Vacuum evaporation silicon wafer bearing device

Abstract

The utility model discloses a vacuum evaporation silicon wafer bearing device, a cross beam and a support beam (13) are arranged between a front vertical beam (24) and a rear vertical beam (26), the cross beam comprises a cross beam I (1), a middle cross beam (18) and a cross beam II (25), the cross beam I (1) is provided with a cross beam support table (2), the front vertical beam (24) and the rear vertical beam (26) are provided with a vertical beam support table (11), the vertical beam support table (11) is connected with the cross beam through a support plate (10), and the cross beam I (1) is provided with a cross beam support table (12). A first tray (5) and a second tray (22) which are provided with wafer placing frames (29) are installed on the front face of the supporting beam (13), the wafer placing frames (29) are provided with protruding points (30), a baffle (12) is installed on the back face of the supporting beam (13), a first shielding plate (6) is assembled above the first tray (5), and a second shielding plate (23) is assembled above the second tray (22). According to the silicon wafer bearing device, the overall flatness of the silicon wafer bearing device is guaranteed, and the coating quality of silicon wafers is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model belongs to vacuum coating equipment technical field relates to a kind of vacuum evaporation silicon wafer bearing device. BACKGROUND

[0002] Physical vapor deposition (PVD) is a kind of technology by physical process to convert solid material into gaseous, and then deposit on substrate surface to form thin film. PVD mainly realizes material transfer and deposition through physical process, such as evaporation, sputtering, arc evaporation, etc. The vacuum evaporation silicon wafer bearing device loads solar silicon wafer in evaporation equipment process cavity to circulate, and completes coating process. Therefore, the requirement for bearing device in the whole coating process is very high, and the quality of silicon wafer coating in the later process is directly affected by the quality of bearing device.

[0003] The existing bearing device crossbeam is made of rectangular tube, which is restricted by pipe manufacturing process. The rectangular tube will be twisted and deformed to some extent, which is very unfavorable for the processing of the later process. At the same time, due to the double influence of the weight of the crossbeam and the weight of the bearing frame overlapped on it, the middle position of the crossbeam will be bent and collapsed, which affects the flatness of the whole bearing device and increases the difficulty of automatic wafer taking and placing. Moreover, during the coating process of silicon wafer, target material will gather above the cavity. When the target material accumulates to a certain extent, it will fall off from the cavity. At this time, if the silicon wafer bearing device is passing below, the target material will fall on the silicon wafer, which will pollute the silicon wafer and seriously affect the coating quality of the silicon wafer. UTILITY MODEL CONTENTS

[0004] In view of the above problems existing in the prior art, the present application provides a kind of vacuum evaporation silicon wafer bearing device.

[0005] The technical scheme of the utility model is as follows:

[0006] A kind of vacuum evaporation silicon wafer bearing device, including front vertical beam and rear vertical beam, front vertical beam and rear vertical beam are provided with crossbeam, support beam, crossbeam includes crossbeam one, middle crossbeam, crossbeam two, crossbeam one is equipped with crossbeam support table, middle crossbeam is set at the middle position of front vertical beam and rear vertical beam, front vertical beam and rear vertical beam are provided with vertical beam support table, vertical beam support table is connected crossbeam by support plate, support beam is installed with tray one and tray two with wafer placing frame in front, wafer placing frame is provided with convex point, the back of support beam is installed with baffle, the top of tray one is equipped with shutter one, the top of tray two is equipped with shutter two.

[0007] As a preferred embodiment of the utility model: crossbeam one, crossbeam two, middle crossbeam are piece type structure, crossbeam one and crossbeam two are connected with crossbeam flange, and middle crossbeam is connected with middle crossbeam flange.

[0008] As a preferred embodiment of the utility model: the front vertical beam is provided with vertical beam flange and intermediate vertical beam flange, the vertical beam flange is assembled in the cross beam flange, and the intermediate vertical beam flange is assembled in the intermediate cross beam flange.

[0009] As a preferred embodiment of the utility model: the cross beam one is connected with cross beam support, and the back of the cross beam support is provided with cover plate limiting block.

[0010] As a preferred embodiment of the utility model: the intermediate cross beam is connected with intermediate support, the back of the intermediate support is provided with intermediate cover plate limiting block, and the intermediate cross beam is assembled with cross beam support.

