Silicon wafer cleaning machine for semiconductor silicon epitaxial wafer production

Abstract

The utility model relates to the technical field of semiconductor silicon epitaxial wafers, in particular to a silicon wafer cleaning machine for semiconductor silicon epitaxial wafer production, which comprises a shell, one side of the shell is in threaded connection with a valve, one side of the valve is inserted with a water outlet pipe, a second magnetic sheet is embedded above the shell, the upper part of the shell is hinged with a cover plate, and the upper part of the cover plate is connected with a water inlet pipe. A first magnetic piece is embedded in the upper portion of the cover plate, a water tank is installed on one side of the shell through screws, a water suction pump is installed on the rear portion of the water tank through screws, a connecting plate and a filter box are arranged in the shell, and the filter box is arranged below the connecting plate; a sliding rod is attached to an internal hole groove of the connecting plate, the improved cleaning machine is internally provided with a stirring assembly and a cleaning spray head, an internal filter box can be cleaned up, a swing mechanism is arranged outside the filter box, internal parts can be mixed, the situation that only one face can be cleaned during cleaning is avoided, and the cleaning uniformity is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor silicon epitaxial wafer, specifically to a silicon wafer cleaning machine for semiconductor silicon epitaxial wafer production. BACKGROUND

[0002] Epitaxy is a kind of semiconductor process, in which the bottom layer of the silicon wafer is P-type substrate silicon, then a layer of single crystal silicon is grown on the substrate, which is called epitaxial layer; later, base region, emitter region and the like are injected on the epitaxial layer, and finally a vertical NPN tube structure is basically formed, in which the epitaxial layer is the collector region, and the epitaxial layer has the base region and the emitter region; the epitaxial wafer is a silicon wafer with an epitaxial layer on the substrate. Since some factories only produce processes after epitaxy, they buy epitaxial wafers with epitaxy process from others to continue the subsequent processes.

[0003] The inventor found the following problems in the prior art during the implementation of the utility model: 1. The fixed water spraying head and cleaning assembly cannot ensure that each part of the silicon epitaxial wafer is fully cleaned, for example, the flow and stirring intensity of the cleaning liquid is relatively weak in the edge and corner areas of the silicon epitaxial wafer, which is easy to leave impurities and particles, affecting the quality of the epitaxial wafer. Since the position of the cleaning and stirring assembly is fixed, scratches may occur between the silicon epitaxial wafer and the assembly due to the relative fixed contact or friction during the long cleaning process. Even a small scratch can damage the crystal lattice structure on the surface of the epitaxial wafer, increase the surface roughness, and thus affect the electrical performance and yield of the semiconductor device; 2. The relative movement between the epitaxial wafer placed stably and the cleaning liquid is weak. For some stubborn stains attached to the surface of the silicon epitaxial wafer, it is difficult to generate enough mechanical force to remove them by relying on the natural flow and soaking of the cleaning liquid, which leads to local pollution on the surface of the epitaxial wafer, and thus affects the performance and reliability of the subsequent semiconductor device. When the washing liquid flows in the filter box, it flows unevenly, resulting in different cleaning intensity and washing degree of the silicon epitaxial wafer in different parts, for example, the epitaxial wafer area close to the inlet of the cleaning liquid may be subjected to strong water flow impact, and the cleaning is thorough, while the area far from the inlet is not fully cleaned due to the weakening of the water flow, leaving impurities and affecting the overall quality of the epitaxial wafer. SUMMARY

[0004] The utility model discloses a semiconductor silicon epitaxial wafer production is with silicon wafer cleaning machine to solve the fixed water jet head and cleaning assembly of above -mentioned background art, it is difficult to ensure that every part of silicon epitaxial wafer can be fully cleaned to the problem. To realize above -mentioned purpose, the utility model provides the following technical scheme: a semiconductor silicon epitaxial wafer production is with silicon wafer cleaning machine, including the side of shell is connected with valve through screw thread, the side of valve is inserted with water outlet pipe, the top of shell inserts with second magnetic attraction piece, the top of shell is hinged with cover plate, the top of cover plate inserts with first magnetic attraction piece, the side of shell is installed with water tank through screw, the rear of water tank is installed with water pump through screw, the inside of shell is equipped with connecting plate and filter box respectively, the lower side of connecting plate is equipped with filter box;

