Heat transfer equipment

Abstract

According to the heat transfer equipment, the Peltier effect of a PN junction semiconductor is utilized, direct current is applied to the PN junction semiconductor, so that heat of a first temperature changing face is transferred to a second temperature changing face, the first temperature changing face of the PN junction semiconductor achieves the refrigeration effect, reverse voltage is applied to the PN junction semiconductor, and heat of the second temperature changing face of the PN junction semiconductor is transferred to the first temperature changing face. The first variable-temperature surface of the PN junction semiconductor achieves a heat dissipation effect, air flow is generated through the fan and guided through the internal structure, so that air passes through the first heat dissipation part and the second heat dissipation part which are connected with the PN junction semiconductor, and when the first variable-temperature surface of the PN junction semiconductor achieves a refrigeration effect, the air passing through the first heat dissipation part forms cold air. When the first variable temperature surface of the PN junction semiconductor has a heat dissipation effect, hot air is formed, and the air is blown to a user through the first through hole in the shell. The air conditioner has the advantages that the equipment power is large, the refrigerating and heating requirements can be met, and the heating and refrigerating effects are good.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of small household appliances, in particular to a heat transfer device. BACKGROUND

[0002] At present, small refrigeration devices on the market are mainly spray fans and neck fans. The principle of fan cooling is to increase the air flow rate of human skin. However, the neck fan has small volume, small battery capacity and short endurance time. The neck fan needs to assemble a series of components such as battery, control, motor and fan, and the weight is relatively heavy. Long-term wearing can cause discomfort. The temperature difference between the cold end of the semiconductor in the neck fan and the metal sheet connected to it and the temperature of the skin part of the user and the environment will cause discomfort. The motor power of the neck fan is small, and the wind power is relatively weak, which may not meet the demand of some people for wind power.

[0003] The spray fan needs to be manually added with water, and the capacity is small, so water needs to be added frequently, which is not very convenient to use. If the spray fan is not used properly, it will cause high humidity, which not only makes the body feel uncomfortable, but also easily causes problems such as dampness and mildew. The atomization system of some spray fans is not fine enough, causing uneven spraying, spraying water mist around the device, affecting the use effect. If the spray fan is not cleaned for a long time, bacteria and mold may breed, which may harm the body. The spray fan may produce some noise when running, especially when the wind volume is large. The spray fan needs to be regularly maintained and cleaned to prevent the breeding of bacteria and mold and to ensure the spraying effect.

[0004] At present, the heating device of the heating fan and the warmer on the market can only achieve the effect of heating, and cannot achieve the effect of refrigeration. Users need to purchase small refrigeration devices and heating devices at the same time to meet the cooling demand in summer and the heating demand in winter. Therefore, a device that can simultaneously achieve refrigeration and heating is needed to meet the needs of users. SUMMARY

[0005] The present application provides a heat transfer device to solve the problems of small power of existing small household appliance devices, inability of a device to achieve refrigeration and heating, and poor refrigeration and heating effect.

[0006] The application provides a heat transfer device, comprising a cylindrical shell, an electric fan and a semiconductor refrigerator, two ends of the shell are respectively provided with opposite sealing end faces and ventilation end faces; a cavity in the shell forms a first channel and a second channel; a first through hole and a second through hole are provided on the side wall of the shell, the first through hole is connected to the first channel, and the second through hole is connected to the second channel; the electric fan is arranged in the shell; the electric fan comprises an air inlet and an air outlet, the air inlet is arranged opposite to the ventilation end face; the semiconductor refrigerator is arranged in the shell; the semiconductor refrigerator comprises a first heat dissipation part and a second heat dissipation part; one side of the first heat dissipation part is arranged opposite to the first channel, and the other side is arranged opposite to the air outlet; one side of the second heat dissipation part is arranged opposite to the second channel, and the other side is arranged opposite to the air outlet.

[0007] Further, the shell comprises a cylindrical body, the cylindrical body comprises a bottom surface, a first air outlet surface and a second air outlet surface; the first through hole penetrates the first air outlet surface; and the second through hole penetrates the second air outlet surface and / or the bottom surface.

[0008] Further, the first air outlet surface and the second air outlet surface form an included angle of 30-120 degrees.

[0009] Further, the shell further comprises two pads, the pads protrude from the bottom surface of the cylindrical body, and the two pads are respectively close to two ends of the cylindrical body.

