TYPE C electrical fast pulse suppression shielding case
By designing the TYPE C electric fast pulse suppression shielding cover, the shortcomings of the shielding cover in static electricity and heat release are solved, the EMC and EFT requirements are met, the risk of circuit board damage is reduced, and the heat dissipation efficiency and service life are improved.
Patent Information
- Application Number
- CN202422922129.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-11-28
AI Technical Summary
The existing shielding cover design of the Type C interface ignores the release of static electricity and heat, causing circuit board chips and components to be easily damaged and failing to meet EMC and EFT requirements.
A TYPE C electric fast pulse suppression shielding cover is designed, which includes a through shielding cover body. The internal space is divided into multiple chambers and is provided with release windows for dissipating static electricity and heat. Stainless steel material is used to ensure connection strength and shielding effect.
It effectively reduces the risk of damage to the circuit board due to static electricity accumulation, improves heat dissipation efficiency, extends the service life of the interface, and meets EMC and EFT requirements.
Smart Images

Figure CN223451336U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to TYPE C interface technical field especially TYPE C electricity fast pulse inhibits shield case. BACKGROUND
[0002] In the field of smart phones and tablet computers, notebook computers, storage devices and docking stations, displays and projectors, power adapters, new energy vehicles, industrial and medical devices, audio and video devices, consumer electronics, etc., TYPE C interface is an interface with very high usage rate.
[0003] When designing TYPE C interface, it is very important to meet EMC (electromagnetic compatibility) and EFT (electrical fast transient) requirements. The main structure of TYPE C interface consists of TYPE C connector with plug-in metal shell, shield case (also known as shield shell) connecting plug-in metal shell with metal shielding layer of connecting wire, circuit board located in shield case and welded with pins in plug-in metal shell and wire core of connecting wire, and corresponding chips and components in circuit board. The design of shield case plays a decisive role in whether it meets EMC and EFT requirements.
[0004] However, the current design of shield case mainly adopts a whole surrounding structure, which is relatively simple and ignores the release of static electricity and heat, which may cause damage to chips and components on the circuit board due to the accumulation of static electricity and heat. INVENTION CONTENTS
[0005] The utility model aims at providing a technical solution to solve the above problems.
[0006] To achieve the above purpose, the utility model provides the following technical scheme: TYPE C electrical fast pulse suppression shield case for connecting plug-in metal shell of TYPE C plug and metal shielding part of connecting wire, including shield case body penetrating from front to back, front end of shield case body has front end joint part for connecting plug-in metal shell of TYPE C plug, rear end of shield case body has rear end joint part for connecting metal shielding part of connecting wire; the internal space of shield case body is sequentially formed with front end joint chamber, PCB board containing chamber, wire core branch chamber and rear end joint chamber from front to back; release window is arranged on the outer side of shield case body and connected with wire core branch chamber.
[0007] As a further scheme of the utility model: the PCB board containing chamber is used for containing the PCB board welded with the chip and the resistance, and the front end of the PCB board has the front end golden finger used for welding with the welding pin of TYPE C plug, the rear end of the PCB board has the rear end golden finger used for welding with the core of connecting wire, the chip on the PCB board is between the front end golden finger and the rear end golden finger, and the resistance on the PCB board is between the front end golden finger and the rear end golden finger.
[0008] As a further scheme of the utility model: the shielding cover body has the first side cover body opposite to one side of the PCB board, the second side cover body opposite to the other side of the PCB board, the third side cover body connecting the left side of the first side cover body with the left side of the second side cover body, and the fourth side cover body connecting the right side of the first side cover body with the right side of the second side cover body, wherein the board surface of the PCB board opposite to the first side cover body is the board surface welded with the chip.
[0009] As a further scheme of the utility model: the release window is at least set on the first side cover body.
[0010] As a further scheme of the utility model: the release window extends to the fourth side cover body from the part close to the fourth side cover body on the first side cover body to the right, and continues to extend to the part close to the fourth side cover body on the second side cover body.
[0011] As a further scheme of the utility model: the release window extends to the PCB board containing chamber.
