Ball mounting device of semiconductor packaging equipment

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to a ball mounting device of semiconductor packaging equipment, which comprises a base, an adjusting mechanism is arranged on the base, and a material taking and placing mechanism is arranged on one side of the adjusting mechanism. A ball mounting mechanism and a screening mechanism are arranged on the two sides of the adjusting mechanism correspondingly, and the ball mounting mechanism and the screening mechanism are both arranged on the base. Through driving of a half-circle rotating motor in the adjusting mechanism, the whole material taking and placing mechanism can rotate forwards and backwards by 180 degrees, the reciprocating circulation link from material taking to material placing and then returning to material taking can be carried out, a plurality of suction nozzle mechanisms on the material taking and placing mechanism can suck a plurality of solder balls at fixed points at the same time, the solder balls are arranged in advance, and therefore the material taking and placing efficiency is improved. After the chip body is placed in the chip seat, the solder balls can be placed through the suction nozzle to carry out ball mounting work, so that the chip mounting structure is simple, rapid and good in integrity.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor packaging technical field, specifically disclose a kind of ball mounting device of semiconductor packaging equipment. BACKGROUND

[0002] In the semiconductor packaging process, solder balls play a crucial role, especially in flip-chip packaging technology, solder balls are used to establish reliable electrical connections between semiconductor chips and substrates or circuit boards. Through solder balls, the chip's input / output (I / O) pins can be connected to the corresponding pads on the substrate or circuit board, enabling signal and power transmission.

[0003] Solder balls not only provide electrical connections, but also serve as mechanical support, fixing the chip on the substrate or circuit board, ensuring stable physical connections when the chip is subjected to mechanical vibrations, thermal stress, and other environmental influences. Solder balls also help conduct heat, transferring the heat generated during chip operation from the chip to the substrate or circuit board, and then dissipating into the environment, helping the chip maintain a reasonable temperature range and preventing overheating from causing performance degradation or failure.

[0004] As disclosed in the utility model with the authorization announcement number CN207925457U, a kind of semiconductor package of multiple solder joint continuous welding belongs to semiconductor integrated circuit packaging field, to solve the problem that semiconductor package is deformed after multiple solder joint connection planting ball stacking welding. The device includes a lead frame, a chip, and a packaging glue. The lead frame and the chip are wrapped with the packaging glue. The lead frame includes a chip seat and a pin. The chip seat is connected to the chip by a bonding material. The chip has solder joints. The solder joints are connected by a first solder line. A solder joint near the pin is connected to the pin by a second solder line. The utility model removes the traditional ball planting and welding in the ball planting process. There is no special requirement for the size of the solder joint. A continuous solder line is used to complete the welding in one step. The device is easy to debug, has good quality, and is efficient. A solder line is used to continuously weld multiple solder joints. The solder line is an arc, improving product reliability. The utility model has a simple structure, is easy to operate, is safe and reliable, and has high production efficiency. During the ball planting process of the semiconductor, the solder balls are placed on the semiconductor and are welded and fixed by a welding robot. However, during the process of placing solder balls on the semiconductor, a mechanical hand cooperates with a suction cup structure to place the solder balls on the semiconductor one by one. However, this placement process is inefficient, and the size of the solder balls may vary during batch manufacturing. If not screened, this may easily lead to poor contact during the later semiconductor packaging process. UTILITY MODEL CONTENTS

[0005] Therefore, the ball mounting device of the semiconductor packaging equipment is provided to solve the problems of low efficiency of placing the solder balls one by one by the mechanical hand and the problem of needing to be screened due to different specifications of the solder balls.

[0006] To achieve the above object, the utility model provides the following technical scheme: a ball mounting device of semiconductor packaging equipment, including base, be provided with adjusting mechanism on the base, one side of adjusting mechanism is provided with taking and placing mechanism,

[0007] The ball mounting mechanism and the screening mechanism are arranged on the two sides of the adjusting mechanism, and both the ball mounting mechanism and the screening mechanism are arranged on the base.

[0008] Further, the adjusting mechanism comprises a half-turn motor, a half-turn rotating shaft is arranged in the half-turn motor for driving, a turntable is fixedly installed at the end of the half-turn rotating shaft, a support column is fixedly installed at the upper end of the turntable, and a top plate is fixedly installed at the upper end of the support column.

