Wafer film thickness test tray suitable for wafer test zero point position identification

Abstract

The utility model relates to a wafer film thickness test tray suitable for wafer test zero position identification, which comprises a tray body, a groove is arranged at the zero position of the tray body, and a module matched with the groove is assembled in the groove. The cambered surface, corresponding to the first reflective optoelectronic switch, of the module is coated with a first reflective coating, the side surface, corresponding to the second reflective optoelectronic switch, of the module is coated with a second reflective coating, and the first reflective coating and the second reflective coating are designed in a split mode. According to the tray, the groove is formed in the zero position, the module is filled in the groove, the reflective coatings are arranged on the two side faces of the module respectively, the module is convenient to replace and install, special positioning is not needed, direct installation is achieved, and time and labor are saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a wafer film thickness test tray suitable for wafer test zero position recognition belongs to semiconductor technical field. BACKGROUND

[0002] The current wafer film thickness test accessory tray is used for positioning the zero position of a circle, then the thickness of the wafer is recorded by rotating the tray to a certain angle (90 / 135 etc.), and the position corresponding to the thickness is positioned according to the angle. The zero position is generally positioned by using a reflective photoelectric switch, and the reflective material generally adopts a back adhesive type soft material, and a reflective coating is coated on the surface of the soft material to play a reflective role. But this back adhesive type pasting method has the following problems: 1. After a long time or after being contaminated with other solvents, the back adhesive is easy to open, causing the material to fall off and the light path to be lost, causing the test position to be unable to be accurately determined; 2. When pasted in a position with a bend, the reflective light position is offset due to the increased deformation stress at the bend position, causing the photoelectric switch to fail, etc., causing the test position to be unable to be obtained. SUMMARY

[0003] In view of the above technical problems, the utility model provides a wafer film thickness test tray suitable for wafer test zero position recognition, a groove is provided at the zero position of the tray and filled with a module, a reflective coating is provided on the two sides of the module, the module is convenient to replace and install, does not need special positioning, is directly installed, saving time and effort.

[0004] To achieve the above purpose, the utility model adopts the following technical scheme:

[0005] A wafer film thickness test tray suitable for wafer test zero position recognition, comprising:

[0006] A tray body, a groove is provided at the zero position of the tray body, a module adapted to the groove is assembled in the groove, a first reflective coating is coated on the arc surface of the module corresponding to the first reflective photoelectric switch, a second reflective coating is coated on the side surface of the module corresponding to the second reflective photoelectric switch, and the first reflective coating and the second reflective coating are designed in a split type.

[0007] A wafer film thickness test tray suitable for wafer test zero position recognition, comprising:

[0008] A tray body, a groove is provided at the zero position of the tray body, a module adapted to the groove is assembled in the groove, and the module is a reflective module.

[0009] The wafer film thickness test tray suitable for wafer test zero position recognition, preferably, the groove is a T-shaped groove, and the module is a T-shaped module.

[0010] The wafer film thickness test tray suitable for wafer test zero point position identification, preferably, the groove is an L-shaped groove, and the module is an L-shaped module.

[0011] The wafer film thickness test tray suitable for wafer test zero point position identification, preferably, the module is fastened to the groove.

[0012] The wafer film thickness test tray suitable for wafer test zero point position identification, preferably, the groove is provided with a threaded hole, and the module is locked with the groove by a top screw; or,

[0013] The module and the groove are locked by screws.

[0014] The wafer film thickness test tray suitable for wafer test zero point position identification is preferably provided with a reflective coating on the wall surface corresponding to the arc surface of the module of the first reflective photoelectric switch, and the wall surface corresponding to the side surface of the module of the second reflective photoelectric switch is provided with a reflective coating.

[0015] In the wafer film thickness test tray suitable for wafer test zero point position identification, preferably, the reflective coating is a glass bead type reflective film layer or a micro prism type reflective film layer.

[0016] In the wafer film thickness test tray suitable for wafer test zero point position identification, preferably, the first reflective coating and the second reflective coating are glass bead type reflective film layers or micro prism type reflective film layers.

[0017] The utility model has the following advantages due to the adoption of the above technical solution:

[0018] 1. The wafer film thickness test tray of the present invention has a groove at the zero point and is filled with a module. A reflective coating is provided on both sides of the module. The module is easy to replace and install, does not require special positioning, and can be directly installed, saving time and effort.

[0019] 2. The utility model uses reflective materials to make the reflective module, which can permanently solve the risk of the adhesive peeling off due to aging. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of an existing wafer film thickness test tray provided by the present invention;

[0021] Figure 2 A schematic diagram of a wafer film thickness test tray suitable for wafer test zero point position identification provided by an embodiment of the present invention;

[0022] Figure 3The explosion map of the wafer film thickness test tray suitable for wafer test zero position recognition is provided in the embodiment of the utility model;

[0023] The reference signs in the drawings are as follows:

[0024] 1-tray body, 101-groove, 102-module; 2-first reflective photoelectric switch; 3-second reflective photoelectric switch. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the utility model clearer, the technical scheme in the utility model is described clearly and completely below, obviously, the described embodiments are some embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0026] Unless otherwise defined, the technical terms or scientific terms used in the utility model should be understood as the usual meaning by the person skilled in the art in the field to which the utility model belongs. The "first", "second", "third", "fourth" and similar words used in the utility model do not represent any order, quantity or importance, but are only used to distinguish different components. "Include" or "contain" and similar words mean that the elements or objects before the word cover the elements or objects listed after the word and their equivalents, and do not exclude other elements or objects. "Connection" or "connection" and similar words are not limited to physical or mechanical connection, but can include electrical connection, whether direct or indirect.

