Liquid cooling heat dissipation device for server memory

Abstract

The utility model provides a server memory liquid cooling heat dissipation device, and relates to the technical field of server memory heat dissipation, the server memory liquid cooling heat dissipation device comprises a heat dissipation part, the heat dissipation part comprises a first connecting seat, the bottom of the first connecting seat is provided with a cooling liquid flowing cavity, and the top of the cooling liquid flowing cavity is provided with a plurality of first connecting grooves; stainless steel temperature-uniforming plates are inserted into the first connecting grooves, and gaps are reserved between the stainless steel temperature-uniforming plates so that server memory banks can be inserted into the stainless steel temperature-uniforming plates. According to the invention, the stainless steel uniform temperature plate is used as a heat conduction main body, and the stainless steel uniform temperature plate increases the contact area with the first connecting seat and the memory bank, so that heat generated by the memory bank can be quickly conducted to the first connecting seat, and the cooling liquid flowing cavity formed in the first connecting seat can allow cooling liquid to circulate for heat exchange; compared with a traditional heat dissipation mode, the heat dissipation structure in the technical scheme is firmer, more durable and not prone to damage, and the reliability of the system is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to server memory heat dissipation technical field, specifically, relate to server memory liquid cooling heat dissipation device. BACKGROUND

[0002] In the heat dissipation field of data center liquid cooling server system, the optimization of heat dissipation performance has been the focus, and the traditional heat dissipation mode, such as heat pipe flattening contact type heat dissipation, although can satisfy the heat dissipation demand of server to a certain extent, but its inherent defects limit its further development and application;

[0003] Specifically, the contact surface of heat pipe flattening contact type heat dissipation is relatively small, which leads to low heat transfer efficiency, and the heat dissipation performance is limited, especially in the high-power density server environment, the limitation of this heat dissipation mode is more obvious, and it cannot meet the growing heat dissipation demand. Therefore we make improvement, and propose server memory liquid cooling heat dissipation device. SUMMARY

[0004] The utility model discloses the purpose at: in view of the heat pipe flattening contact type heat dissipation contact surface relatively small of existing at present, lead to the problem of low heat transfer efficiency.

[0005] In order to realize the above-mentioned invention purpose, the utility model provides server memory liquid cooling heat dissipation device to improve the above-mentioned problem.

[0006] The application is as follows:

[0007] Server memory liquid cooling heat dissipation device, including heat dissipation part, the heat dissipation part includes first connecting seat, the bottom of first connecting seat is provided with cooling liquid flow cavity, the top of cooling liquid flow cavity is provided with a plurality of first connecting slots, a plurality of first connecting slots are all inserted with stainless steel uniform temperature plate, and a plurality of stainless steel uniform temperature plates are inserted into the gap between the server memory bar.

[0008] As the preferred technical scheme of the application, one side of the first connecting seat is provided with two connecting pipes, the two connecting pipes are communicated with the cooling liquid flow cavity, and the bottom of the first connecting seat is further provided with a sealing cover plate for plugging the bottom opening of the cooling liquid flow cavity.

[0009] As the preferred technical scheme of the application, a plurality of L-shaped plates are fixedly installed in the cooling liquid flow cavity, and a plurality of L-shaped plates are staggered arranged on the inner wall of both sides of the cooling liquid flow cavity.

[0010] As the preferred technical scheme of the application, a plurality of recesses are formed in the top of the inner cavity of the cooling liquid flow cavity, and a plurality of recesses are located between a plurality of first connecting slots.

[0011] As a preferred technical scheme of the present application, the two sides of the stainless steel uniform temperature plate are provided with ceramic heat-conducting plates.

[0012] As a preferred technical scheme of the present application, the two sides of the stainless steel uniform temperature plate are provided with ceramic heat-conducting plates.

[0013] As a preferred technical scheme of the present application, the two sides of the stainless steel uniform temperature plate are provided with ceramic heat-conducting plates.

[0014] As a preferred technical scheme of the present application, the two sides of the stainless steel uniform temperature plate are provided with ceramic heat-conducting plates.

[0015] As a preferred technical scheme of the present application, the two sides of the stainless steel uniform temperature plate are provided with ceramic heat-conducting plates.

[0016] As a preferred technical scheme of the present application, the two sides of the stainless steel uniform temperature plate are provided with ceramic heat-conducting plates.

