Chip protection film

Abstract

The utility model relates to a chip protective film, which is formed by laminating and compounding a conductive film, a conductive conducting film, an antistatic protective film and a conductive bonding film, the antistatic protective film is of a latticed structure, one surface of the latticed antistatic protective film is compounded on the conductive conducting film, the conductive conducting film is compounded on the conductive film, and the other surface of the latticed antistatic protective film is compounded on the conductive bonding film. And the other surface of the latticed antistatic protective film is a conductive adhesive film. The anti-static packaging film has the advantages that when the anti-static protection film is of the latticed structure, a conductive layer is formed on the surface of the packaged chip, so that the surface resistivity of the chip is reduced, static electricity generated during packaging, transportation and film tearing of the chip is quickly led in and leaked, and the internal structure of the chip is prevented from being damaged by the static electricity; secondly, the grid-shaped antistatic protective film is formed by sequentially arranging the macromolecular resin conductive balls in a contact manner, so that the grid-shaped antistatic protective film and the chip are in multi-point contact, the contact surface is small, and static electricity can be quickly guided out due to multiple paths; and as the conductive balls are tangent to each other to form the V-shaped grooves which are communicated with each other, the air circulation performance is good, the air circulation performance and the relative stability of the temperature in the chip transportation process are ensured, and the transportation safety of the chip is further ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to a chip protection film which has reliable anti-static function, reliably protects the internal structure of the chip from static damage, and does not cause static damage to the chip when the chip protection film is torn. BACKGROUND

[0002] CN210706393U, entitled "High-cleanliness anti-static chip packaging film", includes a protection film and an anti-sticking anti-static layer. The protection film includes a base film and an adhesive layer coated on the base film. The anti-sticking anti-static layer is bonded to the protection film, and the anti-sticking anti-static layer has a plurality of conductive particles therein. The anti-sticking anti-static layer includes a polymer film, and the conductive particles are dispersed in the polymer film. The polymer film includes a first surface and a second surface, and the first surface is bonded to the protection film. The first surface has a plurality of spaced protrusions, and recesses are formed between adjacent protrusions. The second surface of the polymer film is also provided with a support layer made of plastic. The conductive particles are in contact with each other to form a path. The path is arranged in a chain-like manner. The disadvantages are: first, although the conductive particles are added in the polymer film of the packaging film, the conductive particles cannot ensure that the static electricity is released 100%, and only the static electricity is relatively reduced, so that the chip is inevitably damaged; second, after the anti-sticking anti-static layer and the protection film are bonded, only the protrusions are bonded to the adhesive layer, and the recesses are not bonded to the adhesive layer of the protection film, thereby reducing the bonding area between the anti-sticking anti-static layer and the protection film, achieving easy tearing between the anti-sticking anti-static layer and the protection film, and not achieving easy tearing between the chip surfaces; third, bubbles are generated during the bonding process of the anti-sticking anti-static layer and the protection film, the bubbles can be transferred from the protrusions to the recesses and discharged, although the effect of reducing bubbles is achieved, but the protection of the chip does not play any role. SUMMARY

[0003] Design purpose: to avoid the disadvantages of the background art, design a chip protection film which has reliable anti-static function, reliably protects the internal structure of the chip from static damage, and does not cause static damage to the chip when the chip protection film is torn.

[0004] Design scheme: in order to realize the above design purpose, the utility model discloses in scheme design: 1, the design of the anti-static protection film is the grid structure, and it is one of the technical features of the utility model. The purpose of such design is: static electricity is generated due to the unbalance of the surface charge of the object, and the common generation methods include contact, friction and peeling, etc. In the design and production process of the chip, electrostatic discharge (ESD) is a problem that cannot be ignored, which may cause damage to the internal structure of the chip, resulting in its inability to operate normally. The utility model designs the film for protecting the chip into a grid structure, and through the contact between the grid film and the surface of the chip, the surface of the chip forms a conductive layer, reduces the surface resistivity, makes the static electricity generated during the packaging, transportation and film tearing of the chip quickly leak, avoids the accumulation of static electricity on the surface of the chip, and further achieves the purpose of protecting the internal structure of the chip from being damaged by static electricity. Because the conductive path is constructed on the surface of the material, the charged particles can quickly contact and conduct, thereby inhibiting and reducing the generation of static electricity. 2, the grid-shaped anti-static protection film is composed of a plurality of high molecular resin conductive balls arranged in sequence, which is the second technical feature of the utility model. The purpose of such design is: when the grid-shaped anti-static protection film is composed of high molecular resin conductive balls, the contact (adhesion) between the grid-shaped anti-static protection film and the chip forms a multi-point contact. The advantage of multi-point contact is: the contact surface is small, but the static shielding and static discharge are fast due to the multiple outlets. Secondly, the links between the multiple high molecular resin conductive balls are interconnected, so the air circulation is good, which can ensure the air circulation and the relative stability of the temperature during the transportation of the chip, and ensure the safety of the transportation of the chip. 3, the surface of the high molecular resin conductive ball (the other side of the grid-shaped anti-static protection film) is designed as a sticky adhesive surface, which is the third technical feature of the utility model. The purpose of such design is: since the surface of the high molecular resin conductive ball is a sticky adhesive surface, the adhesive surface and the surface of the chip are tangential (point) adhesion. Therefore, when the anti-static protection film adhered to the surface of the chip needs to be torn off from the chip, the anti-static protection film with tangential point surface adhesion can be naturally, smoothly and effortlessly torn off from the surface of the chip without generating static electricity, which ensures the safety and reliability of the performance of the chip before assembly without any change. 4, the design of the conductive film and the conductive conductive film is the fourth technical feature of the utility model. The purpose of such design is: first, the conductive conductive film serves as the support of the grid-shaped anti-static protection film, which can ensure the reliability of the formation of the grid-shaped anti-static protection film without any change, and can also quickly conduct the static electricity generated in the grid-shaped anti-static protection film to the conductive film to release the static discharge conductor, and quickly discharge the static electricity in the grid-shaped anti-static protection film.