[0009] A support plate is fixedly installed at one side of the support column, bearings are fixedly penetrated through the surface of the top plate and the surface of the support plate, the same shaft is penetrated through the inside of the two bearings distributed in the up and down directions, and the surface of the shaft is arranged in interference fit with the inner ring wall of the bearing.

[0010] Further, a plurality of supporting legs are fixedly installed at the lower end of the turntable, ball seats are fixedly installed at the lower end of the supporting legs, and rolling balls are arranged in rolling mode in the inside of the ball seats.

[0011] Further, external threads are arranged on the surface of the shaft, a threaded sleeve is threadedly connected to the surface of the external threads, a limiting block is fixedly installed on the outer wall of the threaded sleeve, a limiting groove is formed at one side of the support column, and the limiting block is arranged in sliding mode with the limiting groove.

[0012] Further, a lifting motor is arranged at the upper end of the top plate, a lifting rotating shaft is arranged in the inside of the lifting motor for driving, and the end of the lifting rotating shaft is fixedly connected with the upper end of the shaft through a shaft coupling.

[0013] A connecting plate is fixedly sleeved on the surface of the threaded sleeve, the upper and lower ends of the connecting plate are further fixedly connected with the outer ring wall of the threaded sleeve through reinforcing ribs, a lifting cylinder is penetrated through the surface of the connecting plate, and a lifting piston rod is arranged in the inside of the lifting cylinder.

[0014] Further, the taking and placing mechanism comprises a mounting plate, the mounting plate is fixedly installed with the lifting piston rod of the lifting cylinder, a suction concentrated interface is penetrated through the surface of the mounting plate, a bifurcated interface is arranged at the lower end of the suction concentrated interface, a suction interface is arranged at the upper end of the suction concentrated interface, a gas pump is further fixedly installed at the upper end of the mounting plate, and the gas inlet of the gas pump is flange-connected with the suction interface through a pipeline.

[0015] The lower end of the mounting plate is provided with a positioning seat, one side of the positioning seat is fixed with a suction cup seat, a plurality of suction nozzles are penetrated through the surface of the suction cup seat, and the upper end of the suction nozzle is connected with the corresponding bifurcated interface flange through a pipeline.

[0016] Further, the ball mounting mechanism comprises a ball mounting table, a chip seat is fixed in the middle position of the upper end of the ball mounting table through a support, a chip body is placed in the groove of the chip seat, a jacking cylinder is fixed in the middle position of the ball mounting table, and a jacking piston rod is arranged in the jacking cylinder.

[0017] A built-in sleeve is arranged in the center position of the chip seat, the jacking piston rod is arranged in sliding sleeve connection with the built-in sleeve, and a top disc is arranged in the chip seat.

[0018] Further, guide rail pairs are arranged on the two sides of the ball mounting table respectively, anti-dropping blocks are fixed at the two ends of the guide rail pairs respectively, guide rail pairs are arranged in sliding connection with the guide rail pairs, moving plates are fixed at the upper ends of the two guide rail pairs through supports, and a camera is arranged in the middle position of the moving plate in penetrating mode.

[0019] Further, the screening mechanism comprises a screening table, and a screening plate is fixed at the upper end of the screening table through a support.

[0020] A fence is arranged at the upper end of the screening plate, a ramp is fixed at one side of the fence, and a grid rod is fixed at the outlet position of the lower end of the ramp.

[0021] The working principle and beneficial effects of the scheme are as follows: 1. The whole taking and placing mechanism can be rotated by 180 degrees in the positive and negative directions through the driving of the half-circle rotating motor in the adjusting mechanism, so that the reciprocating cycle of taking to placing and then returning to taking can be realized, and the multiple suction nozzle mechanisms on the taking and placing mechanism can simultaneously adsorb multiple solder balls for pre-arrangement, and after the chip body is placed in the chip seat, the solder balls can be placed through the suction nozzles to realize the ball mounting work, which is simple, fast and good in integrity.

[0022] 2. As described in 1, the lifting motor can drive the shaft rod to rotate, realize the movement of the threaded sleeve, and realize the stable up-down movement of the connecting plate through the sliding of the limiting block in the limiting groove.

[0023] 3. The number and arrangement of the screening holes are the same as the number and arrangement of the suction nozzles, so that after screening, the solder balls can be sucked as a whole to improve the efficiency, and the grid formed by the grid rods can block the larger solder balls, and the smaller solder balls can directly fall into the collecting box for collection.

