Electron collection device and vacuum magnetron sputtering equipment
By setting up an electron collection device in the vacuum coating equipment, the electrons in the chamber are discharged to the ground, which solves the problem of abnormal discharge caused by electron accumulation and ensures the quality of the coating.
Patent Information
- Application Number
- CN202423029056.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-12-09
AI Technical Summary
In the prior art, electron accumulation in a vacuum chamber leads to abnormal discharge, which affects the coating quality.
An electron collecting device is set up in the vacuum chamber of the vacuum coating equipment, including a collecting body and a supporting assembly. The collecting body is located above the target material, and the supporting assembly transports the collected electrons to the bottom wall of the vacuum chamber for grounding to avoid electron aggregation.
By grounding, electrons are transmitted to the ground, avoiding electron accumulation in the vacuum chamber, preventing abnormal discharge and ensuring the coating quality.
Smart Images
Figure CN223468442U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to vacuum coating equipment technical field especially relates to an electron collection device and vacuum magnetron sputtering equipment. BACKGROUND
[0002] Magnetron sputtering is a common physical vapor deposition coating process, and its basic principle is: in the vacuum chamber of the vacuum coating equipment, argon is introduced, and argon ions (Ar+) and electrons are formed under the action of an electric field; during the deposition process, the substrate is an anode with a large number of positive charges, and the target material is a cathode with a large number of negative charges. Therefore, under the action of the electric field, the argon ions produced by the ionization of argon gas are attracted by the cathode due to the positive charge, thereby impacting the target material to generate a glow plasma, so as to form a thin film on the surface of the target material, and the electrons produced by the ionization of argon gas are attracted by the anode due to the negative charge, thereby gathering near the anode substrate.
[0003] In the prior art, the anode substrate and its support frame are insulated from the vacuum chamber, and the vacuum chamber is grounded. Therefore, the electrons moving to the anode substrate cannot be conducted away through the grounding of the vacuum chamber, thereby producing a significant accumulation effect. When a large number of electrons accumulate near the anode substrate, and the distance between the anode deposition and its support frame and other structural members in the chamber is relatively limited (usually the closest distance is only a few centimeters), the potential of the anode deposition and its support frame accumulates higher and higher, and therefore abnormal discharge phenomenon may occur, which has a greater impact on the quality of the deposited film, for example, the film surface has patterns that affect the coating quality, and may also have film peeling, cracking, and other problems, that is, the coating quality is affected.
[0004] To solve this problem, the prior art usually sets a cathode shielding cover outside the target material to attract electrons near the target surface, which can reduce the frequency of abnormal discharge to a certain extent. However, during the coating process, the number of electrons in the vacuum chamber increases continuously, and the ability of the cathode shielding cover to attract electrons is limited, so there are still many electrons in the vacuum chamber. With the continuous accumulation of electrons, abnormal discharge phenomenon still occurs. Therefore, the prior art cannot completely eliminate this abnormal discharge phenomenon.
[0005] Therefore, there is an urgent need for an electron collection device and a vacuum magnetron sputtering equipment to solve the above problems. Utility model content
[0006] The utility model aims at providing an electron collection device and a vacuum magnetron sputtering equipment to solve the problem that the prior art cannot completely eliminate abnormal discharge phenomenon and affect the coating quality.
[0007] As conceived above, the technical solution adopted by the utility model is:
[0008] An electron collecting device is arranged in a vacuum chamber of a vacuum coating device, the vacuum chamber is grounded, and a target is arranged in the vacuum chamber, the electron collecting device comprises:
[0009] A collecting body is arranged above the target and used for collecting electrons in the vacuum chamber.
[0010] A supporting assembly is connected to one end of the collecting body and abuts against a bottom wall of the vacuum chamber, and is used for conveying the collected electrons on the collecting body to the bottom wall of the vacuum chamber.
[0011] Further, the collecting body is a circular ring, and a radial direction of the collecting body is perpendicular to a vertical direction.
[0012] Further, the supporting assembly comprises a plurality of supporting members, and the plurality of supporting members are arranged at one end of the collecting body close to the target and are spaced apart along a circumferential direction of the collecting body.
