Quad flat no-lead (QFN) packaging bonding clamp

Abstract

The utility model relates to the technical field of chip packaging processing equipment, in particular to a QFN packaging bonding clamp which comprises a clamp seat, the top of the clamp seat is respectively provided with a groove and a mounting frame, the inner wall of the bottom end of the groove is provided with heat dissipation holes, a packaging substrate is placed in the groove, the outer side of the packaging substrate is provided with a positioning adjusting mechanism, and the positioning adjusting mechanism is provided with a positioning groove. An electric cylinder is fixedly mounted at the top of the mounting frame, a pressurizing block is arranged at the bottom of the mounting frame, connecting pieces are fixedly mounted on the outer sides of the pressurizing block respectively, and positioning rods are fixedly mounted at the tops of the connecting pieces. According to the positioning device, the micro hydraulic rod and the limiting sliding rod are combined for use, so that the positioning touch plates move in opposite directions, and a chip substrate can be better clamped and positioned under the elastic support of the supporting spring, so that the purpose of quickly positioning a chip is achieved, and subsequent packaging operation is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging processing equipment technical field, concretely is QFN package bonding fixture. BACKGROUND

[0002] QFN is the packaging technology of integrated chip, refers to the double side or square flat lead -free package, its not like traditional SOIC with TSOP package has the gull -wing lead, wafer carrier interval is small, and the conductive path between its internal pin and pad is short, self -induction coefficient and package body in -line resistance is very low, therefore can provide excellent electric performance, needs through the fixture to be fixed in its packaging process.

[0003] At present, the QFN package bonding fixture used, the clamping and positioning of the chip substrate in the fixture is realized by manual, the efficiency of manual operation is low, a large amount of time is consumed, thereby being not favorable for subsequent packaging operation, the overall production efficiency is influenced, simultaneously, the pressing of the chip in the fixture is realized by lever, the uneven force on all parts of the chip is prone to being caused by the mode, thereby the packaging quality is influenced, and the subsequent use is not favorable.

[0004] In conclusion, the utility model discloses QFN package bonding fixture to solve the problem in above -mentioned background art. UTILITY MODEL CONTENTS

[0005] The utility model discloses a QFN package bonding fixture to solve the problem in above -mentioned background art.

[0006] To achieve the above -mentioned purpose, the utility model provides the following technical scheme:

[0007] QFN package bonding fixture, including fixture seat, the top of fixture seat is provided with recess and mounting bracket respectively, the bottom end inner wall of recess is equipped with heat dissipation hole, the inside of recess is placed and is provided with the positioning adjusting mechanism of packaging substrate, the top of mounting bracket is fixedly installed with electric cylinder, the bottom of mounting bracket is provided with pressure block, the outside of pressure block is fixedly installed with connecting piece respectively, the top of connecting piece is fixedly installed with positioning rod.

[0008] The positioning adjusting mechanism includes the installation groove on the top surface of fixture seat, the inside of installation groove is fixedly installed with micro -hydraulic rod, the telescopic end of micro -hydraulic rod is provided with positioning block, the side, away from micro -hydraulic rod of positioning block is provided with limit slide rod, the right -hand end of limit slide rod is fixedly installed with positioning touch plate, the left side of positioning touch plate is fixedly provided with support spring.

[0009] As the preferred scheme of the utility model, the heat dissipation holes are multiple, the multiple heat dissipation holes are equidistantly distributed about the left and right grooves, and the bottom end inner wall thereof extends to the bottom surface of the clamp seat.

[0010] As the preferred scheme of the utility model, the telescopic end of the electric cylinder penetrates the top surface of the mounting frame and is fixedly connected with the top surface of the pressing block, the bottom of the pressing block is provided with a rubber pad, and the bottom end inner wall thereof coincides with the bottom middle axis of the groove.

[0011] As the preferred scheme of the utility model, the vertical section shape of the mounting frame is an L-shaped structure, and the top end of the positioning rod penetrates the bottom surface of the horizontal end of the mounting frame and extends upward.

[0012] As the preferred scheme of the utility model, the mounting slots are mirror-imaged about the top surface of the clamp seat, and the inner wall thereof is in contact with the outer side surface of the positioning block.

[0013] As the preferred scheme of the utility model, the left end of the limiting sliding rod penetrates the right side surface of the positioning block and is provided with an anti-dropping block.

[0014] As the preferred scheme of the utility model, the left end of the supporting spring is in contact with the right side surface of the positioning block, the outer side surface of the positioning contact plate is provided with a friction soft pad, and the bottom surface thereof is flush with the bottom end inner wall of the groove.