[0012] As a further scheme of the utility model: the release window extends to the area beyond the rear end golden finger of the PCB board, and does not extend to the area of any component of the chip and the resistance.
[0013] As a further scheme of the utility model: the release window extends to the area of any component of the chip and the resistance, wherein the release window and the leveled chip and resistance are not in the front-to-back arrangement.
[0014] As a further scheme of the utility model: the first side cover body and / or the third side cover body are provided with the additional release window communicating with the PCB board containing chamber; the area opposite to the additional release window is the area between the chip and the rear end golden finger, and the opposite area is the area without the resistance.
[0015] As a further scheme of the utility model: the shielding cover body is made of stainless steel with the thickness not less than 0.25 mm.
[0016] Compared with the prior art, the beneficial effects of the technical scheme are that: the shielding cover body can be connected with the plug-in metal shell of the TYPE C plug and the metal shielding part of the connecting wire, and the area opposite to the chip and the resistor is covered and shielded, so that the EMC and EFT requirements are as far as possible to be met; and further, the release window is arranged at the position in the shielding cover body which is not opposite to the chip and the resistor, so that an export path is provided for static electricity, the risk that the internal circuit is damaged due to static electricity accumulation is reduced, and a quick release window is provided for the heat inside the shielding cover body, the heat dissipation efficiency is improved, the temperature of the interface can be effectively reduced, and the service life is prolonged.
[0017] The additional aspects and advantages of the present application will be partially given in the following description, and partially become obvious from the following description, or be understood through the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.
[0019] Fig. 1 is the structure front view of the present application;
[0020] Fig. 2 is the structure rear view of the present application;
[0021] Fig. 3 is the position schematic view of the PCB contained in the present application.
[0022] The corresponding reference signs in the drawings are explained as follows:
[0023] Shielding cover body-1, front end joint-2, rear end joint-3, PCB-4, release window-5, additional release window-6, plug-in metal shell of TYPE C plug
[0024] First side cover body-11, second side cover body-12, third side cover body-13, fourth side cover body-14,
[0025] Front end joint cavity-101, PCB containing cavity-102, wire core branch cavity-103, rear end joint cavity-104,
[0026] Front end gold finger-401, rear end gold finger-402. DETAILED DESCRIPTION
[0027] Clearly, the described embodiments are merely a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0028] Please refer to Figs. 1-3 , the TYPE C electric fast pulse suppression shield cover, including the shield cover body 1 which is penetrated from front to back, the front end of the shield cover body 1 has the front end joint part 2 for being engaged with the plug-in metal shell 7 of the TYPE C plug, the rear end of the shield cover body 1 has the rear end joint part 3 for being engaged with the metal shielding part (not shown) of the connecting wire.
[0029] The internal space of the shield cover body 1 is sequentially formed with the front end joint chamber 101, the PCB board containing chamber 102, the wire core branch chamber 103 and the rear end joint chamber 104 in the direction from front to back, the front end joint chamber 101 corresponds to the front end joint part 2, and the rear end joint chamber 104 corresponds to the rear end joint part 3.
[0030] The PCB board 4 welded with the chip U1 and the resistor R1 is contained in the PCB board containing chamber 102.
[0031] The front end of the PCB board 4 has the front end golden finger 401 for being welded with the welded pin of the TYPE C plug, and the rear end of the PCB board 4 has the rear end golden finger 402 for being welded with the wire core of the connecting wire.
[0032] The chip U1 on the PCB board 4 is located between the front end golden finger 401 and the rear end golden finger 402, and the resistor R1 on the PCB board 4 is located between the front end golden finger 401 and the rear end golden finger 402.
[0033] In some embodiments, the metal shielding part of the connecting wire is, for example, a metal woven shielding net, an aluminum foil shielding layer, a copper foil shielding layer or other metal shielding parts of the connecting wire.
[0034] The plurality of wire cores in the connecting wire are branched at the wire core branch chamber 103, so that the wire cores can be welded with the corresponding golden fingers on the rear end of the PCB board 4.
