Electronic element wire pressing mechanism

Abstract

The utility model discloses an electronic component wire pressing mechanism, relates to electronic component processing technical field, including bottom plate, wire pressing subassembly and bunching subassembly, wire pressing subassembly and bunching subassembly are respectively fixed on the top surface of bottom plate, rubber cushion is provided right below the wire pressing subassembly, the both sides of rubber cushion are provided with baffle plate, the baffle plate is provided with the wire pressing subassembly, the bunching subassembly is provided with the wire pressing subassembly, the wire pressing subassembly is provided with the wire bunching subassembly. The baffle is fixedly installed on the top face of the bottom plate through bolts. A wire to be connected is conveyed to the inner side of the wire clamping groove, the wire penetrates through a wire bunching hole in the wire bunching device, the electric telescopic rod drives the mounting plate and the other rubber soft cushion to move downwards, the two rubber soft cushions press the wire, and after press-fit welding is finished, the wire bunching device is used for fixing the wire. An assembling worker takes out the wire bunching device sleeved with the wire from the interior of the wire bunching device clamping groove, the wire welded to the electronic element is restrained by the wire bunching device and cannot be wound with one another, and therefore follow-up machining of the electronic element by a factory is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component processing technical field especially relates to a kind of electronic component line pressing mechanism. BACKGROUND

[0002] Electronic component is the basic element of electronic circuit, they usually have two or more than two lead or metal contact, and by interconnection constitutes the electronic circuit with specific function, such as amplifier, radio receiver and oscillator etc..When producing electronic component, special line pressing structure is needed to press wire on the wiring port of electronic component.

[0003] Such as Chinese patent publication No. CN221353378U discloses a kind of electronic component processing line pressing mechanism, including base, the top surface of base is fixedly connected with connecting box by support, the outer surface of support is installed with support plate, the side of support is provided with line pressing element corresponding with support plate, the top surface of support plate is provided with two mounting plates.

[0004] The above-mentioned electronic component processing line pressing structure needs to take down the electronic component connected with wire and send to subsequent processing workshop for continuous processing after pressing wire rod, but the wire on the electronic component will be entangled with each other in the conveying process, thereby affecting the processing efficiency of subsequent electronic component. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the problem of the prior art that the wire on the electronic component will be entangled with each other in the conveying process, thereby affecting the processing efficiency of subsequent electronic component, and provides a kind of electronic component line pressing mechanism.

[0006] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme: a kind of electronic component line pressing mechanism, including bottom plate, line pressing assembly and bunching assembly, the line pressing assembly and bunching assembly are fixedly installed at the top surface of bottom plate respectively, the rubber soft pad is provided below the line pressing assembly, the both sides of rubber soft pad are provided with baffle, the baffle is fixedly installed on the top surface of bottom plate by bolt, the both ends of baffle are respectively provided with positioning hole, the both sides of rubber soft pad are respectively fixedly connected with positioning protrusion symmetrically, the positioning protrusion is movably clamped in the inside of positioning hole, the side of rubber soft pad is evenly provided with a plurality of wire clamping grooves, the bunching assembly includes bunching device clamping groove and wire bunching device, the bunching device clamping groove is fixedly installed on the top surface of bottom plate, and the wire bunching device is movably clamped in the inside of bunching device clamping groove.

[0007] Preferably, a plurality of bunching holes are formed in the inside of wire bunching device, and the both ends of wire bunching device are respectively fixedly connected with clamping block.

[0008] Preferably, the two ends of the bundle line card slot are respectively provided with positioning card slots, and the clamping block is movably clamped in the positioning card slot.

[0009] Preferably, the wire pressing assembly comprises a mounting frame, a middle portion of one end of the mounting frame is fixedly provided with an electric telescopic rod, one end of the electric telescopic rod is fixedly connected with a pressing plate, one side of the pressing plate is fixedly provided with a mounting plate, and the other two baffle plates are fixedly arranged on one side of the mounting plate.

[0010] Preferably, the mounting frame is fixedly arranged on the top surface of the bottom plate.

[0011] Preferably, the inner side of the mounting frame is symmetrically fixedly provided with two limiting long rods, and the two limiting long rods are movably penetrated through the two ends of the pressing plate.

[0012] Compared with the prior art, the utility model has the advantages and positive effects that:

[0013] 1、In the utility model, the wires to be connected are conveyed to the inner side of the wire clamping groove, the wires pass through the wire bundling holes in the wire bundling device, the electric telescopic rod drives the mounting plate and the other rubber pad to move downward, the two rubber pads press and fit the wires, after the press fit welding is completed, the assembly worker takes out the wire bundling device with the wires from the inside of the wire bundling device, and the wires welded on the electronic component are constrained by the wire bundling device and do not appear winding with each other, thereby facilitating the subsequent processing of the electronic component in the factory.