[0015] Compared with the prior art, the utility model has the advantages that:

[0016] 1. In the utility model, the QFN packaging bonding clamp is provided, the structure design in the positioning adjusting mechanism is utilized, the micro hydraulic rod and the limiting sliding rod are combined and used, the positioning contact plates move towards each other, the chip substrate is better clamped and positioned under the elastic support of the supporting spring, the purpose of quickly positioning the chip is achieved, and this is favorable for subsequent packaging operation.

[0017] 2. In the utility model, the QFN packaging bonding clamp is provided, the structure design of the electric cylinder, the positioning rod and the pressing block is utilized, the pressing block can drive the positioning rod and the mounting frame to slide and approach the chip under the driving of the electric cylinder, the purpose of uniformly pressing the chip is achieved, the uneven force on the chip is avoided, and the packaging quality of the chip is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is an overall structural schematic view of the utility model;

[0019] Figure 2 It is an overall structural schematic view of the utility model; Figure 1Amplification structure schematic view of middle A point;

[0020] Figure 3 The utility model discloses a structure schematic view of clamp seat.

[0021] In the figure: 1, clamp seat, 2, recess, 201, heat dissipation hole, 202, substrate, 3, mounting bracket, 301, electric cylinder, 302, pressure block, 303, connecting piece, 304, positioning rod, 4, positioning adjusting mechanism, 401, installation groove, 402, miniature hydraulic rod, 403, positioning block, 404, limit slide rod, 405, positioning touch plate, 406, support spring. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the utility model embodiments, and obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments, and all other embodiments obtained by those skilled in the art without creative labor based on the embodiments in the utility model belong to the protection scope of the utility model.

[0023] In order to facilitate understanding of the utility model, the utility model will be more fully described below with reference to the relevant drawings, and several embodiments of the utility model are given, however, the utility model can be realized in many different forms, and is not limited to the embodiments described in the text, on the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be a middle element, and when an element is referred to as being "connected to" another element, it can be directly connected to the other element or there can be a middle element, and the terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs, and the terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model, and the term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] Embodiment, please see Figures 1-3 The utility model provides a technical scheme:

[0027] The utility model provides a QFN package bonding clamp, including clamp seat 1, the top of clamp seat 1 is provided with recess 2 and mounting frame 3 respectively, the bottom end inner wall of recess 2 is provided with heat dissipation hole 201, the inside of recess 2 places package substrate 202, the outside of package substrate 202 is provided with positioning adjustment mechanism 4, the top of mounting frame 3 is fixedly installed with electric cylinder 301, the bottom of mounting frame 3 is provided with pressure block 302, the outside of pressure block 302 is fixedly installed with connecting piece 303 respectively, the top of connecting piece 303 is fixedly installed with positioning rod 304;

[0028] Specifically, the heat dissipation holes 201 are multiple, and the multiple heat dissipation holes 201 are equidistantly distributed about the recess 2, and the bottom end inner walls of the heat dissipation holes 201 extend to the bottom surface of the clamp seat 1.

[0029] In the embodiment, the heat dissipation holes 201 can effectively dissipate the heat generated in the packaging process, and the overheating of the chip is avoided.

[0030] Specifically, the extension end of the electric cylinder 301 penetrates through the top surface of the mounting frame 3 and is fixedly connected with the top surface of the pressure block 302, the bottom of the pressure block 302 is provided with a rubber pad, and the rubber pad coincides with the bottom central axis of the recess 2, the vertical cross-sectional shape of the mounting frame 3 is in an L-shaped structure, and the top end of the positioning rod 304 is attached to the bottom surface of the horizontal end of the mounting frame 3 and extends upward.

[0031] In the embodiment, the electric cylinder 301 is mainly used to drive the pressure block 302 to move downward, and the positioning rod 304 is mainly used to slide with the mounting frame 3, so that the stability of the pressure block 302 when moving downward is ensured, and the chip is uniformly pressed.

[0032] In the embodiment, please refer to Figure 1 and Figure 3 The positioning adjustment mechanism 4 includes a mounting groove 401 formed in the top surface of the clamp seat 1, a micro hydraulic rod 402 fixedly installed in the inside of the mounting groove 401, a positioning block 403 provided at the extension end of the micro hydraulic rod 402, a limiting slide rod 404 provided at the side of the positioning block 403 away from the micro hydraulic rod 402, a positioning touch plate 405 fixedly installed at the right end of the limiting slide rod 404, and a supporting spring 406 fixedly provided at the left side of the positioning touch plate 405.

[0033] Specifically, the top surface of the mounting groove 401 is mirror-imaged with respect to the clamp base 1, and the inner wall thereof is in contact with the outer side surface of the positioning block 403; the left end of the limiting slide rod 404 is in contact with the right side surface of the positioning block 403 and is movably penetrated into the right side surface of the positioning block 403 and is provided with an anti-dropping block; the left end of the supporting spring 406 is in contact with the right side surface of the positioning block 403; and the outer side surface of the positioning touch plate 405 is provided with a friction soft pad, and the bottom surface thereof is flush with the bottom end inner wall of the recess 2.