[0013] Further, the supporting member is a U-shaped member, and the supporting member comprises a first supporting plate, a second supporting plate and a third supporting plate connected in sequence, the second supporting plate is perpendicular to the first supporting plate and the third supporting plate which are parallel to each other, the first supporting plate is connected to the collecting body, and the third supporting plate abuts against the bottom wall of the vacuum chamber.
[0014] Further, a size L of the supporting member in the vertical direction is 10 mm-150 mm.
[0015] Further, a second mounting hole is arranged on the first supporting plate, a plurality of first mounting holes are arranged on the collecting body, the plurality of second mounting holes and the plurality of first mounting holes are one-to-one corresponding, and the second mounting hole and the first mounting hole are connected by a fixing member; or, the first supporting plate and the collecting body are welded.
[0016] Further, the target is a cylindrical member, an axis of the target coincides with an axis of the collecting body, an inner diameter of the collecting body is D1, a diameter of the target is D3, and D1=(0.8-1.2)D3.
[0017] Further, a normal projection of the target on a plane where the collecting body is located is located in an annular hole of the collecting body.
[0018] Further, an outer diameter of the collecting body is D2, D2=(1-1.5)D1, and a size difference between the outer diameter D2 of the collecting body and the inner diameter D1 of the collecting body is less than 5 mm.
[0019] A vacuum magnetron sputtering device comprises the electron collecting device.
[0020] The utility model discloses a beneficial effect:
[0021] The utility model provides a kind of electronic collection device and vacuum magnetron sputtering equipment, electronic collection device is set in the vacuum cavity of vacuum coating equipment, vacuum cavity ground, and target material is provided in vacuum cavity, and electronic collection device includes collection body and support component, collection body is located above target material, for collecting the electron in vacuum cavity, one end of support component is connected with collection body, and the other end of support component is abutted to the bottom wall of vacuum cavity, for the electron collected on collection body is transported to the bottom wall of vacuum cavity, to transmit electron to ground surface.Due to vacuum cavity ground, the electron collected on collection body can be continuously transmitted to ground surface by support component and inner wall of vacuum cavity, to avoid the phenomenon that abnormal discharge is caused by electron aggregation in vacuum cavity, to avoid the phenomenon of abnormal discharge and influence coating quality, ensure coating quality. DRAWINGS
[0022] In order to more clearly illustrate the technical scheme in the embodiment of the utility model, the drawings needed to be used in the embodiment of the utility model will be simply introduced as follows, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to the content of the embodiment of the utility model and these drawings for the ordinary skilled in the art without paying creative labor.
[0023] Figure 1 It is the structure schematic view of electronic collection device provided by the utility model embodiment one;
[0024] Figure 2 It is the structure schematic view of another view of electronic collection device provided by the utility model embodiment one;
[0025] Figure 3 It is the structure schematic view of support provided by the utility model embodiment one;
[0026] Figure 4 It is the structure schematic view of another view of support provided by the utility model embodiment one.
[0027] In the drawing:
[0028] 1, collection body;11, annular hole;2, support component;21, support;211, first support plate;2111, second mounting hole;212, second support plate;213, third support plate;2131, recess. DETAILED DESCRIPTION
[0029] To make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the utility model will be further explained below in combination with the drawings and through specific embodiments. It can be understood that the specific embodiments described herein are merely used to explain the utility model and not limit the utility model. In addition, it should be noted that only parts related to the utility model are shown in the drawings for the convenience of description, not all.
[0030] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0031] In the description of the utility model, unless explicitly defined and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0032] In the utility model, unless explicitly defined and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature. In the description of the embodiment, if not specially stated, "a plurality of" specifically refers to two or more than two.
[0033] In the description of the embodiment, the terms "up", "down", "right", etc. orientation or position relationship is based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.
[0034] It should be noted that when an element is referred to as "fixed to" or "provided on" another element, it can be directly on another element or there can be a middle element.
[0035] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.
[0036] Example 1
[0037] This embodiment provides an electron collecting device, which is arranged in a vacuum chamber of a vacuum coating device. The vacuum chamber is grounded and a target material is arranged in the vacuum chamber. The electron collecting device can avoid the phenomenon of abnormal discharge caused by electron accumulation in the vacuum chamber, thereby avoiding the phenomenon of abnormal discharge and affecting the coating quality, thereby ensuring the coating quality.