[0024] Other advantages, objects, and features of the present application will be apparent to those skilled in the art from the following description, and it is intended to cover what is claimed hereinafter by the principles and features of the present application. The objects and other advantages of the present application will be realized and attained by the structure particularly pointed out in the following description. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a schematic diagram of the embodiment as a whole;

[0026] Figure 2 It is a schematic diagram of the distribution of each mechanism of the ball planting device of the embodiment;

[0027] Figure 3 It is an enlarged schematic diagram of A of the embodiment;

[0028] Figure 4 It is a partial enlarged schematic diagram of the material taking and placing mechanism of the embodiment;

[0029] Figure 5 It is a partial enlarged schematic diagram of the ball planting mechanism of the embodiment;

[0030] Figure 6 It is a partial enlarged schematic diagram of the screening mechanism of the embodiment.

[0031] In the drawings, the following marks are used: 1, base; 2, adjusting mechanism; 3, material taking and placing mechanism; 4, ball planting mechanism; 5, screening mechanism; 20, half-circle rotating motor; 21, rotating disc; 22, support column; 23, top plate; 24, support plate; 25, bearing; 26, shaft rod; 27, lifting motor; 28, lifting air cylinder; 29, connecting plate; 211, support leg; 212, ball seat; 213, rolling ball; 261, external thread; 262, threaded sleeve; 263, limiting block; 264, limiting groove; 30, mounting plate; 31, air suction centralized interface; 32, air pump; 33, positioning seat; 34, suction disc seat; 35, suction nozzle; 40, ball planting table; 41, jacking air cylinder; 42, chip seat; 43, chip body; 44, built-in sleeve; 45, top disc; 401, guide rail pair sliding rail; 402, guide rail pair sliding block; 403, anti-dropping block; 404, moving plate; 405, camera; 50, screening table; 51, screening plate; 52, fence; 53, ramp; 54, grid rod; 55, collecting box; 56, screening hole. DETAILED DESCRIPTION

[0032] The following is further described in detail through specific implementation methods:

[0033] Example

[0034] like Figures 1 to 6 As shown, a ball planting device for semiconductor packaging equipment is disclosed, comprising a base 1, an adjustment mechanism 2 is provided on the base 1, a material taking and placing mechanism 3 is provided on one side of the adjustment mechanism 2, and a ball planting mechanism 4 and a screening mechanism 5 are provided on both sides of the adjustment mechanism 2, and both the ball planting mechanism 4 and the screening mechanism 5 are provided on the base 1;

[0035] The adjusting mechanism 2 includes a half-turn rotating motor 20. The outer wall surface of the half-turn rotating motor 20 is fixedly assembled with the upper surface of the base 1 through a bracket. The half-turn rotating motor 20 is a servo motor and can rotate back and forth 180 degrees, so that the picking and unloading mechanism 3 can work alternately between the ball planting mechanism 4 and the screening mechanism 5. The screening mechanism 5 screens out suitable solder balls, and the solder balls and the semiconductors on the ball planting mechanism 4 are stably placed and implanted through the picking and unloading mechanism 3. The servo motor has a built-in position feedback system, which can accurately control the rotation angle through a control signal (such as a PWM signal). Through programming control, a command is sent to make the servo motor rotate 180 degrees forward, and then an opposite command is sent to make the motor reverse 180 degrees. It is very suitable for high-precision working environments such as semiconductors. A half-turn rotating shaft for driving is provided inside the half-turn rotating motor 20. The upper end of the half-turn rotating shaft extends outward through the half-turn rotating motor 20. A turntable 21 is fixedly installed on the end of the half-turn rotating shaft. A pillar 22 is fixed on the upper end of the turntable 21, and a top plate 23 is fixed on the upper end of the pillar 22.

[0036] A plurality of legs 211 are fixed to the lower end of the turntable 21. The legs 211 are arranged in a ring along the bottom of the turntable 21. A ball seat 212 is fixed to the lower end of the leg 211. A rolling ball 213 is arranged inside the ball seat 212. The ball seat 212 covers two-thirds of the rolling ball 213. The rolling ball 213 is a solid stainless steel ball. The rolling ball 213 can be used as a roller structure. When the adjustment mechanism 2 rotates, it can cooperate with the legs 211 to form an auxiliary rotation support effect.

