Pouring sealant potting device applied to PCBA electronic module sealing

Abstract

The utility model relates to a pouring sealant pouring device applied to sealing of a PCBA (Printed Circuit Board Assembly) electronic module, which is characterized in that pouring sealant and the PCBA electronic module to be poured are preheated by utilizing a preheating bin, so that the flowability of the pouring sealant after pouring is improved, the pouring sealant can be ensured to completely wrap each electronic element of the PCBA electronic module, and meanwhile, due to the good flowability, the pouring sealant can be prevented from being damaged. The pouring sealant can effectively discharge gas generated in the pouring process, in the normal-temperature environment between the preheating bin and the drying bin, the PCBA electronic module subjected to pouring is slowly cooled, meanwhile, the pouring sealant continues to discharge gas and finally enters the drying bin, the pouring sealant is rapidly cured through high temperature, the curing speed of the pouring sealant is shortened, and the production efficiency of the PCBA electronic module is improved. And finally, the technical effects of improving the encapsulation exhaust effect and the encapsulation speed of the PCBA electronic module are achieved. The technical problem that the curing speed and the exhaust effect are difficult to consider in the pouring sealant curing process is effectively solved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of printed circuit, concretely relates to a potting glue potting device for PCBA electronic module sealing. BACKGROUND

[0002] With the continuous development of society, products with certain protection ability (or insulation, or waterproof and moisture-proof, or dustproof, or anti-vibration and impact, or anticorrosion, etc.) are increasingly widely used in various fields such as industry, construction, home, manufacturing and medical treatment, and have become an indispensable part of our daily life and work.

[0003] In order to achieve these protection capabilities, it is not enough to rely on the protection of the product shell, and the product control work core (i.e. PCBA electronic module) itself must also have certain protection ability. To achieve this protection, using potting glue to wrap and seal PCBA to achieve protection is a common way. The common types of potting glue are: silicone potting glue, epoxy resin potting glue, polyurethane potting glue, acrylic potting glue, etc. These potting glues need to be cured, which can be cured at room temperature or heated, and can be done in air or vacuum environment. In the curing process, how to effectively discharge the gas carried or generated by PCBA itself and the gas carried by the potting glue itself and generated during curing before the potting glue is cured, while improving the curing speed of the potting glue, is a process difficulty in the potting glue process. UTILITY MODEL CONTENT

[0004] The technical problem to be solved by the utility model is to provide a potting glue potting device for PCBA electronic module sealing, which solves the technical problem that the curing process of the potting glue cannot simultaneously consider the curing speed and the exhaust effect.

[0005] The utility model provides technical scheme that application is used to PCBA electronic module sealed potting glue potting device of sealed, including a belt conveyor and the preheating bin and drying bin that set gradually along the conveying direction of belt conveyor, the opposite two side walls of preheating bin are opened with the material port of the upper layer conveying belt and PCBA electronic module's in and out and the through hole that the lower layer conveying belt passes through respectively, be provided with an upper baffle in preheating bin in the upper layer conveying belt top, and the upper baffle separates the preheating bin upper part into a storage cavity, and the storage cavity is used for storing potting glue, the inside of upper baffle is provided with electric heating rod, is used for heating in preheating bin, improves the temperature in preheating bin, preheats potting glue simultaneously, be provided with a glue outlet on the upper baffle, and the glue outlet is connected with a glue injection pump, and the outlet of glue injection pump is connected with the glue injection pipe that extends downward, and the downstream side of glue injection pipe is provided with a detector for detecting PCBA electronic module, when the upper layer conveying belt conveys PCBA electronic module to the just below glue injection pipe, and the detector detects PCBA electronic module just;The opposite two side walls of drying bin are also opened with the material port of the upper layer conveying belt and PCBA electronic module's in and out and the through hole that the lower layer conveying belt passes through respectively, and still be provided with a plurality of electric heating rods in drying bin, preheating bin and drying bin are away from each other, the belt conveyor, glue injection pump are electrically connected with a controller respectively and are controlled to the controller, and the detector is electrically connected with the controller, when the detector detects PCBA electronic module, sends signal to the controller, and the controller accepts signal and suspends belt conveyor, makes PCBA electronic module under the glue injection pipe stop moving, then, the controller controls glue injection pump and starts, and pours potting glue into PCBA electronic module, after pouring is completed, restores and starts belt conveyor.

[0006] As a preferred scheme, a baffle is arranged above the upper layer conveying belt between the preheating bin and the drying bin, the baffle is used for blocking the ash layer to avoid the potting glue in the PCBA electronic module being contaminated by the ash layer.

[0007] As a preferred scheme, the detector is a through-beam laser sensor.