[0011] As a preferred embodiment of the utility model: the front vertical beam, rear vertical beam, cross beam one and cross beam two are metal materials, and the metal materials include stainless steel and titanium alloy.

[0012] As a preferred embodiment of the utility model: the front vertical beam, rear vertical beam, cross beam one and cross beam two are non-metal materials, and the non-metal materials include PEEK material.

[0013] As a preferred embodiment of the utility model: the cross beam one, cross beam two and intermediate cross beam are made of section steel with the thickness of 15mm.

[0014] The utility model discloses a beneficial effect is:

[0015] The utility model discloses a vacuum evaporation silicon wafer bearing device, the surface flatness of cross beam one, cross beam two and intermediate cross beam is good, and also easy to flatten and subsequent processing, greatly increase the bending strength of cross beam in vertical direction, the strength in vertical direction is improved, ensure the overall flatness of silicon wafer bearing device, reduce the difficulty of automatic taking and placing piece, because evaporation is plated silicon wafer lower surface first, and the upper assembly of tray is equipped with shutter, can guarantee that the target material on the cavity top will not fall to the silicon wafer, makes the silicon wafer avoid being contaminated, ensures the film quality of silicon wafer. ACCURACY OF DRAWINGS

[0016] Figure 1 It is the front view of the utility model a vacuum evaporation silicon wafer bearing device;

[0017] Figure 2 It is the rear view of the utility model;

[0018] Figure 3 It is the perspective view of the utility model;

[0019] Figure 4 It is the enlarged view of A place;

[0020] Figure 5 It is the enlarged view of B place;

[0021] Figure 6A structure diagram of the shielding plate one.

[0022] In the figure: 1-crossbeam one; 2-crossbeam support; 5-tray one; 6-shielding plate one; 7-crossbeam support; 8-crossbeam flange; 9-vertical beam flange; 10-support plate; 11-vertical beam support; 12-stop plate; 13-support beam; 16-intermediate vertical beam flange; 17-intermediate crossbeam flange; 18-intermediate crossbeam; 22-tray two; 23-shielding plate two; 24-front vertical beam; 25-crossbeam two; 26-back vertical beam; 27-intermediate cover plate limiting block; 28-cover plate limiting block; 29-film holder; 30-bump. DETAILED DESCRIPTION

[0023] The utility model will be described in detail below in combination with the drawings and embodiments. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without making creative labor belong to the scope of protection of the utility model.

[0024] As Figures 1-6 shown, a vacuum evaporation silicon wafer bearing device, including front vertical beam 24 and back vertical beam 26, front vertical beam 24 and back vertical beam 26 between the setting has crossbeam, support beam 13, crossbeam includes crossbeam one 1, intermediate crossbeam 18, crossbeam two 25, crossbeam one 1 is equipped with crossbeam support 2, intermediate crossbeam 18 is set at the intermediate position of front vertical beam 24 and back vertical beam 26, front vertical beam 24 and back vertical beam 26 are provided with vertical beam support 11, and vertical beam support 11 is connected crossbeam through support plate 10, and support beam 13 is installed with tray one 5 and tray two 22 with film holder 29 on the front, and film holder 29 is provided with bump 30, and bump 30 holds silicon wafer, and support beam 13 is installed with stop plate 12 on the back, and tray one 5 is equipped with shielding plate one 6 on the top, and tray two 22 is equipped with shielding plate two 23 on the top.

[0025] Crossbeam one 1, crossbeam two 25, intermediate crossbeam 18 are sheet type structure, and crossbeam one 1 is connected with crossbeam flange 8, and intermediate crossbeam 18 is connected with intermediate crossbeam flange 17; front vertical beam 24 is provided with vertical beam flange 9 and intermediate vertical beam flange 16, vertical beam flange 9 is assembled in crossbeam flange 8, and intermediate vertical beam flange 16 is assembled in intermediate crossbeam flange 17; crossbeam one 1 is connected with crossbeam support 7, and crossbeam support 7 is installed with cover plate limiting block 28 on the back.