[0037] A support plate 24 is fixed to one side of the pillar 22. Bearings 25 are fixedly passed through the surfaces of the top plate 23 and the support plate 24. The top plate 23 and the support plate 24 are respectively fixed to the corresponding bearings 25 by screws. The two upper and lower bearings 25 are both penetrated by the same shaft rod 26. The surface of the shaft rod 26 is set with an interference fit with the inner ring wall of the bearing 25.

[0038] The surface of the shaft rod 26 is provided with an external thread 261, the surface thread of the external thread 261 is butt jointed with a threaded sleeve 262, the outer wall of the threaded sleeve 262 is fixedly provided with a limiting block 263, one side of the support column 22 is provided with a limiting groove 264, and the limiting block 263 and the limiting groove 264 are slidably arranged;

[0039] The upper end of the top plate 23 is provided with a lifting motor 27, the inside of the lifting motor 27 is provided with a lifting rotating shaft for driving, the end of the lifting rotating shaft is fixed with the upper end of the shaft rod 26 through a shaft coupling, the lifting motor 27 is externally connected with a forward and reverse switch through a wire, the forward and reverse switch can drive the lifting motor 27 to rotate forward and reverse, the lifting motor 27 can drive the shaft rod 26 to link, so that the external thread 261 rotates, the threaded sleeve 262 moves, and the limiting block 263 slides in the inside of the limiting groove 264, so that the stable up-down movement of the connecting plate 29 can be realized.

[0040] The surface of the threaded sleeve 262 is fixedly sleeved with the connecting plate 29, the upper and lower ends of the connecting plate 29 are further fixedly connected with the outer ring wall of the threaded sleeve 262 through reinforcing ribs, the surface of the connecting plate 29 is penetratedly provided with a lifting air cylinder 28, the inside of the lifting air cylinder 28 is provided with a lifting piston rod, the lifting piston rod of the lifting air cylinder 28 can drive the suction nozzle 35 to move up and down, and the solder ball can be adsorbed from the position of the screening mechanism 5 and then placed on the chip body 43.

[0041] The taking and placing mechanism 3 comprises a mounting plate 30, the mounting plate 30 is fixedly installed with the lifting piston rod of the lifting air cylinder 28, the surface of the mounting plate 30 is penetratedly provided with a suction concentrated interface 31, the suction concentrated interface 31 is fixedly assembled with the connecting position of the mounting plate 30 through screws, the lower end of the suction concentrated interface 31 is provided with a bifurcated interface, the upper end of the suction concentrated interface 31 is provided with a suction interface, and the upper end of the mounting plate 30 is further fixedly provided with an air pump 32; the air inlet of the air pump 32 is flange-connected with the suction interface through a pipeline, and the air pump 32 can stably suck air, so that the suction nozzle 35 can stably adsorb the solder ball.

[0042] The lower end of the mounting plate 30 is provided with a positioning seat 33, the positioning seat 33 is fixedly assembled with the surface of the mounting plate 30 through a support, one side of the positioning seat 33 is fixedly provided with a suction disc seat 34, the surface of the suction disc seat 34 is penetratedly provided with a plurality of suction nozzles 35, the suction nozzles 35 are fixedly connected with the connecting position of the suction disc seat 34 through resin glue, and the upper end of the suction nozzle 35 is flange-connected with the corresponding bifurcated interface through a pipeline.

[0043] The ball mounting mechanism 4 comprises a ball mounting table 40, the lower end of the ball mounting table 40 is fixedly assembled with the upper end of the base 1 through screws, the upper end of the ball mounting table 40 is fixedly provided with a chip seat 42 in the middle position through a support, the chip body 43 is placed in the groove of the chip seat 42, the middle position of the ball mounting table 40 is fixedly provided with a jacking cylinder 41, the inside of the jacking cylinder 41 is provided with a jacking piston rod, the center position of the chip seat 42 is provided with an embedded sleeve 44, the embedded sleeve 44 is fixedly connected with the connecting position of the chip seat 42 through screws, the jacking piston rod is slidably connected with the embedded sleeve 44, the inside of the chip seat 42 is provided with a top disc 45, the top disc 45 is attached with the lower end of the chip body 43, the top disc 45 is made of rubber material, the top disc 45 is fixedly connected with the upper end of the jacking piston rod through screws, through the jacking effect of the jacking cylinder 41, the chip body 43 can be integrally ejected and taken after ball mounting, which is convenient for the recycling operation of workers;

