On-board host based on efficient heat dissipation of SOC chip

Abstract

The utility model discloses a vehicle-mounted host computer based on efficient heat dissipation of an SOC chip, which comprises a bottom shell, a mainboard, a chip, a chip heat conduction part, a chip heat dissipation part and a middle frame assembly, and is characterized in that the mainboard is arranged on the bottom shell; the chip is arranged on the main board; the chip heat conduction part is attached to the chip; the chip heat dissipation part abuts against the chip heat conduction part. The middle frame assembly is detachably arranged on the bottom shell, and the chip heat dissipation component is arranged in the middle frame assembly. Therefore, the chip and the heat dissipation component are installed in a limiting and abutting mode, the chip is installed in a limiting mode and fixed in an abutting mode, meanwhile, the effects of rapid heat conduction and heat dissipation of the chip are achieved, cost is reduced, and market competitiveness is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of automobile electron, especially a vehicle host based on SOC chip high -efficient heat dissipation. BACKGROUND

[0002] At present, the cornerstone of the automobile information entertainment system is SoC (System on Chip), as the main processor and core component of the vehicle, the continuous progress and innovation of SoC bring unprecedented rich features and excellent performance for the vehicle information entertainment system and the Internet of vehicles. However, with the continuous enhancement of the function of the vehicle information entertainment system, the heat generated by SoC during operation also rises sharply, therefore, it is crucial to implement efficient heat dissipation strategy for the thermal management of SoC. This is not only the key to ensure that the vehicle host can run safely in a high temperature environment (close to 80 DEG C), avoiding exceeding the maximum junction temperature limit of SoC, but also the basis for ensuring the overall stability of the system.

[0003] Under the existing technical framework, when the vehicle host is designed as a compact single-DIN machine (the size is 17815350mm), the space of the SoC heat dissipation fin is extremely limited, and its weight is often limited to about 100g, which greatly restricts the heat dissipation performance. When the heat power of the heat source increases, the existing heat dissipation structure is difficult to quickly and effectively dissipate heat.

[0004] Further, with the enrichment of the function of the vehicle host and the improvement of the working frequency, the heat dissipation also rises, and many chips urgently need to design more efficient heat dissipation structure to reduce the working junction temperature and ensure that it is maintained below the allowable safety level. The previous design tends to be conservative and excessive, that is, by increasing the size and heat dissipation area of the heat sink to pursue the maximum cooling effect, but this approach not only increases the overall cost and weight of the product, but also leads to waste of resources and rise in cost, weakening the market competitiveness of the product. UTILITY MODEL CONTENTS

[0005] The utility model aims at least to solve one of the technical problems in the related art to some extent.

[0006] Therefore, the purpose of the utility model is to provide a vehicle host based on SOC chip high -efficient heat dissipation, which adopts the mode of limiting and abutting installation of the chip and the heat dissipation component, and the chip is limited and installed and abutted and fixed at the same time, which plays the effect of rapid heat conduction and heat dissipation of the chip, thereby reducing the cost and improving the market competitiveness.

[0007] The utility model proposes a kind of vehicle-mounted host based on SOC chip high efficiency heat dissipation to achieve the above-mentioned purpose, including bottom shell, mainboard, chip, chip heat conduction component, chip heat dissipation component and middle frame assembly, wherein, the mainboard is arranged on the bottom shell;Chip is arranged on the mainboard;Chip heat conduction component is attached on the chip;Chip heat dissipation component is attached on the chip heat conduction component;The middle frame assembly is detachably arranged on the bottom shell, and the chip heat dissipation component is arranged in the middle frame assembly.

[0008] The utility model discloses a kind of vehicle-mounted host based on SOC chip high efficiency heat dissipation, chip and heat dissipation component limit attachment installation mode, chip is limited installation and is fixed while playing the effect of quick heat conduction and heat dissipation to chip, to reduce cost and improve market competitiveness further.

[0009] In addition, the vehicle-mounted host based on SOC chip high efficiency heat dissipation proposed according to the above application can also have the following additional technical features:

[0010] Specifically, the middle frame assembly includes a middle frame housing, heat dissipation fins, and heat dissipation holes. The middle frame housing is detachably arranged on the bottom shell. The heat dissipation fins are arranged on the middle frame housing. The heat dissipation holes are in multiple groups, and each group of heat dissipation holes is arranged on the middle frame housing.

[0011] Specifically, the chip heat conduction component is a chip heat conduction silica gel sheet, and the bottom wall of the chip heat conduction component is attached to the top wall of the chip.

