Loudspeaker mounting structure, loudspeaker module and electronic equipment

Abstract

The utility model discloses a loudspeaker mounting structure, a loudspeaker module and electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a machine body and a loudspeaker module, the loudspeaker module comprises a body and an FPC arranged on the body, the machine body is provided with a loudspeaker installation area, the body is installed in the loudspeaker installation area, the loudspeaker installation structure comprises a circumferential dispensing groove, the circumferential dispensing groove is located in the loudspeaker installation area and arranged in the circumferential direction of the body, and the FPC is arranged in the circumferential dispensing groove. The gap is formed between the bottom of the body and the surrounding structure; an electric connecting part is arranged on the machine body, the FPC is electrically connected with the electric connecting part, a glue storage groove communicated with the circumferential dispensing groove is formed in the side, close to the electric connecting part, of the circumferential dispensing groove, and at least part of the glue storage groove is exposed out of the FPC. The glue storage groove enables glue to be injected into the unshielded area of the FPC in the dispensing process, the glue can gradually enter the circumferential dispensing groove shielded by the FPC from the glue storage groove, good sealing is achieved, and abnormal loudspeaker functions caused by poor sealing are avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, and in particular to a loudspeaker mounting structure, a loudspeaker module and an electronic device. BACKGROUND

[0002] In the prior art, the installation of the loudspeaker core of a mobile phone is usually performed in the following manner: first, the loudspeaker core is installed, then a dispensing operation is performed, and then a flexible printed circuit board (FPC) is installed and connected to the core.

[0003] However, there are many problems in the design and processing process. On the one hand, the installation process is complex, and multiple steps such as core installation, dispensing and FPC connection need to be performed in sequence, which not only increases the production time and management cost, but also increases the operation difficulty, and once a problem occurs in a certain link, the product quality will be affected. On the other hand, the FPC needs to be welded with the core and the external circuit, which requires high precision and needs to be operated by professional equipment and technical personnel, and any poor welding point may cause abnormal function of the loudspeaker, and strict quality detection and control also increase the cost. At the same time, the complex process and high precision requirement make the processing and production process cost high, including equipment investment, labor cost, quality detection cost, etc. In addition, due to the limitation of design and process, the flexibility of processing and installation is insufficient, and it is difficult to quickly adjust according to the actual situation. Especially for the lower loudspeaker of the mobile phone, due to the limited installation space, under this installation process, the production process is not only inefficient, but also prone to errors.

[0004] The main reason for the above problems is that if the FPC is integrated with the core, the dispensing sealing process of the core will be affected by the FPC shielding, and cannot be sealed. CONTENT OF THE UTILITY MODEL

[0005] The present application provides a loudspeaker mounting structure, a loudspeaker module and an electronic device, which can ensure that the dispensing can still be completed in the FPC shielding area through the structure of the loudspeaker mounting area, thereby realizing the integration of the loudspeaker module body and the FPC in the production process of the electronic device.

[0006] The technical scheme is as follows:

[0007] The first aspect of the application provides a loudspeaker mounting structure applied to an electronic device, the electronic device comprising a body and a loudspeaker module, the loudspeaker module comprising a body and an FPC arranged on the body, the body being arranged on a loudspeaker mounting area of the body, the loudspeaker mounting structure comprising a circumferential dispensing groove, the circumferential dispensing groove being arranged on the loudspeaker mounting area and along the circumference of the body for sealing the gap between the bottom of the body and the surrounding structure; the body is provided with an electrical connection part, the FPC is electrically connected with the electrical connection part, and the side of the circumferential dispensing groove close to the electrical connection part is provided with a glue storage groove in communication with the circumferential dispensing groove, and the glue storage groove is at least partially exposed to the FPC.

[0008] Through the above technical solution, glue can be injected in the area not blocked by the FPC during dispensing, and the glue can be stored, so that the glue can gradually enter the circumferential dispensing groove blocked by the FPC from the glue storage groove, achieving good sealing and avoiding abnormal function of the loudspeaker caused by poor sealing. Since there is no need to worry about the blocking of the FPC, the application realizes the integration of the body of the loudspeaker module and the FPC, which improves the overall stability of the loudspeaker module and reduces the risk of affecting product quality due to poor connection of each link. Especially for the case of limited installation space such as mobile phone lower loudspeaker, the operation error caused by complicated steps is reduced, so that the production process is not only more efficient, but also more accurate.

[0009] In a possible design, the groove width of the glue storage groove is greater than the groove width of the circumferential dispensing groove. Since the dispensing operation is to inject glue into the glue storage groove first, and then flow to the circumferential dispensing groove blocked by the FPC, the glue storage groove needs to have a larger groove width. The larger groove width can accommodate more glue, providing sufficient reserves for the subsequent flow of glue to the circumferential dispensing groove.

[0010] In a possible design, the length of the glue storage groove is greater than the width of the FPC, and both ends of the glue storage groove are exposed to the FPC. No matter where the FPC is located, the glue storage groove can provide sufficient glue source for the blocked area. The fact that both ends of the glue storage groove are exposed to the FPC can ensure that the glue can flow into the blocked area from two directions.

[0011] In a possible design, there are two glue storage grooves, the first end of the glue storage groove is located below the FPC, the second end of the glue storage groove is exposed to the FPC, and the second ends of the two glue storage grooves are located on both sides of the FPC respectively. Glue is supplied to the blocked area from two different directions.

[0012] In a possible design, the glue storage groove comprises a flow guide section, an inclined guide surface is arranged at one end of the flow guide section away from the circumferential glue dispensing groove, the inclined guide surface gradually inclines downward, and the lowest end of the inclined guide surface is located at the side of the inclined guide surface close to the circumferential glue dispensing groove. The operator does not need to intervene in the flow direction of the glue, which reduces the operation difficulty and error probability, and also reduces the situation of rework due to poor sealing. In terms of enhancing the sealing effect, the glue can flow to the sealing area more quickly and uniformly, so that the sealing is more sufficient.