[0005] The inside hole groove of connecting plate is attached with slide rod, and the inside hole groove of connecting plate is screw connected with threaded lead screw, the lower side of connecting plate is installed with the shell of first motor through screw, the lower side output shaft of first motor is installed with stirring shaft through screw, the outer wall of stirring shaft is bonded with silica gel cleaning piece, the upper side of connecting plate is installed with water collecting box through screw, and the lower side of water collecting box is screw connected with spray head.

[0006] The side of filter box is rotatably connected with rotating shaft, the side of rotating shaft is inserted with second incomplete gear, the lower side of second incomplete gear is engaged with first incomplete gear, the middle part of one side of first incomplete gear is inserted with the output shaft of second motor, the other side of filter box is installed with sliding block through screw, and the outer wall of sliding block is attached with sliding groove.

[0007] Further preferably, the stirring shaft forms a rotating structure through the first motor, and the outer wall of the stirring shaft is vertically and uniformly distributed with a plurality of silica gel cleaning pieces.

[0008] Further preferably, the inside of the connecting plate is horizontally distributed with a slide rod and a threaded lead screw.

[0009] Further preferably, the front and rear of the water collecting box are horizontally distributed with two rows of spray heads.

[0010] Further preferably, one side of the threaded lead screw forms a rotating structure through the third motor, and the connecting plate forms a horizontal sliding structure through the threaded lead screw and the slide rod.

[0011] Further preferably, the first incomplete gear forms a rotating structure through the second motor, and the second incomplete gear forms a rotating structure through the first incomplete gear, and the filter box forms a rotating structure through the rotating shaft.

[0012] Further preferably, the external structure size of the sliding block is consistent with the internal structure size of the sliding groove.

[0013] Compared with the prior art, the utility model has the advantages of

[0014] In the utility model, the movable connecting plate, the spray head connected therewith, the stirring shaft and the silica gel cleaning piece realize all -round and uniform flushing and rotating brushing of the semiconductor silicon epitaxial wafer in the filter box, the threaded rod rotates under the driving of the third motor, the threaded connection is formed with the nut in the connecting plate, the connecting plate can move horizontally along the axis, so that the spray head and the silica gel cleaning piece move in the horizontal direction, ensure that the cleaning liquid can cover each part of the silicon epitaxial wafer, avoid the problem of insufficient cleaning of the edge and corner area caused by the traditional fixed water spray head and cleaning assembly, greatly improve the uniformity of cleaning, effectively reduce the residue of impurities and particles, and improve the overall quality of the epitaxial wafer.

[0015] In the utility model, the second motor drives the first incomplete gear to rotate, and then drives the second incomplete gear meshing therewith to swing back and forth, so that the filter box penetrating in the shell can rotate, and the slide rod on the other side of the filter box is connected inside the slide groove installed on the inner wall of the shell, ensuring the stable rotation of the filter box, and the relative motion between the silicon epitaxial wafer and the cleaning liquid is further enhanced, so that the cleaning liquid can flush each surface of the epitaxial wafer more fully, thereby further improving the uniformity and completeness of cleaning, solving the problem of different cleaning effects of different parts caused by uneven flow of cleaning liquid, and cleaning the semiconductor silicon epitaxial wafer with the silica gel cleaning piece of soft material, which can effectively remove impurities while greatly reducing the damage to the surface of the epitaxial wafer during cleaning, and the traditional fixed cleaning and stirring assembly is different from the scratches caused by relative fixed contact or friction, the soft material of the silica gel cleaning piece can adaptively adjust the contact force and angle according to the surface shape and profile of the epitaxial wafer when contacting the epitaxial wafer, avoiding the damage of the epitaxial wafer surface lattice structure and scratches caused by rigid contact, effectively protecting the surface quality of the epitaxial wafer, and ensuring that the electrical performance and yield are not affected. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is the top view structure schematic drawing of the utility model;

[0017] Figure 2 It is the front view structure schematic drawing of the utility model;

[0018] Figure 3 It is the connecting plate below structure schematic drawing of the utility model;

[0019] Figure 4 It is the filter box one side structure schematic drawing of the utility model;

[0020] Figure 5 It is the filter box other side explosion structure schematic drawing of the utility model.

