Unmanned aerial vehicle-mounted radar VPX host

Abstract

The utility model provides an unmanned aerial vehicle-mounted radar VPX host, and belongs to the technical field of unmanned aerial vehicle-mounted radars. Comprising a shell assembly and a VPX main body, and the VPX main body is arranged in the shell assembly; the VPX main body comprises a VPX back plate, a distributor plate, heat conduction walls, a power supply mounting plate, a power supply and a circuit board sub-module, the heat conduction walls are arranged on the two sides of the circuit board sub-module, the VPX back plate is arranged on the rear side of the circuit board sub-module, the two side edges of the VPX back plate are connected with the heat conduction walls, and a VPX case frame is constructed; the power supply is fixed on the outer surface of the heat-conducting wall through a power supply mounting plate; the rear side of the VPX backboard is provided with a distributor plate. According to the utility model, the modularized design is adopted, the interoperability and compatibility among the components are ensured, the heat generated during the operation of the system is effectively reduced through the optimized heat dissipation design, and the reliability and stability of each module are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of unmanned aerial vehicle-borne radar VPX host computer, belong to unmanned aerial vehicle-borne radar technical field. BACKGROUND

[0002] With the rapid development of unmanned aerial vehicle technology, the application of aviation remote sensing and monitoring is more and more extensive, especially in the field of national defense, agriculture, environmental monitoring and disaster assessment, unmanned aerial vehicle-borne radar system is widely concerned due to its high efficiency, low cost, strong mobility and other advantages. However, there are still some problems to be solved in the current unmanned aerial vehicle-borne radar system, mainly reflected in:

[0003] 1) Low integration: the existing unmanned aerial vehicle-borne radar host computer often uses independent sensing module and processing unit inside, which leads to low overall integration of the system. This architecture not only increases the load of the unmanned aerial vehicle, but also brings challenges to integrated debugging and system stability.

[0004] 2) Poor reliability: unmanned aerial vehicle will be subjected to various vibrations and impacts during flight, especially in adverse weather conditions or maneuvering flight, such vibrations may damage the internal electronic devices of the radar, making it lose its effectiveness, and even cause failure.

[0005] 3) Poor scalability: the lack of standardized interfaces in unmanned aerial vehicle-borne radar system makes it difficult to integrate new modules, and a large amount of redesign and debugging is required when upgrading the entire system, increasing time and cost. The poor scalability limits the flexibility and adaptability of the radar system, especially in different operating environments and task requirements, unable to quickly respond to market changes and technological progress, restricting the long-term development of the system. INVENTION CONTENTS

[0006] The utility model aims to provide a kind of unmanned aerial vehicle-borne radar VPX host computer, modular design and join heat dissipation design, can improve integration, improve system reliability.

[0007] To achieve the above purpose, the utility model realizes the following technical scheme:

[0008] A kind of unmanned aerial vehicle-borne radar VPX host computer, including shell assembly and VPX main body, the VPX main body is set in shell assembly interior;

[0009] The VPX main body includes VPX backplane, distribution board, heat-conducting wall, power supply mounting plate, power supply, circuit board sub-module, the heat-conducting wall is set on both sides of circuit board sub-module, the VPX backplane is set on the back side of circuit board sub-module, the two side edges of VPX backplane are connected with heat-conducting wall, and are constructed as VPX case frame;

[0010] The power supply is fixed to the outer surface of the heat-conducting wall through a power supply mounting plate;

[0011] The rear side of the VPX backplane is provided with a distribution board.

[0012] Preferably, the inner surface of the heat-conducting wall is provided with a concave-convex step, and the two sides of the circuit board sub-module are provided with fixing frames which are embedded into the concave-convex step to fix the circuit board sub-module between the two heat-conducting walls.

[0013] Preferably, the upper part of the outer surface of the heat-conducting wall is provided with heat dissipation fins, and the heat dissipation fins form heat dissipation air ducts therebetween; the lower part of the outer surface of the heat-conducting wall is a flat surface and is provided with a heat dissipation fan.

[0014] Preferably, the middle part of the outer surface of the heat-conducting wall is provided with a heat dissipation boss, and the heat dissipation boss is provided with heat dissipation air ducts which are communicated with the heat dissipation air ducts between the heat dissipation fins.

[0015] Preferably, the lower part of the heat-conducting wall is provided with one or more heat dissipation fans.

