Powder forming mother board

Abstract

The utility model is suitable for the technical field of mica plates, and provides a powder forming mother board which comprises a lower mica layer and an upper mica layer, and the lower mica layer is located below the upper mica layer. The first reinforcing frame and the second reinforcing frame are arranged between the interiors of the lower mica layer and the upper mica layer, and the first reinforcing frame is located below the second reinforcing frame; the first transverse plate is integrally formed on the inner side wall of the first reinforcing frame; the second transverse plate is integrally formed on the inner side wall of the second reinforcing frame; the connecting columns are welded between the first reinforcing frame and the second reinforcing frame and between the first transverse plate and the second transverse plate; through the arrangement of the first reinforcing frame, the second reinforcing frame, the first adsorption net and the second adsorption net, on one hand, the structural strength of the powder forming mother board is improved through the pre-embedded structure, the problem that a mica board is prone to breakage is avoided, on the other hand, the adsorption force to mica powder is increased, the compactness of the formed mica powder is guaranteed, and the structural strength is further improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to mica plate technical field especially relates to a powder forming mother board. BACKGROUND

[0002] The mica fragments of the mica ore after rough selection, the mica fragments of the mica ore after crushing and the mica fragments of the mica product after production are collectively called powder mica product, and the powder mica product has good high-temperature insulation performance.

[0003] But the powder mica board is formed by powder, and the structure strength is low and easy to break, which limits the use of the powder mica board, and the existing two mica boards are generally connected by glue, but the mica board is easy to shake during the connection process, and the connection of the two mica boards is easy to deviate.

[0004] Therefore, a powder forming mother board is proposed. INVENTION CONTENTS

[0005] The utility model provides a kind of powder forming mother board, to solve the above-mentioned problems.

[0006] The utility model is realized as follows: a kind of powder forming mother board, comprising: lower mica layer and upper mica layer, the lower mica layer is below upper mica layer;First reinforcing frame and second reinforcing frame between the inside of the lower mica layer and upper mica layer are equipped, the first reinforcing frame is below second reinforcing frame;First horizontal plate integrally formed in the inner side wall of the first reinforcing frame;Second horizontal plate integrally formed in the inner side wall of the second reinforcing frame;Connecting column welded between the first reinforcing frame and second reinforcing frame and between the first horizontal plate and second horizontal plate;First butt joint block and second butt joint block welded between the first reinforcing frame and second reinforcing frame and close to the side position of connecting column, the first butt joint block is located on the side of second butt joint block;Insertion column integrally formed in the outer side wall of the first butt joint block;Insertion hole opened in the outer side wall of the second butt joint block;First adsorption net is laid on the top of the second reinforcing frame;Second adsorption net is laid on the bottom of the first reinforcing frame.

[0007] Preferably, the lower mica layer and upper mica layer are powder pressed into shape, and the lower mica layer and upper mica layer fully wrap the first reinforcing frame, second reinforcing frame, first adsorption net and second adsorption net.

[0008] Preferably, the first reinforcing frame and the second reinforcing frame are both rectangular frame structures in cross section.

[0009] Preferably, the insertion column and the insertion hole match and fit, and the insertion column can be inserted into the insertion hole.

[0010] Preferably, semicircular grooves for the insertion of the pillars are provided on the outer side walls of the lower mica layer and the upper mica layer.

[0011] Preferably, the first adsorption net and the second adsorption net are both provided with mesh holes for powder to pass through.

[0012] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0013] By providing the first reinforcement frame, the second reinforcement frame, the first adsorption net, and the second adsorption net, on the one hand, the pre-embedded structure improves the structural strength of the powder-molded motherboard, thereby avoiding the problem of easy breakage of the mica board; on the other hand, the adsorption force on the mica powder is increased, thereby ensuring the compactness of the mica powder after molding, thereby further improving the structural strength. By inserting the pre-embedded plug-in column into the socket, and then using glue to butt-connect the two motherboards at their joints, the two motherboards are ensured to be tightly and firmly connected, thereby avoiding deviation in the butt connection between the two motherboards. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural diagram of the utility model;

[0015] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0016] Figure 3 This is a schematic diagram of the cooperation between the first reinforcement frame and the second reinforcement frame of the utility model;

[0017] Figure 4 It is a structural schematic diagram of the first docking block and the second docking block of the utility model.