[0038] like Figure 1 As shown, in this embodiment, the electron collecting device is arranged in the vacuum chamber of the vacuum coating equipment (not shown in the figure), the vacuum chamber is grounded, and a target material (not shown in the figure) is arranged in the vacuum chamber. The electron collecting device includes a collecting body 1 and a supporting assembly 2. The collecting body 1 is located above the target material and is used to collect electrons in the vacuum chamber. One end of the supporting assembly 2 is connected to the collecting body 1, and the other end of the supporting assembly 2 is abutted against the bottom wall of the vacuum chamber (not shown in the figure), which is used to transport the electrons collected on the collecting body 1 to the bottom wall of the vacuum chamber to transmit the electrons to the ground. It can be understood that since the vacuum chamber is grounded, the electrons collected on the collecting body 1 can be continuously transmitted to the ground through the supporting assembly 2 and the inner wall of the vacuum chamber, thereby avoiding the phenomenon of abnormal discharge caused by electron aggregation in the vacuum chamber, thereby avoiding the phenomenon of abnormal discharge and affecting the coating quality, thereby ensuring the coating quality.
[0039] Exemplarily, the collector body 1 and the support assembly 2 are both made of a conductive material, such as stainless steel, aluminum alloy, tantalum alloy, nickel alloy, molybdenum alloy, etc. In this embodiment, the collector body 1 is made of aluminum alloy, which is not only a conductive material but also an anode material, facilitating the collector body 1 to collect electrons within the vacuum chamber.
[0040] Furthermore, the collector body 1 is a circular ring, with the radial direction of the collector body 1 perpendicular to the vertical direction. It is understood that the placement of the collector body 1 above the target does not block the passage of ionized ions through the annular aperture 11 of the collector body 1, thereby reducing the probability that the placement of the collector body 1 above the target will affect the target coating quality. Furthermore, the collector body 1 provides a certain vertical bearing area, which helps improve the collection efficiency of the collector body 1 for electrons. For example, the thickness of the collector body 1 is 1 mm to 3 mm.
[0041] Further, in the embodiment, the target is a cylindrical member, the axis of the target coincides with the axis of the collecting body 1, the inner diameter of the collecting body 1 is D1, and the diameter of the target is D3, and D1 = (0.8-1.2)D3. It can be understood that the axis of the target coincides with the axis of the collecting body 1, which facilitates the setting of the relative position of the target and the collecting body 1. When the electrons and ions normally fall, the ions fall onto the surface of the target through the annular hole 11 of the collecting body 1, and the collecting body 1 collects the electrons, thereby meeting the quality requirements of the target film and the requirements of electron collection. For example, the inner diameter D1 of the collecting body 1 can be 0.8 times, 0.9 times, 1 times, 1.1 times, 1.2 times, or the like of the diameter D3 of the target. The specific multiple of the inner diameter D1 of the collecting body 1 and the diameter D3 of the target can be determined according to the use requirements.
[0042] Of course, in other embodiments, the target can be rectangular or other shapes. Specifically, the orthogonal projection of the target on the plane where the collecting body 1 is located is located in the annular hole 11 of the collecting body 1. It can be understood that in the vertical direction, the collecting body 1 does not affect the normal falling of the ions onto the surface of the target, that is, it does not affect the quality of the target film because of the collection of the electrons in the vacuum chamber.
[0043] For example, in the embodiment, the outer diameter of the collecting body 1 is D2, D2 = (1-1.5)D1, and the size difference between the outer diameter D2 of the collecting body 1 and the inner diameter D1 of the collecting body 1 is less than 5 mm. Specifically, the outer diameter D2 of the collecting body 1 can be 1 times, 1.1 times, 1.2 times, 1.3 times, 1.4 times, 1.5 times, or the like of the inner diameter D1 of the collecting body 1. The specific multiple of the outer diameter D2 of the collecting body 1 and the inner diameter D1 of the collecting body 1 can be determined according to the use requirements, and the size difference between the outer diameter D2 of the collecting body 1 and the inner diameter D1 of the collecting body 1 is less than 5 mm.