[0016] Preferably, the middle part of the heat dissipation boss is provided with screw holes for fixing a shell assembly, and the two sides of the outer surface of the heat-conducting wall are provided with mounting tables for mounting the shell assembly, and the mounting tables are provided with screw holes on the surfaces thereof.

[0017] Preferably, the circuit board sub-module comprises an upper cover plate, a circuit board, a lower cover plate, a front cover plate, a VPX locking strip and a pulling aid, wherein the upper cover plate, the lower cover plate and the front cover plate surround the circuit board, the VPX locking strip is used for clamping and fixing the circuit board sub-module in a VPX case frame, the pulling aid is arranged at the front part of the lower cover plate and is used for pulling out the circuit board sub-module, and the two side edges of the upper cover plate are provided with fixing frames.

[0018] Preferably, the pulling aid comprises a handle part and a jacking part, the pulling aid is rotationally fixed to the front part of the lower cover plate, the jacking part protrudes from the side edge of the lower cover plate and is in abutment with the side surface of the concave-convex step.

[0019] The utility model discloses the advantage lies in: the utility model discloses modular design, strictly follow OpenVPX system specification. This design ensures the interoperability and compatibility between each component, so that the system can select appropriate module flexibly according to application demand, and is connected through the standard slot and interface defined by OpenVPX. Modular design not only improves the integration of the system, but also makes the design of each module more flexible, and facilitates quick configuration and adjustment according to task requirements.

[0020] Through the optimized heat dissipation design (such as the through air duct and heat dissipation fan), the utility model effectively reduces the heat generated during system operation, and improves the reliability and stability of each module. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings are included to provide a further understanding of the present application, and are incorporated in and constitute a part of this specification, illustrate embodiments of the present application and are used to explain the present application, but do not limit the present application.

[0022] Figure 1 Unmanned airborne radar VPX host appearance schematic diagram;

[0023] Figure 2 Unmanned airborne radar VPX host composition external exploded schematic diagram;

[0024] Figure 3 Unmanned airborne radar VPX host composition internal exploded schematic diagram;

[0025] Figure 4 VPX case frame explosion schematic diagram;

[0026] Figure 5 VPX case frame structure schematic diagram;

[0027] Figure 6 Distribution board installation schematic diagram;

[0028] Figure 7 Thermal wall structure front view schematic diagram;

[0029] Figure 8 Thermal wall structure top view schematic diagram;

[0030] Figure 9 Thermal wall structure outer side three-dimensional schematic diagram;

[0031] Figure 10 Thermal wall structure inner side three-dimensional schematic diagram;

[0032] Figure 11 Power supply installation schematic diagram;

[0033] Figure 12 Power supply installation effect schematic diagram;

[0034] Figure 13 Circuit board sub-module composition schematic diagram;

[0035] Figure 14 Circuit board sub-module structure schematic diagram;

[0036] Figure 15 Circuit sub-module installation schematic diagram;

[0037] Figure 16 Pulling aid local schematic diagram;

[0038] Figure: 1. Housing assembly, 2. VPX backplane, 3. Mounting breakout board, 4. Thermal barrier, 5. Concave and convex steps, 6. Power supply mounting plate, 7. Power supply, 8. Mounting bracket, 9. Heat sink fins. 10. Circuit board submodule, 101. Upper cover, 102. Circuit board, 103. Lower cover, 104. Front cover, 105. VPX locking strip, 106. Ejector, 11. Cooling fan, 12. Heat dissipation boss, 13. Screw holes, 14. Mounting platform. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0040] like Figures 1-16 As shown, a UAV-mounted radar VPX host comprises a housing component (1) and a VPX body, wherein the VPX body is arranged inside the housing component (1); the VPX body comprises a VPX backplane (2), a distribution board (3), a heat-conducting wall (4), a power supply mounting plate (6), a power supply (7), and a circuit board submodule (10), wherein the heat-conducting wall (4) is arranged on both sides of the circuit board submodule (10), the VPX backplane (2) is arranged on the rear side of the circuit board submodule (10), and both sides of the VPX backplane (2) are connected to the heat-conducting wall (4) to form a VPX chassis frame; the power supply (7) is fixed to the outer surface of the heat-conducting wall through the power supply mounting plate (6); and the distribution board (3) is installed on the rear side of the VPX backplane (2).

[0041] The housing assembly (1) is composed of a top housing, a bottom housing, a left housing, a right housing, a front housing and a rear housing. Figure 2 As shown; the internal components of the airborne radar VPX host are as follows Figure 3 shown.