[0044] The two sides of the ball mounting table 40 are respectively provided with guide rail pairs of slide rails 401, the two ends of the guide rail pairs of slide rails 401 are respectively fixedly provided with anti-dropping blocks 403, the upper end of the guide rail pairs of slide rails 401 is slidably provided with guide rail pairs of slide blocks 402, the upper end of the two guide rail pairs of slide blocks 402 is fixedly provided with a moving plate 404 through a support, the middle position of the moving plate 404 is provided with a camera 405, the camera 405 mainly performs visual imaging shooting after ball mounting, an advanced visual detection system is used for checking the position of the solder ball before placement and the quality of the solder ball after placement, so as to ensure that the position of each solder ball is accurate and meets the quality standard;

[0045] The guide rail pair is a commonly used mechanical transmission element, which is used for realizing linear motion or rotary motion, and is usually composed of two parts: guide rail and slide block (or guide rail seat and sliding unit). The main function of the guide rail pair is to provide guidance and support, so that the moving part can move smoothly and accurately along the predetermined track.

[0046] The screening mechanism 5 comprises a screening table 50, the lower end of the screening table 50 is fixedly assembled with the upper end of the base 1 through screws, the upper end of the screening table 50 is fixedly provided with a screening plate 51 through a support, the screening plate 51 is provided with screening holes 56, the number and arrangement of the screening holes 56 are the same as those of the suction nozzles 35, so that the solder balls can be integrally sucked away after screening, and the ball mounting work can be performed, thereby improving the efficiency, the upper end of the screening plate 51 is provided with an enclosure 52, one side of the enclosure 52 is fixedly provided with a ramp 53, the ramp 53 is convenient for workers to put the solder balls from one side, so that the solder balls can roll and fall into the screening holes 56 for cooperation, the lower end outlet position of the ramp 53 is fixedly provided with a grating rod 54, the grating formed by the grating rod 54 can block the solder balls with relatively large sizes, the lower side of the screening plate 51 is provided with a collection box 55, the solder balls with relatively small sizes will directly fall into the collection box 55 for collection after passing through the screening holes 56.

[0047] In specific implementation

[0048] When the ball implantation on the chip body 43 is needed, the chip body 43 is first placed in the chip seat 42, then the worker can release a batch of solder balls to be implanted through the ramp 53, and then make it slide onto the screening plate 51. The grid formed by the grid rod 54 can block the larger solder balls, and the smaller solder balls will directly fall into the collection box 55 for collection when passing through the screening hole 56. Then, the corresponding number of solder balls of the screening hole 56 are erected in the screening hole 56, waiting for the adsorption and transfer of the suction nozzle 35.

[0049] Through the driving of the half-turn motor 20, the rotating shaft can drive the rotating disc 21 to rotate, thereby driving the support column 22 to link, and finally driving the taking and placing mechanism 3 to rotate 180 degrees from the current ball implantation mechanism 4 position to the screening mechanism 5 position. In the process of rotating the rotating disc 21, the support column 211 can be supported by the rolling of the rolling ball 213, which can reduce the friction resistance and ensure the support quality. The shaft rod 26 is linked by the lifting motor 27, so that the external thread 261 rotates to realize the movement of the threaded sleeve 262. The stable up and down movement of the adapter plate 29 is realized by the sliding of the limiting block 263 in the limiting groove 264. The mounting plate 30 is moved up and down by the lifting cylinder 28 on the adapter plate 29, so that the taking and placing mechanism 3 can realize two-stage adjustment, improve the displacement adjustment stability of the taking and placing process, and make the suction nozzle 35 contact and adsorb the solder balls distributed on the screening mechanism 5 one by one. The suction effect of the air pump 32 ensures the stability of the suction force. The suction path is branched by the suction concentrated interface 31, which plays a transitional effect.

[0050] Then, the suction nozzle 35 is reset to the ball implantation mechanism 4 position by the half-turn motor 20, and then the solder balls are placed on the chip body 43 by the taking and placing mechanism 3, completing the ball implantation work. The camera 405 for visual shooting is moved to the chip body 43 by the sliding of the guide rail pair block 402 on the guide rail pair slide 401, and the ball implantation situation is detected. After the detection is completed, the solder ball is fixed with the chip body 43 by the external welding manipulator. When taking the material, the chip body 43 is lifted out of the chip seat 42 by the lifting piston rod of the lifting cylinder 41.

