Printing die assembly and light-emitting element transfer printing device

Abstract

The utility model provides a printing die assembly and a light-emitting element transfer printing device. The stamp assembly may include: a stamp member including a stamp layer including a plurality of pick-up posts, each of the plurality of pick-up posts having an insertion slot defining a central portion and an outer contour portion, a base layer disposed on an upper surface of the stamp layer, and a magnetic layer disposed on a surface of the outer contour portion; and a magnetic plate detachably arranged on the upper surface of the base layer to attract the magnetic layer.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of stamping assembly and light emitting element transfer printing device. BACKGROUND

[0002] With the development of multimedia, the importance of display devices is increasing. For this, various display devices such as organic light emitting display devices (OLED: Organic Light Emitting Display), liquid crystal display devices (LCD: Liquid Crystal Display) are being used.

[0003] As a device that displays an image of a display device, a display panel such as a light emitting display panel or a liquid crystal display panel is included. Among them, the light emitting display panel can include a light emitting diode (LED: Light Emitting Diode), and the light emitting diode includes an organic light emitting diode using an organic substance as a fluorescent substance, or an inorganic light emitting diode using an inorganic substance as a fluorescent substance, etc.

[0004] When manufacturing a display panel using an inorganic light emitting diode as a light emitting diode, a manufacturing device for arranging a micro light emitting diode (Micro LED) on a substrate of the display panel needs to be developed. SUMMARY

[0005] The technical problem to be solved by the utility model is to provide a stamping assembly and a transfer printing device capable of solving the problem of light emitting elements remaining on a donor substrate or on one surface of a stamp in a light emitting element transfer printing process.

[0006] The technical problem of the utility model is not limited to the above-mentioned technical problems, and other technical problems not mentioned can be clearly understood by those skilled in the art through the following description.

[0007] The stamping assembly according to an embodiment for solving the above technical problem can include: a stamping component including a stamping layer, a base layer, and a magnetic layer, the stamping layer including a plurality of pickup columns, each of the plurality of pickup columns having an insertion groove defining a central portion and an outer portion, the base layer being arranged on an upper surface of the stamping layer, and the magnetic layer being arranged on one surface of the outer portion; and a magnetic plate detachably arranged on an upper surface of the base layer to attract the magnetic layer.

[0008] According to an embodiment, one surface of the central portion can be a flat surface, and the insertion groove of the stamping layer can be used for inserting a light emitting element.

[0009] According to an embodiment, when the magnetic plate is disposed on the upper surface of the base layer, the magnetic layer can move toward the magnetic plate, the length of the outer profile portion can be reduced by the attractive force between the magnetic layer and the magnetic plate, and thus the insertion bonding of the light emitting element can be released.

[0010] According to an embodiment, when the magnetic plate is disposed on the lower surface of the magnetic layer, the magnetic layer can move toward the magnetic plate, the length of the outer profile portion can be increased by the attractive force between the magnetic layer and the magnetic plate, and thus the light emitting element can be insertion-bonded.

[0011] According to an embodiment, the cross section of the insertion groove can be one of an inverted V shape, an inverted U shape, and a rectangular shape.

[0012] According to an embodiment, a light emitting element transfer printing apparatus can include a stage supporting a substrate, a stamping member transferring a light emitting element to the substrate on the stage by pick and place, a first magnetic plate detachably disposed on the stamping member, and a second magnetic plate detachably disposed on a lower portion of the stage, wherein the stamping member can include a stamping layer including a plurality of pick-up columns each having an insertion groove defining a central portion and an outer profile portion, a base layer disposed on an upper surface of the stamping layer, and a magnetic layer disposed on a surface of the outer profile portion.

[0013] According to an embodiment, a surface of the central portion can be a flat surface, and the insertion groove of the stamping layer can be used for insertion bonding of the light emitting element. The area of the central portion can be smaller than the area of the light emitting element.

[0014] According to an embodiment, when the first magnetic plate is disposed on the upper surface of the base layer, the magnetic layer can move toward the first magnetic plate, the length of the outer profile portion can be reduced by the attractive force between the magnetic layer and the first magnetic plate, and thus the insertion bonding of the light emitting element can be released.

[0015] According to an embodiment, when the second magnetic plate is disposed on the lower surface of the stage, the magnetic layer can move toward the second magnetic plate, the length of the outer profile portion can be increased by the attractive force between the magnetic layer and the second magnetic plate, and thus the light emitting element can be insertion-bonded.

[0016] According to an embodiment, the substrate can be a donor substrate on which the light emitting element is arranged.

[0017] According to an embodiment, an adhesive layer can be disposed on the donor substrate.

[0018] According to an embodiment, the light emitting element can include an n-type semiconductor, an active layer, a p-type semiconductor, a first contact electrode, and a second contact electrode.

[0019] According to an embodiment, a transfer method of a light emitting element can include the steps of arranging a first substrate on which light emitting elements are arranged on a worktable, arranging a stamp part including a magnetic layer on the light emitting elements, inserting the light emitting elements arranged on the first substrate into insertion grooves of the stamp part and lifting the light emitting elements, and arranging the light emitting elements on a second substrate and arranging a first magnetic plate on the stamp part, thereby releasing the insertion of the light emitting elements from the insertion grooves, wherein the stamp part can include a stamp layer including a plurality of pickup pillars, each of the plurality of pickup pillars can include an insertion groove defining a central portion and an outer portion, and the magnetic layer can be arranged on a surface of the outer portion.

[0020] According to an embodiment, in the step of releasing the insertion of the light emitting elements from the insertion grooves, when the first magnetic plate is arranged on the stamp part, the magnetic layer can be pulled by an attractive force of the magnetic layer and the first magnetic plate, thereby a length of the outer portion is shortened, and thus the insertion of the light emitting elements can be released.

[0021] According to an embodiment, in the step of inserting the light emitting elements into the insertion grooves of the stamp part and lifting the light emitting elements, when the central portion of the stamp part is brought into contact with the light emitting elements and the stamp part is pressed, the central portion can be compressed and a length of the central portion is shortened, and the light emitting elements can be inserted into the insertion grooves.