[0042] The VPX backplane (2) complies with the OpenVPX system specification and can be adapted to common VPX circuit board modules. Figure 6 As shown, a distribution board (3) is installed on the rear side of the VPX backplane. The main function of the distribution board (3) is to convert the interface, and convert the external power supply and communication interface into the standard interface of the VPX system.

[0043] As a refinement of the above embodiment, the inner surface of the heat-conducting wall (4) is provided with concave-convex steps (5), and fixing frames (8) are provided on both sides of the circuit board submodule (10), and the fixing frames (8) are embedded in the concave-convex steps (5) to fix the circuit board submodule (10) between the two heat-conducting walls (4).

[0044] As a refinement of the above embodiment, the outer surface of the heat-conducting wall (4) is provided with heat dissipation fins (9) at the upper part, and heat dissipation air ducts are formed between the heat dissipation fins (9); the outer surface of the heat-conducting wall (4) is flat at the lower part, and is provided with heat dissipation fans (11).

[0045] The heat-conducting wall (4) is provided with one or more heat dissipation fans (11) at the lower part.

[0046] This design effectively ensures good overall heat dissipation effect. The back of the heat-conducting wall (4) is designed with a concave-convex step (5) to provide a support arm for each circuit board sub-module (10). The number of heat dissipation fans (11) is three, which are sequentially installed on the lower part of the front of the heat-conducting wall (4) by screws.

[0047] As a refinement of the above embodiment, the outer surface of the heat-conducting wall (4) is provided with a heat dissipation boss (12) at the middle part, and the heat dissipation boss (12) is provided with a heat dissipation air duct that communicates with the heat dissipation air duct between the heat dissipation fins (9).

[0048] The middle part of the heat dissipation boss (12) is provided with a screw hole (13) for fixing the shell assembly (1), and the outer surface of the heat-conducting wall (4) is provided with a mounting table (14) on both sides for mounting the shell assembly (1), and the surface of the mounting table (14) is provided with a screw hole (13).

[0049] As a refinement of the above embodiment, according to different task requirements, five different circuit board sub-modules can be installed, and all kinds of circuit board sub-modules adopt a unified structure design. The circuit board sub-module (10) includes an upper cover plate (101), a circuit board (102), a lower cover plate (103), a front cover plate (104), a VPX locking strip (105), and a pulling aid (106), wherein the upper cover plate (101), the lower cover plate (103), and the front cover plate (104) surround the circuit board (102), the VPX locking strip (105) is used to tightly fix the circuit board sub-module (10) in the VPX case frame, and the pulling aid (106) is arranged at the front part of the lower cover plate (103) and is used to pull out the circuit board sub-module (10), and the two sides of the upper cover plate (101) are provided with fixing frames (8).

[0050] The upper cover plate (101) and the lower cover plate (103) have two functions: one is to effectively increase the module strength and ensure stable operation under airborne vibration conditions; the other is to fully contact the top of the chip with the cover plate through the heat-conducting silicone sheet, which can effectively conduct the heat of the chip to the cover plate and increase the heat dissipation area.

[0051] The number of locking pieces (105) is two, which are respectively placed on the left and right of the upper cover plate (101).

[0052] The pulling-out aid (106) comprises a handle portion and a lifting portion. The pulling-out aid (106) is rotatably fixed to the front portion of the lower cover plate (103). The lifting portion protrudes from the side edge of the lower cover plate (103) and fits against the side of the concave-convex step (5).

[0053] As a refinement of the above embodiment, the power supply (6) part mainly includes a main power supply mounting plate, a main power supply, a backup power supply mounting plate, and a backup power supply. The main power supply is first fixed to the main power supply mounting plate, and then the two are fixed to the front upper part of the left heat conduction wall, such as Figure 11 As shown, similarly, the backup power supply is also first fixed to the backup power supply mounting plate, and then the two are fixed to the front upper part of the right heat conduction wall.

[0054] like Figure 15 As shown, when installing the circuit board submodule, first push the circuit board submodule along the ridge on the heat conduction wall as a whole, and then tighten the screw at the front end of the locking member (105) to clamp the circuit board submodule in the VPX chassis frame.

[0055] When the circuit board submodule is to be removed, the pulling-out aid (106) is first bent outward to rotate it around the rotation axis, and then the pulling-out aid (106) is grasped and pulled outward to remove the circuit board submodule. Figure 16 shown.