[0021] Fig. 1, housing; 2, connecting plate; 201, threaded screw rod; 202, spray head; 203, water collecting box; 204, sliding rod; 205, first motor; 206, stirring shaft; 207, silica gel cleaning piece; 3, filter box; 301, rotating shaft; 302, second incomplete gear; 303, first incomplete gear; 304, second motor; 305, sliding block; 306, sliding groove; 4, cover plate; 5, first magnetic attraction piece; 6, second magnetic attraction piece; 7, valve; 8, water outlet pipe; 9, water tank; 10, water pump. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0023] Please refer to Figures 1 to 5 The present application provides a technical solution: a silicon wafer cleaning machine for semiconductor silicon epitaxial wafer production, one side of a housing 1 is connected with a valve 7 through threads, one side of the valve 7 is inserted with a water outlet pipe 8, the upper part of the housing 1 is embedded with a second magnetic attraction piece 6, the upper part of the housing 1 is hingedly connected with a cover plate 4, the upper part of the cover plate 4 is embedded with a first magnetic attraction piece 5, one side of the housing 1 is installed with a water tank 9 through screws, the rear of the water tank 9 is installed with a water pump 10 through screws, the inside of the housing 1 is respectively provided with a connecting plate 2 and a filter box 3, the lower part of the connecting plate 2 is provided with the filter box 3;

[0024] The inside hole groove of the connecting plate 2 is attached with a sliding rod 204, the inside hole groove of the connecting plate 2 is threadedly connected with a threaded screw rod 201, the lower part of the connecting plate 2 is installed with the outer shell of a first motor 205 through screws, the lower part of the first motor 205 is installed with a stirring shaft 206 through screws, the outer wall of the stirring shaft 206 is glued with a silica gel cleaning piece 207, the upper part of the connecting plate 2 is installed with a water collecting box 203 through screws, the lower part of the water collecting box 203 is threadedly connected with a spray head 202;

[0025] One side of the filter box 3 is rotationally connected with a rotating shaft 301, one side of the rotating shaft 301 is inserted with a second incomplete gear 302, the lower part of the second incomplete gear 302 is engaged with a first incomplete gear 303, one side of the middle part of the first incomplete gear 303 is inserted with the output shaft of a second motor 304, the other side of the filter box 3 is installed with a sliding block 305 through screws, the outer wall of the sliding block 305 is attached with a sliding groove 306.

[0026] In this embodiment, as Figure 1 , Figure 2 andFigure 3 As shown in the figure, the stirring shaft 206 is connected with the first motor 205 to form a rotating structure, and the outer wall of the stirring shaft 206 is vertically and uniformly provided with a plurality of silica gel cleaning pieces 207; when the first motor 205 operates, the power is transmitted to the stirring shaft 206, so that the stirring shaft 206 starts to rotate, and because the outer wall of the stirring shaft 206 is vertically and uniformly provided with a plurality of silica gel cleaning pieces 207, the silica gel cleaning pieces 207 can contact the semiconductor silicon wafer in the filter box 3 when the stirring shaft 206 rotates, and the silica gel cleaning pieces 207 are made of soft material, which can reduce the damage to the semiconductor silicon wafer during cleaning.

[0027] In this embodiment, as shown in Figure 1 , Figure 2 and Figure 3 , the inside of the connecting plate 2 is horizontally provided with a sliding rod 204 and a threaded screw rod 201; the sliding rod 204 and the threaded screw rod 201 are horizontally distributed inside the connecting plate 2, the sliding rod 204 mainly plays a supporting and guiding role to ensure the stability of the connecting plate 2 during movement, and the threaded screw rod 201 provides a power transmission path for the horizontal movement of the connecting plate 2.