[0022] According to an embodiment, in the step of inserting the light emitting elements into the insertion grooves of the stamp part and lifting the light emitting elements, when the second magnetic plate is arranged at a lower portion of the worktable, the magnetic layer can be pulled by an attractive force of the magnetic layer and the second magnetic plate, thereby a length of the outer portion is lengthened, and thus the light emitting elements can be inserted into the insertion grooves.

[0023] According to an embodiment, an area of the central portion can be smaller than an area of the light emitting element, and the outer portion can not overlap the light emitting element.

[0024] According to an embodiment, the light emitting element can include an n-type semiconductor, an active layer, a p-type semiconductor, a first contact electrode, and a second contact electrode.

[0025] A bonding layer can be arranged on the first substrate and the second substrate according to an embodiment.

[0026] According to an embodiment, the problem that the light emitting elements cannot be completely transferred when transferring and remain on the donor substrate or the stamp can be solved by picking up the light emitting elements by the insertion slot. Thus, the product quality and yield of the display device when performing the transfer process can be improved.

[0027] Also, since the repair process and the stamp cleaning process are not required, the equipment cost and the process performing cost can be reduced.

[0028] The effects according to the embodiments are not limited by the above examples, and more various effects are included in the present specification. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a layout diagram illustrating a display device according to an embodiment.

[0030] Figure 2 is an example diagram illustrating an example of a pixel of Figure 1

[0031] Figure 3 is an example diagram illustrating another example of a pixel of Figure 1

[0032] Figure 4 is a cross-sectional view illustrating an example of a display panel taken along A-A' of Figure 2

[0033] Figure 5 is a cross-sectional view illustrating a structure of a stamp assembly according to an embodiment.

[0034] Figure 6 is an enlarged view of an A region of Figure 5

[0035] Figure 7 and Figure 8 is an enlarged view of an A region according to another modified example.

[0036] Figure 9 and Figure 10 are diagrams for explaining a change in the relative position of the magnetic layer and the length of the outer profile portion according to the position of the magnetic plate.

[0037] Figure 11 is a diagram illustrating a light emitting element transfer device according to an embodiment.

[0038] Figure 12 is a flowchart illustrating a light emitting element transfer method according to an embodiment.

[0039] Figures 13 to 19 is a cross-sectional view for explaining a light emitting element transfer method according to another embodiment.

[0040] ​​​​Figures 20 to 26 is a cross-sectional view for illustrating a light emitting element transfer method according to still another embodiment.

[0041] Explanation of Reference Signs

[0042] DETAILED DESCRIPTION

[0043] The advantages and features of the present application as well as methods of accomplishing the advantages and features will be apparent from embodiments explained in detail below with reference to the accompanying drawings. However, the present application is not limited to the embodiments disclosed below, which can be implemented in various forms different from each other, and the present embodiments are provided merely to make the present application complete and to inform those skilled in the art to which the present application pertains of the scope of the present application completely, and the present application is defined only by the scope of the claims.

[0044] When elements or layers are referred to as being "on" other elements or layers, it includes all cases of being on, above, or interposed between other layers or elements. Throughout the specification, like reference numerals refer to like elements throughout the specification. Shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for explaining the embodiments are exemplary, and thus are not limited to matters shown by the present application.

[0045] Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

[0046] Figure 1 is a layout view illustrating a display device according to an embodiment. Figure 2 is an example view illustrating a pixel of Figure 1 Figure 3 is an example view illustrating a pixel of Figure 1

[0047] Referring to Figures 1 to 3 ​​The display device, as a device for displaying a dynamic image or a still image, can be used not only as a display screen of a portable electronic device such as a mobile phone, a smart phone, a tablet personal computer (PC), a smart watch, a watch phone, a mobile communication terminal, an electronic organizer, an electronic book, a portable multimedia player (PMP), a navigator, an Ultra Mobile PC (UMPC), etc., but also as a display screen of a television, a notebook computer, a monitor, an advertisement board, an internet of things (IOT) device, etc.

[0048] The display panel 100 can be formed in a planar shape of a rectangle having a long side in a first direction DR1 and a short side in a second direction DR2 intersecting the first direction DR1. A corner where the long side in the first direction DR1 meets the short side in the second direction DR2 can be formed smoothly with a predetermined curvature or as a right angle. The planar shape of the display panel 100 is not limited to a quadrangle, and can be formed in other polygons, a circle, or an ellipse. The display panel 100 can be formed flat, but is not limited thereto. For example, the display panel 100 can include curved portions formed at left and right side ends and having a predetermined curvature or a varying curvature. Also, the display panel 100 can be formed flexibly to be capable of being bent, folded, curved, folded, or curled.

[0049] The display panel 100 can further include pixels PX, scan wirings extending in the first direction DR1, and data wirings extending in the second direction DR2 to display an image. The pixels PX can be arranged in a matrix shape in the first direction DR1 and the second direction DR2.

[0050] Each of the pixels PX can include a plurality of sub-pixels RP, GP, B'P as shown in Figure 2 and Figure 3 Each of the pixels PX is schematically shown as including three sub-pixels RP, GP, B'P (i.e., a first sub-pixel RP, a second sub-pixel GP, and a third sub-pixel B'P) in Figure 2 and Figure 3 However, embodiments of the present specification are not limited thereto.

[0051] The first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel B'P can be connected to one of the data wirings and at least one of the scan wirings.

[0052] Each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel B'P can have a planar shape of a rectangle, a square, or a rhombus. For example, as shown in FIG. 1A, each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel B'P can have a planar shape of a rectangle including a short side in the first direction DR1 and a long side in the second direction DR2. Alternatively, as shown in FIG. 1B, each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel B'P can have a planar shape of a square or a rhombus including a side having a length in the first direction DR1 same as a length in the second direction DR2. Figure 2 Figure 3

[0053] As shown in FIG. 1A, the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel B'P can be arranged along the first direction DR1. Alternatively, one of the second sub-pixel GP and the third sub-pixel B'P and the first sub-pixel RP can be arranged along the first direction DR1, and the remaining one and the first sub-pixel RP can be arranged along the second direction DR2. For example, as shown in FIG. 1C, the first sub-pixel RP and the second sub-pixel GP can be arranged along the first direction DR1, and the first sub-pixel RP and the third sub-pixel B'P can be arranged along the second direction DR2. Figure 2 Figure 3

[0054] Alternatively, one of the first sub-pixel RP and the third sub-pixel B'P and the second sub-pixel GP can be arranged along the first direction DR1, and the remaining one and the second sub-pixel GP can be arranged along the second direction DR2. Alternatively, one of the first sub-pixel RP and the second sub-pixel GP and the third sub-pixel B'P can be arranged along the first direction DR1, and the remaining one and the third sub-pixel B'P can be arranged along the second direction DR2.

