Fan-free embedded heat dissipation structure for computer

Abstract

The utility model relates to the technical field of heat dissipation of fan-free embedded computer hosts, and discloses a heat dissipation structure for a fan-free embedded computer. Comprising an industrial control host box, a heat dissipation cover connected to the upper surface of the industrial control host box through a fastener, a PCB in threaded connection with the interior of the industrial control host box, a CPU fixedly connected to the PCB and a heat dissipation block fixedly connected to the upper surface of the CPU in an attached mode, and the circulation space heat dissipation mechanism is used for expanding the heat dissipation range and can efficiently absorb and discharge heat generated by the CPU in multiple directions; the problem that heat is concentrated on the heat absorption part and cannot be dissipated in time can be solved, meanwhile, a heat transfer airflow loop can be formed at the heat concentration position through natural wind, and the heat dissipation enhancing auxiliary mechanism is used for improving the flexibility of the heat dissipation part. And meanwhile, the mechanism can diffuse the heat dissipation area, so that the heat dissipation range of the heat source can be further expanded.

Description

TECHNICAL FIELD

[0001] The utility model relates to a fanless embedded computer heat dissipation technical field, concretely is a heat dissipation structure for fanless embedded computer. BACKGROUND

[0002] Fanless embedded computer is a kind of computer type with significant advantages in design and performance, especially suitable for high temperature, high humidity, high dust and other harsh environments, fanless embedded computer is not dependent on traditional fan to heat dissipation computer system. It realizes the effective conduction and emission of heat by adopting advanced heat dissipation technology, such as high-efficiency heat dissipation sheet, heat pipe and the like, fanless design reduces the noise during operation, avoids the problem that dust blocks fan to cause poor heat dissipation, makes the whole machine more quiet, stable, and prolongs the service life of product. At the same time, this design also improves the reliability of system, because fan as a vulnerable component, its failure can cause system shutdown.

[0003] Because of the fanless reason, the heat dissipation capacity of this type of computer is poor, and the traditional stacked heat dissipation mode is difficult to better transfer heat from CPU, which is easy to cause CPU temperature accumulation and lead to CPU overload, and the traditional heat dissipation adopts solid direct contact and transfers heat to the case, which is easy to cause the heat conduction parts not to be fully attached and reduce the heat dissipation effect. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a heat dissipation structure for fanless embedded computer to solve the problems raised in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical scheme: a heat dissipation structure for fanless embedded computer, including industrial computer box, the heat dissipation cover that industrial computer box upper surface utilizes fastener connection, the PCB board that industrial computer box interior screw connection, the CPU that PCB board is fixedly connected, the heat dissipation block that CPU upper surface is fixedly connected, the copper pipe that heat dissipation block interior fixedly connected and the high-conductivity heat dissipation sheet that heat dissipation block upper surface fixedly connected, the circulating space heat dissipation mechanism is arranged in the industrial computer box, and the reinforcing heat dissipation auxiliary mechanism is arranged on the upper side of circulating space heat dissipation mechanism.

[0006] Preferably, the circulating space heat dissipation mechanism includes spiral disc pipe, the spiral disc pipe is fixedly connected in the industrial computer box, airflow passageways are arranged on the both sides of the spiral disc pipe, the high-conductivity heat dissipation sheet is fixedly connected with heat dissipation fins on the upper surface, the heat dissipation fins are fixedly connected with communication pipes inside, the airflow connector is fixedly connected inside the industrial computer box, the airflow connector is communicated with the spiral disc pipe, the air guide pipe is arranged in communication with one side of the spiral disc pipe and the communication pipe, and the circulating pipe is arranged in communication with the other side of the spiral disc pipe and the communication pipe.

[0007] Preferably, a slot with a square cross section is formed in the inner side of the industrial host computer box, and a plurality of columnar openings are evenly distributed on both sides of the spiral coil pipe.

[0008] Preferably, the communication pipes are sequentially connected to each other, and the air flow circuit is formed by the air guide pipes and the circulation pipes on both sides of the spiral coil pipe and is connected to the outside of the industrial host computer box through the air flow openings on both sides of the spiral coil pipe.

[0009] Preferably, the enhanced heat dissipation auxiliary mechanism comprises a hanging block, the hanging block is slidingly connected to the inner wall of the heat dissipation cover, a sliding box is fixedly connected to the outer wall of the hanging block, a diffusion box is fixedly connected to the inner side of the upper side of the heat dissipation cover, a sliding block is fixedly connected to one side of the sliding box, a fluid box is slidingly connected to the outer wall of the sliding block, the fluid box is sealingly and slidingly connected to the sliding box, flow guide openings are formed in the upper sides of the sliding box on both sides, a hanging rod is fixedly connected to the upper side of the heat dissipation cover, the hanging rod extends to the inside of the fluid box through the diffusion box and the upper side of the sliding box, and an elastic member is fixedly connected between the bottom of the hanging rod and the upper surface of the fluid box.

[0010] Preferably, a square opening is formed in the middle of the lower side of the diffusion box, and slots are formed in the middle of both sides of the diffusion box, and the slots have the same size as the flow guide openings.

