Printed circuit board (PCB)

Abstract

The utility model provides a PCB, and relates to the technical field of PCBs. The PCB comprises at least four datum points, and the datum points are distributed on the PCB in a scattered mode. The reference point comprises a reference hole and a filler, the reference hole is arranged on one side of the PCB where the elements are arranged, the reference hole is filled with the filler, and the color of the filler is different from the color of the area outside the reference point in the PCB. According to the embodiment of the invention, the durability and the wear resistance of the reference point can be effectively improved, the possibility that the reference point is worn or erased is reduced, the difference between the reference point and other areas of the PCB is improved by using the filler, the identifiability of the reference point is improved, a chip mounter can carry out rapid positioning conveniently, and the positioning accuracy and the success rate of PCB chip mounting are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB, in particular, the present application relates to a kind of PCB board. BACKGROUND

[0002] Surface Mount Technology (SMT) is a new generation of electronic assembly technology, which compresses the traditional electronic components into devices with only a few tenths of the volume. SMT surface mount technology mainly involves mounting technology, welding technology, semiconductor packaging technology, assembly equipment design technology, circuit forming process technology, functional design simulation technology, etc. SMT production line mainly includes: chip mounter, printing machine, SPI (solder paste detector), wave soldering equipment, reflow soldering equipment, AOI detection equipment (automatic optical detection equipment), X-ray detection equipment, repair workstation, etc. Among them, the chip mounter is used to realize high-speed, high-precision and automatic mounting of electronic components, which is related to the efficiency and precision of SMT production line, and is the most critical and complex core equipment.

[0003] The accurate positioning of the PCB board is one of the key steps to realize the accurate mounting of the chip mounter, and accurate positioning is a key factor for the success of PCB board mounting. In the prior art, the positioning of the PCB board is carried out by setting reference points on the PCB board. However, the existing reference points are similar to the pads and have poor wear resistance, are not easy to identify, and are easy to wear or erase, resulting in positioning failure or positioning error of the chip mounter, and reducing the success rate of PCB board mounting. UTILITY MODEL CONTENT

[0004] The present application provides a kind of PCB board, can solve the problem that existing reference point is not easy to identify and is easy to be worn or erased, improve positioning difficulty, make the success rate of PCB board mounting low.

[0005] In order to achieve this purpose, the embodiments of the present application provide the following schemes.

[0006] According to an aspect of the embodiments of the present application, a PCB board is provided, which comprises at least four reference points, and the reference points are dispersedly arranged on the PCB board.

[0007] The reference point comprises a reference hole and a filler, the reference hole is arranged on one side of the PCB board layout element, and the filler fills the reference hole, and the color of the filler is different from the color of the area other than the reference point in the PCB board.

[0008] In one possible implementation, the distance between the reference point and the element in the PCB board is greater than a preset distance, and the element comprises at least one of electronic devices, wires and pads.

[0009] In a possible implementation, the reference hole is formed by laser engraving or mechanical drilling the PCB board.

[0010] In a possible implementation, the filler is a coating or ink.

[0011] In a possible implementation, the vertex or bottom edge of the cross section of the reference hole corresponds to the direction of the PCB board.

[0012] In a possible implementation, the number of reference points corresponds to the size or element density of the PCB board.

[0013] In a possible implementation, the PCB board is a rectangular board, and the reference points are arranged in the middle or corner area of the rectangular board.

[0014] In a possible implementation, the top cross section of the reference hole is a triangle, and the side length of the triangle is greater than a preset value.

[0015] In a possible implementation, the PCB board is provided with an identification area corresponding to the reference point, and the identification area is used to identify the reference point.

