Bonding welding spot removing device and bonding machine

Abstract

The utility model belongs to the technical field of chip assembly, and particularly relates to a bonding welding spot removing device and a bonding machine, and the bonding welding spot removing device comprises a fixing clamp (1) which is fixed on a wire feeding mechanism (102) of a bonding machine micro-motion assembly (101), the wire feeding mechanism (102) is provided with a wire clamp for clamping a gold wire, and wire feeding is realized through micro-motion opening and closing of the wire clamp; the rotating block (2) is rotationally connected to the side edge of the fixing clamp (1) through a rotating shaft; the scraper knife (3) is fixed on the rotating block (2); the bonding welding spot removing device (104) is switched between a working state and a non-working state through rotation of the rotating block (2), in the working state, the scraper knife (3) is vertically downward and exceeds the chopper (103) located on the side of the scraper knife (3), and in the non-working state, the scraper knife (3) rotates to be vertically upward along with the rotating block (2). According to the invention, the risk of manually removing the welding spots is reduced, time and labor are saved, the maintainability of the chip is improved, and the repair time is saved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of chip assembly, and particularly relates to a bonding point removing device and a bonder. BACKGROUND

[0002] In the production process of a microwave assembly, typical processes are reflow soldering, eutectic sintering, gluing, bonding, laser sealing, and testing. Among them, wire bonding (WB) is a process technology of connecting the soldering area (pad) of a semiconductor chip and the metal wiring soldering area on the I / O lead or substrate of a microelectronic package with a metal filament. There are three kinds of wire bonding technologies: thermocompression bonding, ultrasonic bonding, and thermosonic bonding. Thermosonic bonding is a process of using heat, pressure, and ultrasonic vibration to realize metallurgical welding between the lead and the pad. In the bonding process of the chip, if the soldering point exceeds the pad, the root of the soldering point is broken, or the gold wire is removed due to debugging requirements, the soldering point will remain on the chip pad, which will affect the re-bonding of the chip. At this time, according to the process requirements, the soldering point on the pad must be removed.

[0003] Due to the extremely small size of the pad, which is about 60um*60um to 100um*100um, the removal is extremely difficult, and the chip damage rate is high. The current traditional removal tool has a flat shovel head with a width of about 120um. When removing the soldering point, the product needs to be taken out of the heating table and cooled, and then the shovel handle is manually held under the microscope to remove the soldering point on the 100*100um pad without damaging the pad and the peripheral circuit of the chip. The main defects are:

[0004] 1. The force on the hand is uncontrollable when removing, which can easily scrape off the gold plating layer on the surface of the pad, resulting in the scrap of the entire chip;

[0005] 2. The hand is easy to shake when removing, which cannot accurately control the motion trail of the shovel head, and the chip surface circuit is easily damaged, resulting in the scrap of the entire chip;

[0006] 3. In the production process, if the product needs to be taken out of the heating table for repair, the product needs to be cooled and then operated. After the repair is completed, the product needs to be reheated before the production can continue, which is time-consuming and labor-intensive. INVENTION CONTENTS

[0007] In order to solve the above problems, the application provides a bonding point removing device and a bonder, which further installs the bonder without affecting the normal function and use of the bonder, so as to solve the operation problems such as hand shaking, uncontrollable force, and easy damage to the chip when the chip soldering point is scraped.

[0008] The first aspect of the present application provides a bonding pad cleaning device, characterized in that it comprises:

[0009] A fixed clamp is fixed on a wire feeding mechanism of a micro-motion assembly of a bonding machine, a wire clamp for clamping a gold wire is installed on the wire feeding mechanism, and wire feeding is achieved by micro-motion opening and closing of the wire clamp;

[0010] A rotating block is rotatably connected to the side of the fixed clamp through a rotating shaft;

[0011] A spade is fixed on the rotating block;

[0012] The rotating block is rotated to switch the bonding pad cleaning device between a working state and a non-working state, in the working state, the spade is vertically downward and exceeds the cleaver located on the side thereof, and in the non-working state, the spade is rotated with the rotating block to be vertically upward.