[0044] Further, the support assembly 2 includes a plurality of support members 21, and the plurality of support members 21 are arranged at one end of the collecting body 1 close to the target in the circumferential direction of the collecting body 1. It can be understood that the plurality of support members 21 arranged at intervals facilitate to improve the stability of the support assembly 2 supporting the collecting body 1. For example, the support assembly 2 includes 3, 4, 5, 6, or the like number of support members 21. In the embodiment, the support assembly 2 includes 4 support members 21, and the 4 support members 21 are arranged at one end of the collecting body 1 close to the target in the circumferential direction of the collecting body 1. Of course, in other embodiments, the specific number and arrangement of the support members 21 can be changed according to the use requirements.
[0045] Further, the support 21 is a U-shaped piece, and the support 21 comprises a first support plate 211, a second support plate 212 and a third support plate 213 connected in sequence, the second support plate 212 is perpendicular to the first support plate 211 and the third support plate 213 which are parallel to each other, the first support plate 211 is connected with the collecting body 1, and the third support plate 213 abuts against the bottom wall of the vacuum chamber. It can be understood that, by arranging the support 21 as above, the collecting body 1 can be stably supported under the premise that the support 21 is connected with the collecting body 1 and abuts against the bottom wall of the vacuum chamber, the support effect of the support 21 on the collecting body 1 is improved, and the stability of the collecting body 1 is improved. Meanwhile, the support 21 is a U-shaped piece, which facilitates the assembly of the support 21 and the collecting body 1, and is convenient to operate.
[0046] Exemplarily, the first support plate 211, the second support plate 212 and the third support plate 213 are connected by welding.
[0047] Further, the size L of the support 21 in the vertical direction is 10mm-150mm. Specifically, the size L of the support 21 in the vertical direction can be 10mm, 20mm, 25mm, 30mm, 35mm, 40mm, 150mm, etc., and the specific size of the support 21 in the vertical direction can be determined according to actual use requirements.
[0048] Exemplarily, in the embodiment, the planes where the first support plate 211 and the third support plate 213 are located are both perpendicular to the vertical direction, the length direction of the second support plate 212 is parallel to the vertical direction, the size L of the support 21 in the vertical direction is the sum of the thickness L1 of the first support plate 211, the thickness L3 of the third support plate 213 and the length L2 of the second support plate 212, i.e. L=(L1+L2+L3). In addition, the thicknesses of the first support plate 211, the second support plate 212 and the third support plate 213 are all 1mm-3mm. In the embodiment, the thicknesses of the first support plate 211, the second support plate 212 and the third support plate 213 are all 1mm, and the lengths of the first support plate 211, the second support plate 212 and the third support plate 213 can be determined according to actual use requirements.
[0049] It can be understood that the specific size of the support 21 and the collecting body 1 can be determined according to the actual size of the target material and the size relationship of the support 21 and the collecting body 1. For example, the target material diameter D3 is 250 mm, the inner diameter D1 of the collecting body 1 is 230 mm (0.92 times the diameter D3 of the target material), the outer diameter D2 of the collecting body 1 is 310 mm (1.24 times the inner diameter D1 of the collecting body 1), and the size L of the support 21 in the vertical direction is 20 mm. Or, the target material diameter D3 is 250 mm, wherein the inner diameter D1 of the collecting body 1 is 250 mm (1 times the diameter D3 of the target material, equal to the diameter D3 of the target material), the outer diameter D2 of the collecting body 1 is 310 mm (1.24 times the inner diameter D1 of the collecting body 1), and the size L of the support 21 in the vertical direction is 35 mm. The specific diameter of the target material is not limited in this embodiment.
[0050] Further, the first support plate 211 is provided with a second mounting hole 2111, and the collecting body 1 is correspondingly provided with a plurality of first mounting holes (not shown in the figure). The plurality of second mounting holes 2111 correspond to the plurality of first mounting holes one by one, and the second mounting hole 2111 is connected with the first mounting hole through a fixing member. It can be understood that by respectively providing the second mounting hole 2111 on the first support plate 211 of the plurality of supports 21, and correspondingly providing the plurality of first mounting holes on the collecting body 1, and connecting them through the fixing member, the detachable connection between the collecting body 1 and the support 21 is realized, which facilitates the transportation of the collecting body 1 and the support 21 under the premise of meeting the stable support of the collecting body 1. In this embodiment, the fixing member is a bolt, the length of the first support plate 211 is greater than the length of the third support plate 213, the second mounting hole 2111 is arranged at the end of the first support plate 211 away from the second support plate 212, thereby facilitating the manufacturing of the second mounting hole 2111 and the fixing member being simultaneously arranged in the first mounting hole and the second mounting hole 2111.