[0010] Further, the first through hole penetrates one end of the first air outlet surface away from the bottom surface.

[0011] Further, the first through hole is a strip-shaped hole, and the extension direction of the first through hole is consistent with the extension direction of the shell; and / or the second through hole is a strip-shaped hole, and the extension direction of the second through hole is consistent with the extension direction of the shell.

[0012] Further, when the number of the first through holes is two or more, the two or more first through holes are arranged on the same straight line.

[0013] Further, the shell comprises a cylindrical body and a third through hole, the third through hole penetrates the ventilation end face and / or a part of the cylindrical body close to the ventilation end face.

[0014] Further, the semiconductor refrigerator comprises a frame and a PN junction semiconductor block, the frame is fixedly connected to the inner side wall of the shell; the first heat dissipation part and the second heat dissipation part are respectively mounted to two sides of the frame; the PN junction semiconductor block is mounted to the frame; the PN junction semiconductor block comprises two temperature changing surfaces away from each other, which are a first temperature changing surface and a second temperature changing surface.

[0015] Further, the first heat dissipation part comprises a first substrate and two or more first fins, the first substrate is attached to the first temperature changing surface of the PN junction semiconductor block; the first fins are vertically connected to the surface of the first substrate.

[0016] Further, the second heat dissipation part comprises a second substrate and two or more second fins, the second substrate is attached to the second temperature changing surface of the PN junction semiconductor block; the second fins are vertically connected to the surface of the second substrate.

[0017] Further, the materials of the two temperature changing surfaces of the PN junction semiconductor block are P-type semiconductor material and N-type semiconductor material respectively; the materials of the first heat dissipation part and the second heat dissipation part are heat conductive material.

[0018] Further, the heat transfer device further comprises an AC-DC converter and a controller, the AC-DC converter is used to convert alternating current into direct current; the output end of the AC-DC converter comprises a positive terminal and a negative terminal; the two temperature changing surfaces of the PN junction semiconductor block are respectively electrically connected through a multi-mode switch; the controller is electrically connected to the alternating current, and the electric fan is electrically connected to the controller.

[0019] Further, the semiconductor refrigerator further comprises a flow guide plate, one end of the flow guide plate is connected to the edge of the frame at the end of the ventilation end surface, and the other end of the flow guide plate extends towards the middle of the air outlet of the fan.

[0020] Further, the heat transfer device further comprises a strip-shaped partition plate, one end of the partition plate is connected to the joint of the first heat dissipation part and the second heat dissipation part, and the other end of the partition plate extends and is connected to the sealed end surface; the edge of the partition plate is connected to the inner side wall of the shell, and the first channel and the second channel are isolated by the partition plate.

[0021] Further, the partition plate is parallel to the first air outlet surface of the shell; the partition plate is connected to the edge of the frame of the semiconductor refrigerator at the end of the sealed end surface.

[0022] Further, the cross section perpendicular to the extension direction of the shell is taken as a cross section; the ratio of the cross-sectional area of the second channel to the cross-sectional area of the first channel is 1-6; and / or, the cross section of the shell includes but is not limited to a triangle, a rounded triangle, a trapezoid, a rounded trapezoid, a semicircle or a rectangle.

[0023] Further, the heat transfer device further comprises L-shaped baffles arranged between the partition and the first air outlet surface of the shell, each L-shaped baffle and the partition and the first air outlet surface form an air duct, one end of the air duct forms a first air outlet facing the air outlet surface, and the other end forms a second air outlet facing a first through hole.

[0024] The heat transfer device has the advantages that the working principle is to use the Peltier effect of the PN junction semiconductor, direct current is applied to the PN junction semiconductor to make the heat of the first temperature change surface of the semiconductor component transfer to the second temperature change surface, so that the first temperature change surface of the semiconductor component has a refrigeration effect, and then a control circuit is used to apply a reverse voltage to the PN junction semiconductor to make the heat of the second temperature change surface of the PN junction semiconductor transfer to the first temperature change surface, so that the first temperature change surface of the semiconductor component has a heat dissipation effect. The product generates air flow through an electric fan, and guides the air flow through the first heat dissipation part and the second heat dissipation part connected to the PN junction semiconductor. When the first temperature change surface of the PN junction semiconductor has a refrigeration effect, the air passing through the first heat dissipation part absorbs heat of the first heat dissipation part to form cold air, and the cold air is blown to the user through the first through hole on the shell to reduce the ambient temperature of the user and improve the thermal comfort of the user. The air passing through the second heat dissipation part absorbs heat of the second heat dissipation part and is then discharged through the second through hole. When the first temperature change surface of the PN junction semiconductor has a heat dissipation effect, the air passing through the second heat dissipation part absorbs heat, and the heat is transferred to the first heat dissipation part through the PN junction semiconductor. The air passing through the first heat dissipation part absorbs heat to form hot air, and the hot air is blown to the user through the first through hole on the shell to increase the ambient temperature of the user and improve the thermal comfort of the user. The air passing through the second heat dissipation part absorbs heat of the second heat dissipation part and is then discharged through the second through hole. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0026] Figure 1 is a schematic diagram of the overall structure of the heat transfer device described in the embodiments of the present application Figure One ;