[0014] 2、In the utility model, the electronic component wire pressing mechanism can press and fit different numbers of wires by replacing the rubber pad, thereby performing the wire press fit welding process on different types of electronic components, and expanding the range of electronic components that can be processed by the electronic component wire pressing mechanism. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A three-dimensional structure schematic diagram of the electronic component wire pressing mechanism is provided for the utility model;

[0016] Figure 2 A connection relationship schematic diagram between the bottom plate and the rubber pad in the electronic component wire pressing mechanism is provided for the utility model;

[0017] Figure 3 A three-dimensional structure schematic diagram of the wire bundling assembly in the electronic component wire pressing mechanism is provided for the utility model;

[0018] Figure 4 A three-dimensional structure schematic diagram of the wire pressing assembly in the electronic component wire pressing mechanism is provided for the utility model.

[0019] Legend: 1. Bottom plate; 11. Rubber pad; 111. Positioning protrusion; 12. Baffle; 121. Positioning hole; 2. Wire pressing assembly; 21. Mounting frame; 22. Electric telescopic rod; 23. Pressing plate; 24. Mounting plate; 25. Limiting rod; 3. Wire harness assembly; 31. Wire harness slot; 311. Positioning slot; 32. Wire harness; 321. Wire harness hole; 322. Block. DETAILED DESCRIPTION

[0020] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other without conflict.

[0021] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0022] Example 1: Figure 1 - Figure 4 As shown, the utility model provides an electronic component wire pressing mechanism, including a base plate 1, a wire pressing assembly 2 and a wire harness assembly 3, the wire pressing assembly 2 and the wire harness assembly 3 are respectively fixedly mounted on the top surface of the base plate 1, a rubber pad 11 is provided directly below the wire pressing assembly 2, and a plurality of wire slots are evenly provided on one side of the rubber pad 11, the wire harness assembly 3 includes a wire harness slot 31 and a wire harness 32, the wire harness slot 31 is fixedly mounted on the top surface of the base plate 1, the wire harness 32 is movably connected to the inside of the wire harness slot 31, the inside of the wire harness 32 is provided with a plurality of wire harness holes 321, and the two ends of the wire harness 32 are respectively fixedly connected with a card block 322, and the wire harness A positioning slot 311 is respectively provided at both ends of the slot 31, and the card block 322 is movably connected to the inside of the positioning slot 311. The wire pressing assembly 2 includes a mounting frame 21, and an electric telescopic rod 22 is fixedly installed in the middle of one end of the mounting frame 21. One end of the electric telescopic rod 22 is fixedly connected to a pressure plate 23, and a mounting plate 24 is fixedly installed on one side of the pressure plate 23. The other two baffles 12 are fixedly installed on one side of the mounting plate 24, and another rubber pad 11 is arranged between the two baffles 12. The mounting frame 21 is fixedly installed on the top surface of the base plate 1, and a limiting long rod 25 is symmetrically fixedly installed on the inner side of the mounting frame 21. The two limiting long rods 25 are movably passed through the two ends of the pressure plate 23.

[0023] The following is a detailed description of the specific settings and functions of this embodiment. The wires to be connected are transported to the inner side of the wire slot, and the wires pass through the wire harness hole 321 in the wire harness 32. The electric telescopic rod 22 drives the pressure plate 23 to move downward, and the pressure plate 23 drives the mounting plate 24 and another rubber pad 11 to move downward. The two rubber pads 11 press the wires together, and the assembly worker uses welding equipment to weld one end of the wire to the welding point of the electronic component. After the pressing and welding is completed, the electric telescopic rod 22 drives the pressure plate 23 to move upward, and the assembly worker removes the wire harness 32 with the wires from the inside of the harness slot 31. The wires welded on the electronic components are constrained by the wire harness 32 and will not be entangled with each other, which facilitates the factory to perform subsequent processing of the electronic components.

[0024] Example 2: Figure 1 - Figure 3 As shown, the utility model provides an electronic component wire pressing mechanism, including a base plate 1, a wire pressing assembly 2 and a wire harness assembly 3, the wire pressing assembly 2 and the wire harness assembly 3 are respectively fixedly installed on the top surface of the base plate 1, a rubber pad 11 is arranged directly below the wire pressing assembly 2, and baffles 12 are arranged on both sides of the rubber pad 11, the baffle 12 is fixedly installed on the top surface of the base plate 1 by bolts, and positioning holes 121 are respectively provided at both ends of the baffle 12, and positioning protrusions 111 are symmetrically fixedly connected on both sides of the rubber pad 11, and the positioning protrusions 111 are movably connected to the inside of the positioning holes 121. A number of wire slots are evenly provided on one side of the rubber pad 11, and the wire harness assembly 3 includes a wire harness slot 31 and a wire harness 32, the wire harness slot 31 is fixedly installed on the top surface of the base plate 1, and the wire harness 32 is movably connected to the inside of the wire harness slot 31.