[0012] Specifically, the chip heat dissipation component is an aluminum plate, and the chip heat dissipation component is a U-shaped plate. The bottom wall of the chip heat dissipation component is attached to the top wall of the chip heat conduction component.

[0013] Specifically, the bottom shell and the mainboard each have a matching threaded hole. The bottom shell and the middle frame housing each have a matching threaded hole. The middle frame housing and the chip heat dissipation component each have a matching threaded hole, and the threaded holes have the same diameter.

[0014] Additional aspects and advantages of the utility model will be partially presented in the following description, some will become apparent from the following description, or be understood through the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0015] The above and / or additional aspects and advantages of the utility model will become apparent and more readily understood from the following description, taken in conjunction with the accompanying drawings, in which:

[0016] Figure 1 The utility model structure schematic diagram is shown in the following figure:

[0017] Figure 2The utility model discloses a middle frame assembly structure schematic diagram.

[0018] As shown in the figure: 10, bottom shell, 20, mainboard, 30, chip, 40, chip heat conduction part, 50, chip heat dissipation part, 60, middle frame assembly, 601, middle frame shell, 602, heat dissipation fin, 603, heat dissipation hole. DETAILED DESCRIPTION

[0019] The embodiments of the utility model are described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the utility model and cannot be understood as limiting the utility model. On the contrary, the embodiments of the utility model include all changes, modifications and equivalents falling within the spirit and scope of the appended claims.

[0020] The vehicle-mounted host of the utility model embodiment based on SOC chip high -efficient heat dissipation is described below in combination with the drawings.

[0021] As Figures 1-2 shown, the utility model embodiment based on SOC chip high -efficient heat dissipation's vehicle-mounted host, including bottom shell 10, mainboard 20, chip 30, chip heat conduction part 40, chip heat dissipation part 50 and middle frame assembly 60.

[0022] Among them, mainboard 20 sets up on bottom shell 10, chip 30 sets up on mainboard 20, chip heat conduction part 40 is bonded on chip 30. Chip heat dissipation part 50 is bonded on chip heat conduction part 40, and middle frame assembly 60 is detachably arranged on bottom shell 10, and chip heat dissipation part 50 is arranged in middle frame assembly 60.

[0023] It should be noted that the bottom shell 10 is made of copper shell, the mainboard 20 is a PCB circuit board, and the positioning groove for mounting the chip 30 is arranged on the mainboard 20. The chip 30 is limitedly installed in the positioning groove on the mainboard 20. Then the chip heat conduction part 40 is bonded on the top wall of the chip 30 through the heat-conducting glue. Finally, the chip heat dissipation part 50 is installed on the middle frame assembly 60. When the middle frame assembly 60 is installed on the bottom shell 10, the chip heat dissipation part 50 is bonded on the top wall of the chip heat conduction part 40, thereby reinforcing the chip 30 and achieving heat conduction and dissipation.

[0024] In an embodiment of the utility model, as Figure 2 shown, the middle frame assembly 60 includes a middle frame shell 601, heat dissipation fins 602, and heat dissipation holes 603.

[0025] The middle frame shell 601 is detachably arranged on the bottom shell 10, the heat dissipation fins 602 are arranged on the middle frame shell 601, and the heat dissipation holes 603 are in multiple groups and are arranged on the middle frame shell 601.

[0026] It should be noted that the heat dissipation fins 602 and the middle frame shell 601 are integrally formed, and the middle frame shell 601 is provided with an embedded groove, the embedded groove increases the contact area with air, and cooperates with the heat dissipation fins 602 and the multiple groups of uniformly distributed heat dissipation holes 603 to effectively dissipate heat for the vehicle-mounted host.

[0027] In an embodiment of the utility model, as shown in Figure 1 The chip heat conduction component 40 is a chip heat conduction silica gel sheet, and the bottom wall of the chip heat conduction component 40 is attached to the top wall of the chip 30.

[0028] It should be noted that the chip heat conduction component 40 is a silica gel sheet prepared from heat-conducting silica gel, and the thickness of the chip heat conduction component 40 is set according to test data and actual application scenarios.

[0029] In an embodiment of the utility model, as shown in Figure 1 The chip heat dissipation component 50 is an aluminum plate, the chip heat dissipation component 50 is a U-shaped plate, and the bottom wall of the chip heat dissipation component 50 is attached to the top wall of the chip heat conduction component 40.

[0030] It should be noted that the chip heat dissipation component 50 is a U-shaped plate with a flush bottom, and the bottom wall of the chip heat dissipation component 50 is seamlessly attached to the chip heat conduction component 40, which effectively achieves the purpose of rapid heat conduction and dissipation when the chip 30 is running.