[0056] It should be noted that: the utility model has a ventilation duct that runs through from top to bottom, and 6 cooling fans are installed at the bottom of the main unit, so that as much air as possible can flow through the heat dissipation teeth, power supply and circuit board sub-modules, perform heat exchange on the heat dissipation teeth, exchange the heat generated by each part, and reduce the temperature of each module. In addition, cover plates are installed on the left and right heat-conducting walls to ensure that the air flows in the direction of the ventilation duct.

[0057] The concave and convex steps (5) on the heat-conducting wall of the host are used to slide the circuit submodule (10) along the slide into the chassis and plug it into the VPX backplane. A locking member (105) is placed in the space between the slide and the circuit submodule (10). The locking function of the locking member is used to better fasten the circuit submodule (10) to the VPX chassis frame, preventing the module from shaking inside the chassis and causing the VPX connector to break. It also allows the module's heat dissipation surface to better contact the chassis, which is beneficial for heat conduction and allows the module's heat to be effectively transferred to the VPX chassis. An auxiliary extraction member is installed at the lower right corner of the circuit submodule (10) to facilitate the insertion and removal of the module.

[0058] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application have been described in detail, for the skilled in the art, it still can be modified, or for the equivalent replacement of part of the technical features of the technical solutions recorded in the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, shall be included within the scope of the present application.

Claims

1. A UAVborne radar VPX mainframe, characterized in that, It comprises a shell assembly (1) and a VPX main body, which is arranged inside the shell assembly (1); The VPX main body comprises a VPX backplane (2), a distribution board (3), heat-conducting walls (4), a power supply mounting plate (6), a power supply (7), and a circuit board sub-module (10), the heat-conducting walls (4) are arranged on both sides of the circuit board sub-module (10), the VPX backplane (2) is arranged on the rear side of the circuit board sub-module (10), and the two side edges of the VPX backplane (2) are connected with the heat-conducting walls (4) to form a VPX case frame; The power supply (7) is fixed to the outer surface of the heat-conducting wall through the power supply mounting plate (6); The VPX backplane (2) is arranged on the rear side of the distribution board (3).

2. The unmanned radar VPX mainframe of claim 1, wherein, The inner surface of the heat-conducting wall (4) is provided with a concave-convex step (5), and the two sides of the circuit board sub-module (10) are provided with fixing frames (8), which are embedded in the concave-convex step (5) to fix the circuit board sub-module (10) between the two heat-conducting walls (4).

3. The unmanned radar VPX mainframe of claim 2, wherein, The outer surface of the heat-conducting wall (4) is provided with a heat dissipation fin (9) on the upper part, and a heat dissipation air duct is formed between the heat dissipation fins (9); the lower part of the outer surface of the heat-conducting wall (4) is a plane, and a heat dissipation fan (11) is arranged on the plane.

4. The unmanned radar VPX mainframe of claim 3, wherein, The outer surface of the heat-conducting wall (4) is provided with a heat dissipation boss (12) on the middle part, and the heat dissipation boss (12) is provided with a heat dissipation air duct, which is in communication with the heat dissipation air duct between the heat dissipation fins (9).

5. The unmanned radar VPX mainframe of claim 3, wherein, The lower part of the heat-conducting wall (4) is provided with one or more heat dissipation fans (11).

6. The unmanned radar airborne VPX mainframe of claim 4, wherein, The middle part of the heat dissipation boss (12) is provided with a threaded hole (13) for fixing the shell assembly (1), and the outer surface of the heat-conducting wall (4) is provided with a mounting table (14) on both sides for mounting the shell assembly (1), and the surface of the mounting table (14) is provided with a threaded hole (13).

7. The unmanned radar VPX mainframe of claim 1, wherein, The circuit board sub-module (10) comprises an upper cover plate (101), a circuit board (102), a lower cover plate (103), a front cover plate (104), a VPX locking strip (105), and a pulling aid (106), wherein the upper cover plate (101), the lower cover plate (103), and the front cover plate (104) surround the circuit board (102), the VPX locking strip (105) is used for clamping and fixing the circuit board sub-module (10) in the VPX case frame, the pulling aid (106) is arranged on the front part of the lower cover plate (103) and is used for pulling out the circuit board sub-module (10), and the two side edges of the upper cover plate (101) are provided with the fixing frames (8).

8. The unmanned radar VPX mainframe of claim 7, wherein, The pulling aid (106) comprises a handle part and a lifting part, and is rotatably fixed to the front part of the lower cover plate (103), the lifting part protrudes from the side edge of the lower cover plate (103) and is attached to the side surface of the concave-convex step (5).

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