[0055] The first sub-pixel RP can include a first light emitting element emitting a first light, the second sub-pixel GP can include a second light emitting element emitting a second light, and the third sub-pixel B'P can include a third light emitting element emitting a third light. The first light can be a light of a red wavelength band, the second light can be a light of a green wavelength band, and the third light can be a light of a blue wavelength band. The red wavelength band can be a wavelength band of about 600 nm to 750 nm, the green wavelength band can be a wavelength band of about 480 nm to 560 nm, and the blue wavelength band can be a wavelength band of about 370 nm to 460 nm, but embodiments of the present specification are not limited thereto.

[0056] ​​​​Each of the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel B'P can include an inorganic light-emitting element having an inorganic semiconductor as a light-emitting element that emits light. For example, the inorganic light-emitting element can be a flip chip type micro light-emitting diode (LED: Light Emitting Diode), but embodiments of the present specification are not limited thereto.

[0057] As shown in Figure 2 and Figure 3 , the area of the first sub-pixel RP, the area of the second sub-pixel GP, and the area of the third sub-pixel B'P can be substantially the same, but embodiments of the present specification are not limited thereto. At least one of the area of the first sub-pixel RP, the area of the second sub-pixel GP, and the area of the third sub-pixel B'P can be different from the other. Alternatively, two of the area of the first sub-pixel RP, the area of the second sub-pixel GP, and the area of the third sub-pixel B'P can be substantially the same, and the remaining one can be different from the two. Alternatively, the area of the first sub-pixel RP, the area of the second sub-pixel GP, and the area of the third sub-pixel B'P can be different from each other.

[0058] Figure 4 is a cross-sectional view showing an example of the display panel taken along A-A' of Figure 2 .

[0059] Referring to Figure 4 , the display panel 100 can include a thin film transistor layer TFTL and a light-emitting element LE disposed on a substrate SUB. The thin film transistor layer TFTL can be a layer formed of a thin film transistor (TFT: Thin Film Transistor).

[0060] The thin film transistor layer TFTL includes an active layer ACT, a first gate layer GTL1, a second gate layer GTL2, a first data metal layer DTL1, a second data metal layer DTL2, a third data metal layer DTL3, and a fourth data metal layer DTL4. In addition, the thin film transistor layer TFTL includes a buffer film BF, a gate insulating film 130, a first interlayer insulating film 141, a second interlayer insulating film 142, a first planarization film 160, a first insulating film 161, a second planarization film 180, and a second insulating film 181.

[0061] The substrate SUB can be a base substrate or a base member for supporting a display device. The substrate SUB can be a rigid substrate of a glass material, but embodiments of the present specification are not limited thereto. The substrate SUB can be a flexible substrate capable of bending, folding, rolling, or the like. In this case, the substrate SUB can include an insulating substance such as a polyimide (PI) or the like.

[0062] A buffer film BF can be disposed on one surface of the substrate SUB. The buffer film BF can be a film for preventing air or moisture from penetrating. The buffer film BF can be configured with a plurality of inorganic films alternately stacked. For example, the buffer film BF can be formed as a multi-film in which one or more inorganic films of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. The buffer film BF can be omitted.

[0063] An active layer ACT can be disposed on the buffer film BF. The active layer ACT can include a silicon semiconductor such as polysilicon, single crystal silicon, low-temperature polysilicon, and amorphous silicon, or can include an oxide semiconductor.

[0064] The active layer ACT can include a channel TCH of a thin film transistor TFT, a first electrode TS, and a second electrode TD. The channel TCH of the thin film transistor TFT can be an area overlapping with a gate electrode TG of the thin film transistor TFT in a third direction DR3 that is a thickness direction of the substrate SUB. The first electrode TS of the thin film transistor TFT can be disposed on one side of the channel TCH, and the second electrode TD can be disposed on the other side of the channel TCH. The first electrode TS and the second electrode TD of the thin film transistor TFT can be areas not overlapping with the gate electrode TG in the third direction DR3. The first electrode TS and the second electrode TD of the thin film transistor TFT can be areas having conductivity by doping ions in a silicon semiconductor or an oxide semiconductor.

[0065] A gate insulating film 130 can be disposed on the active layer ACT. The gate insulating film 130 can be formed with an inorganic film (for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0066] A first gate layer GTL1 can be disposed on the gate insulating film 130. The first gate layer GTL1 can include the gate electrode TG of the thin film transistor TFT and a first capacitor electrode CAE1. The first gate layer GTL1 can be formed as a single layer or a multi-layer configured with one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0067] A first interlayer insulating film 141 can be arranged on the first gate layer GTL1. The first interlayer insulating film 141 can be formed using an inorganic film (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0068] A second gate layer GTL2 can be arranged on the first interlayer insulating film 141. The second gate layer GTL2 can include a second capacitor electrode CAE2. The second gate layer GTL2 can be formed as a single layer or a multilayer using one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0069] A second interlayer insulating film 142 can be arranged on the second gate layer GTL2. The second interlayer insulating film 142 can be formed using an inorganic film (e.g., a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer).

[0070] A first data metal layer DTL1 including a first connection electrode CE1, a first sub-pad (not shown), and a data wiring (not shown) can be arranged on the second interlayer insulating film 142. The data wiring (not shown) can be formed integrally with the first sub-pad (not shown), but embodiments of the present specification are not limited thereto. The first data metal layer DTL1 can be formed as a single layer or a multilayer using one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0071] The first connection electrode CE1 can be connected to the first electrode TS or the second electrode TD of the thin film transistor TFT through a first contact hole CT1 that penetrates the first interlayer insulating film 141 and the second interlayer insulating film 142.