[0016] The technical scheme provided by the embodiments of the present application has the following beneficial effects:

[0017] The PCB board provided by the present application includes at least four reference points, and the reference points are dispersedly arranged on the PCB board. The reference point includes a reference hole and a filler. The reference hole is arranged on one side of the PCB board where elements are arranged. The filler fills the reference hole, and the color of the filler is different from the color of the area other than the reference point on the PCB board. The embodiments of the present application form the reference point by using the reference hole and the filler, effectively improve the durability and wear resistance of the reference point, reduce the possibility of wear or erasure of the reference point, and use the filler to distinguish the reference point from other areas of the PCB board, improve the recognizability of the reference point, facilitate the rapid positioning of the chip mounter, and improve the positioning accuracy and the success rate of the PCB board mounting. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced.

[0019] Fig. 1 The structural diagram of the PCB board provided by the embodiments of the present application is shown in the figure.

[0020] Fig. 2 The schematic diagram of the PCB board provided by the embodiments of the present application after rotating 180 degrees is shown in the figure.

[0021] Explanation of reference numbers: 1. PCB board; 11. Reference hole; 12. Component; 13. Filler. DETAILED DESCRIPTION

[0022] The following describes the embodiments of the present application in conjunction with the accompanying drawings. It should be understood that the embodiments described below in conjunction with the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions of the embodiments of the present application.

[0023] Those skilled in the art will understand that, unless otherwise stated, the singular forms "a," "an," "said," and "the" used herein may also include plural forms. It should be further understood that the terms "including" and "comprising" used in the embodiments of the present application mean that the corresponding features can be implemented as the presented features, information, data, steps, operations, elements, and / or components, but do not exclude implementation as other features, information, data, steps, operations, elements, components, and / or combinations thereof supported by the present technical field. It should be understood that when we refer to an element as being "connected" or "coupled" to another element, the element can be directly connected or coupled to the other element, or it can refer to the element and the other element establishing a connection relationship through an intermediate element. In addition, the "connection" or "coupling" used herein may include wireless connection or wireless coupling. The term "and / or" used herein indicates at least one of the items defined by the term, for example, "A and / or B" indicates implementation as "A," or implementation as "A," or implementation as "A and B."

[0024] In order to make the purpose, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0025] The following describes several exemplary embodiments to illustrate the technical solutions of the embodiments of the present invention and the technical effects produced by the technical solutions of the present invention. It should be noted that the following embodiments can refer to, draw on, or combine with each other, and the same terms, similar features, and similar implementation steps in different embodiments will not be repeated.

[0026] The PCB board provided in this application is intended to solve at least one technical problem existing in the prior art.

[0027] In the embodiment of the present application, a PCB board is provided, such as Figs. 1-2 As shown, the PCB board 1 includes at least four reference points, which are dispersed on the PCB board 1; the reference points include a reference hole 11 and a filler 13, the reference hole 11 is set on the side of the PCB board 1 where the component 12 is arranged, and the filler 13 fills the reference hole 11, and the color of the filler 13 is different from the color of the area outside the reference point in the PCB board 1.

[0028] Optionally, the color of the filler 13 can be a high-contrast color, which can be determined according to the color of the PCB board 1 itself, the color of the element 12, and the light, ambient light, and other conditions of the working environment of the chip mounter.

[0029] In an embodiment, the color of the filler 13 can be white or yellow, which can improve the recognizability of the reference point by using the high-contrast color of the filler 13 itself, so that the camera of the chip mounter can quickly identify the reference point from the image of the PCB board 1.

[0030] Optionally, the display screen is fixed in the display screen box 4, which can be an LED screen, an LCD screen, an OLED screen, and other types of screens.

[0031] Optionally, the distance between the reference point and the element 12 on the PCB board 1 is greater than a preset distance, and the element 12 includes at least one of an electronic device, a trace, and a solder pad. By separating the reference point from the element 12, the reference point is prevented from being blocked.

[0032] Optionally, the distance between the reference point and the element 12 can be greater than 1 mm, and the preset distance can be 2 mm or other values, which can be determined according to the size and blocking range of the element 12 adjacent to the reference point.