[0013] In a possible design, the distance between the inner side walls on the opposite sides of the flow guide section gradually decreases from the direction where the electrical connection part is located to the direction close to the circumferential glue dispensing groove, forming a funnel-like structure, which can guide the glue to flow more smoothly to the circumferential glue dispensing groove, reduce the flow resistance of the glue, improve the glue dispensing efficiency, and ensure that the glue quickly and accurately reaches the part to be sealed. As the distance between the inner side walls gradually decreases, the glue is extruded during the flow process, so that the glue can be more uniformly distributed in the circumferential glue dispensing groove and the area blocked by the FPC, avoiding local poor sealing and improving the sealing quality and stability.

[0014] In a possible design, the side walls on the opposite sides of the flow guide section are flow guide side walls, the flow guide side walls gradually incline downward, and the lowest end of the flow guide side walls is located at the side of the flow guide side walls close to the circumferential glue dispensing groove. The glue in the flow guide section can naturally flow to the side close to the circumferential glue dispensing groove along the inclined side walls, and the glue can be quickly and smoothly moved to the area to be sealed by gravity without additional power, thereby improving the glue dispensing efficiency.

[0015] In a possible design, the glue storage groove further comprises a glue storage section below the flow guide section. Part of the glue enters the glue storage section for storage, ensuring sufficient glue supply during glue dispensing, and avoiding incomplete or uneven sealing due to insufficient glue.

[0016] In a possible design, the loudspeaker mounting area is provided with a mounting recess, the circumferential glue dispensing groove is located at the upper edge of the mounting recess, and the loudspeaker module is mounted in the mounting recess and is adapted to the mounting recess.

[0017] The second aspect of the application provides a loudspeaker module, which comprises the above-mentioned loudspeaker mounting structure, loudspeaker module, and electrical connection part.

[0018] According to the above technical solution, since the loudspeaker module comprises the above-mentioned loudspeaker mounting structure, it at least has all the beneficial effects of the loudspeaker mounting structure, which will not be described here.

[0019] In a possible design, the end of the FPC is provided with a contact part, and the contact part is welded or elastically connected to the electrical connection part.

[0020] In a possible design, the speaker module is multiple, the speaker mounting area is multiple, and the multiple speaker modules correspond to the multiple speaker mounting areas one by one. The multiple speaker modules can work simultaneously to generate greater volume output. Different speaker modules can cooperate to produce sound, making the sound more uniform and powerful in space. For electronic devices supporting multi-channel audio, multiple speaker modules can correspond to different channels to achieve a more realistic surround sound effect.

[0021] In a possible design, the multiple speaker mounting areas include a specific speaker mounting area, the first speaker module is mounted in the specific speaker mounting area, the first electrical connection part corresponds to the specific speaker mounting area, and the first electrical connection part includes an adapter part. The adapter part is mounted on the body, the first end of the adapter part is welded to the FPC, and the second end of the adapter part is elastically electrically connected to the first electrical connection part. By providing the adapter part, the installation demand of the narrow space can be effectively adapted. The adapter part can be flexibly designed and arranged according to the shape and size of the space, so that the speaker module can be stably installed in the limited space.

[0022] In a possible design, the speaker module includes a module shell, the speaker mounting structure is arranged on the module shell, the module shell is arranged on the body, the specific speaker mounting area is arranged on the module shell, and the adapter part is arranged on the module shell. The module shell provides a special mounting position for the specific speaker mounting area, so that the speaker module is more concentrated and independent. Modularization is conducive to improving production efficiency, different parts can be produced and assembled at the same time, and the overall manufacturing time is reduced. The module shell can help the speaker to better focus and direct the output of sound. Through a specific shape, the sound can be guided to propagate in a specific direction, improving the propagation efficiency and directivity of the sound, and the sound emitted by the speaker can be more clearly heard in the specific direction.

[0023] In a possible design, the module shell is provided with a fixing groove, and the adapter part is arranged in the fixing groove. In the embodiment of the present application, the fixing groove arranged on the module shell provides a clear mounting position for the adapter part, achieving precise positioning.

[0024] In a possible design, the bottom surface of the circumferential dispensing groove on the side close to the electrical connection part is a flow guide surface, and the flow guide surface gradually inclines downward from both ends thereof to the area below the FPC. The flow guide surface can use gravity to guide the glue to flow naturally to the key area that needs to be sealed, and the glue flows from the glue storage groove to form a complete seal. Each area can be fully filled with glue to improve the sealing effect.

[0025] In a possible design, the guide slope includes a first guide section and a second guide section, the first guide section is located on a side away from the circumferential glue dispensing groove, and the second guide section is located on a side close to the circumferential glue dispensing groove, and the slope of the first guide section is smaller than the slope of the second guide section. Through the design of the two-section guide slope, the generation of air bubbles can be effectively avoided, thereby ensuring the sealing performance of the loudspeaker module and providing a solid guarantee for high-quality audio output of the electronic device.

[0026] The third aspect of the present application provides an electronic device, comprising a body and a loudspeaker module as described in any of the above technical solutions mounted on the body.