[0072] A first planarization film 160 for flattening a step difference caused by the active layer ACT, the first gate layer GTL1, the second gate layer GTL2, and the first data metal layer DTL1 can be arranged on the first data metal layer DTL1. The first planarization film 160 can be formed using an organic film of an acryl resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

[0073] A second data metal layer DTL2 can be arranged on the first planarization film 160. The second data metal layer DTL2 can include a second connection electrode CE2 and a second sub-pad (not shown). The second connection electrode CE2 can be connected to the first connection electrode CE1 through a second contact hole CT2 that penetrates the first insulating film 161 and the first planarization film 160. The second data metal layer DTL2 can be formed as a single layer or a plurality of layers composed of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0074] A second planarization film 180 can be arranged on the second data metal layer DTL2. The second planarization film 180 can be formed of an organic film of an acryl resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

[0075] A third data metal layer DTL3 can be arranged on the second planarization film 180. The third data metal layer DTL3 can include a third connection electrode CE3 and a third sub-pad (not shown). The third connection electrode CE3 can be connected to the second connection electrode CE2 through a third contact hole CT3 that penetrates the second insulating film 181 and the second planarization film 180. The third data metal layer DTL3 can be formed as a single layer or a plurality of layers composed of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0076] A third planarization film 190 can be arranged on the third data metal layer DTL3. The third planarization film 190 can be formed of an organic film of an acryl resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, or the like.

[0077] A fourth data metal layer DTL4 can be arranged on the third planarization film 190. The fourth data metal layer DTL4 can include anode pad electrodes APD, cathode pad electrodes CPD, and fourth sub-pads (not shown). The anode pad electrodes APD can be connected to the third connection electrodes CE3 through fourth contact holes CT4 that penetrate the third planarization film 190. The cathode pad electrodes CPD can receive a first power supply voltage as a low potential voltage. The fourth data metal layer DTL4 can be formed as a single layer or a multilayer using one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0078] A transparent conductive layer (not shown) for improving adhesion with the first and second contact electrodes CTE1, CTE2 of the light emitting element LE can be arranged on each of the anode pad electrodes APD and the cathode pad electrodes CPD. The transparent conductive layer (not shown) can be formed using a transparent conductive oxide such as indium tin oxide (ITO) and indium zinc oxide (IZO). In another embodiment, the transparent conductive layer (not shown) can be omitted.

[0079] A protective film (not shown) can be arranged on the anode pad electrodes APD, the cathode pad electrodes CPD, and the first pads (not shown). The protective film (not shown) can be arranged to cover edges of the anode pad electrodes APD, the cathode pad electrodes CPD, and the first pads (not shown). The protective film (not shown) can be formed using an inorganic film such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. In another embodiment, the protective film (not shown) can be omitted.

[0080] The light emitting element LE is schematically shown as a flip chip type micro LED in which the first and second contact electrodes CTE1, CTE2 are arranged to face the anode pad electrodes APD and the cathode pad electrodes CPD, but is not limited thereto. The light emitting element LE can be an inorganic light emitting element formed using an inorganic substance such as GaN. The length in the first direction DR1, the length in the second direction DR2, and the length in the third direction DR3 of the light emitting element LE can each be several μm to several hundred μm. For example, each of the length in the first direction DR1, the length in the second direction DR2, and the length in the third direction DR3 of the light emitting element LE can be about 100 μm or less.

[0081] The light emitting elements LE can be grown on a semiconductor substrate such as a silicon wafer. Each of the light emitting elements LE can be transferred directly from the silicon wafer to the anode pad electrode APD and the cathode pad electrode CPD of the substrate SUB. In this case, the first contact electrode CTE1 and the anode pad electrode APD can be adhered to each other by a bonding process. Also, the second contact electrode CTE2 and the cathode pad electrode CPD can be adhered to each other by a bonding process. The first contact electrode CTE1 and the anode pad electrode APD can be electrically connected to each other by a bonding electrode 23. Also, the second contact electrode CTE2 and the cathode pad electrode CPD can be electrically connected to each other by a bonding electrode 23.

[0082] As an example, the bonding electrode 23 can be disposed on a surface of the light emitting element LE. The bonding electrode 23 can be a bonding material using a pressurized fusion bonding with a laser. Here, the pressurized fusion bonding refers to a state in which the bonding electrode 23 is heated and fused to fuse and mix the light emitting element LE with the anode pad electrode APD and the cathode pad electrode CPD, and is cooled and solidified when the supply of the laser is finished. Since the electrical conductivity based on the light emitting element LE and the anode pad electrode APD and the cathode pad electrode CPD is maintained while being cooled and solidified from the fused and mixed state, the anode pad electrode APD and the cathode pad electrode CPD can be electrically connected to the light emitting element LE, respectively, and physically connected. Accordingly, the bonding electrode 23 can be disposed on the first contact electrode CTE1 and the second contact electrode CTE2 of the light emitting element LE.

[0083] The bonding electrode 23 can include, for example, Au, AuSn, PdIn, InSn, NiSn, Au-Au, AgIn, AgSn, Al, Ag, or a carbon nanotube (CNT), or the like. These can be used individually or in a combination of two or more. The bonding electrode 23 can be formed by being deposited on the pad electrode or can be formed on the pad electrode by various methods such as screen printing, depending on the kind of the bonding electrode 23.

[0084] Alternatively, each of the light emitting elements LE can be transferred to the anode pad electrode APD and the cathode pad electrode CPD of the substrate SUB using a transfer member. For this, reference will be made to Figures 5 to 26 which will be described later.

[0085] Each of the light emitting elements LE can be a light emitting structure including a base substrate S SUB, an n-type semiconductor N SEM, an active layer MQW, a p-type semiconductor P SEM, a first contact electrode CTE1, and a second contact electrode CTE2.

[0086] The base substrate S SUB can be a sapphire substrate, but embodiments of the present specification are not limited thereto.

[0087] The n-type semiconductor NSEM can be disposed on a surface of the base substrate SSUB. For example, the n-type semiconductor NSEM can be disposed on a lower surface of the base substrate SSUB. The n-type semiconductor NSEM can be configured with GaN doped with an n-type conductivity dopant such as Si, Ge, Sn, or the like.