[0017] Compared with the prior art, the present application has the following beneficial effects:

[0018] In the scheme of the present application:

[0019] In order to solve the problem of relatively small contact surface of the heat pipe flattening contact type heat dissipation in the prior art, resulting in low heat transfer efficiency, the present application uses a stainless steel uniform temperature plate as a heat-conducting main body, which increases the contact area with the first connecting seat and the memory strip, so as to quickly conduct the heat generated by the memory to the first connecting seat. The cooling liquid flow cavity opened on the first connecting seat can supply the cooling liquid to flow, so as to exchange heat, thereby realizing efficient heat dissipation. Compared with the traditional heat dissipation mode, the heat dissipation structure in the present technical scheme is more solid and durable, and is not easy to be damaged, thereby improving the reliability of the system. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 The structural schematic diagram of the server memory liquid cooling heat dissipation device provided by the present application is shown in the figure.

[0021] Figure 2 The exploded view of the server memory liquid cooling heat dissipation device provided by the present application is shown in the figure.

[0022] Figure 3 The bottom view structural schematic diagram of the server memory liquid cooling heat dissipation device provided by the present application is shown in the figure.

[0023] Figure 4The structural schematic view of a cooling liquid flowing cavity of a server memory liquid cooling heat dissipation device is provided.

[0024] Indicated in the figure are:

[0025] 1, first connecting seat; 101, cooling liquid flowing cavity; 102, connecting pipe; 103, L-shaped plate; 104, groove; 105, sealing cover plate; 106, first connecting groove; 107, stainless steel uniform temperature plate; 108, second connecting groove; 109, ceramic heat conduction plate;

[0026] 2, second connecting seat; 201, third connecting groove; 202, pressing plate; 203, fourth connecting groove. DETAILED DESCRIPTION

[0027] In order for those skilled in the art to better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts should belong to the scope of protection of the present application.

[0028] As described in the background, the traditional heat dissipation mode such as heat pipe flattening contact type heat dissipation can meet the heat dissipation demand of the server to a certain extent, but its inherent defects limit its further development and application. Specifically, the contact surface of the heat pipe flattening contact type heat dissipation is relatively small, resulting in low heat transfer efficiency and limited heat dissipation performance. In particular, in the high-power-density server environment, the limitations of this heat dissipation mode are more obvious, and it cannot meet the growing heat dissipation demand.

[0029] In order to solve this technical problem, the present application provides a server memory liquid cooling heat dissipation device which is applied to the heat dissipation of a through-type server memory.

[0030] Specifically, please refer to Figures 1-4 , the server memory liquid cooling heat dissipation device specifically comprises:

[0031] a heat dissipation part, the heat dissipation part comprising a first connecting seat 1, the bottom of the first connecting seat 1 being provided with a cooling liquid flowing cavity 101, the top of the cooling liquid flowing cavity 101 being provided with a plurality of first connecting grooves 106, a stainless steel uniform temperature plate 107 being inserted into each of the plurality of first connecting grooves 106, and gaps being left between the plurality of stainless steel uniform temperature plates 107 for inserting a server memory bar.

[0032] The server memory liquid cooling heat dissipation device provided by the utility model, the application adopts the stainless steel heat uniform plate 107 as the heat conduction main body, the stainless steel heat uniform plate 107 increases the contact area with the first connecting seat 1 and the memory strip, so that the heat generated by the memory can be quickly conducted to the first connecting seat 1, the cooling liquid flowing cavity 101 formed in the first connecting seat 1 can be used for the circulation of the cooling liquid, so as to exchange heat, and high-efficiency heat dissipation is realized; compared with the traditional heat dissipation mode, the heat dissipation structure in the technical scheme is more solid and durable, is not easy to be damaged, and the reliability of the system is improved.

[0033] In order for the person skilled in the art to better understand the technical scheme of the utility model, the technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings.

[0034] It should be noted that the embodiments in the utility model and the features and technical schemes in the embodiments can be combined with each other without conflict.

[0035] It should be noted that: similar signs and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0036] Embodiment 1, please refer to Figures 1-4 The server memory liquid cooling heat dissipation device comprises a heat dissipation part, the heat dissipation part comprises a first connecting seat 1, the bottom of the first connecting seat 1 is provided with a cooling liquid flowing cavity 101, the top of the cooling liquid flowing cavity 101 is provided with a plurality of first connecting grooves 106, a stainless steel heat uniform plate 107 is inserted into each of the plurality of first connecting grooves 106, and gaps are left between the plurality of stainless steel heat uniform plates 107 for the insertion of server memory strips; the application adopts the stainless steel heat uniform plate 107 as the heat conduction main body, the stainless steel heat uniform plate 107 increases the contact area with the first connecting seat 1 and the memory strip, so that the heat generated by the memory can be quickly conducted to the first connecting seat 1, the cooling liquid flowing cavity 101 formed in the first connecting seat 1 can be used for the circulation of the cooling liquid, so as to exchange heat, and high-efficiency heat dissipation is realized; compared with the traditional heat dissipation mode, the heat dissipation structure in the technical scheme is more solid and durable, is not easy to be damaged, and the reliability of the system is improved;

[0037] The stainless steel heat uniform plate 107 is made of stainless steel, and the stainless steel has excellent heat conduction performance, so that the heat generated by the memory strip can be quickly conducted to the first connecting seat 1, which makes the heat be quickly transferred, avoids the local overheating of the memory strip, and prolongs the service life of the memory.