[0013] Preferably, the fixed clamp comprises a cross plate and first and second lateral plates located on both sides of the cross plate, the first lateral plate is provided with a threaded hole, the fixed clamp is abutted on the wire feeding mechanism through a first bolt installed thereon, and the second lateral plate is connected with the rotating block through a pin shaft.

[0014] Preferably, an elastic member is arranged on the side of the second lateral plate facing the rotating block, the side of the rotating block facing the second lateral plate is divided into a convex surface and a concave surface through a step, when the rotating block is rotated around the pin shaft, the elastic member moves in the concave surface of the second lateral plate, and when the elastic member moves to the convex surface of the second lateral plate, the elastic member is pressed against the rotating block to lock the rotating block.

[0015] Preferably, the elastic member is an elastic top bead.

[0016] Preferably, the rotating block is provided with a through hole for installing the spade, the through hole is provided with a threaded hole on the side thereof, and the spade is fixed at a specified position of the through hole through a second bolt installed thereon.

[0017] The second aspect of the present application provides a bonding machine, comprising a microscope assembly and a micro-motion assembly located at the bottom end of the microscope assembly, the micro-motion assembly is controlled by a joystick, the micro-motion assembly is provided with a cleaver for bonding a pad of the micro-motion assembly and a wire feeding mechanism for feeding a wire to the cleaver, and the wire feeding mechanism is provided with the bonding pad cleaning device as described above.

[0018] The present application reduces the risk of manual cleaning of the pads, saves time and effort, improves the maintainability of the chip, and saves repair time. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 FIG. 1 is a working state diagram of a bonding pad cleaning device according to a preferred embodiment of the present application.

[0020] Figure 2 A schematic diagram of a non-working state of a bonding pad cleaning device according to a preferred embodiment of the present application.

[0021] Figure 3 A schematic diagram of a structure of a bonding pad cleaning device according to a preferred embodiment of the present application.

[0022] Figure 4 A schematic diagram of a rotating block structure according to the embodiment shown. Figure 3

[0023] Wherein, 1 - fixed clamp, 11 - cross plate, 12 - first lateral plate, 13 - second lateral plate, 131 - elastic member, 2 - rotating block, 21 - convex surface, 22 - concave surface, 3 - shovel, 4 - first bolt, 5 - second bolt, 101 - micro-motion assembly of bonder, 102 - wire feeding mechanism, 103 - cleaver, 104 - bonding pad cleaning device. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme of the present application will be described in more detail below in combination with the drawings in the embodiments of the present application. In the drawings, the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of the present application. The embodiments of the present application will be described in detail below in combination with the drawings.

[0025] The first aspect of the present application provides a bonding pad cleaning device, as shown in Figures 1-3 The main components include:

[0026] The fixed clamp 1 is fixed on the wire feeding mechanism 102 of the micro-motion assembly 101 of the bonder, and the wire clamp for clamping the gold wire is installed on the wire feeding mechanism 102. The wire feeding is realized by the micro-motion opening and closing of the wire clamp;

[0027] The rotating block 2 is rotatably connected to the side of the fixed clamp 1 through the rotating shaft;

[0028] The shovel 3 is fixed on the rotating block 2;

[0029] ​The rotation of the rotating block 2 switches the bonding point cleaning device 104 between the working state and the non-working state. In the working state, the shovel 3 is vertically downward and exceeds the cleaver 103 located at the side thereof. In the non-working state, the shovel 3 is rotated with the rotating block 2 to be vertically upward.

[0030] Firstly, the bonder is described. The bonder can operate the bonder micro-motion assembly 101 under the microscope through the rocker to move. When the bonder micro-motion assembly 101 moves, the bonder micro-motion assembly 101 can further drive the wire feeding mechanism 102 and the cleaver 103 located at the side thereof to move. The wire feeding mechanism 102 feeds the wire to the cleaver 103, and the cleaver 103 is used for bonding the chip.