[0027] Figure 2 is a schematic diagram of the overall structure of the heat transfer device described in the embodiments of the present application Figure Two ;

[0028] Figure 3 is a schematic diagram of the partial structure of the heat transfer device described in the embodiments of the present application Figure One ;

[0029] Figure 4 is a schematic diagram of a part of the heat transfer device according to an embodiment of the present application Figure Two ;

[0030] Figure 5 is a schematic diagram of a part of the heat transfer device according to an embodiment of the present application Figure Three ;

[0031] Figure 6 is a schematic diagram of a part of the heat transfer device according to an embodiment of the present application Figure Four ;

[0032] Figure 7 is a schematic diagram of a part of the heat transfer device according to an embodiment of the present application Figure Five ;

[0033] Figure 8 is a schematic diagram of a part of the heat transfer device according to an embodiment of the present application Figure Six ;

[0034] Figure 9 is a schematic diagram of an electronic component of the heat transfer device according to an embodiment of the present application.

[0035] BRIEF DESCRIPTION OF DRAWINGS

[0036] 100 heat transfer device

[0037] 110 housing, 111 sealing end face, 112 ventilation end face, 113 first passage, 114 second passage, 115 first through hole, 116 second through hole, 117 cushion block, 118 third through hole

[0038] 120 electric fan, 121 air inlet, 122 air outlet, 123 controller

[0039] 130 semiconductor refrigerator, 131 first heat dissipation part, 132 second heat dissipation part, 133 frame, 134 PN junction semiconductor block, 135a first temperature changing surface, 135b second temperature changing surface, 136 first base plate, 137 first fin, 138 second base plate, 139 second fin

[0040] 140 cylindrical body, 141 bottom face, 142 first air outlet face, 143 second air outlet face, 144 flow guide plate, 145 partition plate, 146 L-shaped baffle, 147 air duct, 148 first air inlet, 149 second air inlet

[0041] 150 fixing device, 161 AC / DC converter, 162 multi-mode switch DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "up", "down", "left", and "right", generally refer to the up, down, left, and right of the device in actual use or working state, specifically the drawing direction in the accompanying drawings.

[0043] This application provides a heat transfer device, which is described in detail below. It should be noted that the order in which the following embodiments are described does not limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the description of each embodiment has its own emphasis. For details not described in one embodiment, please refer to the relevant descriptions of other embodiments.

[0044] like Figures 1-7 As shown, the present application provides a heat transfer device 100, including a cylindrical shell 110, an electric fan 120 and a semiconductor cooler 130, the two ends of the shell 110 are respectively a sealing end surface 111 and a ventilation end surface 112 arranged opposite to each other; the cavity inside the shell 110 forms a first channel 113 and a second channel 114; a first through hole 115 and a second through hole 116 are provided on the side wall of the shell 110, the first through hole 115 is connected to the first channel 113, and the second through hole 116 is connected to the second channel 114, the first through hole 115 is a strip hole, and the extension direction of the first through hole 115 is consistent with the extension direction of the shell 110; and / or, the second through hole 115 is a strip hole, and the extension direction of the second through hole 115 is consistent with the extension direction of the shell 110 The extension direction is consistent; when the number of the first through holes 115 is two or more, the two or more first through holes 110 are arranged on the same straight line; the electric fan 120 is arranged in the shell 110; the electric fan 120 includes an air inlet 121 and an air outlet 122, and the air inlet 121 is arranged opposite to the ventilation end surface 112; the semiconductor cooler 130 is arranged in the shell 111; the semiconductor cooler 130 includes a first heat dissipation part 131 and a second heat dissipation part 132; one side of the first heat dissipation part 131 is arranged opposite to the first channel 113, and the other side of the first heat dissipation part 131 is arranged opposite to the air outlet 122; one side of the second heat dissipation part 132 is arranged opposite to the second channel 114, and the other side of the second heat dissipation part 132 is arranged opposite to the air outlet 122.