[0051] The above only is the embodiment of the present application, and the well-known specific structure and characteristics and other common knowledge in the scheme are not described in detail here. It should be pointed out that for those skilled in the art, without departing from the structure of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application, and these will not affect the effect and practicability of the present application.

Claims

1. A ball implantation device for semiconductor packaging equipment, characterized in that: The device comprises a base, an adjustment mechanism is provided on the base, a material taking and releasing mechanism is provided on one side of the adjustment mechanism; a ball planting mechanism and a screening mechanism are provided on both sides of the adjustment mechanism, and both the ball planting mechanism and the screening mechanism are provided on the base; The adjustment mechanism includes a half-turn rotating motor, a half-turn rotating shaft for driving is provided inside the half-turn rotating motor, a turntable is fixedly mounted on the end of the half-turn rotating shaft, a support is fixed on the upper end of the turntable, and a top plate is fixed on the upper end of the support; A support plate is fixed on one side of the pillar, and bearings are fixedly passed through the surfaces of the top plate and the support plate. The same shaft rod is passed through the two bearings distributed above and below, and the surface of the shaft rod is interference-fitted with the inner ring wall of the bearing. The material taking and unloading mechanism includes a mounting plate, a surface of the mounting plate is provided with a concentrated air extraction interface, a lower end of the concentrated air extraction interface is provided with a bifurcated interface, an upper end of the concentrated air extraction interface is provided with an air extraction interface, an air pump is also fixed to the upper end of the mounting plate, and the air inlet of the air pump is connected to the air extraction interface flange through a pipeline; A positioning seat is provided at the lower end of the mounting plate, a suction cup seat is fixed to one side of the positioning seat, a plurality of suction nozzles are passed through the surface of the suction cup seat, and the upper ends of the suction nozzles are connected to the corresponding bifurcated interface flanges through pipes; The ball planting mechanism includes a ball planting table, a chip seat is fixed to the middle position of the upper end of the ball planting table through a bracket, a chip body is placed in the groove of the chip seat, a lifting cylinder is fixed to the middle position of the ball planting table, and a lifting piston rod is provided inside the lifting cylinder; A built-in sleeve is provided through the center of the chip seat, the lifting piston rod is slidably connected with the built-in sleeve, and a top plate is provided inside the chip seat, which fits the lower end of the chip body; The screening mechanism comprises a screening platform, the upper end of which is fixed with a screening plate via a bracket, and the screening plate is provided with screening holes; The upper end of the screening plate is provided with a fence, a ramp is fixed on one side of the fence, and a grid rod is fixed at the lower end exit position of the ramp; a plurality of legs are fixed at the lower end of the turntable, a ball seat is fixed at the lower end of the legs, and a rolling ball is set inside the ball seat; The surface of the shaft is provided with an external thread, the surface of the external thread is threadedly connected with a threaded sleeve, the outer wall of the threaded sleeve is fixed with a limit block, a limit groove is provided on one side of the pillar, and the limit block is slidably arranged with the limit groove; The upper end of the top plate is provided with a lifting motor, the interior of the lifting motor is provided with a lifting shaft for driving, and the end of the lifting shaft is fixed to the upper end of the shaft by a coupling; The surface of the threaded sleeve is fixedly connected with a connecting plate, and the upper and lower ends of the connecting plate are reinforced and connected to the outer ring wall of the threaded sleeve through reinforcing ribs. A lifting cylinder is provided through the surface of the connecting plate, and a lifting piston rod is provided inside the lifting cylinder. The mounting plate is fixedly installed with the lifting piston rod of the lifting cylinder.

2. The ball implantation device for semiconductor packaging equipment according to claim 1, wherein: Guide rail auxiliary slides are respectively provided on both sides of the ball planting table, and anti-slip blocks are respectively fixed at both ends of the guide rail auxiliary slides. A guide rail auxiliary slider is slidingly provided on the upper end of the guide rail auxiliary slides. The upper ends of the two guide rail auxiliary sliders are fixed with a movable plate through a bracket, and a camera is set through the middle position of the movable plate.

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