[0038] Further, as Figures 1-4As shown, two connecting pipes 102 are mounted on one side of the first connecting seat 1, both of which are in communication with the cooling liquid flow cavity 101, and a sealing cover plate 105 is arranged at the bottom of the first connecting seat 1 to block the bottom opening of the cooling liquid flow cavity 101. The two connecting pipes 102 are used to connect with the existing refrigeration equipment through pipelines, and the refrigeration equipment can use a water chiller. The water chiller circulates and injects cooling liquid into the cooling liquid flow cavity 101 through the connecting pipe 102.

[0039] Further, as shown in Figure 4 The L-shaped plates 103 are fixedly installed in the cooling liquid flow cavity 101, and are arranged on the inner walls on both sides of the cooling liquid flow cavity 101. The arrangement of the L-shaped plates 103 increases the flow path and disturbance degree of the cooling liquid in the flow cavity 101, greatly improving the heat exchange efficiency. When the cooling liquid flows in the cooling liquid flow cavity 101, the L-shaped plates 103 change the flow direction of the cooling liquid, increasing the contact time and area of the cooling liquid with the first connecting seat 1. This design enables the cooling liquid to more fully absorb heat, improving the heat exchange effect, which helps to quickly reduce the temperature of the memory bank and improve the performance and stability of the server.

[0040] Further, as shown in Figure 4 A plurality of grooves 104 are formed in the top of the cavity of the cooling liquid flow cavity 101, and are located between a plurality of first connecting grooves 106, i.e. the grooves 104 are located in the first connecting seat 1 on both sides of the first connecting groove 106. This arrangement enables the cooling liquid to better exchange heat with the stainless steel vapor chamber 107. The arrangement of the grooves 104 increases the amount of cooling liquid, making the heat exchange more sufficient and enhancing the heat transfer between the cooling liquid and the stainless steel vapor chamber 107. This design can quickly remove the heat on the stainless steel vapor chamber 107 and reduce the temperature of the memory bank.

[0041] In embodiment 2, the server memory liquid cooling heat dissipation device provided in embodiment 1 is further optimized. Specifically, as shown in Figures 1-3 The ceramic heat-conducting plate 109 is arranged on both sides of the stainless steel vapor chamber 107 and contacts the memory bank in use. The arrangement of the ceramic heat-conducting plate 109 can efficiently conduct heat and reliably insulate, greatly improving the safety of the device. The ceramic material has good heat-conducting performance and can quickly transfer the heat generated by the memory bank to the stainless steel vapor chamber 107 and the first connecting seat 1. In addition, the insulation property of the ceramic material can effectively prevent safety problems such as leakage of the memory bank, protecting the hardware equipment of the server. This design not only ensures the heat dissipation effect, but also improves the safety and reliability of the server, providing double protection for the stable operation of the server.

[0042] Further, as shown in Figures 1-2As shown, the second connecting groove 108 is arranged at both sides of the first connecting groove 106, and the end of the ceramic heat-conducting plate 109 is inserted into the second connecting groove 108, so that the first connecting seat 1 is also directly in contact with the ceramic heat-conducting plate 109, thereby improving the heat exchange effect and increasing the heat dissipation effect. The design increases the contact area of heat transfer, so that the heat can be quickly transferred from the ceramic heat-conducting plate 109 to the first connecting seat 1. The insertion mode makes the installation of the ceramic heat-conducting plate 109 more firm and less likely to loosen, thereby ensuring the stability of heat transfer. This helps to improve the heat dissipation efficiency of the server, reduce the operating temperature, and prolong the service life of the server.

[0043] In the embodiment 3, the server memory liquid cooling heat dissipation device provided in the embodiment 1 or 2 is further optimized, and specifically, Figures 1-3 As shown, the number of heat dissipation parts is two, and the second connecting seat 2 is arranged between the two heat dissipation parts. The second connecting seat 2 can connect the two heat dissipation parts together and support the end of the stainless steel uniform plate 107 and the ceramic heat-conducting plate 109 away from the first connecting seat 1.

[0044] Further, as shown in the Figure 2 The second connecting seat 2 is provided with a plurality of third connecting grooves 201, and the end of the stainless steel uniform plate 107 away from the first connecting seat 1 is inserted into the third connecting groove 201, so that the installation of the stainless steel uniform plate 107 is more firm and reliable. This design can effectively prevent the stainless steel uniform plate 107 from shaking or shifting during use, thereby ensuring the stability of the heat dissipation effect.