[0025] The effect achieved by the entire embodiment is that when the rubber pad 11 needs to be replaced, the worker forcibly removes the rubber pad 11 from between the two baffles 12, and then aligns the rubber pad 11 with a different number of wire slots between the two baffles 12, and squeezes the rubber pad 11 downward so that the positioning protrusion 111 in the rubber pad 11 is squeezed into the interior of the positioning hole 121, completing the replacement of the rubber pad 11, so that the electronic component wire pressing mechanism can press different numbers of wires, thereby performing the wire pressing and welding process for different types of electronic components, expanding the range of electronic components that can be processed by the electronic component wire pressing mechanism.

[0026] The working principle and method of using the device are as follows: the connecting wire is conveyed to the inner side of the wire clamping groove, the wire passes through the wire bundling hole 321 in the wire bundling device 32, the electric telescopic rod 22 drives the pressing plate 23 to move downward, the pressing plate 23 drives the mounting plate 24 and the other rubber pad 11 to move downward, the two rubber pads 11 press and fit the wire, the assembler uses the welding equipment to weld one end of the wire to the welding point of the electronic component, after the pressing and welding are completed, the electric telescopic rod 22 drives the pressing plate 23 to move upward, the assembler takes out the wire bundling device 32 with the wire sleeved therefrom from the inside of the bundling device clamping groove 31; when the rubber pad 11 needs to be replaced, the worker takes down the rubber pad 11 from between the two baffles 12, aligns the rubber pad 11 provided with different numbers of wire clamping grooves between the two baffles 12, and extrudes the rubber pad 11 downward, so that the positioning protrusions 111 in the rubber pad 11 are extruded into the inside of the positioning holes 121, and the replacement of the rubber pad 11 is completed.

[0027] The above is only a preferred embodiment of the present application, and is not intended to limit the present application in other forms. Any skilled person in the art can modify or change the above disclosed technical content to equivalent embodiments applied to other fields. However, any simple modification, equivalent change and modification made according to the technical essence of the present application to the above embodiments still fall within the protection scope of the present application.

Claims

1. An electronic component wire pressing mechanism characterized by comprising: Including the bottom plate (1), the wire pressing assembly (2) and the wire bundling assembly (3), the wire pressing assembly (2) and the wire bundling assembly (3) are fixedly installed on the top surface of the bottom plate (1) respectively, the rubber soft pad (11) is arranged below the wire pressing assembly (2), the both sides of the rubber soft pad (11) are provided with the baffle (12), the baffle (12) is fixedly installed on the top surface of the bottom plate (1) through the bolt, the both ends of the baffle (12) are respectively provided with the positioning hole (121), the both sides of the rubber soft pad (11) are respectively fixedly connected with the positioning convex (111) in a symmetrical mode, the positioning convex (111) is movably clamped in the inside of the positioning hole (121), a plurality of wire clamping grooves are uniformly formed in the side of the rubber soft pad (11), the wire bundling assembly (3) includes the wire bundling device clamping groove (31) and the wire bundling device (32), the wire bundling device clamping groove (31) is fixedly installed on the top surface of the bottom plate (1), and the wire bundling device (32) is movably clamped in the inside of the wire bundling device clamping groove (31).

2. The electronic component wire pressing mechanism according to claim 1, characterized by: A plurality of wire bundling holes (321) are formed in the inside of the wire bundling device (32), and the clamping block (322) is fixedly connected with the both ends of the wire bundling device (32).

3. The electronic component wire pressing mechanism according to claim 2, characterized by: The both ends of the wire bundling device clamping groove (31) are respectively provided with the positioning clamping groove (311), and the clamping block (322) is movably clamped in the inside of the positioning clamping groove (311).

4. The electronic component wire pressing mechanism according to claim 1, characterized by: The wire pressing assembly (2) includes the mounting frame (21), the middle portion of one end of the mounting frame (21) is fixedly installed with the electric telescopic rod (22), one end of the electric telescopic rod (22) is fixedly connected with the pressing plate (23), one side of the pressing plate (23) is fixedly installed with the mounting plate (24), the other two baffles (12) are fixedly installed on one side of the mounting plate (24), and the other rubber soft pad (11) is arranged between the two baffles (12).

5. The electronic component wire pressing mechanism according to claim 4, wherein: The mounting frame (21) is fixedly installed on the top surface of the bottom plate (1).

6. An electronic component wire pressing mechanism according to claim 5, wherein: The inside of the mounting frame (21) is fixedly installed with the limiting long rod (25) in a symmetrical mode, and the both ends of the pressing plate (23) are movably penetrated by the two limiting long rods (25).

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