[0088] The active layer MQW can be disposed on a portion of a surface of the n-type semiconductor NSEM. The active layer MQW can include a single quantum well structure or a multiple quantum well structure. In the case where the active layer MQW includes a multiple quantum well structure, it can also be a structure in which a plurality of well layers and barrier layers are alternately stacked. At this time, the well layers can be formed of InGaN, and the barrier layers can be formed of GaN or AlGaN, but are not limited thereto. Alternatively, the active layer MQW can be a structure in which a semiconductor material of a high band gap and a semiconductor material of a low band gap are alternately stacked, and can include different group III to group V semiconductor materials according to a wavelength band of emitted light.

[0089] Figure 5 FIG. 1 is a cross-sectional view illustrating a structure of a stamp assembly according to an embodiment, Figure 6 Figure 5 is a magnified view of an A region of Figure 7 Figure 8 is a magnified view of the A region according to another modified example.

[0090] Referring to Figure 5 Figure 6 The stamp assembly SA can include a stamp member 20 and a magnetic plate 30.

[0091] The stamp member 20 is formed of a material that transmits laser light, and includes a base layer 210, a stamp layer 220 disposed on a surface of the base layer 210, and a magnetic layer 230.

[0092] For example, the base layer 210 can be formed of glass or plastic. In the case where the base layer 210 includes glass having a thin thickness, the glass can be ultra-thin tempered glass. Alternatively, the base layer 210 can be formed of polyethylene terephthalate (PET), polyurethane (PU), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), cyclic olefin polymer (COP), or the like.

[0093] The stamp layer 220 can be formed of an acrylic, urethane, or silicon-based material, but is not limited thereto. ​​​

[0094] The stamp layer 220 includes a plurality of pick-up pillars 221. The pick-up pillars 221 are prism-shaped or cylindrical and include an insertion groove 221-O defining a central portion 221-C and an outer portion 221-S. The central portion 221-C is positioned inwardly relative to the insertion groove 221-O, while the outer portion 221-S is positioned outwardly relative to the insertion groove 221-O. The outer portion 221-S can be separated from the insertion groove 221-O by the central portion 221-C. The outer portion 221-S can be positioned around the central portion 221-C, but is not limited thereto.

[0095] A surface of the central portion 221 -C may be a flat surface.

[0096] The pickup post 221 includes a central portion 221-C contacting the light emitting element LE and an outer portion 221-S surrounding the central portion 221-C. The central portion 221-C may be wider than the outer portion 221-S, but is not limited thereto.

[0097] The magnetic layer 230 can be disposed below the outer portion 221-S of the stamp layer 220. The magnetic layer 230 can be formed on the outer portion 221-S using methods such as photolithography, nanoimprint lithography, inkjet printing, or screen printing. The magnetic layer 230 can be formed from steel or other magnetic materials. For example, the magnetic layer 230 can include at least one material selected from the group consisting of iron, cobalt, nickel, alloys of these metals, neodymium, gadolinium, samarium-cobalt alloys, and iron-neodymium-boron alloys.

[0098] The magnetic plate 30 may have an area sufficient to overlap all of the pickup posts 221 of the stamp layer 220 .

[0099] The magnetic plate 30 may be detachably disposed on the upper portion or the lower portion of the stamp member 20. For example, the magnetic plate 30 may be detachably disposed on the upper portion of the base layer 210.

[0100] The relative position of the magnetic layer 230 with respect to the central portion 221 -C and the length of the outer portion 221 -S may be changed depending on whether the magnetic plate 30 is attached or detached.

[0101] The magnetic plate 30 may be a permanent magnet or an electromagnet.

[0102] In addition, if Figure 6 As shown, the side surface S1 of the central portion 221-C may be perpendicular to a surface of the central portion 221-C. The inner surface SS1 of the outer portion 221-S may be inclined relative to a surface of the outer portion 221-S. For example, the angle θ formed by the inner surface SS1 of the outer portion 221-S and a surface of the outer portion 221-S may be an obtuse angle greater than 90 degrees.

[0103] In another modification, as shown in Figure 7 the cross section of the insertion groove 221-O can have an inverted V shape in which the width narrows as it approaches the base layer 210 side, but is not limited thereto. For example, it can also have an inverted U shape.

[0104] In still another modification, as shown in Figure 8 the cross section of the insertion groove 221-O can be rectangular.

[0105] Figure 9 and Figure 10 are diagrams for illustrating changes in the relative position of the magnetic layer and the length of the outer portion according to the position of the magnetic plate.

[0106] Referring to Figure 9 , the magnetic plate 30 can be disposed on the upper surface of the stamp member 20. For example, the magnetic plate 30 can be disposed on one surface of the base layer 210.

[0107] In the case where the magnetic plate 30 is disposed on one surface of the base layer 210, an attractive force is generated between the magnetic layer 230 and the magnetic plate 30. The magnetic layer 230 can be lifted by the attractive force between the magnetic layer 230 and the magnetic plate 30, and the outer portion 221-S of the stamp layer 220 is pressed, so that the length of the outer portion 221-S can be contracted. Thus, the length of the outer portion 221-S can become smaller than the length of the central portion 221-C.

[0108] Referring to Figure 10 , the magnetic plate 30 can be disposed on the lower surface of the stamp member 20. For example, the magnetic plate 30 can be disposed to face the magnetic layer 230.

[0109] In the case where the magnetic plate 30 is disposed on the lower surface of the stamp member 20, an attractive force is generated between the magnetic layer 230 and the magnetic plate 30. The magnetic layer 230 can be pulled in the direction of the lower portion where the magnetic plate 30 is disposed by the attractive force between the magnetic layer 230 and the magnetic plate 30. Thus, the length of the outer portion 221-S of the stamp layer 220 can increase. Therefore, the length of the outer portion 221-S can be greater than the length of the central portion 221-C.

[0110] Figure 11 is a diagram showing a light emitting element transfer printing apparatus according to an embodiment.