[0034] In the embodiment, the micro hydraulic rod 402 is arranged to drive the positioning block 403 to move along the inner wall of the mounting groove 401 and drive the positioning block 403 to move, so that the positioning block 403 can be in contact with the substrate 202 inside the recess 2, and the supporting spring 406 and the limiting slide rod 404 can elastically support the positioning touch plate 405, so that the positioning touch plate 405 does not exert excessive clamping force on the substrate 202, and the positioning and clamping effect of the chip is improved.

[0035] The working process of the utility model is as follows: when the QFN packaging bonding clamp is used, the substrate 202 to be packaged is placed in the recess 2, and then the positioning operation is performed; the micro hydraulic rod 402 is started, the telescopic end of the micro hydraulic rod 402 starts to expand and drives the positioning block 403 to move, the positioning block 403 drives the positioning touch plate 405 to contact the substrate 202 through the limiting slide rod 404, in the process of contact, the positioning touch plate 405 moves towards the positioning block 403 through the limiting slide rod 404 and the supporting spring 406, then the limiting slide rod 404 slides along the positioning block 403, and the supporting spring 406 gradually contracts and generates an elastic force, the elastic force can make the positioning touch plate 405 stably contact the substrate 202, thereby completing the positioning operation of the substrate 202, then the chip cap layer contacts the substrate 202, and the electric cylinder 301 is started, the electric cylinder 301 drives the pressing block 302 to move downwards, at this time, the connecting piece 303 drives the positioning rod 304 to slide along the inner wall of the mounting frame 3, so that the pressing block 302 stably contacts the top of the chip cap layer and uniformly exerts pressure, ensures the uniformity of the force of the chip, and meets the packaging requirements of the chip.

[0036] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A QFN package bonding fixture, comprising a fixture seat (1), characterized in that: The top of the clamp seat (1) is respectively provided with a groove (2) and a mounting frame (3); the inner wall of the bottom end of the groove (2) is provided with a heat dissipation hole (201); a packaging substrate (202) is placed inside the groove (2); a positioning adjustment mechanism (4) is provided on the outer side of the packaging substrate (202); an electric cylinder (301) is fixedly installed on the top of the mounting frame (3); a pressure block (302) is provided on the bottom of the mounting frame (3); connecting pieces (303) are respectively fixedly installed on the outer sides of the pressure blocks (302); and a positioning rod (304) is fixedly installed on the top of the connecting piece (303); The positioning adjustment mechanism (4) comprises a mounting groove (401) provided on the top surface of the clamp seat (1); a micro hydraulic rod (402) is fixedly installed inside the mounting groove (401); a positioning block (403) is provided at the telescopic end of the micro hydraulic rod (402); a limiting slide bar (404) is provided on the side of the positioning block (403) away from the micro hydraulic rod (402); a positioning touch plate (405) is fixedly installed at the right end of the limiting slide bar (404); and a support spring (406) is fixedly provided on the left side of the positioning touch plate (405).

2. The QFN package bonding fixture according to claim 1, wherein: There are a plurality of heat dissipation holes (201), which are equally spaced from left to right about the groove (2), and the inner walls of their bottom ends extend to the bottom surface of the clamp seat (1).

3. The QFN package bonding fixture according to claim 1, wherein: The telescopic end of the electric cylinder (301) passes through the top surface of the mounting frame (3) and is fixedly connected to the top surface of the pressure block (302). The bottom of the pressure block (302) is provided with a rubber pad, and the rubber pad coincides with the bottom center axis of the groove (2).

4. The QFN package bonding fixture according to claim 1, wherein: The vertical cross-section of the mounting frame (3) is L-shaped, and the top end of the positioning rod (304) fits through the bottom surface of the horizontal end of the mounting frame (3) and extends upward.

5. The QFN package bonding fixture according to claim 1, wherein: The top surface of the mounting groove (401) relative to the clamp seat (1) is distributed in a left-right mirror image, and the inner wall thereof is in contact with the outer surface of the positioning block (403).

6. The QFN package bonding fixture according to claim 1, wherein: The left end of the position-limiting slide bar (404) fits and moves through the right side surface of the positioning block (403) and is provided with an anti-slip block.

7. The QFN package bonding fixture according to claim 1, wherein: The left end of the support spring (406) contacts the right side surface of the positioning block (403), and the outer surface of the positioning touch plate (405) is provided with a friction pad, and its bottom surface is flush with the bottom inner wall of the groove (2).

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