[0045] In the embodiment, the air outside the shell 110 is guided into the shell 110 by the electric fan 120 through the ventilation end face 112 to form an air flow; a part of the air flow passes through the first heat dissipation part 131 and the first channel 113 and is discharged to the outside of the shell 110 through the first through hole 115; another part of the air flow passes through the second heat dissipation part 132 and the second channel 114 and is discharged to the outside of the shell 100 through the second through hole 116.

[0046] As shown in Figures 1-3 , the shell 110 comprises a cylindrical body 140, the cylindrical body 140 comprises a bottom surface 141, a first air outlet face 142 and a second air outlet face 143; the first through hole 115 penetrates the first air outlet face 142, and the first through hole 115 penetrates one end of the first air outlet face 142 away from the bottom surface 141, and the one end away from the bottom surface 141 is defined as an upper end of the first air outlet face 142.

[0047] The application scenario of the heat transfer device 100 is indoors, usually placed on a table, with the bottom surface 141 facing the table top, and the upper end of the first air outlet face 142 closest to the user, so that the air discharged to the outside of the shell 110 through the first through hole 115 is more likely to blow towards the user, providing a better user experience; the air discharged to the outside of the shell 100 through the second through hole 116 blows in a direction away from the user and / or towards the table top.

[0048] Further, the first air outlet face 142 and the second air outlet face 143 form an included angle of 30-120 degrees, and in the embodiment, the included angle is preferably 60 degrees or 90 degrees; if the included angle is too small, the air discharged to the outside of the shell 110 through the first through hole 115 will blow towards the user from too low a direction; if the included angle is too large, the air discharged to the outside of the shell 110 through the first through hole 115 will blow towards the user from too high a direction, affecting the user's experience.

[0049] As shown in Figure 2 , the shell 110 further comprises two pads 117 protruding from the bottom surface of the cylindrical body 140, and the two pads 117 are respectively close to the two ends of the cylindrical body 140; the pads 117 serve to support the bottom surface 141 of the cylindrical body 140, so that a gap exists between the bottom surface 141 and the plane on which the shell 110 is placed, improving the ventilation effect of the second through hole 116 on the bottom surface 141.

[0050] As shown in Figure 1 , the shell 110 further comprises two pads 117 protruding from the bottom surface of the cylindrical body 140, and the two pads 117 are respectively close to the two ends of the cylindrical body 140; the pads 117 serve to support the bottom surface 141 of the cylindrical body 140, so that a gap exists between the bottom surface 141 and the plane on which the shell 110 is placed, improving the ventilation effect of the second through hole 116 on the bottom surface 141. Figure 5As shown, the shell 110 includes a cylindrical body 140, and the third through hole 118 passes through the ventilation end surface 112 and / or the part of the cylindrical body 140 close to the ventilation end surface 112, so that the electric fan 120 can suck the air outside the shell 110 into the shell 110, generate air flow in the shell 110, and blow the air toward the semiconductor cooler 130 inside the shell 110.

[0051] like Figures 5-7 As shown, the semiconductor cooler 130 includes a frame 133 and a PN junction semiconductor block 134, and the frame 133 is fixedly connected to the inner wall of the shell 110; the first heat dissipation part 131 and the second heat dissipation part 132 are respectively installed on both sides of the frame 133; the PN junction semiconductor block 134 is installed in the frame 133; the PN junction semiconductor block 134 includes two temperature changing surfaces that are opposite to each other, namely the first temperature changing surface 135a and the second temperature changing surface 135b; the materials of the two temperature changing surfaces of the PN junction semiconductor block 134 are P-type semiconductor material and N-type semiconductor material, respectively; the materials of the first heat dissipation part 131 and the second heat dissipation part 132 are thermally conductive materials, the first heat dissipation part 131 is attached to the first temperature changing surface 135a, and the second heat dissipation part 132 is attached to the second temperature changing surface 135b.

[0052] like Figure 8 As shown, the first heat dissipation part 131 includes a first substrate 136 and two or more first fins 137 spaced apart. The first substrate 136 is attached to the first temperature change surface 135 a of the PN junction semiconductor block 134 ; the first fins 137 are vertically connected to the surface of the first substrate 137 .