[0031] The bonding point cleaning device 104 provided in the application is fixed on the wire feeding mechanism 102 of the bonder, so that the shovel 3 of the bonding point cleaning device 104 can be driven to move by the movement of the wire feeding mechanism 102, and then the bonding point on the pad of the chip is cleaned. The bonding point cleaning device 104 is clamped on the wire feeding mechanism 102 through the fixing clamp 1. The fixing clamp 1 is provided with the rotatable rotating block 2 at the side thereof. The rotating block 2 drives the shovel 3 to rotate, so that the shovel 3 is vertically downward or vertically upward. As shown in Figure 1 , the shovel 3 is vertically downward, which is the working state. The length of the shovel 3 exceeds the cleaver 103, so that the cleaver 103 is suspended when the shovel 3 works. As shown in Figure 2 , the shovel 3 is vertically upward or slightly upward, which is the non-working state. At this time, the bottom end of the cleaver 103 exceeds the bottom end of the shovel 3, and the shovel 3 does not affect the work of the cleaver 103.

[0032] In some optional embodiments, referring to Figure 3 , the fixing clamp 1 includes the cross plate 11 and the first lateral plate 12 and the second lateral plate 13 located at the two sides of the cross plate 11. The first lateral plate 12 is provided with a threaded hole. The first bolt 4 is installed to abut the fixing clamp 1 on the wire feeding mechanism 102. The second lateral plate 13 is connected with the rotating block 2 through the pin shaft.

[0033] In this embodiment, the first lateral plate 12 of the fixing clamp 1 can be imprisoned on the wire feeding mechanism 102 through the first bolt 4. The rotating block 2 is connected with the second lateral plate 13 of the fixing clamp 1 through the pin shaft, so as to realize the rotating movement of the rotating block 2 and the shovel 3.

[0034] In some optional embodiments, referring to Figure 4The second lateral plate 13 is provided with an elastic member 131 on one side of the rotating block 2. The rotating block 2 is divided into a convex surface 21 and a concave surface 22 by a step on one side of the second lateral plate 13. When the rotating block 2 rotates around the pin shaft, the elastic member 131 moves in the concave surface 22 of the second lateral plate 13 and presses the rotating block 2 when moving to the convex surface 21 of the second lateral plate 13 to lock the rotating block 2.

[0035] It should be noted that although Figure 4 The elastic member 131 is fixed on the second lateral plate 13 of the fixed clamp 1. During rotation, the elastic member 131 moves on the convex surface 21 or the concave surface 22 of the rotating block 2. Due to the existence of the convex surface 21 of the rotating block 2, the second lateral plate 13 can form a certain rotation resistance with the rotating block 2 through the elastic member 131. That is, when the rotating block 2 rotates, when the elastic member 131 is on the left side of the pin shaft / pin hole, that is, the elastic member 131 contacts the convex surface 21 at the position, the rotating block 2 is pressed by the elastic member 131 to form a certain rotation resistance, so that the rotating block 2 is fixed in the non-working state. Figure 4 When the rotating block 2 is rotated clockwise on the basis of the non-working state, the elastic member 131 first enters the concave surface 22 and then continues to rotate to the convex surface 21 on the right side of the pin shaft / pin hole. The rotating block 2 is pressed by the elastic member 131 to form a certain rotation resistance, so that the rotating block 2 is fixed in the working state. Figure 4

[0036] In some optional embodiments, the elastic member 131 is an elastic top bead.

[0037] In some optional embodiments, as shown in Figure 3 The rotating block 2 has a through hole for mounting the shovel 3. The through hole is provided with a threaded hole on the side. The second bolt 5 is used to fix the shovel 3 at a specified position of the through hole.

[0038] In this embodiment, the position of the shovel 3 in the through hole of the rotating block 2 can be adjusted by the second bolt 5, so that the length of the shovel 3 can be adjusted.

[0039] The second aspect of the application provides a bonding machine, which comprises a microscope assembly and a micro-motion assembly 101 at the bottom end of the microscope assembly. The micro-motion assembly 101 is controlled by a joystick. The micro-motion assembly 101 is provided with a cleaver 103 for bonding a micro-wave assembly pad and a wire feeding mechanism 102 for feeding wire to the cleaver 103. The wire feeding mechanism 102 is provided with a bonding spot cleaning device 104 as described above.