[0027] Through the above technical solution, since the electronic device comprises the loudspeaker module, at least all the beneficial effects of the loudspeaker module are possessed, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a structural schematic diagram of an internal part of an electronic device provided by an embodiment of the present application;

[0029] Figure 2 is a structural schematic diagram of an electronic device provided by an embodiment of the present application after hiding an upper cover in Figure 1 ;

[0030] Figure 3 is an exploded structural schematic diagram of Figure 2 ;

[0031] Figure 4 is a partial enlarged view of an A area in Figure 3 ;

[0032] Figure 5 is a structural schematic diagram of a loudspeaker module provided by an embodiment of the present application;

[0033] Figure 6 is an exploded structural schematic diagram of a loudspeaker module provided by an embodiment of the present application;

[0034] Figure 7 is a top view structural schematic diagram of a loudspeaker module provided by an embodiment of the present application;

[0035] Figure 8 is an A-A cross-sectional structural schematic diagram in Figure 7 ;

[0036] Figure 9 is a partial enlarged view of a B area in Figure 8 ;

[0037] Figure 10 is a structural schematic diagram of a loudspeaker module with an upper cover provided by an embodiment of the present application;

[0038] Figure 11is a structural schematic diagram of a loudspeaker module and an adapter provided by an embodiment of the present application;

[0039] Figure 12 is a structural schematic diagram of an internal structure of a loudspeaker module provided by an embodiment of the present application;

[0040] In the drawings, the meanings of the respective reference numerals are as follows:

[0041] 10, body;

[0042] 11, loudspeaker mounting area; 12, circumferential dispensing groove; 13, glue storage groove; 131, flow guide section; 1311, guide inclined surface; 1312, flow guide side wall; 132, glue storage section; 14, sound outlet;

[0043] 20, loudspeaker module; 21, body; 22, FPC; 221, contact portion;

[0044] 30, loudspeaker module; 31, adapter; 33, mounting recess; 34, module housing; 341, upper cover; 342, bottom shell; 343, sound outlet. DETAILED DESCRIPTION

[0045] To make the objectives, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0046] It should be understood that the "multiple" mentioned in the present application refers to two or more. In the description of the present application, unless otherwise specified, " / " represents the meaning of or, for example, A / B can represent A or B; "and / or" in the present application only represents a description of the association relationship of the associated objects, and can represent three relationships, for example, A and / or B, which can represent three cases of A alone, A and B together, and B alone. In addition, in order to clearly describe the technical solutions of the present application, the same items or similar items with basically the same functions and effects are distinguished by using "first", "second", etc. The skilled in the art can understand that "first", "second", etc. do not limit the quantity and execution order, and "first", "second", etc. also do not necessarily mean different.

[0047] In the related art, the installation of the loudspeaker core of a mobile phone is usually performed in the following manner: first, the loudspeaker core is installed, then dispensing is performed, and then a flexible printed circuit board (FPC) is installed and connected with the core.

[0048] There are many problems in the design and processing process. On the one hand, the installation process is complex, and multiple steps such as kernel installation, glue dispensing, and FPC connection need to be performed in sequence, which not only increases the production time and management cost, but also increases the operation difficulty, and once a problem occurs in a certain link, it will affect the product quality. On the other hand, the FPC needs to be welded with the kernel and the external circuit, which requires high precision and needs to be operated by professional equipment and technical personnel, and any poor welding point may cause abnormal function of the loudspeaker, and strict quality detection and control also increase the cost. At the same time, the complex process and high precision requirement make the processing and production process cost high, including equipment investment, labor cost, quality detection cost, etc. In addition, due to the limitation of design and process, the flexibility of processing and installation is insufficient, and it is difficult to quickly adjust according to the actual situation. Especially for the lower loudspeaker of the mobile phone, due to the limited installation space, under this installation process, the production process is not only inefficient, but also prone to errors.

[0049] The main reason for the above problems is that if the FPC is integrated with the kernel module, the glue sealing process of the kernel will be affected by the FPC shielding and cannot be sealed.

[0050] To solve the technical problem that the FPC shielding in the production and processing process causes the loudspeaker kernel and the FPC to be unable to be modularized in the related technology, as shown in Figures 1 to 5 The loudspeaker installation structure provided by the embodiment can be applied to electronic devices, including mobile phones, tablets, etc. It can also be applied to other various types of electronic devices, such as smart watches, smart speakers, game consoles, etc. The electronic device includes a body 10 and a loudspeaker module 20. The loudspeaker module 20 includes a body 21 and an FPC 22 arranged on the body 21. The body 10 is provided with a loudspeaker installation area 11, and the body 21 is installed on the loudspeaker installation area 11. The loudspeaker installation structure includes a circumferential glue dispensing groove 12, which is located on the loudspeaker installation area 11 and is arranged along the circumference of the body 21, and is used to seal the gap between the bottom of the body 21 and the surrounding structure. The surrounding structure of the bottom of the body 21 can be the structure of the main body of the body 10 or the module shell. The body 10 is provided with an electrical connection part, and the FPC 22 is electrically connected with the electrical connection part. The side of the circumferential glue dispensing groove 12 close to the electrical connection part is provided with a glue storage groove 13 communicating with the circumferential glue dispensing groove 12. The glue storage groove 13 is at least partially exposed to the FPC 22. The glue storage groove 13 is at least partially exposed to the FPC 22, which means that it is exposed in the glue dispensing operation direction. Because the FPC 22 will shield the circumferential glue dispensing groove 12 in the glue dispensing operation direction. It should be noted that the body 10 is the general term of the shell and internal support structure of the electronic device, which provides mounting positions and protection for various parts of the electronic device.

[0051] It should be noted that the speaker mounting area 11 is a specific area on the electronic device body 10 specially divided for mounting the speaker module 20. The size and shape of this area can be designed according to the specifications of the speaker module 20 to ensure that the speaker module 20 can be stably mounted in the electronic device. The speaker mounting area 11 usually has some special design, such as fixing structure, sealing measures, etc., to improve the installation stability and audio playing effect of the speaker module 20.