[0033] In an embodiment, the preset distance can be set as a parameter in the PCB-related drawing software, so that when the drawing software is used to draw the circuit diagram of the PCB board 1, the distance between the reference point and the element 12 can be greater than the preset distance. Specifically, an avoidance range can be set for the reference point in the drawing software, such as a 1 mm range outside the figure, in which elements 12 and traces are prohibited from being placed, to ensure that the reference point is away from the solder pad, the trace, and other elements 12, and to avoid blocking.

[0034] Optionally, the reference hole 11 is formed by laser engraving or mechanical drilling of the PCB board 1. The reference hole 11 is formed by laser engraving or mechanical drilling to ensure the accuracy of the position of the reference hole 11.

[0035] Optionally, the filler 13 is a coating or ink. By filling the filler 13 in the reference hole 11, the reference point is prevented from being contaminated by solder or other materials. To improve the contamination resistance of the reference hole 11, a special coating (such as an anti-pollution coating) or ink can be used, and the reference point made by this method has good durability and wear resistance and is not easily erased or worn.

[0036] Optionally, the vertex or bottom edge of the cross section of the reference hole 11 corresponds to the direction of the PCB board 1. The chip mounter can pre-store the direction corresponding to the vertex or bottom edge of the cross section, so as to determine the mounting mode of the PCB board 1 by using the vertex or bottom edge.

[0037] In one embodiment, the cross section of the reference hole 11 is triangular, and the placement machine can identify whether the PCB 1 is rotated by using the vertex of the triangle, so as to determine whether the PCB 1 is placed correctly. Specifically, as shown in FIGS. 8 and 9, the vertex of the triangle is downward after rotation, so that whether the PCB 1 is rotated can be accurately identified. Fig. 1 、 Fig. 2

[0038] Optionally, the number of reference points corresponds to the size of the PCB 1 or the density of the components 12, wherein the larger the size of the PCB 1 or the higher the density of the components 12, the more the number of reference points.

[0039] Optionally, when the PCB 1 is a rectangular board, the reference points can be arranged at the middle or corner regions of the rectangular board, and the specific arrangement positions of the reference points can be determined according to the shape and size of the PCB 1 and the density of the components 12 in different regions of the PCB 1.

[0040] In one embodiment, for a small PCB 1 (e.g., a PCB 1 with a size less than 100 square centimeters), one reference point can be arranged at each corner; for a large PCB 1 (e.g., a PCB 1 with a size greater than or equal to 100 square centimeters), one reference point can be arranged at each corner and the center position; for a PCB 1 with a high density of components 12, e.g., a specific region of a small PCB 1 has hundreds or even thousands of components 12 (e.g., the density of the components 12 is greater than 4 per square centimeter), reference points can be arranged at key positions of the PCB 1 (e.g., the edge of the region with dense components 12) to ensure identification accuracy. The placement machine has enough reference points to improve identification accuracy, increase redundancy, ensure alignment accuracy, and improve production efficiency.

[0041] Optionally, to avoid excessive redundancy, the reference points are arranged dispersedly on the PCB 1. Specifically, the minimum distance between the reference points is greater than a predetermined threshold, which can be 10 millimeters.

[0042] Optionally, to facilitate distinguishing whether the PCB 1 is rotated or flipped, the reference points can be distributed asymmetrically on the PCB 1, and whether the reference points are rotated or flipped can be determined according to the shape of the pattern formed by all or part of the reference points on the PCB 1.

[0043] Optionally, the top cross section of the reference hole 11 is triangular, and the length of the side of the triangle is greater than a predetermined value. By limiting the length of the side, it is ensured that the placement machine can accurately identify the reference points.

[0044] ​In one embodiment, in order to ensure that the patch machine can accurately identify the reference point of the triangle, the length of the side is at least 1.5 mm. In this way, the reference point can be ensured to have sufficient size and contrast, facilitating the camera to identify.

[0045] Optionally, the PCB board 1 is provided with an identification area corresponding to the reference point, and the identification area is used to identify the reference point. The identification area can be provided with position information or a number corresponding to the reference point, so as to improve the accuracy of the patch machine in identifying the reference point. The position of the identification area can be determined according to the position of the reference point and the distribution position of the components 12 on the PCB board 1.