[0045] Further, as shown in the Figure 2 The top of the second connecting seat 2 is provided with a pressing plate 202 through bolts, and the pressing plate 202 is used for limiting the stainless steel uniform plate 107. The pressing plate 202 can effectively prevent the stainless steel uniform plate 107 from being pulled out of the third connecting groove 201, thereby ensuring the integrity and reliability of the heat dissipation structure.

[0046] Further, as shown in the Figure 1 And Figure 2 The fourth connecting groove 203 is arranged at both sides of the third connecting groove 201, and the end of the ceramic heat-conducting plate 109 away from the first connecting seat 1 is inserted into the fourth connecting groove 203. This design can effectively prevent the ceramic heat-conducting plate 109 from loosening or shifting during use, thereby ensuring the stability of the heat conduction and insulation effect.

[0047] The use process of the server memory liquid cooling heat dissipation device is as follows:

[0048] Two connecting pipes 102 are connected with the water inlet and the cold water outlet of the water chiller through pipes, the water chiller circulates and injects cooling liquid into the cooling liquid flowing cavity 101 through the connecting pipes 102, the heat of the memory bank is transmitted to the first connecting seat 1 through the ceramic heat-conducting plate 109 and the stainless steel heat-dissipating plate 107, and the first connecting seat 1 exchanges heat with the cooling liquid, so that heat dissipation is realized.

[0049] In the present application, unless otherwise clearly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected or in communication with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0050] Obviously, the above-described embodiments are only part of the embodiments of the present application, not all the embodiments, and the preferred embodiments of the present application are given in the drawings, but do not limit the patent scope of the present application. The present application can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or equivalently replace some technical features. Any equivalent structure made by using the content of the present application specification and drawings, directly or indirectly applied to other related technical fields, is also within the patent protection scope of the present application.

Claims

1. A liquid cooling heat dissipation device for server memory, characterized in that, The application relates to a heat dissipation part which comprises a first connecting seat (1), the bottom of the first connecting seat (1) is provided with a cooling liquid flow cavity (101), the top of the cooling liquid flow cavity (101) is provided with a plurality of first connecting grooves (106), a stainless steel uniform temperature plate (107) is inserted into each of the first connecting grooves (106), and gaps are left between the stainless steel uniform temperature plates (107) for inserting server memory bars.

2. The in-server memory liquid cooling heat dissipation device according to claim 1, characterized in that, Two connecting pipes (102) are mounted on one side of the first connecting seat (1) and communicate with the cooling liquid flow cavity (101), and a sealing cover plate (105) for sealing the bottom opening of the cooling liquid flow cavity (101) is further arranged at the bottom of the first connecting seat (1).

3. The in-server memory liquid cooling heat dissipation device according to claim 1, characterized in that, A plurality of L-shaped plates (103) are fixedly installed in the cooling liquid flow cavity (101), and the L-shaped plates (103) are arranged on the inner walls on both sides of the cooling liquid flow cavity (101) in a staggered mode.

4. The in-server memory liquid cooling heat dissipation device of claim 1, wherein, A plurality of recesses (104) are formed in the top of the inner cavity of the cooling liquid flow cavity (101), and the recesses (104) are located between the first connecting grooves (106).

5. The in-server memory liquid cooling heat dissipation device of claim 1, wherein, Ceramic heat-conducting plates (109) are arranged on both sides of the stainless steel uniform temperature plate (107).

6. The in-memory liquid cooling system of claim 5, wherein, Second connecting grooves (108) are formed in the side walls of the first connecting grooves (106), and the end portions of the ceramic heat-conducting plates (109) are inserted into the second connecting grooves (108).

7. The in-memory liquid cooling system of claim 6, wherein, The number of the heat dissipation parts is two, and a second connecting seat (2) is arranged between the two heat dissipation parts.

8. The in-memory liquid cooling system of claim 7, wherein, A plurality of third connecting grooves (201) are formed in the second connecting seat (2), and the end, away from the first connecting seat (1), of the stainless steel uniform temperature plate (107) is inserted into the third connecting grooves (201).

9. The in-memory liquid cooling system of claim 8, wherein, A pressing plate (202) is mounted on the top of the second connecting seat (2) through bolts, and the pressing plate (202) is used for limiting the stainless steel uniform temperature plate (107).

10. The in-server memory liquid cooling heat dissipation device of claim 8, wherein, Fourth connecting grooves (203) are formed in the side walls of the third connecting grooves (201), and the end, away from the first connecting seat (1), of the ceramic heat-conducting plate (109) is inserted into the fourth connecting grooves (203).

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