[0027] In order to facilitate the description, spatial relative relationship terms can be used in the text to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "internal", "external", "inboard", "outboard", "under", "above", etc. Such spatial relative relationship terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure.

[0028] At present, the zero position of the wafer film thickness test tray is generally positioned by using the reflective photoelectric switch mode, the reflective material generally adopts the back adhesive type soft material, and a layer of reflective coating is coated on the surface of the soft material to play the role of reflection. But this back adhesive type pasting method has the following problems: 1. After a long time or after being contaminated with other solvents, the back adhesive is easy to open, causing the material to fall off and the light path to be lost, resulting in the problem that the test position cannot be accurately determined; 2. When the back adhesive type is pasted in a position with a corner, the pasting position is easy to peel off due to increased deformation stress at the corner position, causing the reflective light position to deviate, causing the photoelectric switch to fail, etc., resulting in the problem that the test position cannot be obtained.

[0029] Based on the above technical problems, the utility model provides a wafer film thickness test tray suitable for wafer test zero position recognition, the tray is provided with a groove at the zero position and filled with a module, the module is provided with a reflective coating on both sides, the module is convenient to replace and install, does not need special positioning, is directly installed, saves time and effort.

[0030] As Figure 1 The existing wafer film thickness test tray is shown, the existing reflective coating is directly coated on the zero position of the tray, there is a bend at the junction of the arc surface and the upper end surface of the tray, the adhesive position is easy to peel off at the bend position due to the increase of deformation stress, which causes the position of reflected light to deviate, and further causes the photoelectric switch to fail, etc., resulting in the problem that the test position cannot be obtained. To solve this problem, the present application proposes the following solutions.

[0031] As Figure 2 , 3 The wafer film thickness test tray suitable for wafer test zero position recognition comprises:

[0032] The tray body 1 is provided with a groove 101 at the zero position, the groove 101 is assembled with a module 102 matched with the groove 101, the module 102 is coated with a first reflective coating on the arc surface corresponding to the first reflective photoelectric switch 2, the module 102 is coated with a second reflective coating on the side surface corresponding to the second reflective photoelectric switch 3, and the first reflective coating and the second reflective coating are designed in a split type.

[0033] Further, the wall surface corresponding to the arc surface of the first reflective photoelectric switch 2 and the module 102 is provided with a reflective coating, and the wall surface corresponding to the side surface of the second reflective photoelectric switch 3 and the module 102 is provided with a reflective coating.

[0034] Specifically, the first reflective coating, the second reflective coating and the reflective coating can be a glass bead type reflective film layer or a micro-prism type reflective film layer. The glass bead type reflective film is generally a film structure object composed of multiple layers of different substances such as a surface layer (protective film), a reflection layer (functional layer), a base layer (bearing layer), an adhesive layer and a bottom layer (protective layer). The surface layer of the reflective film is generally composed of a resin film with good light transmission and weather resistance, the reflection layer is composed of different materials according to different types of reflective film, such as micro glass beads, micro-prisms or metal reflective plating, the base layer is a thin film made of resin organic compounds, the adhesive layer is generally epoxy resin glue, and the bottom layer is a protective layer made of thick paper. The reflection principle of the micro-prism type reflective film layer is the refraction and reflection of micro-prisms.

[0035] The main representative products of micro-prism retroreflective film can be mainly divided into four types from the aspects of retroreflective features and structures: truncated corner prism retroreflective film focusing on long-distance recognition, truncated corner prism retroreflective film focusing on large-angle reading at short distance, full-prism retroreflective film considering long-distance recognition performance and short-distance reading performance, and new type of prism retroreflective film combining prism technology with new material technology. They are diversified to meet application levels, and new retroreflective materials emerged in recent years to meet different levels of demand. The long-distance truncated corner micro-prism retroreflective film is the first generation of micro-prism retroreflective film. The front brightness of this type of retroreflective film is very high, and the front brightness (0.2° / -4°) of white film is generally above 800 cd / lx / m. Moreover, the distribution of retroreflected light has no directionality, and the retroreflective film has little difference in retroreflective effect whether it is horizontally or vertically pasted. However, at large incident angle and observation angle, the retroreflective brightness will be greatly attenuated. The large-angle truncated corner micro-prism retroreflective film has relatively low front brightness, but its retroreflective brightness will not be greatly attenuated at large incident angle and observation angle. The full-prism retroreflective film is a prism type retroreflective material using full-prism structure. The part of the traditional micro-prism structure that cannot retroreflect is removed, so that the retroreflective film is composed of full retroreflective prism structures. It combines the two features of long-distance and large-angle micro-prism retroreflective film, maintains high front brightness and easy discovery at long distance, and improves the retroreflective brightness at large incident angle and observation angle at a distance of 50-250 meters. On the current full-prism retroreflective film, there are more than 930 units in a square centimeter of material area through the connection and arrangement of each microcrystalline cube according to a certain rule to control the path of incident and reflected light. The lower layer of microcrystalline cube forms an air layer after sealing, uses the diffraction phenomenon of light to form internal total reflection of incident light, so as to achieve the most superior retroreflective effect without the help of a metal reflection layer. The retroreflective performance of this retroreflective film made of wear-resistant high-hardness polycarbonate material and microcrystalline cube technology is not only multiplied, but also greatly improved in large-angle retroreflective performance. The front brightness of this full-prism retroreflective film is more than six times that of the engineering grade, and the front brightness (0.2° / -4°) of white film is generally above 600 cd / lx / m. The retroreflective performance at large observation angle (0.5° and 2°) is about two to four times higher than that of the high-strength grade. The retroreflective film layer in the utility model is a commonly used known retroreflective film, which is not specifically limited here.