[0046] In one embodiment, the position and number of the reference point are marked on the PCB board 1, and meanwhile, the position and size information of the reference point are added in the production document. Based on the information in the production document and the marking on the PCB board 1, the camera of the patch machine can quickly identify and locate the reference point, reducing the identification time, and the production personnel can quickly confirm the position of the reference point, reducing the time for manual adjustment, and accelerating the overall production speed.

[0047] It can be known from the above embodiments that the PCB board of the present application has the following beneficial effects:

[0048] Firstly, the present application ensures that the reference point is clearly identifiable by reasonable layout and material selection, reducing identification errors. Secondly, multiple reference points provide high redundancy, so that even if part of the reference points are blocked or damaged, the patch machine can still accurately identify. At the same time, manual intervention and calibration are reduced, the production cycle is shortened, and the production efficiency is improved. The reference point is made by laser engraving or mechanical drilling technology and filled with high-contrast and pollution-resistant materials, ensuring the accuracy of the position of the reference point and maintaining good identification effect after long-term use. The directionality of the reference point helps the patch machine to identify the rotation direction of the PCB board, ensuring the alignment accuracy. The increase of the text auxiliary can make the camera quickly identify and locate the reference point, reduce the identification time, and the production personnel can quickly confirm the position of the reference point, reduce the time for manual adjustment, and accelerate the overall production speed.

[0049] The present application not only improves the identification accuracy and reliability of the reference point, but also enhances the production efficiency and quality of the PCB board, providing strong support for the production process.

[0050] The terms "first", "second", "third", "fourth", "1", "2", etc. (if any) in the specification and claims of the present application and the above drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that shown or described.

[0051] It should be understood that although each operation step in the flowchart of the embodiments of the present application is indicated by an arrow, the implementation order of the steps is not limited to the order indicated by the arrow. Unless explicitly stated herein, in some implementation scenarios of the embodiments of the present application, the implementation steps in each flowchart can be executed in other orders as required. In addition, part or all of the steps in each flowchart can include multiple sub-steps or multiple stages based on the actual implementation scenario. Part or all of these sub-steps or stages can be executed at the same time, and each of these sub-steps or stages can also be executed at different times. In the scenario where the execution times are different, the execution order of these sub-steps or stages can be flexibly configured as required, and the embodiments of the present application do not limit this.

[0052] The above is only an optional implementation of some implementation scenarios of the present application. It should be pointed out that, for ordinary skilled persons in the technical field, other similar implementation means based on the technical idea of the present application without departing from the technical concept of the present application also belong to the protection scope of the embodiments of the present application.

Claims

1. A PCB board, characterized in that: The PCB board includes at least four reference points, and the reference points are distributed on the PCB board; The reference point includes a reference hole and a filler. The reference hole is set on the side of the PCB board where the components are arranged. The filler fills the reference hole, and the color of the filler is different from the color of the area outside the reference point in the PCB board.

2. The PCB board according to claim 1, characterized in that: The distance between the reference point and a component in the PCB board is greater than a preset distance, and the component includes at least one of an electronic device, a trace, and a pad.

3. The PCB board according to claim 1, characterized in that: The reference hole is formed by laser engraving or mechanical drilling on the PCB board.

4. The PCB board according to claim 1, characterized in that: The filler is a coating or ink.

5. The PCB board according to claim 1, characterized in that: The vertex or the bottom edge of the cross section of the reference hole corresponds to the direction of the PCB board.

6. The PCB board according to claim 1, characterized in that: The number of the reference points corresponds to the size or component density of the PCB board.

7. The PCB board according to claim 6, characterized in that: The PCB board is a rectangular board, and the reference point is set in the middle or corner area of ​​the rectangular board.

8. The PCB board according to claim 1, wherein: The top cross-section of the reference hole is a triangle, and the side length of the triangle is greater than a preset value.

9. The PCB board according to claim 1, characterized in that: The PCB board is provided with a marking area corresponding to the reference point, and the marking area is used to mark the reference point.

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