[0053] Furthermore, the second heat dissipation portion 132 includes a second substrate 138 and two or more second fins 139 spaced apart from each other. The second substrate 139 is attached to the second temperature change surface 135 b of the PN junction semiconductor block 134 . The second fins 139 are vertically connected to the surface of the second substrate 138 .

[0054] One end of the first fin 137 is perpendicularly connected to the surface of the first base plate 136, and a gap is formed between the other end of the first fin 137 and the inner wall of the housing 110. One end of the second fin 139 is perpendicularly connected to the surface of the second base plate 139, and a gap is formed between the other end of the second fin 139 and the inner wall of the housing 110.

[0055] like Figure 9As shown, the heat transfer device 100 further comprises an AC / DC converter 161 for converting AC power into DC power; the output of the AC / DC converter 161 comprises a positive terminal (not shown) and a negative terminal (not shown); the two temperature-variable surfaces 135a, 135b of the PN junction semiconductor block 134 are respectively electrically connected to the positive terminal and the negative terminal through a multi-mode switch 162; a controller 123 is electrically connected to the AC power, and the electric fan 120 is electrically connected to the controller 123.

[0056] In the present embodiment, the multi-mode switch is a switch circuit module commonly known in the art, in different modes, the positive terminal and the negative terminal can be interchangeably connected to objects. In the cooling mode, the negative terminal is connected to the first temperature-variable surface 135a, and the positive terminal is connected to the second temperature-variable surface 135b; in the heating mode, the positive terminal is connected to the first temperature-variable surface 135a, and the negative terminal is connected to the second temperature-variable surface 135b.

[0057] In the present embodiment, in the cooling mode, a first DC power is supplied to the PN junction semiconductor block 134, the first temperature-variable surface 135a is a cooling surface, and the temperature of the first heat dissipation part 131 is lower than the room temperature; the second temperature-variable surface 135b is a heating surface, and the temperature of the second heat dissipation part 132 is higher than the room temperature. The heat transfer device 100 is usually placed on a table in the use state, the first air outlet surface 142 faces the user side, and the first through hole 115 faces the user's face.

[0058] In the cooling mode, when the electric fan 120 is started, the air outside the shell 110 is guided into the shell 110 by the electric fan 120 through the ventilation end surface 112 to form an air flow, a part of the air flow passes through the first heat dissipation part 131 and the first passage 113, and is discharged to the outside of the shell 110 through the first through hole 115, and this part of the air flow is cooled after heat exchange with the first heat dissipation part 131, forming cold air discharge, so that the user sitting in front of the table can enjoy the cold air with a temperature lower than the room temperature.

[0059] At the same time, another part of the air flow passes through the second heat dissipation part 132 and the second passage 114, and is discharged to the outside of the shell 110 through the second through hole 116, and this part of the air flow is heated after heat exchange with the second heat dissipation part 132, forming hot air discharge, and since the second air outlet surface 143 faces away from the user side, the user's body feeling is hardly affected.

[0060] Experimental data show that when the room temperature is 30℃, in the cooling mode, the temperature of the cold air discharged through the first through hole 115 is about 20~25℃, and the temperature of the hot air discharged through the second through hole 116 is about 35~40℃.

[0061] In the heating mode, a second direct current is supplied to the PN junction semiconductor block 134. When the voltage direction of the second direct current is opposite to that of the first direct current, the first temperature-changing surface 135a becomes a heating surface, and the temperature of the first heat dissipation portion 131 will be higher than the room temperature; the second temperature-changing surface 135b becomes a cooling surface, and the temperature of the second heat dissipation portion 132 will be lower than the room temperature.

[0062] In the heating mode, when the electric fan 120 is started, the air outside the shell 110 is introduced into the shell 110 by the electric fan 120 through the ventilation end surface 112 to form an airflow. Part of the airflow passes through the heated first heat dissipation part 131 and the first channel 113, and is discharged to the outside of the shell 110 from the first through hole 115. This part of the airflow is heated after heat exchange with the first heat dissipation part 131, forming hot air discharge, so that the user sitting at the table can enjoy hot air above room temperature.

[0063] Meanwhile, another portion of the airflow passes through the cooling second heat sink 132 and second channel 114, and is discharged out of the housing 110 through the second through hole 116. This portion of airflow is cooled after heat exchange with the second heat sink 132, forming cool air. Because the second air outlet surface 143 faces away from the user, the user's experience is minimal. Experimental data shows that when the room temperature is 15°C, the temperature of the cool air discharged from the second through hole 116 is approximately 5-10°C.