[0035] In some embodiments, a branch clamp can be arranged in the wire core branch chamber 103, so that the branching effect of the plurality of wire cores is better.
[0036] In the present embodiment, a release window 6 communicating with the wire core branch chamber 103 is arranged on the outer side of the shield cover body 1, and the release window 6 can be used for heat release and static electricity release.
[0037] By connecting the shielding cover 1 with the plug metal shell 7 of the TYPE C plug, the metal shielding part of the connecting line, and covering and shielding the area opposite to the chip U1 and the resistor R1, the EMC and EFT requirements are ensured to be met as much as possible; and further, the release window 5 is provided at the position in the shielding cover 1 which is not opposite to the chip U1 and the resistor R1, thereby providing a discharge path for static electricity, reducing the risk of damage to the internal circuit caused by static electricity accumulation, and providing a quick release window for the heat inside the shielding cover 1, improving the heat dissipation efficiency, effectively reducing the temperature of the interface, and prolonging the service life.
[0038] In some embodiments, the PCB board 4 contained in the shielding cover 1 can also be provided with a wireless module (not shown), such as a Bluetooth module, a WIFI module. Through the setting of the release window, the transmission of the wireless signal of the wireless module can be more smoothly carried out, effectively avoiding the reflection, absorption or attenuation of the wireless signal.
[0039] In some embodiments, the shielding cover 1 has a first side cover 11 opposite to one side of the PCB board 4, a second side cover 12 opposite to the other side of the PCB board 4, a third side cover 13 connecting the left side of the first side cover 11 with the left side of the second side cover 12, and a fourth side cover 14 connecting the right side of the first side cover 11 with the right side of the second side cover 12, and the side of the PCB board opposite to the first side cover 11 is the side on which the chip U1 is soldered.
[0040] In some embodiments, the release window 5 is at least provided on the first side cover 11, i.e. corresponding to the key heat generating part.
[0041] In some embodiments, the release window 5 extends forward to the PCB board containing chamber 102.
[0042] In some embodiments, the release window 5 extends forward to an area beyond the rear end gold finger 402 of the PCB board, and does not extend forward to the area where any of the components such as the chip and the resistor is located. It can be understood that the release window extends forward between the rear end gold finger and the chip (or the resistor). In the case of ensuring that the EMC and EFT requirements can be met as much as possible, the release effect of static electricity and heat is further improved.
[0043] As shown in Fig. 3 In some embodiments, the release window 5 extends forward to the level of any of the components such as the chip U1 and the resistor R1, wherein the release window 5 and the leveled chip U1 and the resistor are not in opposite arrangement. In the case of ensuring that the EMC and EFT requirements can be met as much as possible, the release effect of static electricity and heat is further improved.
[0044] In some embodiments, the release window 5 extends rightward from a portion of the first side cover 11 near the fourth side cover 14 to the fourth side cover 14 , and continues to extend to a portion of the second side cover 12 near the fourth side cover 14 , which has a better effect of releasing static electricity and heat.
[0045] When the release window 5 extends from the first side cover 11 to the fourth side cover 14 and the second side cover 12, and extends from the wire core distribution chamber 103 to the PCB board accommodating chamber 102, if the left and right widths of the release window are set too much, the front-to-back connection strength of the shielding cover 1 will inevitably decrease to a certain extent. Therefore, the release window 5 on the first side cover 11 is limited to a position close to the fourth side cover 14, and the release window 5 on the second side cover 12 is limited to a position close to the fourth side cover 14, so as to ensure that the front-to-back connection strength of the shielding cover 1 is maintained at a high value or a medium-high value.
[0046] The portion of the second side cover 12 close to the fourth side cover 14 is 1 / 4 of the left and right width of the second side cover 12 ; the portion of the first side cover 11 close to the fourth side cover 14 is 1 / 4 of the left and right width of the first side cover 11 .