[0008] As a preferred scheme, at least two air blowers are further arranged above the upper layer conveying belt between the preheating bin and the drying bin, any air blower is inclined downward along the conveying direction of the conveying belt, and the inclination directions of the adjacent two air blowers are opposite, the air blowers are arranged above the conveying path of the PCBA electronic module to blow the surface of the potting glue on the passing PCBA electronic module.

[0009] As a preferred scheme, at least two air blowers are arranged above the upper conveying belt in the drying bin, any air blower blows downwardly along the conveying direction of the conveying belt, and the inclination directions of the adjacent two air blowers are opposite, the air blowers are located above the conveying path of the PCBA electronic module, and the air blowers blow the surface of the pouring sealant on the passing PCBA electronic module.

[0010] As a preferred scheme, a cooling bin is connected to the downstream side of the drying bin, the cooling bin shares a side wall with the drying bin, the side wall away from the drying bin is provided with a material opening for the upper conveying belt and the PCBA electronic module to enter and exit and a through hole for the lower conveying belt to pass through.

[0011] As a preferred scheme, a lower partition plate is arranged in each of the preheating bin and the drying bin, the lower partition plate is located between the upper conveying belt and the lower conveying belt, and the lower partition plate closes the preheating bin or the drying bin above the lower conveying belt, so as to reduce the heat loss in the preheating bin and the drying bin.

[0012] The application has the beneficial effects that: the pouring sealant and the PCBA electronic module to be poured are preheated by the preheating bin, so that the flowability of the pouring sealant after pouring is improved, and it is ensured that the pouring sealant can completely wrap each electronic element of the PCBA electronic module, meanwhile, due to the good flowability, the pouring sealant can effectively discharge the gas generated in the pouring process, in the normal temperature environment between the preheating bin and the drying bin, the PCBA electronic module after pouring is slowly cooled, meanwhile, the pouring sealant continues to discharge the gas, finally enters the drying bin, and the pouring sealant is rapidly solidified by high temperature, so that the solidification speed of the pouring sealant is shortened, and finally the technical effects that the pouring speed and the discharging effect of the PCBA electronic module after pouring are both improved are realized. The technical problem that the solidification speed and the discharging effect are difficult to be considered in the pouring sealant solidification process is effectively solved. BRIEF DESCRIPTION OF DRAWINGS

[0013] The specific embodiments of the application will be further described in detail below with reference to the drawings, in which:

[0014] Figure 1 is a structure schematic view of the pouring sealant pouring device for the PCBA electronic module sealing according to embodiment 1.

[0015] Figure 1 In the figure, 1 is a belt conveyor, 2 is a preheating bin, 3 is a drying bin, 4 is a PCBA electronic module, 5 is a material opening, 6 is a through hole, 7 is an upper partition plate, 8 is a storage cavity, 9 is a glue outlet, 10 is a glue injection pump, 11 is a glue injection pipe, 12 is a detector, 13 is an electric heating rod, 14 is a baffle, 15 is an air blower, 16 is a cooling bin, 17 is a lower partition plate, and 18 is a controller. DETAILED DESCRIPTION

[0016] The specific implementation of the utility model is described in detail below with reference to the drawings. Example 1

[0017] As Figure 1 shown in the potting device for potting sealant applied to PCBA electronic module sealing, including a belt conveyor 1 and the preheating bin 2 and drying bin 3 arranged in sequence along the conveying direction of belt conveyor 1, the opposite two side walls of preheating bin 2 are respectively provided with material port 5 for the inlet and outlet of upper conveying belt and PCBA electronic module 4 and through hole 6 for the passage of lower conveying belt, a upper baffle 7 is arranged in preheating bin 2 above the upper conveying belt, the upper baffle 7 separates the upper part of preheating bin 2 into a storage cavity 8, the storage cavity 8 is used for storing potting sealant, the inside of upper baffle 7 is provided with an electric heating rod, which is used for heating in preheating bin 2, improving the temperature in preheating bin 2, and preheating the potting sealant at the same time, an outflow port 9 is formed on the upper baffle 7, the outflow port 9 is connected with a glue injection pump 10, the outlet of glue injection pump 10 is connected with a downward extending glue injection pipe 11, a detector 12 for detecting PCBA electronic module 4 is arranged on the downstream side of glue injection pipe 11, the detector 12 is preferably a through-beam laser sensor, and a reflective light sensor or other types of sensors can also be used. When the upper conveying belt conveys PCBA electronic module 4 to the position directly below glue injection pipe 11, the detector 12 detects PCBA electronic module 4; the opposite two side walls of drying bin 3 are also respectively provided with material port 5 for the inlet and outlet of upper conveying belt and PCBA electronic module 4 and through hole 6 for the passage of lower conveying belt, and a plurality of electric heating rods 13 are arranged in drying bin 3, and the preheating bin 2 and drying bin 3 are arranged separately.