[0052] Referring to Figure 4 As shown in the figure, the speaker mounting area 11 of the embodiment of the application is provided with a mounting recess 33, and the circumferential dispensing groove 12 is located on the upper edge of the mounting recess 33. The speaker module 20 is installed in the mounting recess 33 and is adapted to the mounting recess 33. The mounting recess 33 provides a special mounting position for the speaker module 20, so that the speaker module 20 can be more stably installed in the electronic device. The circumferential dispensing groove 12 is located on the upper edge of the mounting recess 33, which can realize the sealing and fixing of the speaker module 20 by injecting glue after the speaker module 20 is installed. On the one hand, the mounting recess 33 is adapted to the speaker module 20, which ensures that the speaker module 20 will not be loose or displaced after installation. The close fit can effectively reduce the noise and instability factors caused by vibration of the speaker during work, and improve the quality and stability of audio output. At the same time, the mounting recess 33 can also protect the speaker module 20 to some extent, reducing damage to the speaker caused by external impact and collision. The position of the circumferential dispensing groove 12 enables the glue to be evenly distributed at the junction of the speaker module 20 and the mounting recess 33, forming a firm seal.

[0053] It should be noted that the speaker module 20 in the embodiment of the application is the core part of the speaker mounting structure, which is responsible for converting electrical signals into sound signals. It is composed of a body 21 (also known as a core) and an FPC 22 arranged on the body 21. The body 21 contains key components such as the diaphragm, voice coil, and magnet of the speaker. The diaphragm vibrates under the action of the magnetic field generated by the voice coil, thereby pushing the air to produce sound.

[0054] The FPC 22 (Flexible Printed Circuit, flexible printed circuit board) is a highly flexible circuit board used to connect the body 21 of the speaker module 20 to other parts of the electronic device, realizing the transmission of electrical signals. The flexible feature of the FPC 22 allows it to adapt to the complex spatial layout inside the electronic device, while also facilitating the installation and maintenance of the speaker module 20. In the embodiment of the application, the FPC 22 is integrated with the body 21 to facilitate mass production and assembly, with higher flexibility.

[0055] The circumferential dispensing groove 12 in the embodiment of the present application is an annular groove provided in the loudspeaker mounting area 11. It is distributed along the circumference of the loudspeaker module 20 and is used to seal the gap between the loudspeaker module 20 body 21 and the machine body 10, wherein the machine body 10 can also include a modular housing for mounting the loudspeaker module 20. By injecting glue into the circumferential dispensing groove 12, dust, moisture, etc. can be effectively prevented from entering the inside of the loudspeaker module 20, thereby ensuring the normal operation and service life of the loudspeaker.

[0056] It should be noted that the electrical connection part is a part provided on the machine body 10 for electrical connection with the FPC 22 of the loudspeaker module 20. It is composed of metal contacts, sockets or other connection structures such as spring sheets. Through the electrical connection part, the loudspeaker module 20 can be connected with the circuit system of the electronic device to realize the transmission and control of electrical signals.

[0057] The glue storage groove 13 in the embodiment of the present application is a groove located on the side of the circumferential dispensing groove 12 close to the electrical connection part and communicating with the circumferential dispensing groove 12. The glue storage groove 13 can inject glue in the area not blocked by the FPC 22 during dispensing and store the glue, so that the glue can gradually enter the circumferential dispensing groove 12 blocked by the FPC 22 from the glue storage groove 13, to ensure that sufficient dispensing operation can be performed in the area blocked by the FPC 22.

[0058] It can be seen that the loudspeaker mounting structure of the embodiment of the application can inject glue in the area not blocked by the FPC 22 during the dispensing process and store the glue, so that the glue can gradually enter the area blocked by the FPC 22 from the glue storage groove 13, achieving good sealing and avoiding abnormal function of the loudspeaker caused by poor sealing. Since the circumferential dispensing groove 12 is very narrow, this cannot be achieved by the circumferential dispensing groove 12 itself, and the expanded glue storage groove 13 can solve this problem. Since there is no need to worry about the blocking of the FPC 22, the embodiment of the application achieves the integrated modularization of the body 21 of the loudspeaker module 20 and the FPC 22, which improves the overall stability of the loudspeaker module 20 and reduces the risk of affecting product quality due to poor connection of each link. The processing and installation are more flexible, and the production plan can be quickly adjusted according to the actual situation. Since the loudspeaker module 20 body 21 and the FPC 22 are integrated and modularized, there is no need to perform multiple complex steps such as core installation, dispensing, and FPC 22 connection in sequence as in the traditional way, greatly simplifying the installation process and thus greatly shortening the production time. Especially for the case of limited installation space such as the lower loudspeaker of a mobile phone, the operation errors caused by cumbersome steps are reduced, so that the production process is not only more efficient, but also more accurate. In terms of cost, the simplified process makes production management more convenient, reducing management costs. At the same time, the complex welding operation of professional equipment and technical personnel is reduced, reducing equipment investment and labor costs. In addition, since the welding points and other prone-to-failure links are reduced, the quality detection cost is also reduced accordingly.

[0059] It should be noted that in the design of the loudspeaker mounting structure, the circumferential dispensing groove 12 is mainly arranged along the circumference of the loudspeaker module 20 and is used to seal the gap between the bottom of the body 21 and the machine body 10. Its role is to ensure that the connection between the loudspeaker module 20 and the machine body 10 is tight, preventing dust, moisture, etc. from entering and ensuring the normal operation of the loudspeaker. The glue storage groove 13 needs to be in communication with the circumferential dispensing groove 12 to receive glue and provide glue for the area blocked by the FPC 22. Since the glue storage groove 13 needs to store a part of the glue during the dispensing process to ensure that the dispensing operation can be performed in the area blocked by the FPC 22, it needs to have a relatively large groove width to accommodate enough glue. In contrast, the main task of the circumferential dispensing groove 12 is to form a seal around the loudspeaker module 20, and the amount of glue required is relatively small, so a narrower groove width can be used.