[0064] Experimental data show that when the room temperature is 15°C, in heating mode, the temperature of the hot air discharged from the first through hole 115 is about 20-25°C, and the temperature of the cold air discharged from the second through hole 116 is about 5-10°C.

[0065] like Figures 5-7 As shown, the semiconductor cooler 130 also includes a guide plate 144, one end of which is connected to the edge of the frame 133 facing the ventilation end surface 112, and the other end of the guide plate 144 extends toward the middle of the air outlet 122 of the electric fan 120, so that most of the air sucked into the shell by the electric fan 120 flows toward the first heat dissipation part 131, increasing the air capacity inside the first channel 113, the purpose of which is to increase the air pressure in the first channel 113, so that the wind force of the air discharged from the first through hole 115 to the outside of the shell 110 is stronger, thereby improving the user experience.

[0066] like Figure 4As shown, the heat transfer device 100 further comprises a strip-shaped partition plate 145, one end of the partition plate 145 is connected to the joint of the first heat dissipation part 131 and the second heat dissipation part 132, and the other end of the partition plate 145 extends and is connected to the sealing end face 111; the edges of the partition plate 145 are connected to the inner side wall of the shell 110, the first channel 113 and the second channel 114 are isolated by the partition plate 145, and the partition plate 145 is parallel to the first air outlet face 142 of the shell 110; the partition plate 145 is connected to the edges of the frame 133 of the semiconductor refrigerator 130 towards the sealing end face 111.

[0067] In some embodiments, in a cross section perpendicular to the extending direction of the shell 110, the ratio of the cross-sectional area of the second channel 114 to the cross-sectional area of the first channel 113 is 1-6, which is to ensure that the internal space of the first channel 113 is small enough, and the electric fan 120 blows more air into the first channel 113, so that the air pressure inside the first channel 13 is large enough to ensure that the air discharged from the first through hole 115 to the outside of the shell 110 is more easily blown to the user, and the user experience is better.

[0068] In some embodiments, in a cross section perpendicular to the extending direction of the shell 110, the cross section of the shell 110 includes but is not limited to a triangle, a rounded triangle, a trapezoid, a rounded trapezoid, a semicircle or a rectangle, preferably a triangle or a rounded triangle. Its purpose is to ensure that the shell 110 has two faces, namely the first air outlet face 142 and the second air outlet face 143, so that the directions of the air blown out of the first through hole 115 and the second through hole 116 are inconsistent, the air discharged from the first through hole 115 to the outside of the shell 110 is blown to the user, and the air discharged from the second through hole 116 to the outside of the shell 110 is blown away from the user. The first air outlet face 142 and the second air outlet face 143 cannot face the same direction, otherwise the cold air and the hot air will be blown out in the same direction at the same time, which cannot play a role in refrigeration or heating, and the experience is very poor.

[0069] As shown in FIG. 1, Figures 3-4 As shown, the heat transfer device 100 further comprises L-shaped baffles 146, which are arranged between the partition plate 145 and the first air outlet face 142 of the shell 110, each L-shaped baffle 146 and the partition plate 145, the first air outlet face 142 enclose an air duct 147, one end of the air duct 147 forms a first air port 148 towards the ventilation end face 112, and the other end of the air duct 147 forms a second air port 149 towards a first through hole 115.

[0070] As shown in FIG. 1, Figures 4-5 As shown, the heat transfer device 100 further comprises a fixing device 150 fixed to one end of the shell 100 close to the ventilation end face 112; the electric fan 120 is mounted in the fixing device 150.

[0071] In the application, for example, a first direct current is applied to the heat transfer device 100, the electric fan 120 is started, and the electric fan 120 can suck the air outside the shell 110 into the shell 110 through the third through hole 118. At this time, the Peltier effect of the PN junction semiconductor 130 is utilized, a direct current is applied to the PN junction semiconductor 130, the heat of the first temperature change surface 135a is transferred to the second temperature change surface 135b, the first temperature change surface 135a of the PN junction semiconductor 130 achieves the refrigeration effect, and the second temperature change surface 135b achieves the heat dissipation effect. Most of the air sucked by the electric fan 120 is guided to the first heat dissipation part 131 through the flow guide plate 144, and a small part of the air is guided to the second heat dissipation part 132. The air passing through the first heat dissipation part 131 forms cold air lower than the room temperature, the cold air flows into the first channel 113, and after the cold air enters the first channel 113, the cold air is transmitted to the vicinity of the first through hole 115 of the shell 110 through the L-shaped baffle 146 and is blown to the user through the first through hole 115. The air passing through the second heat dissipation part 132 absorbs the heat dissipated by the second temperature change surface 135b and is discharged to the outside of the shell 110 through the second through hole 116 on the shell 110.

