the battery cell hitting the inner wall of the frame 100 and causing damage when moving.

[0096] When the difference between the width of the accommodating space 300 and the width of the battery piece is less than 0.07 mm, the battery piece does not have enough movement distance in the accommodating space 300, and the battery piece may collide with the inner wall of the frame 100 when moving, resulting in damage; when the difference between the width of the accommodating space 300 and the width of the battery piece is greater than 0.15 mm, the movement distance is too large, and the battery piece is prone to falling off.

[0097] By setting the difference between the width of the accommodating space 300 and the width of the battery piece to be greater than or equal to 0.07 mm and less than or equal to 0.15 mm, the battery piece can be prevented from falling off the coated carrier plate while reserving enough movement distance.

[0098] In addition, the protruding part 220 of the coated carrier plate is distributed on at least two sides of the width direction of the frame 100, which can provide effective support for the battery piece when moving, and prevent the battery piece from falling off the coated carrier plate.

[0099] It can be understood that the maximum mask width error caused by the movement of the silicon substrate 10 to be coated in the accommodating space 300 is 0.15 mm, and combined with the maximum mask width 0.5 mm that can be formed by the support body 210, the width of the mask area formed on the silicon substrate 10 to be coated by the coated carrier plate provided in the embodiment is at most 0.65 mm, which is less than the mask width of 0.7 mm in the prior art, and the coated area of the battery piece can be improved.

[0100] In some embodiments, the frame 100 and the support 200 are an integrated structure. By setting the frame 100 and the support 200 as one whole, the connection weak points between components are eliminated, the mechanical strength and stability of the whole are improved. Moreover, the assembly steps and related manufacturing complexity are also reduced, thereby reducing production cost and time, and also reducing potential quality problems caused by assembly errors.

[0101] The second aspect of the embodiment of the application provides a coating equipment, which comprises a coating equipment body and the coating carrier plate provided in any of the above embodiments.

[0102] The coating carrier plate has been described in detail in the above embodiments, and will not be described here again.

[0103] In combination Figures 4 to 8 The third aspect of the embodiment of the application provides a battery piece, which is made of a silicon substrate 10 to be coated by a coating process and by using the coating carrier plate provided in any of the above embodiments. The battery piece has a grid line structure 600, and the edge of the grid line structure 600 has a fishhook.

[0104] The coating carrier plate has been described in detail in the above embodiments, and will not be described here again.

[0105] In combinationFigure 5 and Figure 8 As shown in FIG. 6A and FIG. 6B, in some embodiments, the grid line structure 600 includes edge sub-grid lines 610 and middle sub-grid lines 620, which are arranged at intervals along the width direction of the cell sheet; the edge sub-grid lines 610 are located on one side of the middle sub-grid lines 620 close to the edge isolation region 510; the edge sub-grid lines 610 have a plurality of connection segments 611, and each two adjacent connection segments 611 have an un-penetrated region 700 therebetween, which is used to form a fishing-tackle.

[0106] As shown in FIG. 6A and FIG. 6B, in some embodiments, the grid line structure 600 includes edge sub-grid lines 610 and middle sub-grid lines 620, which are arranged at intervals along the width direction of the cell sheet; the edge sub-grid lines 610 are located on one side of the middle sub-grid lines 620 close to the edge isolation region 510; the edge sub-grid lines 610 have a plurality of connection segments 611, and each two adjacent connection segments 611 have an un-penetrated region 700 therebetween, which is used to form a fishing-tackle.

[0107] As shown in FIG. 6A and FIG. 6B, in some embodiments, the grid line structure 600 includes edge sub-grid lines 610 and middle sub-grid lines 620, which are arranged at intervals along the width direction of the cell sheet; the edge sub-grid lines 610 are located on one side of the middle sub-grid lines 620 close to the edge isolation region 510; the edge sub-grid lines 610 have a plurality of connection segments 611, and each two adjacent connection segments 611 have an un-penetrated region 700 therebetween, which is used to form a fishing-tackle. Figure 5 As shown in FIG. 6A and FIG. 6B, in some embodiments, the grid line structure 600 includes edge sub-grid lines 610 and middle sub-grid lines 620, which are arranged at intervals along the width direction of the cell sheet; the edge sub-grid lines 610 are located on one side of the middle sub-grid lines 620 close to the edge isolation region 510; the edge sub-grid lines 610 have a plurality of connection segments 611, and each two adjacent connection segments 611 have an un-penetrated region 700 therebetween, which is used to form a fishing-tackle.

