Copper lead sheet packaging structure for improving heating and stress of chip

Abstract

The utility model discloses a copper lead sheet packaging structure for improving chip heating and stress, which comprises a frame and a protective shell, the frame is provided with a packaging assembly, the protective shell covers the packaging assembly and is arranged on the frame, and the packaging assembly comprises a chip and a copper lead sheet; according to the utility model, the structure is simple, the design is reasonable, the area of the copper lead sheet is enlarged by adding the flying wings, the heat radiation of the copper lead sheet can be effectively enhanced, the mechanical strength of the whole device is increased, the structure is more stable, and the stress is effectively improved and the electrical performance of the chip is improved by adding the through holes.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, specifically to a copper lead sheet packaging structure for improving chip heating and stress. BACKGROUND

[0002] With the continuous progress of semiconductor technology, the application range of copper sheet CLIP packaging in the field of semiconductor MOSFET (metal oxide semiconductor field effect transistor) is becoming wider and wider.

[0003] Disadvantages of the prior art:

[0004] At present, the CLIP packaging structure still needs to be improved in terms of heat dissipation, thermal stress and mechanical strength, especially in high-temperature and high-power working environments. For large-size chip packaging products, the existing CLIP causes stress on both sides and two corners of the chip, and the small contact area between the chip and the CLIP affects heat dissipation. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a copper lead sheet packaging structure for improving chip heating and stress to solve the problems raised in the background art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a copper lead sheet packaging structure for improving chip heating and stress, comprising a frame and a protective shell, the frame is provided with a packaging assembly, the protective shell covers the packaging assembly and is arranged on the frame, and the packaging assembly comprises:

[0007] a chip, which is arranged on the frame by being provided with tin paste;

[0008] a copper lead sheet, which is connected to the chip by the tin paste, and is provided with a flying wing and a through hole.

[0009] Preferably, the thickness of the flying wing is consistent with the thickness of the copper lead sheet, and the thickness of the flying wing is 0.2 mm.

[0010] Preferably, the material of the protective shell is epoxy resin.

[0011] Compared with the prior art, the utility model has the following advantages:

[0012] The copper lead sheet packaging structure for improving chip heating and stress is provided with a packaging assembly, which comprises a chip, tin paste and a copper lead sheet provided with a flying wing and a through hole. By increasing the flying wing, the area of the copper lead sheet is expanded, which can effectively enhance the heat dissipation of the copper lead sheet and increase the mechanical strength of the overall device, making the structure more stable. The through hole effectively improves the stress and improves the electrical performance of the chip. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 It is the whole structure schematic diagram of the utility model;

[0014] Fig. 2 It is the whole structure schematic diagram of the utility model;

[0015] Fig. 3 It is the whole structure schematic diagram of the utility model;

[0016] In the drawing: 110, frame;120, protective shell;130, chip;140, tin paste;150, copper lead sheet;151, flying wing;152, through hole. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0018] In the description of the utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0019] In the description of the patent, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "setting" should be understood broadly, for example, it can be fixedly connected, set, or detachably connected, set, or integrally connected, set. For those skilled in the art, the specific meaning of the above terms in the patent can be understood according to the specific circumstances.

[0020] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features. In the description of the utility model, the meaning of "several" is two or more than two, unless otherwise explicitly specified and limited.

[0021] Embodiment

[0022] Please refer to Figs. 1-3 As shown in the drawings, the utility model provides a kind of copper lead sheet packaging structure for improving chip heat and stress technical scheme: including frame 110 and protective shell 120, frame 110 is equipped with packaging assembly, protective shell 120 covers packaging assembly and is installed in frame 110, the material quality of protective shell 120 is selected as epoxy resin, packaging assembly includes chip 130, tin paste 140 and copper lead sheet 150, chip 130 is installed in frame 110 by tin paste 140, copper lead sheet 150 is connected chip 130 by tin paste 140, copper lead sheet 150 is provided with flying wing 151 and through hole 152, flying wing 151 is connected to copper lead sheet 150, the thickness of flying wing 151 is set with the thickness of copper lead sheet 150 consistent, the thickness of flying wing 151 is 0.2mm, the area of flying wing 151 is 2.98mm 2 , by increasing flying wing 151, the area of copper lead sheet 150 is expanded, copper lead sheet 150 can be effectively enhanced heat dissipation, and the mechanical strength of overall device is increased, so that structure is more stable, stress is effectively improved by increasing through hole 152, and the electrical performance of chip 130 is improved.

[0023] The working principle of the utility model is as follows:

[0024] The copper lead sheet packaging structure for improving chip heat and stress of the embodiment is used, packaging assembly is provided, packaging assembly includes chip 130, tin paste 140 and copper lead sheet 150, copper lead sheet 150 is provided with flying wing 151 and through hole 152, by increasing flying wing 151, the area of copper lead sheet 150 is expanded, copper lead sheet 150 can be effectively enhanced heat dissipation, and the mechanical strength of overall device is increased, so that structure is more stable, stress is effectively improved by increasing through hole 152, and the electrical performance of chip 130 is improved.

[0025] The basic principle, main features and advantages of the utility model are shown and described above. Those skilled in the art should understand that the utility model is not limited by the above examples, and the above examples and descriptions in the specification are only preferred examples of the utility model and do not limit the utility model. Without departing from the spirit and scope of the utility model, the utility model can also have various changes and improvements, and these changes and improvements fall within the scope of the claimed utility model. The scope of protection of the utility model is defined by the appended claims and their equivalents.

Claims

1. A copper lead sheet packaging structure for improving chip heat and stress, comprising a frame (110) and a protective shell (120), characterized in that: The frame (110) is provided with a packaging assembly, the protective shell (120) covers the packaging assembly arranged on the frame (110), and the packaging assembly comprises: A chip (130) arranged on the frame (110) through tin paste (140); A copper lead sheet (150) connected with the chip (130) through the tin paste (140), the copper lead sheet (150) is provided with a wing (151) and a through hole (152).

2. The copper leadframe package structure for improving the thermal and stress of chip as claimed in claim 1, wherein: The thickness of the wing (151) is consistent with the thickness of the copper lead sheet (150), and the thickness of the wing (151) is 0.2mm.

3. The copper leadframe package structure for improving the thermal and stress of chip as claimed in claim 1, wherein: The material of the protective shell (120) is selected as epoxy resin.

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