[0018] In the figure: 1. Lower mica layer; 2. Upper mica layer; 3. First reinforcement frame; 4. Second reinforcement frame; 5. First horizontal plate; 6. Second horizontal plate; 7. Connecting column; 8. First docking block; 9. Insert column; 10. Second docking block; 11. Insert hole; 12. First adsorption net; 13. Second adsorption net. DETAILED DESCRIPTION

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0020] Reference to "an embodiment" herein means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase "in an embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily all referring to a common embodiment, or an embodiment that is independent of all other embodiments. One of ordinary skill in the art will readily recognize from the disclosure herein, that embodiments of the present application can be combined with embodiments of the other applications.

[0021] The embodiment of the utility model provides a kind of powder forming mother plate, as shown in Figures 1-4 It is below the upper mica layer 2, and the inside of lower mica layer 1 and upper mica layer 2 is embedded with first reinforcing frame 3 and second reinforcing frame 4, the cross section of first reinforcing frame 3 and second reinforcing frame 4 is rectangular frame structure, first reinforcing frame 3 is below second reinforcing frame 4, and first reinforcing frame 3 is integrally formed with first transverse plate 5 on the inner side wall, second reinforcing frame 4 is integrally formed with second transverse plate 6 on the inner side wall, and connecting column 7 is welded between first reinforcing frame 3 and second reinforcing frame 4 and between first transverse plate 5 and second transverse plate 6, first butt block 8 and second butt block 10 are welded at the side position between first reinforcing frame 3 and second reinforcing frame 4 close to connecting column 7, first butt block 8 is located at the side of second butt block 10, and first butt block 8 is integrally formed with plug-in column 9 on the outer wall of the side away from second butt block 10, plug hole 11 is formed on the outer wall of the side of second butt block 10 away from first butt block 8, plug-in column 9 and plug hole 11 match and fit, and plug-in column 9 can be inserted into plug hole 11, first adsorption net 12 is laid on the top of second reinforcing frame 4, second adsorption net 13 is laid on the bottom of first reinforcing frame 3, and mesh holes are formed on first adsorption net 12 and second adsorption net 13 for powder to pass through.

[0022] It should be noted that, since the powder mica plate is formed by powder, the structural strength is low and easy to break, the connection between the two mica plates is easy to shake, and the connection between the two mica plates is easy to deviate, the first reinforcing frame 3, the second reinforcing frame 4, the first adsorption net 12 and the second adsorption net 13 are provided, on the one hand, the structure of the pre-embedded type is used to improve the structural strength of the powder forming mother plate, to avoid the problem that the mica plate is easy to break, on the other hand, the adsorption force of mica powder is increased, to ensure the tightness of the mica powder after forming, to further improve the structural strength, the plug-in column 9 is inserted into the plug hole 11, and then the two mother plates are connected by using glue, to ensure that the two mother plates are connected tightly and firmly, to avoid the deviation of the two mother plates.

[0023] Specifically, in this embodiment, this scheme mainly includes a first reinforcement frame 3 and a second reinforcement frame 4. When the motherboard is formed, mica powder is laid at the lower layer position inside the mold to form a lower mica layer 1, the first reinforcement frame 3 and the second reinforcement frame 4 are placed on the lower mica layer 1, and then the mica powder is laid on the second reinforcement frame 4 to form an upper mica layer 2, and then extrusion molding is performed. During the extrusion molding process, the mica powder is fully in contact with the first adsorption net 12 and the second adsorption net 13, and the tightness between the mica powders is increased, thereby ensuring the strength of the mica powder after molding. The pins 9 protrude from the lower mica layer 1 and the upper mica layer 2. The arrangement of the first reinforcement frame 3, the second reinforcement frame 4, the first cross plate 5 and the second cross plate 6 increases the structural strength, which can avoid the lower mica layer 1 and the upper mica layer 2 from breaking. When the two motherboards are docked, the pins 9 on one of the motherboards are inserted into the sockets 11 on the other motherboard, and then the two motherboards are docked and connected at the docking points with glue to ensure that the two motherboards are tightly and firmly connected and avoid docking deviation of the two motherboards.