[0108] As shown in FIG. 6A and FIG. 6B, in some embodiments, the grid line structure 600 includes edge sub-grid lines 610 and middle sub-grid lines 620, which are arranged at intervals along the width direction of the cell sheet; the edge sub-grid lines 610 are located on one side of the middle sub-grid lines 620 close to the edge isolation region 510; the edge sub-grid lines 610 have a plurality of connection segments 611, and each two adjacent connection segments 611 have an un-penetrated region 700 therebetween, which is used to form a fishing-tackle.

[0109] As shown in FIG. 6A and FIG. 6B, in some embodiments, the grid line structure 600 includes edge sub-grid lines 610 and middle sub-grid lines 620, which are arranged at intervals along the width direction of the cell sheet; the edge sub-grid lines 610 are located on one side of the middle sub-grid lines 620 close to the edge isolation region 510; the edge sub-grid lines 610 have a plurality of connection segments 611, and each two adjacent connection segments 611 have an un-penetrated region 700 therebetween, which is used to form a fishing-tackle.

[0110] As shown in FIG. 6A and FIG. 6B, in some embodiments, the grid line structure 600 includes edge sub-grid lines 610 and middle sub-grid lines 620, which are arranged at intervals along the width direction of the cell sheet; the edge sub-grid lines 610 are located on one side of the middle sub-grid lines 620 close to the edge isolation region 510; the edge sub-grid lines 610 have a plurality of connection segments 611, and each two adjacent connection segments 611 have an un-penetrated region 700 therebetween, which is used to form a fishing-tackle. Figure 6 As shown in FIG. 6A and FIG. 6B, in some embodiments, the grid line structure 600 includes edge sub-grid lines 610 and middle sub-grid lines 620, which are arranged at intervals along the width direction of the cell sheet; the edge sub-grid lines 610 are located on one side of the middle sub-grid lines 620 close to the edge isolation region 510; the edge sub-grid lines 610 have a plurality of connection segments 611, and each two adjacent connection segments 611 have an un-penetrated region 700 therebetween, which is used to form a fishing-tackle.

[0111] As shown in FIG. 6A and FIG. 6B, in some embodiments, the grid line structure 600 includes edge sub-grid lines 610 and middle sub-grid lines 620, which are arranged at intervals along the width direction of the cell sheet; the edge sub-grid lines 610 are located on one side of the middle sub-grid lines 620 close to the edge isolation region 510; the edge sub-grid lines 610 have a plurality of connection segments 611, and each two adjacent connection segments 611 have an un-penetrated region 700 therebetween, which is used to form a fishing-tackle.

[0112] As shown in FIG. 6A and FIG. 6B, in some embodiments, the grid line structure 600 includes edge sub-grid lines 610 and middle sub-grid lines 620, which are arranged at intervals along the width direction of the cell sheet; the edge sub-grid lines 610 are located on one side of the middle sub-grid lines 620 close to the edge isolation region 510; the edge sub-grid lines 610 have a plurality of connection segments 611, and each two adjacent connection segments 611 have an un-penetrated region 700 therebetween, which is used to form a fishing-tackle. Figure 7 As shown in FIG. 6A and FIG. 6B, in some embodiments, the grid line structure 600 includes edge sub-grid lines 610 and middle sub-grid lines 620, which are arranged at intervals along the width direction of the cell sheet; the edge sub-grid lines 610 are located on one side of the middle sub-grid lines 620 close to the edge isolation region 510; the edge sub-grid lines 610 have a plurality of connection segments 611, and each two adjacent connection segments 611 have an un-penetrated region 700 therebetween, which is used to form a fishing-tackle.

[0113] For the edge sub-grid line 610 closest to the edge isolation area 510, the end point of the connection segment 611 thereon can intersect with the edge profile of the convex isolation area 520 of the trapezoid.

[0114] In combination Figure 4 As shown, in some embodiments, the surface of the battery piece has a plating area and a non-plating area 500; the grid line structure 600 is located within the plating area; the non-plating area 500 includes a connected edge isolation area 510 and a convex isolation area 520, the convex isolation area 520 is arranged along the length direction of the battery piece; the edge isolation area 510 corresponds to the position of the support body 210 of the plating carrier; the convex isolation area 520 corresponds to the position of the convex part 220 of the plating carrier, and at least part of the convex isolation area 520 extends into the non-penetrating area 700.