[0036] Further, as Figure 2As shown, the shape of the groove 101 can be various, for example, the groove 101 is a T-shaped groove, and the corresponding module 102 is a T-shaped module; or, the groove 101 is an L-shaped groove, and the module 102 is an L-shaped module. In a preferred embodiment of the present application, in order to strengthen the connection between the module 102 and the groove 101, a threaded hole is opened at the side of the groove 101, which does not affect the position of the light-reflecting surface, and then a jack or screw is used on the side to lock the module 102.

[0037] Further, the entire module 102 can also be made of a light-reflecting material, which can solve the risk of aging and falling of the back glue, but the cost is relatively high.

[0038] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer film thickness test tray suitable for wafer test zero position recognition, characterized by, The utility model relates to a tray body (1), the recess (101) of zero position of tray body (1) is equipped with the module (102) of recess (101) adaptation, the first reflective photoelectric switch (2) corresponding arc surface of module (102) is coated with first reflective coating, the second reflective photoelectric switch (3) corresponding side of module (102) is coated with second reflective coating, and the first reflective coating and the second reflective coating are split type design. The wall surface corresponding to the arc surface of the first reflective photoelectric switch (2) and the module (102) is provided with a reflective coating, and the wall surface corresponding to the side of the second reflective photoelectric switch (3) and the module (102) is provided with a reflective coating.

2. The wafer film thickness test tray suitable for wafer test zero position identification according to claim 1, wherein, The reflective coating is a glass bead type reflective film layer or a micro-prism type reflective film layer.

3. The wafer film thickness test tray suitable for wafer test zero position identification according to claim 2, wherein, The first reflective coating and the second reflective coating are a glass bead type reflective film layer or a micro-prism type reflective film layer.

4. The wafer film thickness test tray suitable for wafer test zero position identification according to claim 1, wherein, The utility model relates to a tray body (1), the recess (101) of zero position of tray body (1) is equipped with the module (102) of recess (101) adaptation, the first reflective photoelectric switch (2) corresponding arc surface of module (102) is coated with first reflective coating, the second reflective photoelectric switch (3) corresponding side of module (102) is coated with second reflective coating, and the first reflective coating and the second reflective coating are split type design.

5. A wafer film thickness test tray suitable for wafer test zero position recognition, characterized by, The wall surface corresponding to the arc surface of the first reflective photoelectric switch (2) and the module (102) is provided with a reflective coating, and the wall surface corresponding to the side of the second reflective photoelectric switch (3) and the module (102) is provided with a reflective coating. The reflective coating is a glass bead type reflective film layer or a micro-prism type reflective film layer.

6. The wafer film thickness test tray suitable for wafer test zero position recognition according to claim 1 or 5, characterized in that, The first reflective coating and the second reflective coating are a glass bead type reflective film layer or a micro-prism type reflective film layer.

7. The wafer film thickness test tray suitable for wafer test zero position recognition according to claim 1 or 5, characterized in that, The utility model relates to a tray body (1), the recess (101) of zero position of tray body (1) is equipped with the module (102) of recess (101) adaptation, the first reflective photoelectric switch (2) corresponding arc surface of module (102) is coated with first reflective coating, the second reflective photoelectric switch (3) corresponding side of module (102) is coated with second reflective coating, and the first reflective coating and the second reflective coating are split type design.

8. The wafer film thickness test tray suitable for wafer test zero position recognition according to claim 1 or 5, characterized in that, The wall surface corresponding to the arc surface of the first reflective photoelectric switch (2) and the module (102) is provided with a reflective coating, and the wall surface corresponding to the side of the second reflective photoelectric switch (3) and the module (102) is provided with a reflective coating.

9. The wafer film thickness test tray suitable for wafer test zero position identification according to claim 8, wherein, The reflective coating is a glass bead type reflective film layer or a micro-prism type reflective film layer. The first reflective coating and the second reflective coating are a glass bead type reflective film layer or a micro-prism type reflective film layer.

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