[0028] In this embodiment, as shown in Figure 1 and Figure 3 , two rows of spray heads 202 are horizontally distributed in front of and behind the water collecting box 203; the water pump 10 transmits the water source of the water tank 9 into the water collecting box 203, and the two rows of spray heads 202 connected by the water collecting box 203 are horizontally distributed in front and behind; when the water source enters the water collecting box 203, it is sprayed from the spray head 202 to wash the semiconductor silicon wafer in the filter box 3, and the arrangement of the two rows of spray heads 202 increases the coverage area and effect of washing, ensuring that the semiconductor silicon wafer can be fully cleaned.

[0029] In this embodiment, as shown in Figure 1 , Figure 2 and Figure 3 , one side of the threaded screw rod 201 is connected with the third motor to form a rotating structure, and the connecting plate 2 is connected with the threaded screw rod 201 and the sliding rod 204 to form a horizontal sliding structure; when the third motor operates, it drives the threaded screw rod 201 to rotate, and the threaded screw rod 201 is connected with the threads in the nut inside the connecting plate 2; when the threaded screw rod 201 rotates, the connecting plate 2 moves horizontally along the sliding rod 204 through the action of the threads, and in this process, the sliding rod 204 ensures the stability of the moving direction of the connecting plate 2, and the horizontal movement of the connecting plate 2 enables the semiconductor silicon wafer inside the filter box 3 to uniformly receive the washing of the spray head 202, and also facilitates the rotation and brushing of the stirring shaft 206 and the silica gel cleaning piece 207 on the wafer at different positions.

[0030] In this embodiment, as shown in Figure 1 , Figure 2 andFigure 4 As shown in the figure, the first incomplete gear 303 is in rotational structure with the second motor 304, the second incomplete gear 302 is in rotational structure with the first incomplete gear 303, and the filter box 3 is in rotational structure with the rotating shaft 301; when the second motor 304 operates, the first incomplete gear 303 is rotated, the first incomplete gear 303 meshes with the second incomplete gear 302, and the second incomplete gear 302 is swung back and forth due to the rotation of the first incomplete gear 303, the filter box 3 is rotated through the rotating shaft 301, and the rotation of the filter box 3 enables the semiconductor silicon epitaxial wafer to be cleaned at different angles, improving the comprehensiveness and effect of cleaning.

[0031] In the embodiment, as shown in the figure, Figure 1 , Figure 2 and Figure 5 , the outer structure size of the sliding block 305 is consistent with the inner structure size of the sliding groove 306; when the filter box 3 rotates, the sliding block 305 on the other side of the filter box 3 is connected with the sliding groove 306 on the inner wall of the shell 1, and the outer structure size of the sliding block 305 is consistent with the inner structure size of the sliding groove 306, so that the sliding block 305 can be smoothly slid in the sliding groove 306, thereby ensuring the stability of the filter box 3 during rotation, preventing shaking or deviation, and ensuring the smooth progress of the cleaning process.

[0032] The use method and advantages of the semiconductor silicon epitaxial wafer production silicon wafer cleaning machine are as follows:

[0033] As shown in the figure, Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, first semiconductor silicon wafer is poured into the filter box 3, the first magnetic sheet 5 on the cover plate 4 is magnetically attracted and attached to the second magnetic sheet 6 on the upper edge of the shell 1, the water collecting box 203 is connected to the water pump 10 through the corrugated pipe, the water pump 10 is operated to transmit the water source in the water tank 9 to the water collecting box 203, the spray head 202 connected to the water collecting box 203 sprays the water source to wash the semiconductor silicon wafer in the filter box 3, the first motor 205 under the connecting plate 2 is operated, the first motor 205 drives the stirring shaft 206 and the silica gel cleaning sheet 207 to rotate in turn, the silica gel cleaning sheet 207 is made of soft material, so that the damage to the semiconductor silicon wafer can be reduced during cleaning, the third motor on the side of the shell 1 close to the cover plate 4 is operated, the third motor drives the threaded screw rod 201 to rotate, the threaded screw rod 201 is connected with the threads in the nut in the connecting plate 2, so that the axis moves horizontally, when the connecting plate 2 moves, the threaded screw rod 201 and the sliding rod 204 move horizontally, so that the semiconductor silicon wafer in the filter box 3 can be washed uniformly and rotated to clean, the second motor 304 on the side of the shell 1 is operated, the second motor 304 drives the first incomplete gear 303 between the shell 1 to rotate, the first incomplete gear 303 is engaged with the second incomplete gear 302, so that the semiconductor silicon wafer in the filter box 3 can be cleaned by swinging back and forth, the second incomplete gear 302 drives the filter box 3 penetrating in the shell 1 to rotate, the sliding block 305 on the other side of the filter box 3 is connected to slide in the sliding groove 306 installed on the inner wall of the shell 1, the sewage in the shell 1 is discharged through the rotating valve 7 and the water outlet pipe 8.