[0005] Technical solution: a chip protection film is composed of a conductive film, a conductive transmission film, an anti-static protection film and a conductive adhesive film, the anti-static protection film is in a grid structure, one side of the grid-shaped anti-static protection film is combined with the conductive transmission film, the conductive transmission film is combined with the conductive film, and the other side of the grid-shaped anti-static protection film is the conductive adhesive film.

[0006] ‌ Compared with the background art, the chip protection film has the following advantages: first, when the anti-static protection film is in a grid structure, the surface of the packaged chip forms a conductive layer, thereby reducing the chip surface resistivity, making the static electricity generated during the packaging, transportation and film tearing of the chip quickly leak, and ensuring that the internal structure of the chip is not damaged by static electricity; second, the grid-shaped anti-static protection film composed of high molecular resin conductive balls arranged in sequence makes the grid-shaped anti-static protection film and the chip form a multi-point contact, not only the contact surface is small, but also the static electricity is discharged quickly due to the multiple discharge paths, and the air circulation is good due to the V-shaped grooves formed by the tangential contact between the conductive balls, thereby ensuring the air circulation and the relative stability of the temperature during the transportation of the chip, and further ensuring the transportation safety of the chip; third, the surface of the high molecular resin conductive ball is a sticky adhesive surface, and the adhesive points between the adhesive surface and the surface of the chip form a natural inclined tearing and cutting point, so that the anti-static protection film can be naturally, smoothly and effortlessly torn off from the surface of the chip without generating static electricity, thereby ensuring that the anti-static protection film on the chip will not generate static electricity when torn off. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 is a structural schematic diagram of the chip protection film.

[0008] Figure 2 is Figure 1 is a partial structural schematic diagram of the anti-static protection film. DETAILED DESCRIPTION

[0009] Referring to the drawings Figure 1 and 2A chip protection film is composed of a conductive film 1, a conductive conductive film 2, an anti-static protection film 3 and a conductive adhesive film 4, the anti-static protection film 3 is a grid-shaped anti-static protection film, one side of the grid-shaped anti-static protection film 3 is combined with the conductive conductive film 2, the conductive conductive film 2 is combined with the conductive film 1, and the other side of the grid-shaped anti-static protection film 3 is the conductive adhesive film 4. The grid-shaped anti-static protection film is composed of a plurality of high molecular resin conductive balls arranged in sequence, and the conductive adhesive film is formed by coating conductive adhesive on the surface of the high molecular resin conductive ball. The purpose of the nano-level high molecular resin conductive ball prepared by uniformly mixing the nano-level graphite powder and the nano-level high molecular resin powder is that the conductivity of the graphite is very excellent, because the stable lattice structure makes the carbon atoms have excellent conductivity, and when the electrons in the graphite move in the orbit, they will not be scattered due to lattice defects or introduction of foreign atoms, so the interference of the electrons is very small. Therefore, the high molecular resin conductive ball prepared by uniformly mixing the nano-level graphite powder and the nano-level high molecular resin powder not only has good conductivity, but also has good elasticity, and when it is in contact with the chip surface, the good elasticity greatly reduces the impact of gravity and external force on the chip, and ensures the safety of the chip in storage and transportation. The high molecular resin conductive ball is prepared by uniformly mixing the nano-level high molecular resin powder and the nano-level graphite powder, and the manufacturing process is the prior art, which is not described here. The tangent surface of the plurality of high molecular resin conductive balls is combined with the surface of the conductive conductive film 2 to form a point surface.

[0010] In example 2, the high molecular resin conductive ball is prepared by uniformly mixing the nano-level high molecular resin powder, the nano-level graphite powder and the nano-level aluminum powder, and the manufacturing process is the prior art, which is not described here.

[0011] It should be understood that, although the above examples have a more detailed description of the design idea of the utility model, these descriptions are only a simple description of the design idea of the utility model, and not a limitation of the design idea of the utility model, any combination, addition or modification within the design idea of the utility model falls within the protection scope of the utility model.

Claims

1. A chip protection film, characterized by The conductive film (1), the conductive conducting film (2), the anti-static protective film (3) and the conductive adhesive film (4) are stacked and composed, the anti-static protective film (3) is in a grid structure, one side of the grid anti-static protective film (3) is combined on the conductive conducting film (2), the conductive conducting film (2) is combined on the conductive film (1), and the other side of the grid anti-static protective film (3) is the conductive adhesive film (4).

2. The chip protection film according to claim 1, characterized in that: The grid anti-static protective film is composed of a plurality of high molecular resin conductive balls arranged in sequence.

3. The chip protection film according to claim 2, characterized in that: The high molecular resin conductive balls are stacked with the conductive conducting film, and the tangent planes of the plurality of high molecular resin conductive balls are point-surface stacked and bonded with the surface of the conductive conducting film.

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