[0111] The light emitting element transfer printing apparatus can include a stamp assembly SA, a stage ST, and a magnetic plate MP. The description of the stamp assembly SA is referred to the description of Figures 5 to 10 . In addition, the description of Figure 11In the illustrated embodiment, the magnetic plate 30 of the stamp assembly SA is referred to as the first magnetic plate 30 , and the magnetic plate MP is referred to as the second magnetic plate MP to distinguish it from the magnetic plate 30 of the stamp assembly SA. The second magnetic plate MP may also be a permanent magnet or an electromagnet.

[0112] The work table ST serves to support a substrate. The substrate may be a donor substrate DS. The donor substrate DS may include an adhesive layer on its upper surface. The donor substrate DS may be placed on the work table ST. A light emitting element LE may be placed on the donor substrate DS.

[0113] The second magnetic plate MP may have an area capable of entirely overlapping the pickup pins 221 of the stamp layer 220 .

[0114] The second magnetic plate MP may be detachably disposed at a lower portion of the stage ST.

[0115] The relative position of the magnetic layer 230 with respect to the central portion 221-C and the length of the outer portion 221-S can be varied depending on whether the second magnetic plate MP is installed or removed. For example, when the second magnetic plate MP is placed on the lower surface of the worktable ST, an attractive force is generated between the magnetic layer 230 and the second magnetic plate MP of the stamp member 20. This attractive force between the magnetic layer 230 and the second magnetic plate MP pulls the magnetic layer 230 toward the lower portion where the second magnetic plate MP is placed. This increases the length of the outer portion 221-S of the stamp layer 220. Consequently, the outer portion 221-S can be made longer than the central portion 221-C.

[0116] Figure 12 FIG. 1 is a flowchart illustrating a light emitting element transfer method according to an embodiment.

[0117] Figures 13 to 19 It is a cross-sectional view for explaining a light emitting element transfer method according to another embodiment. Figures 12 to 19 It is used to illustrate the use of reference Figures 5 to 10 A cross-sectional view illustrating a method of transferring a light-emitting element by a light-emitting element transfer device. Figures 13 to 19 The stamp assembly SA described in the Figures 5 to 10 The impression assembly SA is described.

[0118] In the following, we will combine Figure 12 right Figures 13 to 19 A method for manufacturing the display device shown will be described.

[0119] Reference Figure 13 , the first substrate DS and the stamp member 20 ( Figure 12 Here, the first substrate DS may be the donor substrate DS as described above, and thus is given the same reference numerals as those of the donor substrate DS.

[0120] A bonding layer can be coated on the first substrate DS. The plurality of light emitting elements LE can be arranged on the bonding layer of the first substrate DS.

[0121] The stamper member 20 can be arranged with the base layer 210 on the upper portion and the stamper layer 220 on the lower portion, and each of the plurality of pickup columns 221 of the stamper layer 220 aligned on the light emitting element LE. For example, the central portion 221-C of the plurality of pickup columns 221 can be arranged on the light emitting element LE. The outer profile portion 221-S of the plurality of pickup columns 221 can not overlap the light emitting element LE.

[0122] Referring to Figure 14 and Figure 15 The light emitting element LE arranged on the first substrate DS is inserted into the insertion groove 221-O of the stamper member 20, thereby being separated from the first substrate DS and lifted up (S120). Figure 12

[0123] For example, a surface of the central portion 221-C of the stamper member 20 is brought into contact with the light emitting element LE, thereby bonding the light emitting element LE to the bonding layer of the first substrate DS. Then, the stamper member 20 is pressurized downward from the upper portion, and the central portion 221-C arranged on the light emitting element LE is compressed by the pressurization, thereby the length of the central portion 221-C is reduced, and the light emitting element LE is inserted and coupled to the insertion groove 221-O. The coupling force between the inserted and coupled light emitting element LE and the stamper member 20 is greater than the bonding force of the bonding layer of the first substrate DS. Therefore, when the stamper member 20 is lifted up, the light emitting element LE can be separated from the first substrate DS and lifted up.

[0124] Referring to Figures 16 to 19 The light emitting element LE is transferred to the second substrate BP (S130). Figure 12 The second substrate BP can be the display panel 100 of Figure 4 , but is not limited thereto. For example, the second substrate BP can be another relay substrate. A bonding layer can be arranged on the second substrate BP.

[0125] For example, as shown in Figure 16 , the light emitting element LE is arranged on the second substrate BP, as shown in Figure 17 , the light emitting element LE is brought into contact with the bonding layer on the second substrate BP, and then the light emitting element LE can be pressurized to be attached to the bonding layer.

[0126] Then, as shown in Figure 18 and Figure 19 ​As shown, the first magnetic plate 30 is arranged on the base layer 210 of the stamp member 20. When the first magnetic plate 30 is arranged on the base layer 210 of the stamp member 20, the magnetic layer 230 can be pulled in the direction of the first magnetic plate 30 by the attractive force between the magnetic layer 230 and the first magnetic plate 30. Thus, the length of the outer profile portion 221-S of the stamp member 20 is shortened, so that the insertion bonding of the light emitting element LE can be released. Thereafter, the light emitting element LE and the stamp assembly SA are separated by lifting the stamp assembly SA.

[0127] Figures 20 to 26 is a cross-sectional view for explaining a light emitting element transfer method according to still another embodiment. Figures 20 to 26 is a cross-sectional view for explaining a method of transferring a light emitting element by a light emitting element transfer apparatus explained with reference to Figure 11 Figures 20 to 26 The stamp assembly SA explained in Figures 5 to 10 may correspond to the stamp assembly SA explained with reference to

[0128] Hereinafter, a manufacturing method of a display device shown in Figure 12 will be explained. Figures 20 to 26

[0129] With reference to Figure 20 , the first substrate DS and the stamp member 20 can be arranged on the work table ST (S110 of Figure 12 . Here, the first substrate DS can be the donor substrate DS as explained above, so that the same reference numerals are given as the donor substrate DS.

[0130] With reference to Figure 21 and Figure 22 , the light emitting element LE arranged on the first substrate DS is inserted and bonded to the insertion groove 221-O of the stamp member 20, so that it is separated from the first substrate DS and lifted (S120 of Figure 12 ).