[0031] Further, in order to better enhance the heat dissipation effect and reduce the cost, the length, height and thickness of the chip heat dissipation component 50 are respectively set through test data and actual application scenarios.

[0032] In an embodiment of the utility model, as shown in Figure 1 The bottom shell 10 and the main board 20 are respectively provided with matching threaded holes, the bottom shell 10 and the middle frame shell 601 are respectively provided with matching threaded holes, the middle frame shell 601 and the chip heat dissipation component 50 are respectively provided with matching threaded holes, and the threaded holes have the same hole diameter.

[0033] It should be noted that the threaded holes described in this embodiment are in multiple groups, and the vehicle-mounted host is assembled and fixed through screws matched with the threaded holes.

[0034] Specifically, the steps for installing the chip 30 in the vehicle host are as follows: the bottom shell 10 is a copper shell, the mainboard 20 is a PCB circuit board, and a positioning groove for installing the chip 30 is provided on the mainboard 20. The chip 30 is then limitedly installed in the positioning groove on the mainboard 20. The chip heat conduction component 40 is then attached to the top wall of the chip 30 using thermal adhesive. Finally, the chip heat dissipation component 50 is installed on the middle frame assembly 60. When the middle frame assembly 60 is installed on the bottom shell 10, the chip heat dissipation component 50 is abutted against the top wall of the chip heat conduction component 40, thereby strengthening the chip 30 while conducting and dissipating heat from the operating chip 30. The heat dissipation fins 602 and the middle frame shell 601 are integrally formed, and an embedded groove is provided on the middle frame shell 601. The embedded groove increases the contact area with the air. In combination with the heat dissipation fins 602 and multiple groups of evenly distributed heat dissipation holes 603, it effectively dissipates heat from the vehicle host.

[0035] In summary, the vehicle-mounted host based on the SOC chip with efficient heat dissipation in the embodiment of the utility model adopts the method of limiting and abutting the chip and the heat dissipation component to install the chip in a limited manner, and fix the chip in a fixed manner, while achieving the effect of rapid heat conduction and heat dissipation of the chip, thereby reducing costs and improving market competitiveness.

[0036] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present invention. Ordinary technicians in this field can change, modify, replace and deform the above embodiments within the scope of the present invention.

Claims

1. A vehicle-mounted host based on efficient heat dissipation of an SOC chip, characterized in that, Including bottom shell (10), mainboard (20), chip (30), chip heat conduction component (40), chip heat dissipation component (50) and middle frame assembly (60), wherein, The mainboard (20) is arranged on the bottom shell (10); The chip (30) is arranged on the mainboard (20); The chip heat conduction component (40) is attached to the chip (30); The chip heat dissipation component (50) is attached to the chip heat conduction component (40); The middle frame assembly (60) is detachably arranged on the bottom shell (10), and the chip heat dissipation component (50) is arranged in the middle frame assembly (60).

2. The vehicle-mounted host based on the SOC chip high-efficiency heat dissipation according to claim 1, characterized in that, The middle frame assembly (60) comprises a middle frame shell (601), a heat dissipation fin (602) and a heat dissipation hole (603), wherein, The middle frame shell (601) is detachably arranged on the bottom shell (10); The heat dissipation fin (602) is arranged on the middle frame shell (601); The heat dissipation hole (603) is a plurality of groups, and the plurality of groups of heat dissipation holes (603) are arranged on the middle frame shell (601) respectively.

3. The vehicle-mounted host computer based on the SOC chip high-efficiency heat dissipation according to claim 1, characterized in that, The chip heat conduction component (40) is a chip heat conduction silica gel sheet, and the bottom wall of the chip heat conduction component (40) is attached to the top wall of the chip (30).

4. The vehicle-mounted host computer based on the SOC chip high-efficiency heat dissipation according to claim 1, characterized in that, The chip heat dissipation component (50) is an aluminum plate, the chip heat dissipation component (50) is a U-shaped plate, and the bottom wall of the chip heat dissipation component (50) is attached to the top wall of the chip heat conduction component (40).

5. The vehicle-mounted host computer based on the SOC chip high-efficiency heat dissipation according to claim 2, characterized in that, The bottom shell (10) and the mainboard (20) are respectively provided with matching threaded holes, the bottom shell (10) and the middle frame shell (601) are respectively provided with matching threaded holes, the middle frame shell (601) and the chip heat dissipation component (50) are respectively provided with matching threaded holes, and the threaded holes have the same diameter.

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