[0060] For this purpose, see Figure 6 and Figure 7As shown, the groove width of the glue storage groove 13 in the embodiment of the present application is greater than that of the circumferential glue dispensing groove 12. In the glue dispensing process of the speaker mounting structure, glue is first injected into the glue storage groove 13. The main function of the glue storage groove 13 is to provide glue storage for the glue dispensing operation, especially to ensure that the circumferential glue dispensing groove 12 blocked by the FPC 22 can be fully supplied with glue. On the one hand, since the glue dispensing operation is to inject glue into the glue storage groove 13 first, and then flow to the circumferential glue dispensing groove 12 blocked by the FPC 22, the glue storage groove 13 needs to have a larger groove width, where the groove width refers to the maximum width of the groove. A larger groove width can accommodate more glue, providing sufficient storage for the subsequent flow of glue to the circumferential glue dispensing groove 12. When the glue flows from the glue storage groove 13 to the circumferential glue dispensing groove 12 blocked by the FPC 22, if the groove width of the glue storage groove 13 is too small, it may not be able to provide enough glue, resulting in poor sealing effect of the blocked area. A larger groove width can ensure that there is enough pressure and flow during the flow of glue, so that the glue can smoothly reach the blocked area and achieve good sealing.

[0061] On the other hand, the circumferential glue dispensing groove 12 is mainly used to seal the gap between the bottom of the speaker module 20 body 21 and the body 10. It requires relatively less glue, and a narrower groove width can better control the distribution of glue, avoiding excessive glue overflow and affecting other components. At the same time, the narrower circumferential glue dispensing groove 12 also better meets the requirement of close fitting between the speaker module 20 and the body 10, and can achieve more precise sealing effect.

[0062] In actual production process, the glue storage groove 13 with larger groove width is also easier to perform glue injection operation. The glue injection equipment can more accurately inject glue into the glue storage groove 13, reducing air bubbles in the glue injection process. The narrower groove width of the circumferential glue dispensing groove 12 can obtain the appropriate amount of glue from the glue storage groove 13 through the natural flow and capillary action of the glue, realizing efficient glue dispensing process.

[0063] Referring to Figure 6 and Figure 7As shown, in one embodiment, in order to ensure that the area blocked by the FPC 22 can be fully covered during the dispensing process. The length of the glue storage groove 13 in the embodiment of the present application is greater than the width of the FPC 22, and both ends of the glue storage groove 13 are exposed to the FPC 22. Since the FPC 22 is connected to the body 21 of the speaker module 20, its position may block part of the circumferential dispensing groove 12, affecting the sealing effect. When the length of the glue storage groove 13 is greater than the width of the FPC 22, no matter where the FPC 22 is located, the glue storage groove 13 can provide sufficient glue source for the blocked area. Both ends of the glue storage groove 13 are exposed to the FPC 22, which can ensure that the glue can flow into the blocked area from two directions. When both ends of the glue storage groove 13 are exposed, the glue can flow into the blocked area from both ends at the same time, so that the distribution of the glue is more uniform, and the sealing effect is better. Exposing both ends of the glue storage groove 13 to the FPC 22 will not increase the process difficulty too much. During the glue injection process, the operator can more intuitively see the position of the glue storage groove 13 and the flow of the glue, which facilitates the control of the glue injection amount and ensures the dispensing quality.

[0064] In another embodiment not shown in the figure, the glue storage groove in the embodiment of the present application is two, the first end of the glue storage groove is located below the FPC, the second end of the glue storage groove is exposed to the FPC, and the second ends of the two glue storage grooves are located on both sides of the FPC. On the one hand, it increases the supply path of the glue, and transports the glue to the blocked area from two different directions. When the dispensing operation is performed, the glue can flow in from both sides at the same time, making the sealing more uniform and sufficient. On the other hand, this layout also enhances the stability and reliability of the entire system. If one of the glue storage grooves fails, the other glue storage groove can continue to function, ensuring that the sealing effect is not too affected.

[0065] Referring to Figures 7 to 9As shown, the glue storage groove 13 in the embodiment of the present application includes a flow guide section 131, one end of the flow guide section 131 away from the circumferential glue dispensing groove 12 is provided with a guide slope 1311, the guide slope 1311 gradually inclines downward, and the lowest end of the guide slope 1311 is located on the side of the guide slope 1311 close to the circumferential glue dispensing groove 12. From the perspective of promoting the flow of glue, the above-mentioned arrangement can guide the glue to flow naturally to the area to be sealed by gravity. During the glue dispensing process, the glue will flow more smoothly from the glue storage groove 13 into the part of the circumferential glue dispensing groove 12 blocked by the FPC 22. In turn, it avoids the problem of glue accumulation or poor flow in the glue storage groove 13, ensuring efficient sealing operation and improving the production efficiency of electronic equipment. The operator does not need to intervene in the flow direction of the glue too much, reducing the operation difficulty and error probability, and also reducing the situation of rework due to poor sealing. In terms of enhancing the sealing effect, since the glue can flow more quickly and uniformly to the sealing area, the sealing is more sufficient. The inclined guide slope 1311 ensures that the glue can fully cover the blocked area, effectively preventing impurities such as dust and moisture from entering, thereby greatly enhancing the sealing effect of the loudspeaker module 20 and ensuring the normal working performance and service life of the loudspeaker.

[0066] The distance between the inner side walls on the opposite sides of the flow guide section 131 in the embodiment of the present application gradually decreases from the direction where the electrical connection part is located towards the direction close to the circumferential glue dispensing groove 12. A funnel-like structure is formed, which can guide the glue to flow more smoothly to the circumferential glue dispensing groove 12, reduce the flow resistance of the glue, improve the glue dispensing efficiency, and ensure that the glue quickly and accurately reaches the part to be sealed. As the distance between the inner side walls gradually decreases, the glue is extruded during the flow process, so that the glue can be more uniformly distributed in the circumferential glue dispensing groove 12 and the area blocked by the FPC 22, avoiding local poor sealing conditions and improving the sealing quality and stability.