[0115] It should be noted that, in order to highlight the position of the fishhook in the grid line structure 600, Figure 4 As shown in the battery piece in the middle, only part of the grid lines near the fishhook are shown. For the area of the battery piece where the grid lines are not shown, the arrangement of the grid lines inside can be designed according to actual needs, and the embodiments of the present application do not make any limitation on this.

[0116] It can be understood that the length direction of the battery piece is parallel to the X direction in Figure 4 ; the width direction of the battery piece is parallel to the Y direction in Figure 4 . When the battery piece is placed in the accommodating space 300 of the plating carrier, the length direction of the battery piece is consistent with the length direction of the frame 100; the width direction of the battery piece is consistent with the width direction of the frame 100.

[0117] After the plating treatment, the part of the battery piece that is not shielded, i.e. the part corresponding to the avoiding area 400 of the battery piece, can form a plating area, and the plating area has a transparent conductive film layer.

[0118] The part of the battery piece shielded by the support 200 and the convex part 220 forms a non-plating area 500.

[0119] Among them, the part of the battery piece shielded by the support 200 forms the edge isolation area 510; the edge isolation area 510 corresponds to the shape and position of the support 200, then in the direction of the line connecting the inside of the battery piece and the outside of the battery piece, the width of the edge isolation area 510 is greater than or equal to 0.35 millimeters, and less than or equal to 0.5 millimeters.

[0120] The part of the battery piece shielded by the convex part 220 forms the convex isolation area 520. The convex isolation area 520 corresponds to the shape and position of the convex part 220, then along the width direction of the battery piece, the length L of the convex isolation area 520 is also greater than 0.05 millimeters, and less than or equal to 0.3 millimeters.

[0121] Therefore, the width of the edge isolation region 510 is reduced, the area of the non-plating region 500 is smaller, and the area of the plating region is larger, which helps to expand the grid line collection area or increase the number of grid lines.

[0122] In combination Figure 8 As shown in the figure, in some embodiments, the grid line structure 600 further comprises a plurality of fishhook-shaped grid lines 630, which are arranged at intervals along the length direction of the cell piece; the fishhook-shaped grid lines 630 are connected to the end of the connection section 611 of the edge auxiliary grid line 610, and the fishhook-shaped grid lines 630 are connected to part of the intermediate auxiliary grid line 620, thereby conducting the edge auxiliary grid line 610 and the intermediate auxiliary grid line 620 through the fishhook-shaped grid lines 630.

[0123] It can be understood that the area of the surface of the silicon substrate 10 to be plated is increased, which helps to expand the grid line collection area or increase the number of grid lines in the subsequent grid line printing process. The edge auxiliary grid line 610 in the grid line structure 600 can be an auxiliary grid line added to expand the grid line collection area.

[0124] The fishhook-shaped grid line can include a first fishhook-shaped grid line 631 and a second fishhook-shaped grid line 632, and the first fishhook-shaped grid line 631 and the second fishhook-shaped grid line 632 separate the edge auxiliary grid line 610 to form a plurality of connection sections 611. The unpenetrated region 700 is located between the first fishhook-shaped grid line 631 and the second fishhook-shaped grid line 632, and the unpenetrated region 700 can provide a space for the convex isolation region 520.

[0125] The fishhook-shaped grid line 630 is connected to the end of the connection section 611 of the edge auxiliary grid line 610, and the fishhook-shaped grid line 630 is connected to part of the intermediate auxiliary grid line 620, thereby conducting the edge auxiliary grid line 610 and the intermediate auxiliary grid line 620 through the fishhook-shaped grid line 630, which can improve the coverage of the grid line structure 600 on the surface of the cell piece, help to optimize the current transmission path, ensure that the current can be quickly and effectively conducted between the auxiliary grid line and the fishhook-shaped grid line 630, reduce the intersection and interference of the current path, and improve the overall performance of the cell piece.

[0126] Finally, it should be noted that other embodiments of the present application will be readily apparent to those skilled in the art upon considering the description set forth herein and the disclosure of the application made in practice. The embodiments of the present application are intended to cover any variations, uses, or adaptations of the embodiments of the present application, which follow the general principles of the embodiments of the present application and include known or customary technical means in the art that are not disclosed by the embodiments of the present application. The specification and embodiments are only considered exemplary, and the true scope and spirit of the embodiments of the present application are indicated by the claims below.

[0127] It should be understood that the embodiments of the present application are not limited to the precise construction that has been described above and shown in the accompanying drawings and that various modifications and changes can be made by those of ordinary skill in the art without departing from the scope of this application. The scope of the application should be limited only by the appended claims.