[0026] The intermediate cross beam 18 is connected with an intermediate support, the back surface of the intermediate support is installed with an intermediate cover plate limiting block 27, and the intermediate cross beam 18 is assembled with a cross beam support 2; the front vertical beam 24, the rear vertical beam 26, the cross beam one 1 and the cross beam two 25 are metal materials, the metal materials include stainless steel and titanium alloy; the front vertical beam 24, the rear vertical beam 26, the cross beam one 1 and the cross beam two 25 are non-metal materials, the non-metal materials include PEEK material; the cross beam one 1, the cross beam two 25 and the intermediate cross beam 18 are made of profile steel with a thickness of 15 mm, and have the advantages of high strength, good rigidity and light weight.

[0027] In conclusion, the vacuum evaporation silicon wafer bearing device has the advantages that the surface flatness of the cross beam one, the cross beam two and the intermediate cross beam is good, and the cross beam is easy to be leveled and processed subsequently, the bending strength of the cross beam in the vertical direction is increased, the strength in the vertical direction is improved, the overall flatness of the silicon wafer bearing device is ensured, and the difficulty of automatic wafer taking and placing is reduced; since the evaporation is to plate the lower surface of the silicon wafer first, the upper portion of the tray is assembled with a shutter, the target material on the upper portion of the cavity cannot fall on the silicon wafer, the silicon wafer is prevented from being polluted, and the film plating quality of the silicon wafer is ensured.

[0028] Although the embodiments of the utility model have been disclosed as above, it is not limited to the application listed in the specification and the embodiments, and it can be applied to various fields suitable for the utility model. For those skilled in the art, the embodiments can be changed, modified, replaced and changed in various ways without departing from the principles and spirits of the utility model, and therefore the utility model is not limited to specific details under the general concept defined by the claims and the equivalent range.

Claims

1. A vacuum deposition silicon wafer carrier apparatus, characterized by: Include front vertical beam (24) and rear vertical beam (26), the front vertical beam (24) and rear vertical beam (26) are provided with crossbeam, support beam (13), the crossbeam includes crossbeam one (1), intermediate crossbeam (18), crossbeam two (25), the crossbeam one (1) is equipped with crossbeam support (2), the intermediate crossbeam (18) is arranged at the intermediate position of front vertical beam (24) and rear vertical beam (26), the front vertical beam (24) and rear vertical beam (26) are provided with vertical beam support (11), the vertical beam support (11) is connected crossbeam by support plate (10), the support beam (13) is installed with tray one (5) and tray two (22) with sheet frame (29) in front, the sheet frame (29) is provided with convex point (30), the back of the support beam (13) is installed with baffle (12), the tray one (5) is equipped with shutter one (6) above, the tray two (22) is equipped with shutter two (23) above.

2. The vacuum evaporation silicon wafer carrier as set forth in claim 1, wherein: The crossbeam one (1), crossbeam two (25) and intermediate crossbeam (18) are sheet type structures, the crossbeam one (1) and crossbeam two (25) are connected with crossbeam flange (8), and the intermediate crossbeam (18) is connected with intermediate crossbeam flange (17).

3. The vacuum evaporation silicon wafer carrier of claim 2, wherein: The front vertical beam (24) is provided with vertical beam flange (9) and intermediate vertical beam flange (16), the vertical beam flange (9) is equipped with crossbeam flange (8), and the intermediate vertical beam flange (16) is equipped with intermediate crossbeam flange (17).

4. The vacuum deposition silicon wafer carrier of claim 1, wherein: The crossbeam one (1) is connected with crossbeam support (7), and the back of the crossbeam support (7) is installed with cover plate limiting block (28).

5. The vacuum evaporation silicon wafer carrier as set forth in claim 1, wherein: The intermediate crossbeam (18) is connected with intermediate support, the back of the intermediate support is installed with intermediate cover plate limiting block (27), and the intermediate crossbeam (18) is equipped with crossbeam support (2).

6. The vacuum evaporation silicon wafer carrier of claim 1, wherein: The front vertical beam (24), rear vertical beam (26), crossbeam one (1) and crossbeam two (25) are metal materials, and the metal materials include stainless steel and titanium alloy.

7. The vacuum evaporation silicon wafer carrier of claim 1, wherein: The front vertical beam (24), rear vertical beam (26), crossbeam one (1) and crossbeam two (25) are non-metal materials, and the non-metal materials include PEEK material.

8. The vacuum evaporation silicon wafer carrier of claim 1, wherein: The crossbeam one (1), crossbeam two (25) and intermediate crossbeam (18) are made of section steel with a thickness of 15 mm.

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