[0067] The side walls on the opposite sides of the flow guide section 131 in the embodiments of the present application are flow guide side walls 1312, which gradually incline downward, and the lowest ends of the flow guide side walls 1312 are located on the side of the flow guide section 131 close to the circumferential dispensing groove 12. This allows the glue to flow naturally along the inclined side walls to the side close to the circumferential dispensing groove 12 in the flow guide section 131, and the glue can be quickly and smoothly moved to the area to be sealed by gravity without additional power, thereby improving the dispensing efficiency. At the same time, since the lowest ends of the flow guide side walls 1312 are on the side close to the circumferential dispensing groove 12, it means that the glue will flow to the sealing area first, ensuring that the circumferential dispensing groove 12 can always be supplied with sufficient glue during the dispensing process, and even if continuous dispensing or sealing of multiple positions occurs, there will be no shortage, thereby achieving a more reliable sealing effect. In addition, the inclined flow guide side walls 1312 help the glue to be more evenly distributed during the flow process. When the glue flows down the side walls, it will gradually spread in the width direction of the flow guide section 131 under the guidance of gravity and the side walls, so that the glue more evenly covers the area to be sealed, avoiding local poor sealing and improving the sealing quality and stability.

[0068] In an embodiment not shown in the drawings, the bottom surface of the side of the circumferential dispensing groove in the embodiments of the present application close to the electrical connection part is a flow guide surface, which gradually inclines downward from both ends to the area below the FPC. In the embodiments of the present application, the bottom surface of the side of the circumferential dispensing groove close to the electrical connection part is a flow guide surface, which gradually inclines downward from both ends to the area below the FPC. This flow guide surface can guide the glue to flow naturally to the key area to be sealed by gravity, and combine with the glue flowing from the glue storage groove to form a complete seal. This allows each area to be filled with sufficient glue, thereby improving the sealing effect.

[0069] If there is a bubble in the sealing area, the sealing effect of the glue will be weakened, so that dust, moisture and other impurities have the opportunity to enter the inside of the loudspeaker module through the weak area around the bubble, affecting the normal working performance and service life of the loudspeaker, and also affecting the sound production. The guide inclined surface in the embodiments of the present application includes a first guide section and a second guide section, the first guide section is located on the side away from the circumferential dispensing groove, and the second guide section is located on the side close to the circumferential dispensing groove, and the slope of the first guide section is smaller than the slope of the second guide section. The first guide section is located on the side away from the circumferential dispensing groove and has a small slope. In the early stage of the dispensing process, the glue first contacts the first guide section. Due to the small slope, the flow speed of the glue in this area is relatively slow. The slow flow allows the gas inside the glue to have enough time to escape, avoiding the gas being carried into the subsequent area with the glue, thereby increasing the risk of generating bubbles.

[0070] When the glue passes through the first guiding section, it reaches the second guiding section. The second guiding section is close to the circumferential glue dispensing groove and has a larger slope. The larger slope makes the glue flow faster, so that the glue can quickly flow to the circumferential glue dispensing groove, especially the area blocked by the FPC. In this process, since most of the gas has escaped after passing through the first guiding section, even if the glue flow speed is increased, the possibility of generating bubbles is greatly reduced.

[0071] Referring to Figures 7 to 9 As shown, in order to ensure that the amount of glue is sufficient, enough glue can reach the area blocked by the FPC, and at the same time, enough glue can enter the gap between the speaker module and its surrounding area (such as the body or the shell for mounting the speaker module) to achieve better sealing effect, the glue storage groove 13 of the embodiment of the application further comprises a glue storage section 132, which is located below the flow guiding section 131. The glue storage section 132 is in communication with the circumferential glue dispensing groove and also in communication with the surrounding gap. The glue storage section 132 can store glue during the glue dispensing process. When the glue flows down from the flow guiding section 131, part of the glue will enter the glue storage section 132 for storage, ensuring that there is enough glue supply during the glue dispensing process, avoiding incomplete or uneven sealing due to insufficient glue. The glue in the glue storage section can also enter the gap between the body 21 of the speaker module 20 and the speaker mounting area 11. Even when the glue dispensing speed is fast or continuous, the glue storage section 132 can provide a stable glue source for subsequent sealing operations. Secondly, with the glue storage section 132, the frequency of frequent glue addition during glue dispensing operation can be reduced. The operator can inject more glue into the glue storage groove 13 at one time, and the glue storage section 132 can continuously provide glue for the sealing area, improving the glue dispensing efficiency and reducing the operation complexity. For large-scale production or automatic glue dispensing equipment, the production efficiency can be significantly improved. When the glue flows from the flow guiding section 131 into the glue storage section 132 and then slowly flows to the part to be sealed, the slow and continuous glue flow ensures that the glue thickness of the sealing area is more uniform.

[0072] Referring to Figures 10 to 12 As shown, according to the second aspect of the application, a speaker module 30 is provided, which comprises the above-mentioned speaker mounting structure, the speaker module 20 and the electrical connection part.

[0073] The end of the FPC 22 in the embodiment of the present application is provided with a contact part 221, which is welded with the electrical connection part, or is elastically electrically connected. When the contact part 221 is connected with the electrical connection part in a welding manner, a firm electrical connection can be formed. The welding can ensure good intermetallic bonding, so that the current can be stably transmitted between the FPC 22 and the electrical connection part, ensuring that the audio signal can be accurately and correctly transmitted from the circuit system of the electronic device to the speaker module 20, thereby emitting clear and stable sound. The welding connection has a low contact resistance, which can reduce energy loss in the signal transmission process and improve the quality and strength of the signal. During the use of the electronic device, especially when processing complex audio signals, low contact resistance can avoid signal distortion and attenuation, providing users with high-quality audio experience. The welding connection can effectively resist external force and prevent the FPC 22 and the electrical connection part from loosening or disconnecting, ensuring the continuous and stable work of the speaker module 20.