[0051] Of course, in other embodiments, the connection between the first support plate 211 and the collecting body 1 can also be achieved by welding the first support plate 211 and the collecting body 1. This way improves the stability of the connection between the support 21 and the collecting body 1, and further improves the stability of the collecting body 1. In this embodiment, the length of the first support plate 211 is greater than the length of the third support plate 213, the end of the first support plate 211 away from the second support plate 212 is welded to the collecting body 1, and in the vertical direction, the first support plate 211 is located below the collecting body 1, or the side of the end of the first support plate 211 away from the second support plate 212 is welded to the outer side of the collecting body 1.
[0052] Further, the third support plate 213 is provided with a groove 2131 extending to an end of the third support plate 213 away from the second support plate 212, by providing the groove 2131, the weight of the third support plate 213 can be appropriately reduced, and the light weight of the support 21 is realized.
[0053] Embodiment two
[0054] The embodiment provides a vacuum magnetron sputtering device, which comprises the electronic collecting device provided in the embodiment one.
[0055] It should be noted that the above are only preferred embodiments of the present application and the technical principles applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, re-adjustments and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.
Claims
1. An electron collecting device, characterized by, The electron collecting device is arranged in a vacuum chamber of a vacuum coating device, the vacuum chamber is grounded, and a target is arranged in the vacuum chamber. The electron collecting device comprises: a collecting body (1) arranged above the target and used for collecting electrons in the vacuum chamber; 2. The electron collection apparatus according to claim 1, wherein a supporting assembly (2) connected to one end of the collecting body (1) and abutting against a bottom wall of the vacuum chamber, and used for conveying the electrons collected on the collecting body (1) to the bottom wall of the vacuum chamber.
3. The electron collection apparatus according to claim 2, wherein The collecting body (1) is a circular ring, and a radial direction of the collecting body (1) is perpendicular to a vertical direction.
4. The electron collection device of claim 3, wherein, The supporting assembly (2) comprises a plurality of supporting members (21) arranged at an end of the collecting body (1) close to the target in a circumferential direction of the collecting body (1).
5. The electron collection apparatus according to claim 3, wherein The supporting member (21) is a U-shaped member, and comprises a first supporting plate (211), a second supporting plate (212) and a third supporting plate (213) connected in sequence, the second supporting plate (212) is perpendicular to the first supporting plate (211) and the third supporting plate (213) which are parallel to each other, the first supporting plate (211) is connected to the collecting body (1), and the third supporting plate (213) abuts against the bottom wall of the vacuum chamber.
6. The electron collection apparatus according to claim 4, wherein A dimension L of the supporting member (21) in the vertical direction is 10 mm-150 mm.
7. The electronic collection device of claim 2, wherein, The first supporting plate (211) is provided with a second mounting hole (2111), the collecting body (1) is correspondingly provided with a plurality of first mounting holes, the second mounting hole (2111) corresponds to one of the first mounting holes, and the second mounting hole (2111) and the first mounting hole are connected by a fixing member; or, the first supporting plate (211) is welded to the collecting body (1).
8. The electronic collection device of claim 2, wherein, The target is a cylindrical member, an axis of the target coincides with an axis of the collecting body (1), an inner diameter of the collecting body (1) is D1, a diameter of the target is D3, and D1=(0.8-1.2)D3.
9. The electron collecting device according to claim 7 or 8, characterized in that, A normal projection of the target on a plane where the collecting body (1) is located is located in a ring-shaped hole (11) of the collecting body (1).
10. A vacuum magnetron sputtering apparatus, characterized by An outer diameter of the collecting body (1) is D2, D2=(1-1.5)D1, and a size difference between the outer diameter D2 and the inner diameter D1 of the collecting body (1) is less than 5 mm. The electron collecting device comprises the electron collecting device according to any one of claims 1-9.