[0040] ​The bonder used in the present application is generally a 7476E bonder. After the bonder is equipped with the bonding pad cleaning device 104, the movement of the spatula head on the pad surface is precisely controlled by the control of the bonder joystick, so as to realize the cleaning of the bonding pad.

[0041] The bonding pad cleaning device 104 of the present application is mainly made of aluminum material, so as to reduce the weight of the whole structure and minimize the influence on the bonder. The tungsten steel is used for the spatula head to ensure the hardness of the head when the chip is scraped.

[0042] The tool is used for cleaning the chip pad bonding pad. Compared with the traditional self-made small spatula, the tool has the following advantages:

[0043] 1. High precision: the movement distance of the spatula head is accurate to 0.1 mm, and the spatula head is accurately placed at the position of the chip pad bonding pad to be cleaned, so as to keep a safe distance from other pads and chips.

[0044] 2. High qualified rate: the risk of manual cleaning is reduced, the damage of the pad and the scratch of the chip caused by hand shaking and uncontrollable force are avoided, the qualified rate of product repair is improved, and the cost is saved.

[0045] 3. Simple and fast: the problem bonding pad can be cleaned only by moving the bonder joystick, without taking down the product, and the operation time is greatly shortened.

[0046] 4. Wide application range: suitable for various bare chips.

[0047] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A bonded joint cleaning apparatus, characterized by, The utility model relates to a keying spot cleaning device (104) for a micro-motion assembly (101) of a microbonding machine, comprising: A fixed clamp (1) is fixed on a wire feeding mechanism (102) of the micro-motion assembly (101), and a wire clamp for clamping a gold wire is installed on the wire feeding mechanism (102), and the wire feeding is realized by the micro-motion opening and closing of the wire clamp; A rotating block (2) is rotatably connected to the side of the fixed clamp (1) through a rotating shaft; A spade (3) is fixed on the rotating block (2); The rotating block (2) is rotated to switch the keying spot cleaning device (104) between the working state and the non-working state, in the working state, the spade (3) is vertically downward and exceeds the cleaver (103) located on the side, in the non-working state, the spade (3) is rotated to vertically upward with the rotating block (2).

2. The bonded joint cleaning apparatus of claim 1, wherein The fixed clamp (1) comprises a cross plate (11) and first and second lateral plates (12, 13) located on both sides of the cross plate, the first lateral plate (12) has a threaded hole, the fixed clamp (1) is abutted on the wire feeding mechanism (102) through the installed first bolt (4), and the second lateral plate (13) connects the rotating block (2) through a pin shaft.

3. The bonded joint cleaning apparatus of claim 2, wherein, The second lateral plate (13) is provided with an elastic element (131) on the side facing the rotating block (2), the side of the rotating block (2) facing the second lateral plate (13) is divided into a convex surface (21) and a concave surface (22) through a step, when the rotating block (2) rotates around the pin shaft, the elastic element (131) moves in the concave surface (22) of the second lateral plate (13), and when the elastic element (131) moves to the convex surface (21) of the second lateral plate (13), the elastic element (131) extrudes the rotating block (2) to lock the rotating block (2).

4. The bonded joint cleaning apparatus of claim 3, wherein The elastic element (131) is an elastic top bead.

5. The bonded joint cleaning apparatus of claim 1, wherein The rotating block (2) has a through hole for installing the spade (3), the through hole is provided with a threaded hole on the side, and the spade (3) is fixed at a specified position of the through hole through the installed second bolt (5).

6. A bonding machine characterized by, The utility model relates to a microscope assembly and a micro-motion assembly (101) located at the bottom end of the microscope assembly, the micro-motion assembly (101) is controlled by a joystick, the micro-motion assembly (101) is provided with a cleaver (103) for keying a micro-wave assembly pad and a wire feeding mechanism (102) for feeding a wire to the cleaver (103), and the wire feeding mechanism (102) is provided with the keying spot cleaning device (104) according to claim 1.

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