[0072] A second direct current is applied to the heat transfer device 100, the electric fan 120 is started, and the electric fan 120 can suck the air outside the shell 110 into the shell 110 through the third through hole 118. At this time, the Peltier effect of the PN junction semiconductor 130 is utilized, a direct current is applied to the PN junction semiconductor 130, the heat of the second temperature change surface 135b is transferred to the first temperature change surface 135a, the first temperature change surface 135a of the PN junction semiconductor 130 achieves the heat dissipation effect, and the second temperature change surface 135b achieves the refrigeration effect. Most of the air sucked by the electric fan 120 is guided to the first heat dissipation part 131 through the flow guide plate 144, and a small part of the air is guided to the second heat dissipation part 132. The air passing through the first heat dissipation part 131 forms hot air higher than the room temperature, the hot air flows into the first channel 113, and after the hot air enters the first channel 113, the hot air is transmitted to the vicinity of the first through hole 115 of the shell 110 through the L-shaped baffle 146 and is blown to the user through the first through hole 115. The air passing through the second heat dissipation part 132 absorbs the heat dissipated by the second temperature change surface 135b and is discharged to the outside of the shell 110 through the second through hole 116 on the shell 110.

[0073] The application has the advantages that the heat transfer device is provided, and the working principle is to use the Peltier effect of the PN junction semiconductor, to apply direct current to the PN junction semiconductor so that the heat of the first temperature change surface is transferred to the second temperature change surface, the first temperature change surface of the semiconductor component achieves the refrigeration effect, and then the control circuit applies a reverse voltage to the PN junction semiconductor, so that the heat of the second temperature change surface of the PN junction semiconductor is transferred to the first temperature change surface, and the first temperature change surface of the semiconductor component achieves the heat dissipation effect, the product generates air flow through the fan and the motor, and then guides the air flow through the internal structure, respectively passes through the first heat dissipation part and the second heat dissipation part connected with the PN junction semiconductor, when the first temperature change surface of the PN junction semiconductor has the refrigeration effect, the air heat passing through the first heat dissipation part is absorbed by the first heat dissipation part to form cold air, the cold air blows to the user through the first through hole on the shell to reduce the ambient temperature of the user and improve the thermal comfort of the user, the air passing through the second heat dissipation part absorbs the heat released by the second heat dissipation part and is discharged through the second through hole, when the first temperature change surface of the PN junction semiconductor has the heat dissipation effect, the air heat passing through the second heat dissipation part is absorbed, and the heat is transferred to the first heat dissipation part through the PN junction semiconductor, the air passing through the first heat dissipation part absorbs the heat to form hot air, and then blows to the user through the first through hole on the shell to increase the ambient temperature of the user and improve the thermal comfort of the user, and the air passing through the second heat dissipation part absorbs the heat of the second heat dissipation part and is discharged through the second through hole.

[0074] The heat transfer device is described in detail above, and specific examples are applied to the principle and implementation mode of the application, and the above embodiment is only used to help understand the method and core idea of the application; meanwhile, for those skilled in the art, according to the idea of the application, the specific implementation mode and application range will be changed, and the above description should not be understood as the limitation of the application.

Claims

1. A heat transfer device characterized by, The heat transfer device comprises: a cylindrical shell, two ends of which are respectively provided with a sealing end face and a ventilation end face; a cavity in the shell forms a first channel and a second channel; a first through hole and a second through hole are provided on the side wall of the shell, the first through hole is connected to the first channel, and the second through hole is connected to the second channel; an electric fan arranged in the shell; the electric fan comprises an air inlet and an air outlet, and the air inlet is arranged opposite to the ventilation end face; and a semiconductor refrigerator arranged in the shell; the semiconductor refrigerator comprises a first heat dissipation part and a second heat dissipation part; one side of the first heat dissipation part is arranged opposite to the first channel, and the other side thereof is arranged opposite to the air outlet; one side of the second heat dissipation part is arranged opposite to the second channel, and the other side thereof is arranged opposite to the air outlet.