[0074] The elastic electrical connection adopts an elastic contact piece, such as a spring needle or an elastic contact sheet. The elastic contact piece can stretch and deform within a certain range, making the installation of the FPC 22 more convenient and fast. During the installation process, complex welding operations are not required, and only the contact part 221 of the FPC 22 needs to be aligned with the electrical connection part, and the elastic contact piece can automatically establish an electrical connection. This greatly improves production efficiency and reduces installation costs.

[0075] When it is necessary to repair or replace the FPC 22, the elastic electrical connection is also easier to disassemble, and will not cause damage to other parts of the electronic device. This convenient installation and maintenance method is of great significance to improve the maintainability and service life of the electronic device. The elastic electrical connection has a certain elastic deformation capacity and can adapt to the size deviation and tolerance between the FPC 22 and the electrical connection part. During the manufacturing process of the electronic device, due to machining precision and assembly errors, there may be a size mismatch between the FPC 22 and the electrical connection part. The elastic electrical connection can compensate for these size differences through its own elastic deformation, ensuring the reliability of the electrical connection.

[0076] The speaker modules 20 in the embodiments of the present application are multiple, the speaker installation areas 11 are multiple, and the multiple speaker modules 20 correspond to the multiple speaker installation areas 11 one by one. The multiple speaker modules 20 can work simultaneously to produce greater volume output. Different speaker modules 20 can cooperate to produce sound, making the propagation of sound in space more uniform and powerful. For some scenes that require high volume, such as outdoor use, large conference rooms or entertainment venues, the design of multiple speaker modules 20 can meet the user's demand for volume. Multiple speaker modules 20 can be responsible for different audio frequency ranges, thereby achieving more rich and delicate sound quality performance. For example, some speaker modules 20 can focus on the low frequency part to provide deep and powerful bass effect; while other speaker modules 20 can handle the high frequency part to bring clear and bright high pitch performance. Through such division of labor and cooperation, the audio quality of the electronic device can be significantly improved, providing users with a more excellent auditory experience. For electronic devices supporting multi-channel audio, multiple speaker modules 20 can correspond to different channels to achieve a more realistic surround sound effect. Users can experience a more immersive audio experience through multiple speaker modules 20, enhancing the appeal of entertainment and multimedia applications.

[0077] The plurality of loudspeaker mounting areas 11 in the embodiments of the present application include a loudspeaker mounting area, and the first loudspeaker module 20 is mounted in the loudspeaker mounting area. The electrical connection part corresponding to the loudspeaker mounting area is the first electrical connection part. The first electrical connection part includes an adapter 31 mounted on the body 10. The first end of the adapter 31 is welded with the FPC 22, and the second end of the adapter 31 is elastically electrically connected with the first electrical connection part. In the electronic device, the loudspeaker mounting area is a region with a narrow installation space, such as the position of the lower loudspeaker of a mobile phone. By setting the adapter 31, the installation demand of the narrow space can be effectively adapted. The adapter 31 can be flexibly designed and arranged according to the shape and size of the space, so that the loudspeaker module 20 can be stably installed in the limited space. The adapter 31 is electrically connected with other devices in a space sufficient area, and the installation is relatively easy to install but occupies a larger space. The adapter 31 can be a flexible circuit board or other forms of electrical adapter device. The first end of the adapter 31 is connected with the FPC 22 by welding, which can form a firm electrical connection. The welding can ensure good intermetallic bonding, so that the current can be stably transmitted between the FPC 22 and the adapter 31. The second end of the adapter 31 is elastically electrically connected with the first electrical connection part. This connection method has a certain elastic deformation capacity and can adapt to the size deviation and assembly error that may occur in the narrow space. It is usually difficult to install the loudspeaker module 20 in the narrow space. The complex connection process can be divided into multiple steps, so that the installation is more convenient and fast. First, the adapter 31 is mounted on the body 10, then the FPC 22 is welded with the first end of the adapter 31, and the narrow space of the loudspeaker mounting area is fully adapted, and finally the second end of the adapter 31 is connected with the first electrical connection part by elastic electrical connection, realizing flexible and rapid installation.

[0078] Referring to Figure 10 As shown in the figure, the loudspeaker module in the embodiments of the present application includes a module shell 34, the loudspeaker mounting structure is arranged on the module shell, the module shell 34 is arranged on the body 10, the loudspeaker mounting area is arranged on the module shell 34, and the adapter 31 is mounted on the module shell 34. The module shell 34 provides a special mounting position for the loudspeaker mounting area, so that the installation of the loudspeaker module 20 is more concentrated and independent. Modularization is conducive to improving production efficiency, and different parts can be produced and assembled at the same time, reducing the overall manufacturing time.

[0079] The module shell 34 can help the speaker to focus and direct the sound output better. By a specific shape, the sound can be guided to propagate in a specific direction, such as the direction of the sound outlet 14 of the electronic device, improving the propagation efficiency and directivity of the sound, and the sound emitted by the speaker can be heard more clearly in a specific direction. Moreover, in the case of limited internal space of the mobile phone, the sound emitted by the speaker may be reflected and disturbed inside the mobile phone. The module shell 34 can play a certain sound insulation and sound absorption role, reduce the reflection of sound, reduce internal interference, and thus improve the clarity and purity of the sound.

[0080] If the speaker fails or needs to be upgraded, only the module shell 34 part needs to be replaced, without the need to disassemble the entire main body of the electronic device. This greatly reduces the maintenance cost and time, and improves the maintainability of the device.