[0131] For example, when the second magnetic plate MP is arranged on the lower portion of the work table ST, the magnetic layer 230 is pulled by the attractive force between the magnetic layer 230 of the stamp member 20 and the second magnetic plate MP, so that the length of the outer profile portion 221-S is lengthened. Thus, the light emitting element LE can be inserted and bonded to the insertion groove 221-O.

[0132] With reference to Figure 21 , although a case where the second magnetic plate MP is moved from the lower portion to the upper portion of the work table ST is explained, this is an example in which the second magnetic plate MP is composed of a permanent magnet. In the case where the second magnetic plate MP is an electromagnet, the second magnetic plate MP can be fixed in a state of being in close contact with the lower portion of the work table ST.

[0133] With reference to​​Figures 23 to 26 transferring the light emitting element LE onto the second substrate BP (S130). Figure 12 of S130).

[0134] The second substrate BP can be a display panel 100 of Figure 4 but is not limited thereto. For example, the second substrate BP can be another relay substrate.

[0135] For example, as shown in FIG. 1, the light emitting element LE is arranged on the second substrate BP, as shown in FIG. 2, the light emitting element LE is brought into contact with the adhesive layer on the second substrate BP, and then the light emitting element LE can be pressed to be attached to the adhesive layer. Figure 23 Figure 24 For example, as shown in FIG. 1, the light emitting element LE is arranged on the second substrate BP, as shown in FIG. 2, the light emitting element LE is brought into contact with the adhesive layer on the second substrate BP, and then the light emitting element LE can be pressed to be attached to the adhesive layer.

[0136] Then, as shown in FIG. 3 and FIG. 4, the first magnetic plate 30 is arranged on the base layer 210 of the stamp member 20. When the first magnetic plate 30 is arranged on the base layer 210 of the stamp member 20, the magnetic layer 230 can be pulled toward the first magnetic plate 30 by the attractive force of the magnetic layer 230 and the first magnetic plate 30. Thus, the length of the outer contour portion 221-S of the stamp member 20 is shortened, so that the insertion bonding of the light emitting element LE can be released. Thereafter, the light emitting element LE and the stamp assembly SA are separated by lifting the stamp assembly SA. The adhesive force between the light emitting element LE and the second substrate BP is greater than the bonding force (or adhesive force) between the central portion 221-C of the stamp assembly SA and the light emitting element LE. The adhesive force on the second substrate BP is greater than the adhesive force of the central portion 221-C of the stamp assembly SA. Figure 25 Figure 26 For the stamp assembly not including the insertion groove, the transfer process is performed by bringing the light emitting element into contact with one surface of the stamp layer. At this time, in the case where one surface of the stamp is uneven, the problem that the stamp and the light emitting element are not in contact or are slightly in contact can occur.

[0137] On the contrary, according to an embodiment, the light emitting element can be picked up through the insertion groove to minimize the problem that the light emitting element is not completely transferred when transferred and remains on the donor substrate or the stamp. Thus, the product quality and the yield of the display device when transferred can be improved.

[0138] Also, since the repair process and the stamp cleaning process are not required, equipment costs and process performance costs can be reduced.

[0138]

[0139]

[0140] ​​The above describes the embodiments of the present application with reference to the drawings, but the present application can be manufactured in various forms different from each other and is not limited to the above-described embodiments, and it can be understood by a person having ordinary knowledge in the technical field to which the present application belongs that the present application can be implemented in other specific forms without changing the technical idea or essential characteristics of the present application. Therefore, the above-described embodiments should be understood as exemplary in all aspects, not limiting.

Claims

1. A stamp assembly, characterized by An imprint member including an imprint layer including a plurality of pickup columns each having an insertion groove defining a central portion and an outer portion, a base layer disposed on an upper surface of the imprint layer, and a magnetic layer disposed on a surface of the outer portion; and a magnetic plate detachably disposed on an upper surface of the base layer to attract the magnetic layer.

2. The imprint assembly of claim 1, wherein a surface of the central portion is a flat surface, and the insertion groove of the imprint layer is used to insert and bond the light emitting element.

3. The imprint assembly of claim 2, wherein when the magnetic plate is disposed on the upper surface of the base layer, the magnetic layer moves toward the magnetic plate, a length of the outer portion is contracted by an attractive force between the magnetic layer and the magnetic plate, thereby releasing the insertion and bonding of the light emitting element, and when the magnetic plate is disposed on a lower surface of the magnetic layer, the magnetic layer moves toward the magnetic plate, the length of the outer portion is increased by the attractive force between the magnetic layer and the magnetic plate, thereby inserting and bonding the light emitting element.

4. The imprint assembly of claim 1, wherein a cross section of the insertion groove is one of an inverted V shape, an inverted U shape, and a rectangular shape. An imprint member including an imprint layer including a plurality of pickup columns each having an insertion groove defining a central portion and an outer portion, a base layer disposed on an upper surface of the imprint layer, and a magnetic layer disposed on a surface of the outer portion; and a magnetic plate detachably disposed on an upper surface of the base layer to attract the magnetic layer.

2. The imprint assembly of claim 1, wherein a surface of the central portion is a flat surface, and the insertion groove of the imprint layer is used to insert and bond the light emitting element.

3. The imprint assembly of claim 2, wherein when the magnetic plate is disposed on the upper surface of the base layer, the magnetic layer moves toward the magnetic plate, a length of the outer portion is contracted by an attractive force between the magnetic layer and the magnetic plate, thereby releasing the insertion and bonding of the light emitting element, and when the magnetic plate is disposed on a lower surface of the magnetic layer, the magnetic layer moves toward the magnetic plate, the length of the outer portion is increased by the attractive force between the magnetic layer and the magnetic plate, thereby inserting and bonding the light emitting element.

4. The imprint assembly of claim 1, wherein a cross section of the insertion groove is one of an inverted V shape, an inverted U shape, and a rectangular shape. An imprint member including an imprint layer including a plurality of pickup columns each having an insertion groove defining a central portion and an outer portion, a base layer disposed on an upper surface of the imprint layer, and a magnetic layer disposed on a surface of the outer portion; and a magnetic plate detachably disposed on an upper surface of the base layer to attract the magnetic layer.