[0018] In this embodiment, a baffle 14 is preferably arranged above the upper conveying belt between preheating bin 2 and drying bin 3, the baffle 14 is used for blocking the ash layer to avoid the potting sealant in PCBA electronic module 4 being contaminated by the ash layer.

[0019] It is further preferred in this embodiment that two air blowers 15 are arranged above the upper conveying belt between preheating bin 2 and drying bin 3, any air blower 15 blows downwardly along the conveying direction of conveying belt, and the inclination directions of adjacent two air blowers 15 are opposite, the air blower 15 is located above the conveying path of PCBA electronic module 4 and blows the surface of potting sealant on passing PCBA electronic module 4, the air blower 15 can adjust the air power and temperature according to the need, and the air power is adjusted according to the standard of being able to blow the bubbles on the surface of potting sealant.

[0020] The upper layer of the drying bin 3 is also provided with four air blowers 15, any air blower 15 is inclined downward along the conveying direction of the conveying belt, and the inclination directions of the adjacent two air blowers 15 are opposite, the air blower 15 is located above the conveying path of the PCBA electronic module 4, and the surface of the potting glue on the passing PCBA electronic module 4 is blown. The air blower 15 can adjust the wind power and temperature according to the needs, and the wind power is taken as the standard that can blow the bubble on the surface of the potting glue.

[0021] In order to avoid the shrinkage cracking caused by the sudden drop of the temperature of the potting glue, the cooling bin 16 is connected downstream of the drying bin 3, the cooling bin 16 shares a side wall with the drying bin 3, the material port 5 for the upper layer conveying belt and the PCBA electronic module 4 to enter and exit and the through hole 6 for the lower layer conveying belt to pass through are arranged on the side wall of the cooling bin 16 away from the drying bin 3.

[0022] The preheating bin 2 and the drying bin 3 are respectively provided with a lower partition plate 17, the lower partition plate 17 is located between the upper layer conveying belt and the lower layer conveying belt, and the lower partition plate 17 closes the preheating bin 2 or the drying bin 3 above the lower layer conveying belt, so that the heat loss in the preheating bin 2 and the drying bin 3 is reduced.

[0023] The belt conveyor 1, the glue injection pump 10 and the detector 12 are respectively electrically connected with a controller 18 and controlled by the controller 18, when the detector 12 detects the PCBA electronic module 4, the detector 12 sends a signal to the controller 18, the controller 18 suspends the belt conveyor 1 when receiving the signal, so that the PCBA electronic module 4 below the glue injection pump 11 stops moving, then the controller 18 controls the glue injection pump 10 to start, and the potting glue is injected into the PCBA electronic module 4, after the injection is completed, the belt conveyor 1 is started again. The glue injection pump 10 preferably has a flow detection type, so as to feedback the injection amount of the potting glue, if the flow detection is not used, the running time of the glue injection pump 10 can be set to control the injection amount of the potting glue, and the control of the injection amount belongs to a conventional technical means, which will not be described in detail here. The controller 18 is a conventional single-chip microcomputer or industrial computer.

[0024] The working process of the utility model is: Figure 1As shown, the user first starts the pouring sealant pouring device, after starting, the electric heating rod 13 in the preheating bin 2 and the drying bin 3 starts heating, the electric heating rod 13 in the preheating bin 2 heats the pouring sealant in the storage cavity 8 and the cavity below the upper partition plate 7 at the same time, the electric heating rod 13 in the drying bin 3 heats the internal space of the drying bin 3, after the temperature in the preheating bin 2 and the drying bin 3 reaches the target temperature, the belt conveyor 1 is started, the user places the PCBA electronic module 4 to be poured at intervals on the upstream end of the belt conveyor 1, the belt conveyor 1 conveys the PCBA electronic module 4 downstream, the PCBA electronic module 4 first enters the preheating bin 2 and is preheated in the preheating bin 2, when the PCBA electronic module 4 moves to the opposite of the detector 12, the detector 12 detects the PCBA electronic module 4, the belt conveyor 1 pauses conveying, at this time, the PCBA electronic module 4 detected by the detector 12 is just located directly below the glue injection pipe 11, the controller 18 controls the glue injection pump 10 to start and pours pouring sealant into the PCBA electronic module 4, after pouring is completed, the belt conveyor 1 is started again, and the PCBA electronic module 4 is poured one by one in this way.

[0025] The PCBA electronic module 4 that completes pouring continues to move downstream, because the pouring sealant and the PCBA electronic module 4 are both preheated, the pouring sealant has good fluidity, can quickly exhaust the gas in the pouring sealant, improves the exhaust effect, before the PCBA electronic module 4 enters the drying bin 3, it is all in the exhaust stage, after the PCBA electronic module 4 enters the drying bin 3, it is baked by high temperature, the pouring sealant quickly solidifies, after the PCBA electronic module 4 leaves the drying bin 3, it is cooled to room temperature, and the pouring process is completed.