2. The heat transfer device of claim 1, wherein, The shell comprises a cylindrical body, which comprises a bottom surface, a first air outlet surface and a second air outlet surface; the first through hole penetrates the first air outlet surface; the second through hole penetrates the second air outlet surface and / or the bottom surface.

3. The heat transfer device according to claim 2, wherein the first air outlet surface and the second air outlet surface form an included angle of 30-120 degrees.

4. The heat transfer device of claim 2, wherein, The shell further comprises two pads protruding from the bottom surface of the cylindrical body, and the two pads are respectively close to the two ends of the cylindrical body.

5. The heat transfer device according to claim 2, wherein the first through hole penetrates one end of the first air outlet surface away from the bottom surface.

6. The heat transfer device according to claim 1, wherein the first through hole is a strip-shaped hole, and the extension direction of the first through hole is consistent with the extension direction of the shell; and / or the second through hole is a strip-shaped hole, and the extension direction of the second through hole is consistent with the extension direction of the shell.

7. The heat transfer device according to claim 1, wherein when the number of the first through holes is more than two, the more than two first through holes are arranged on the same straight line.

8. The heat transfer device of claim 1, wherein, The shell comprises: a cylindrical body; and a third through hole penetrating the ventilation end face and / or a part of the cylindrical body close to the ventilation end face.

9. The heat transfer device of claim 1, wherein, The semiconductor refrigerator comprises a frame fixedly connected to the inner side wall of the shell; the first heat dissipation part and the second heat dissipation part are respectively mounted to the two sides of the frame; and a PN junction semiconductor block mounted in the frame; the PN junction semiconductor block comprises two temperature changing surfaces, i.e., a first temperature changing surface and a second temperature changing surface, which are away from each other.

10. The heat transfer device of claim 9, wherein, The first heat dissipation part comprises: a first substrate attached to the first temperature changing surface of the PN junction semiconductor block; and more than two first fins arranged at intervals, which are vertically connected to the surface of the first substrate.

11. The heat transfer device of claim 9, wherein, The second heat dissipation part comprises: a second substrate attached to the second temperature changing surface of the PN junction semiconductor block; and more than two second fins arranged at intervals, which are vertically connected to the surface of the second substrate.

12. The heat transfer device according to claim 9, wherein the materials of the two temperature changing surfaces of the PN junction semiconductor block are respectively P-type semiconductor material and N-type semiconductor material. The first heat dissipation part and the second heat dissipation part are made of heat conductive material.

13. The heat transfer device of claim 9, wherein, Further comprising An AC-DC converter is configured to convert AC power into DC power; the output of the AC-DC converter includes a positive terminal and a negative terminal; two temperature-variable surfaces of the PN junction semiconductor block are respectively electrically connected to the positive terminal and the negative terminal through multi-mode switches; and A controller is electrically connected to the AC power, and the electric fan is electrically connected to the controller.

14. The heat transfer device of claim 9, wherein, The semiconductor refrigerator further comprises A flow guide plate is connected to an edge of the frame at one end of the ventilation end face and extends to the middle of the air outlet of the fan at the other end.

15. The heat transfer device of claim 1, wherein, Further comprising A strip-shaped partition plate is connected to the junction of the first heat dissipation part and the second heat dissipation part at one end and extends to the sealing end face at the other end; the edge of the partition plate is connected to the inner side wall of the shell, and the first channel and the second channel are separated by the partition plate.

16. The heat transfer device of claim 15, wherein The partition plate is parallel to the first air outlet face of the shell; The partition plate is connected to the edge of the frame of the semiconductor refrigerator at one end of the sealing end face.

17. The heat transfer device of claim 1, wherein The cross section is perpendicular to the extension direction of the shell; The ratio of the cross-sectional area of the second channel to the cross-sectional area of the first channel is 1-6; and / or The cross section of the shell includes but is not limited to a triangle, a rounded triangle, a trapezoid, a rounded trapezoid, a semicircle, or a rectangle.

18. The heat transfer device of claim 1, wherein, Further comprising L-shaped baffles are arranged between the partition plate and the first air outlet face of the shell, and each L-shaped baffle, the partition plate, and the first air outlet face form an air duct, one end of the air duct forms a first air outlet facing the ventilation end face, and the other end forms a second air outlet facing a first through hole.

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