2. The imprint assembly of claim 1, wherein a surface of the central portion is a flat surface, and the insertion groove of the imprint layer is used to insert and bond the light emitting element.

3. The imprint assembly of claim 2, wherein when the magnetic plate is disposed on the upper surface of the base layer, the magnetic layer moves toward the magnetic plate, a length of the outer portion is contracted by an attractive force between the magnetic layer and the magnetic plate, thereby releasing the insertion and bonding of the light emitting element, and when the magnetic plate is disposed on a lower surface of the magnetic layer, the magnetic layer moves toward the magnetic plate, the length of the outer portion is increased by the attractive force between the magnetic layer and the magnetic plate, thereby inserting and bonding the light emitting element.

5. A light emitting element transfer apparatus characterized by comprising:

4. The imprint assembly of claim 1, wherein a cross section of the insertion groove is one of an inverted V shape, an inverted U shape, and a rectangular shape. An imprint member including an imprint layer including a plurality of pickup columns each having an insertion groove defining a central portion and an outer portion, a base layer disposed on an upper surface of the imprint layer, and a magnetic layer disposed on a surface of the outer portion; and a magnetic plate detachably disposed on an upper surface of the base layer to attract the magnetic layer.

2. The imprint assembly of claim 1, wherein a surface of the central portion is a flat surface, and the insertion groove of the imprint layer is used to insert and bond the light emitting element.

3. The imprint assembly of claim 2, wherein when the magnetic plate is disposed on the upper surface of the base layer, the magnetic layer moves toward the magnetic plate, a length of the outer portion is contracted by an attractive force between the magnetic layer and the magnetic plate, thereby releasing the insertion and bonding of the light emitting element, and when the magnetic plate is disposed on a lower surface of the magnetic layer, the magnetic layer moves toward the magnetic plate, the length of the outer portion is increased by the attractive force between the magnetic layer and the magnetic plate, thereby inserting and bonding the light emitting element.

4. The imprint assembly of claim 1, wherein a cross section of the insertion groove is one of an inverted V shape, an inverted U shape, and a rectangular shape. An imprint member including an imprint layer including a plurality of pickup columns each having an insertion groove defining a central portion and an outer portion, a base layer disposed on an upper surface of the imprint layer, and a magnetic layer disposed on a surface of the outer portion; and a magnetic plate detachably disposed on an upper surface of the base layer to attract the magnetic layer.

2. The imprint assembly of claim 1, wherein a surface of the central portion is a flat surface, and the insertion groove of the imprint layer is used to insert and bond the light emitting element.

3. The imprint assembly of claim 2, wherein when the magnetic plate is disposed on the upper surface of the base layer, the magnetic layer moves toward the magnetic plate, a length of the outer portion is contracted by an attractive force between the magnetic layer and the magnetic plate, thereby releasing the insertion and bonding of the light emitting element, and when the magnetic plate is disposed on a lower surface of the magnetic layer, the magnetic layer moves toward the magnetic plate, the length of the outer portion is increased by the attractive force between the magnetic layer and the magnetic plate, thereby inserting and bonding the light emitting element.

4. The imprint assembly of claim 1, wherein a cross section of the insertion groove is one of an inverted V shape, an inverted U shape, and a rectangular shape. An imprint member including an imprint layer including a plurality of pickup columns each having an insertion groove defining a central portion and an outer portion, a base layer disposed on an upper surface of the imprint layer, and a magnetic layer disposed on a surface of the outer portion; and a magnetic plate detachably disposed on an upper surface of the base layer to attract the magnetic layer.

2. The imprint assembly of claim 1, wherein a surface of the central portion is a flat surface, and the insertion groove of the imprint layer is used to insert and bond the light emitting element.

3. The imprint assembly of claim 2, wherein when the magnetic plate is disposed on the upper surface of the base layer, the magnetic layer moves toward the magnetic plate, a length of the outer portion is contracted by an attractive force between the magnetic layer and the magnetic plate, thereby releasing the insertion and bonding of the light emitting element, and when the magnetic plate is disposed on a lower surface of the magnetic layer, the magnetic layer moves toward the magnetic plate, the length of the outer portion is increased by the attractive force between the magnetic layer and the magnetic plate, thereby inserting and bonding the light emitting element.

4. The imprint assembly of claim 1, wherein a cross section of the insertion groove is one of an inverted V shape, an inverted U shape, and a rectangular shape. An imprint member including an imprint layer including a plurality of pickup columns each having an insertion groove defining a central portion and an outer portion, a base layer disposed on an upper surface of the imprint layer, and a magnetic layer disposed on a surface of the outer portion; and a magnetic plate detachably disposed on an upper surface of the base layer to attract the magnetic layer.

2. The imprint assembly of claim 1, wherein a surface of the central portion is a flat surface, and the insertion groove of the imprint layer is used to insert and bond the light emitting element.

3. The imprint assembly of claim 2, wherein when the magnetic plate is disposed on the upper surface of the base layer, the magnetic layer moves toward the magnetic plate, a length of the outer portion is contracted by an attractive force between the magnetic layer and the magnetic plate, thereby releasing the insertion and bonding of the light emitting element, and when the magnetic plate is disposed on a lower surface of the magnetic layer, the magnetic layer moves toward the magnetic plate, the length of the outer portion is increased by the attractive force between the magnetic layer and the magnetic plate, thereby inserting and bonding the light emitting element.

4. The imprint assembly of claim 1, wherein a cross section of the insertion groove is one of an inverted V shape, an inverted U shape, and a rectangular shape. An imprint member including an imprint layer including a plurality of pickup columns each having an insertion groove defining a central portion and an outer portion, a base layer disposed on an upper surface of the imprint layer, and a magnetic layer disposed on a surface of the outer portion; and a magnetic plate detachably disposed on an upper surface of the base layer to attract the magnetic layer.

2. The imprint assembly of claim 1, wherein a surface of the central portion is a flat surface, and the insertion groove of the imprint layer is used to insert and bond the light emitting element.

3. The imprint assembly of claim 2, wherein when the magnetic plate ​ The light emitting element includes an n-type semiconductor, an active layer, a p-type semiconductor, a first contact electrode, and a second contact electrode.

Images