[0024] In a further preferred embodiment of the present invention, Figure 1 As shown, the lower mica layer 1 and the upper mica layer 2 are formed by powder pressing, and the lower mica layer 1 and the upper mica layer 2 fully wrap the first reinforcement frame 3, the second reinforcement frame 4, the first adsorption net 12 and the second adsorption net 13.

[0025] In this embodiment, the first adsorption net 12 and the second adsorption net 13 are used to increase the adsorption force on the mica powder to ensure the compactness of the mica powder after molding. The first reinforcement frame 3 and the second reinforcement frame 4 can improve the internal structural strength of the lower mica layer 1 and the upper mica layer 2, thereby avoiding the lower mica layer 1 and the upper mica layer 2 from breaking.

[0026] In a further preferred embodiment of the present invention, Figure 1 As shown, semicircular grooves for the insertion posts 9 to pass through are provided on the outer side walls of the lower mica layer 1 and the upper mica layer 2 .

[0027] In this embodiment, an insertion space is provided for the plug post 9 to be inserted into the plug hole 11 .

[0028] It should be noted that for the aforementioned embodiments, for simplicity of description, they are all expressed as a series of action combinations. However, those skilled in the art should be aware that the present invention is not limited by the order of the actions described, because according to the present invention, certain steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present invention.

[0029] In several embodiments provided by the present application, it should be understood that the disclosed apparatus can be implemented by other manners. For example, the apparatus embodiments described above are merely illustrative, for example, the division of the above units can have another division manner in actual implementation, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or communication connection between the displayed or discussed units can be through some interfaces, indirect coupling or communication connection between the units, and can be electrical or other forms.

[0030] The units described above as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, that is, they can be located in one place, or can be distributed on a plurality of network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0031] The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the protection scope of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add or delete or make other adjustments to the features in each embodiment of the present application according to the circumstances without creative labor, so as to obtain different other technical solutions which do not deviate from the concept of the present application in essence. These technical solutions also belong to the scope of the present application.

Claims

1. A powder formed mother sheet, characterized by, The application relates to a mica sheet, which comprises: a lower mica layer (1) and an upper mica layer (2), wherein the lower mica layer (1) is located below the upper mica layer (2); a first reinforcing frame (3) and a second reinforcing frame (4) arranged between the lower mica layer (1) and the upper mica layer (2), wherein the first reinforcing frame (3) is located below the second reinforcing frame (4); a first horizontal plate (5) integrally formed on the inner side wall of the first reinforcing frame (3); a second horizontal plate (6) integrally formed on the inner side wall of the second reinforcing frame (4); a connecting column (7) welded between the first reinforcing frame (3) and the second reinforcing frame (4) and between the first horizontal plate (5) and the second horizontal plate (6); a first butt joint block (8) and a second butt joint block (10) welded between the first reinforcing frame (3) and the second reinforcing frame (4) and located on one side of the connecting column (7), wherein the first butt joint block (8) is located on one side of the second butt joint block (10); a plug-in column (9) integrally formed on the outer side wall of the first butt joint block (8); a plug-in hole (11) formed on the outer side wall of the second butt joint block (10); a first adsorption net (12) arranged on the top of the second reinforcing frame (4); a second adsorption net (13) arranged on the bottom of the first reinforcing frame (3).

2. A powder formed mother sheet as claimed in claim 1, characterized in that The lower mica layer (1) and the upper mica layer (2) are formed by powder pressing, and the lower mica layer (1) and the upper mica layer (2) fully wrap the first reinforcing frame (3), the second reinforcing frame (4), the first adsorption net (12) and the second adsorption net (13).

3. A powder formed mother sheet as claimed in claim 1, wherein, The first reinforcing frame (3) and the second reinforcing frame (4) are both rectangular frame structures.

4. A powder formed mother sheet as claimed in claim 1, wherein, The plug-in column (9) and the plug-in hole (11) are matched and fitted, and the plug-in column (9) can be inserted into the plug-in hole (11).

5. A powder formed mother sheet as claimed in claim 1, wherein, Half-circular grooves are formed on the outer side walls of the lower mica layer (1) and the upper mica layer (2) and can be penetrated by the plug-in column (9).

6. A powder formed mother sheet as claimed in claim 1, wherein, Mesh holes are formed on the first adsorption net (12) and the second adsorption net (13) and can be penetrated by powder.

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