[0026] When the PCBA electronic module 4 is located in the area between the preheating bin 2 and the drying bin 3, the pouring sealant still has good fluidity, at this time, the surface of the pouring sealant in the PCBA electronic module 4 is blown by the air blower 15, so that the bubbles on the surface of the glue body are broken and the pits on the surface of the glue body are eliminated.

[0027] After the PCBA electronic module 4 enters the drying bin 3, the surface of the pouring sealant in the PCBA electronic module 4 is still blown by the air blower 15, and bubbles on the surface of the glue body are eliminated as much as possible before the pouring sealant is solidified.

[0028] After the PCBA electronic module 4 is dried, it enters the cooling bin 16, the cooling bin 16 is connected with the drying bin 3, so that the internal temperature is slightly higher than room temperature, the PCBA electronic module 4 can be slowly cooled in the cooling bin 16, and then leaves the cooling bin 16 and is cooled to room temperature at room temperature, so that the solidified pouring sealant can be prevented from being separated from electronic elements or cracked.

[0029] The above examples only illustrate the principles of the present application and its effects and advantages, and part of the applied embodiments, but are not used to limit the present application; it should be noted that, for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are all within the protection scope of the present application.

Claims

1. A potting device for potting potting glue applied to a PCBA electronic module, characterized in that, The application relates to a device for filling and drying PCBA electronic modules, which comprises a belt conveyor and a preheating bin and a drying bin arranged in sequence along the conveying direction of the belt conveyor, opposite side walls of the preheating bin are respectively provided with material outlets for the upper conveying belt and the PCBA electronic module to enter and exit and through holes for the lower conveying belt to pass through, an upper partition plate is arranged above the upper conveying belt in the preheating bin, the upper partition plate separates the upper part of the preheating bin into a storage cavity, the storage cavity is used for storing pouring glue, the inside of the upper partition plate is provided with an electric heating rod for heating the preheating bin and improving the temperature in the preheating bin and preheating the pouring glue, an outlet for the glue is arranged on the upper partition plate, an injection pump is connected to the outlet for the glue, the outlet of the injection pump is connected with a downwardly-extending injection pipe, a detector for detecting the PCBA electronic module is arranged on the downstream side of the injection pipe, the detector detects the PCBA electronic module when the upper conveying belt conveys the PCBA electronic module to the position directly below the injection pipe, opposite side walls of the drying bin are respectively provided with material outlets for the upper conveying belt and the PCBA electronic module to enter and exit and through holes for the lower conveying belt to pass through, a plurality of electric heating rods are arranged in the drying bin, the preheating bin and the drying bin are arranged separately, the belt conveyor and the injection pump are respectively electrically connected with a controller and controlled by the controller, the detector is electrically connected with the controller, the detector sends a signal to the controller when the detector detects the PCBA electronic module, the controller stops the belt conveyor after receiving the signal, the PCBA electronic module below the injection pipe stops moving, then the controller controls the injection pump to start and pours the pouring glue into the PCBA electronic module, and the belt conveyor is started again after the pouring is completed.

2. The potting adhesive potting device according to claim 1, characterized in that A baffle is arranged above the upper conveying belt between the preheating bin and the drying bin, the baffle is used for blocking the ash layer and preventing the pouring glue in the PCBA electronic module from being polluted by the ash layer.

3. The potting adhesive potting device according to claim 1, characterized in that, The detector is a pair of laser sensors.

4. The potting adhesive potting device according to claim 1, characterized in that, At least two air blowers are arranged above the upper conveying belt between the preheating bin and the drying bin, any air blower is inclined downward along the conveying direction of the conveying belt, and the inclination directions of the adjacent two air blowers are opposite, the air blowers are arranged above the conveying path of the PCBA electronic module and blow the surface of the pouring glue on the passing PCBA electronic module.

5. The potting adhesive potting device according to claim 1, characterized in that, At least two air blowers are arranged above the upper conveying belt in the drying bin, any air blower is inclined downward along the conveying direction of the conveying belt, and the inclination directions of the adjacent two air blowers are opposite, the air blowers are arranged above the conveying path of the PCBA electronic module and blow the surface of the pouring glue on the passing PCBA electronic module.

6. The potting adhesive potting device according to claim 1, wherein A cooling bin is connected to the downstream side of the drying bin, the cooling bin shares a side wall with the drying bin, the side wall of the cooling bin away from the drying bin is provided with material outlets for the upper conveying belt and the PCBA electronic module to enter and exit and through holes for the lower conveying belt to pass through.

7. The potting adhesive potting device according to claim 1, wherein A lower partition plate is arranged in the preheating bin and the drying bin, the lower partition plate is located between the upper conveying belt and the lower conveying belt, and the lower partition plate closes the preheating bin or the drying bin above the lower conveying belt to reduce the heat loss in the preheating bin and the drying bin.

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