[0034] The basic principle, main characteristics and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only preferred examples of the present application and do not limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cleaning machine for producing semiconductor silicon epitaxial wafers, comprising a housing (1), characterized in that: A valve (7) is connected to one side of the housing (1) via a thread, a water outlet pipe (8) is plugged into one side of the valve (7), a second magnetic sheet (6) is embedded above the housing (1), a cover plate (4) is hingedly connected to the top of the housing (1), a first magnetic sheet (5) is embedded above the cover plate (4), a water tank (9) is mounted on one side of the housing (1) via screws, a water pump (10) is mounted behind the water tank (9) via screws, a connecting plate (2) and a filter box (3) are respectively provided inside the housing (1), and a filter box (3) is provided below the connecting plate (2); The internal hole groove of the connecting plate (2) is fitted with a sliding rod (204), the internal hole groove of the connecting plate (2) is threadedly connected to a threaded screw rod (201), the housing of the first motor (205) is mounted below the connecting plate (2) by screws, the output shaft below the first motor (205) is mounted with a stirring shaft (206) by screws, the outer wall of the stirring shaft (206) is glued with a silicone cleaning sheet (207), a water collecting box (203) is mounted above the connecting plate (2) by screws, and the bottom of the water collecting box (203) is threadedly connected to a nozzle (202); One side of the filter box (3) is rotatably connected to a rotating shaft (301), one side of the rotating shaft (301) is plugged with a second incomplete gear (302), a first incomplete gear (303) is meshed below the second incomplete gear (302), an output shaft of a second motor (304) is plugged into the middle of one side of the first incomplete gear (303), and a slider (305) is mounted on the other side of the filter box (3) via screws, and an outer wall of the slider (305) is fitted with a slide groove (306).

2. The silicon wafer cleaning machine for semiconductor silicon epitaxial wafer production according to claim 1, characterized in that: The stirring shaft (206) forms a rotating structure through the first motor (205), and a plurality of silica gel cleaning sheets (207) are vertically and evenly distributed on the outer wall of the stirring shaft (206).

3. The silicon wafer cleaning machine for semiconductor silicon epitaxial wafer production according to claim 1, characterized in that: A sliding rod (204) and a threaded screw rod (201) are horizontally distributed inside the connecting plate (2).

4. The silicon wafer cleaning machine for semiconductor silicon epitaxial wafer production according to claim 1, characterized in that: Two rows of spray heads (202) are horizontally distributed in front and behind the water collection box (203).

5. The silicon wafer cleaning machine for semiconductor silicon epitaxial wafer production according to claim 1, characterized in that: One side of the threaded screw (201) forms a rotating structure through a third motor, and the connecting plate (2) forms a horizontal sliding structure through the threaded screw (201) and the sliding rod (204).

6. The silicon wafer cleaning machine for semiconductor silicon epitaxial wafer production according to claim 1, characterized in that: The first incomplete gear (303) forms a rotating structure through the second motor (304), the second incomplete gear (302) forms a rotating structure through the first incomplete gear (303), and the filter box (3) forms a rotating structure through the rotating shaft (301).

7. The silicon wafer cleaning machine for semiconductor silicon epitaxial wafer production according to claim 1, characterized in that: The external structural dimensions of the slider (305) are consistent with the internal structural dimensions of the chute (306).

Images