[0047] like Fig. 3 As shown, in some embodiments, an additional release window 6 is provided on the first side cover 11 and / or the third side cover 13, communicating with the PCB board housing chamber 102. The additional release window 6 faces the area between the chip U1 and the rear-end gold finger 402, and also faces an area without resistor R1. The additional release window 6 can release static electricity and heat closer to the chip U1, better compensating for the difference in connection strength required for the release window 5, thereby achieving better static and heat release.
[0048] In some embodiments, the shielding cover 1 is made of stainless steel with a thickness of not less than 0.25 mm.
[0049] In some embodiments, the front end joint portion 2 is a snap-fitting piece integrally formed on the shielding cover 1 , and the rear end joint portion 3 is a wire-wrapped piece integrally formed on the shielding cover 1 .
[0050] It is apparent for a person skilled in the art that the present application is not restricted to the details of the above exemplary embodiments, but that it can be implemented in other concrete forms without departing from the spirit or the essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary only, and not limiting, the scope of the present application being defined by the appended claims rather than the above description, and all changes coming within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims should not be construed as limiting the claims concerned.
Claims
1. TYPE C electrical fast pulse suppression shield, used to connect the plug metal shell of the TYPE C plug and the metal shielding component of the connecting line, characterized by: The shielding cover comprises a shielding cover having front and rear ends extending therethrough, wherein the front end of the shielding cover has a front end engaging portion for engaging with the plug-in metal shell of the TYPEC plug, and the rear end of the shielding cover has a rear end engaging portion for engaging with the metal shielding component of the connecting line; The inner space of the shielding case is formed with a front-end joint chamber, a PCB board accommodating chamber, a wire core branching chamber, and a rear-end joint chamber in sequence from front to back; A release window communicating with the wire core branching chamber is provided on the outer side of the shielding cover.
2. The TYPE C electrical fast pulse suppression shield according to claim 1, characterized in that: The PCB board holding chamber is used to hold PCB boards with chips and resistors soldered on them. The front end of the PCB board has a front gold finger for soldering to the soldering pins of the TYPE C plug, and the rear end of the PCB board has a rear gold finger for soldering to the wire core of the connecting wire. The chip on the PCB board is located between the front gold finger and the rear gold finger, and the resistor on the PCB board is located between the front gold finger and the rear gold finger.
3. The TYPE C electrical fast pulse suppression shield according to claim 2, characterized in that: The shielding cover has a first side cover opposite to one side surface of the PCB board, a second side cover opposite to the other side surface of the PCB board, a third side cover connecting the left side of the first side cover with the left side of the second side cover, and a fourth side cover connecting the right side of the first side cover with the right side of the second side cover. The surface of the PCB board opposite to the first side cover is the surface on which the chip is soldered.
4. The TYPE C electrical fast pulse suppression shield according to claim 3, characterized in that: The release window is at least opened on the first side cover.
5. The TYPE C electrical fast pulse suppression shield according to claim 4, characterized in that: The release window extends rightward from a portion of the first side cover body close to the fourth side cover body to the fourth side cover body, and continues to extend to a portion of the second side cover body close to the fourth side cover body.
6. The TYPE C electrical fast pulse suppression shield according to any one of claims 3 to 5, characterized in that: The release window extends forward to the PCB board accommodating chamber.
7. The TYPE C electrical fast pulse suppression shield according to claim 6, characterized in that: The release window extends forward to the area where the gold fingers on the rear end of the PCB are located, and does not extend forward to the area where any components such as the chip and resistor are located.
8. The TYPE C electrical fast pulse suppression shield according to claim 6, characterized in that: The release window extends forward to be flush with any component of the chip or resistor. The release window is not directly opposite to the chip and resistor it is aligned with.
9. The TYPE C electrical fast pulse suppression shield according to claim 4, 5, 7 or 8, characterized in that: An additional release window communicating with the PCB board accommodating chamber is provided on the first side cover and / or the third side cover; The area opposite to the additional release window is the area between the chip and the back-end gold finger, and the opposite area is an area without resistance.
10. The TYPE C electrical fast pulse suppression shield according to claim 1, characterized in that: The shielding cover is made of stainless steel with a thickness of not less than 0.25mm.