Claims

1. A coating carrier, comprising a frame (100) and a support member (200), characterized in that: in, The support member (200) is located inside the frame (100) and is suitable for placing a silicon substrate (10) to be coated; the support member (200) comprises a support body (210) and a protruding portion (220) provided inside the support body (210); The support member (200) is reused as a coating mask for the silicon substrate (10) to be coated, the support body (210) is used to form an edge isolation region (510) on the silicon substrate (10) to be coated after the coating process, and the protrusion (220) is used to form a protruding isolation region (520) on the silicon substrate (10) to be coated after the coating process, and the protruding isolation region (520) corresponds to the harpoon of the gate line formed on the silicon substrate (10) to be coated during the coating process.

2. The coating carrier according to claim 1, characterized in that: In a cross section parallel to the support member (200), the shape of the protrusion (220) is set to be one of an arc, a triangle and a trapezoid.

3. The coating carrier according to claim 2, characterized in that: In a cross section parallel to the support member (200), the protrusion (220) includes a first circular arc (221) and a second circular arc (222); The first circular arc (221) is convexly arranged toward the supporting body (210), and the second circular arc (222) is convexly arranged toward the supporting body (210); The first end of the first circular arc (221) is connected to the supporting body (210), and the second end of the first circular arc (221) extends toward the inside of the supporting body (210); The first end of the second circular arc (222) is connected to the supporting body (210), and the second end of the second circular arc (222) extends toward the inside of the supporting body (210); The second end of the first circular arc (221) and the second end of the second circular arc (222) are connected.

4. The coating carrier according to any one of claims 1 to 3, characterized in that: The width of the support body (210) is greater than or equal to 0.35 mm and less than or equal to 0.5 mm; the maximum dimension of the protrusion (220) protruding from the support body (210) is greater than or equal to 0.05 mm and less than or equal to 0.3 mm.

5. The coating carrier according to any one of claims 1 to 3, characterized in that: The frame (100) is enclosed to form an accommodating space (300), and the accommodating space (300) is used to accommodate the silicon substrate (10) to be coated; In a cross section parallel to the support member (200), the difference between the width of the accommodating space (300) and the width of the silicon substrate (10) to be coated is greater than or equal to 0.07 mm and less than or equal to 0.15 mm.

6. A coating device, characterized in that: It comprises a coating equipment body and a coating carrier as described in any one of claims 1 to 5.

7. A battery cell, characterized in that: The cell is made of a silicon substrate (10) to be coated through a coating process and using a coating carrier according to any one of claims 1 to 6. The cell has a grid line structure (600), and the edge of the grid line structure (600) has a harpoon.

8. The battery cell according to claim 7, characterized in that: The grid line structure (600) comprises edge secondary grid lines (610) and middle secondary grid lines (620), and the edge secondary grid lines (610) and the middle secondary grid lines (620) are arranged at intervals along the width direction of the battery cell; The edge auxiliary gate line (610) is located on a side of the middle auxiliary gate line (620) close to the edge isolation region (510); The edge secondary grid line (610) has a plurality of connection segments (611), and a non-through region (700) is provided between two adjacent connection segments (611), and the non-through region (700) is reused to form the harpoon.

9. The battery cell according to claim 8, characterized in that: The surface of the cell has a coating area and a non-coating area (500); The gate line structure (600) is located in the coating area; The non-coating area (500) includes a connected edge isolation area (510) and a protruding isolation area (520), and the protruding isolation areas (520) are arranged at intervals along the length direction of the battery cell; The edge isolation area (510) corresponds to the position of the supporting body (210) of the coating carrier; the protruding isolation area (520) corresponds to the position of the protruding portion (220) of the coating carrier, and at least a portion of the protruding isolation area (520) extends into the non-penetrating area (700).

10. The battery cell according to claim 9, characterized in that: The edge of the grid line structure (600) has a plurality of harpoon-shaped grid lines (630), and the plurality of harpoon-shaped grid lines (630) are arranged at intervals along the length direction of the battery cell; The harpoon-shaped grid line (630) is connected to the end of the connecting section (611) of the edge auxiliary grid line (610), and the harpoon-shaped grid line (630) is connected to part of the middle auxiliary grid line (620), and the edge auxiliary grid line (610) and the middle auxiliary grid line (620) are conductively connected through the harpoon-shaped grid line (630).

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