[0081] In an embodiment, the module shell 34 includes a bottom shell 342 and an upper cover 341, the upper cover 341 is covered on the bottom shell 342 to form a more closed space, and the two can be connected by welding or bonding. The speaker module 20 is installed on the bottom shell 342, and the bottom shell 342 is provided with a sound outlet 343, which is arranged opposite to the sound outlet 14, and the two are sealed by compression of annular sealing material (silicone, double-sided tape, foam, etc.).

[0082] The module shell 34 in the embodiment of the application is provided with a fixing groove, and the adapter 31 is installed in the fixing groove. The fixing groove provides a clear installation position for the adapter 31, ensuring that the adapter 31 can be accurately installed at a specific position on the module shell 34. In the embodiment of the application, the fixing groove provided on the module shell 34 provides a clear installation position for the adapter 31, achieving precise positioning. In the production process, workers can quickly and accurately place the adapter 31 therein without complex measurement and adjustment, greatly improving the installation precision and efficiency, and simplifying the assembly process. No additional fixing device or complex installation steps are needed, and the installation can be completed by simply placing the adapter 31 in the fixing groove, reducing production cost. Secondly, the shape and size of the fixing groove match the adapter 31, which can tightly fix the adapter 31 to prevent it from loosening or shifting during use of the electronic device, ensuring the stability of the electrical connection, especially when the electronic device may be subjected to external forces such as vibration and impact. The fixing groove and the adapter 31 are adapted to each other, which can effectively utilize the space in the case of limited space of the electronic device, especially for small-sized electronic devices, providing more installation space for other electronic components.

[0083] Referring to Figures 1 to 3As shown, according to the third aspect of the present application, an electronic device is provided, which comprises the above-mentioned body 10 and the above-mentioned speaker module 30 mounted on the body 10. The electronic device further comprises a display screen, a battery, a control mainboard and the like, which are all mounted on the body 10.

[0084] The above embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A speaker mounting structure applied to an electronic device, characterized by comprising: The electronic device comprises a body and a speaker module, the speaker module comprises a body and an FPC arranged on the body, the body is arranged on a speaker mounting area, the body is mounted on the speaker mounting area, the speaker mounting structure comprises a circumferential dispensing groove, the circumferential dispensing groove is arranged on the speaker mounting area and along the circumferential direction of the body, and is used for sealing the gap between the bottom of the body and the surrounding structure. The body is provided with an electrical connection part, the FPC is electrically connected with the electrical connection part, and one side of the circumferential dispensing groove close to the electrical connection part is provided with a glue storage groove in communication with the circumferential dispensing groove, and the glue storage groove is at least partially exposed to the FPC.

2. The speaker mounting structure of claim 1, wherein The slot width of the glue storage groove is greater than the slot width of the circumferential dispensing groove.

3. The speaker mounting structure of claim 1, wherein The length of the glue storage groove is greater than the width of the FPC, and both ends of the glue storage groove are exposed to the FPC.

4. The speaker mounting structure of claim 1, wherein The glue storage groove is two, the first end of the glue storage groove is below the FPC, the second end of the glue storage groove is exposed to the FPC, and the second ends of the two glue storage grooves are respectively located on both sides of the FPC.

5. The speaker mounting structure of claim 1, wherein The glue storage groove comprises a flow guide section, one end of the flow guide section away from the circumferential dispensing groove is provided with a guide inclined surface, the guide inclined surface gradually inclines downward, and the lowest end of the guide inclined surface is located on one side of the guide inclined surface close to the circumferential dispensing groove.

6. The speaker mounting structure of claim 5, wherein The distance between the inner side walls of the opposite sides of the flow guide section gradually decreases from the direction where the electrical connection part is located to the direction close to the circumferential dispensing groove.

7. The speaker mounting structure of claim 5, wherein The side walls of the opposite sides of the flow guide section are flow guide side walls, the flow guide side walls gradually incline downward, and the lowest end of the flow guide side walls is located on one side of the flow guide side walls close to the circumferential dispensing groove.

8. The speaker mounting structure of claim 5, wherein The glue storage groove further comprises a glue storage section, and the glue storage section is located below the flow guide section.

9. The speaker mounting structure of any one of claims 1 to 8, wherein, The speaker mounting area is provided with a mounting recess, the circumferential dispensing groove is located on the upper edge of the mounting recess, the speaker module is mounted in the mounting recess and is matched with the mounting recess.

10. A speaker module, characterized by The speaker module comprises the speaker mounting structure, the speaker module and the electrical connection part in any one of claims 1 to 9.

11. The speaker module of claim 10, wherein, The end of the FPC is provided with a contact part, the contact part is welded with the electrical connection part, or the contact part is elastically connected with the electrical connection part.

12. The speaker module of claim 10, wherein, The speaker module is multiple, the speaker mounting area is multiple, the multiple speaker modules and the multiple speaker mounting areas are one-to-one corresponding, the multiple speaker mounting areas include a specific speaker mounting area, a first speaker module is mounted in the specific speaker mounting area, the electrical connection part corresponding to the specific speaker mounting area is a first electrical connection part, the first electrical connection part comprises a conversion part, the conversion part is mounted on the body, the first end of the conversion part is welded with the FPC, and the second end of the conversion part is elastically connected with the first electrical connection part.

13. The speaker module of claim 12, wherein, The speaker module comprises a module shell, the speaker mounting structure is arranged on the module shell, the module shell is arranged on the body, the specific speaker mounting area is arranged on the module shell, and the conversion part is arranged on the module shell.

14. The speaker module of claim 13, wherein, The module housing is provided with a fixing groove, and the adapter is installed in the fixing groove.

15. An electronic device, comprising: The electronic device comprises a body and a speaker module installed on the body, and the speaker module is the speaker module according to any one of claims 10 to 14.

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