[0011] Preferably, sliding openings are formed in the heat dissipation cover and the fluid box.

[0012] Compared with the prior art, the heat dissipation structure for the fanless embedded computer has the following beneficial effects:

[0013] 1. The circulating space heat dissipation mechanism is used for expanding the heat dissipation range, can efficiently absorb and discharge the heat generated by the CPU in multiple directions, can avoid the problem that the heat is concentrated on the heat absorbing member and cannot be dissipated in time, and can form a heat transfer air flow circuit at the heat concentration position by using natural wind, can discharge the heat by using the natural wind, and the mechanism is isolated from the inside of the case to avoid the influence of dust and moisture.

[0014] 2. The enhanced heat dissipation auxiliary mechanism is used for increasing the flexibility of the heat dissipation member, can avoid the problem that the heat dissipation member is loose and cannot be closely attached to the heat conducting member to reduce the heat dissipation effect, and can diffuse the heat dissipation area, so that the heat source can further expand the heat dissipation range, thereby ensuring that the heat is quickly consumed, preventing heat accumulation, and ensuring the normal operation of the host computer. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0016] Figure 1 The structure diagram of the present application is shown in the figure.

[0017] Figure 2 The structure diagram of the airflow passage in the present application is shown in the figure.

[0018] Figure 3 The structure diagram of the CPU in the present application is shown in the figure.

[0019] Figure 4 The structure diagram of the diffusion box in the present application is shown in the figure.

[0020] Figure 5 The structure diagram of the elastic member in the present application is shown in the figure.

[0021] In the figure: 1, industrial control host box; 2, heat dissipation cover; 3, PCB board; 4, CPU; 5, heat dissipation block; 6, copper pipe; 7, high-conductivity heat dissipation fin; 8, circulating space heat dissipation mechanism; 801, screw disc pipe; 802, airflow passage; 803, heat dissipation fin; 804, communication pipe; 805, airflow connector; 806, air guide pipe; 807, circulating pipe; 9, enhanced heat dissipation auxiliary mechanism; 901, hanging block; 902, sliding box; 903, diffusion box; 904, sliding block; 905, fluid tank; 906, flow guide; 907, hanging rod; 908, elastic member. DETAILED DESCRIPTION

[0022] The technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0023] In the utility model, unless another definite provision and limitation, the terms "fixed connection", "connected", "connection", "fixed" and the like terms should be broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through the intermediate medium, can be the communication or the interaction relationship of two elements inside two elements.For the ordinary skilled in the art, the above terms can be understood according to the specific meaning of the utility model.

[0024] Embodiment one:

[0025] Please refer to Figures 1-5 The utility model provides a technical scheme: a heat dissipation structure for fanless embedded computer, including industrial control host computer box 1, the heat dissipation cover 2 of fastener connection on the upper surface of industrial control host computer box 1, the PCB board 3 of screw connection in industrial control host computer box 1, the fixed connection of CPU 4 on PCB board 3, the fixed connection of heat dissipation block 5 that CPU 4 upper surface is pasted, copper pipe 6 and the high lead heat sink 7 of fixed connection on the upper surface of heat dissipation block 5 are fixedly connected in heat dissipation block 5, and the circulating space heat dissipation mechanism 8 is provided in industrial control host computer box 1, and the reinforcing heat dissipation auxiliary mechanism 9 is provided on the upside of circulating space heat dissipation mechanism 8.

[0026] Further, the circulating space heat dissipation mechanism 8 includes spiral disc pipe 801, and the spiral disc pipe 801 is fixedly connected in the inside of industrial control host computer box 1, and the airflow pass 802 is provided on both sides of the spiral disc pipe 801, and the heat dissipation fin 803 is fixedly connected on the upper surface of the high lead heat sink 7, and the communication pipe 804 is fixedly connected in the heat dissipation fin 803, and the airflow connector 805 is fixedly connected in the inside of industrial control host computer box 1, and the airflow connector 805 is communicated with the spiral disc pipe 801, and the air guide pipe 806 is communicated with one side of the spiral disc pipe 801 and the communication pipe 804, and the circulating pipe 807 is communicated with the other side of the spiral disc pipe 801 and the communication pipe 804.

[0027] Further, the slot with square cross section of spiral line is formed in the inside of industrial control host computer box 1, and the cylindrical pass is evenly distributed on both sides of the spiral disc pipe 801.

[0028] Further, the communication pipes 804 are sequentially connected with each other, the two sides of the screw disc pipe 801 form an air flow loop through the air guide pipe 806 and the circulation pipe 807, and the air flow loop is connected with the outside of the industrial host box 1 through the air flow ports 802 on the two sides of the screw disc pipe 801. The screw disc pipe 801 is inlaid in the inside of the industrial host box 1, and a large number of air flow ports 802 are arranged on the outside of the screw disc pipe 801 for exchanging heat with external air flow. Two ports are arranged on the inside of the screw disc pipe 801 for connecting the air guide pipe 806 and the circulation pipe 807, and the air guide pipe 806 and the circulation pipe 807 are connected with the communication pipe 804. At the same time, the heat transferred by the high-conductivity heat dissipation fin 7 is absorbed by the heat dissipation fin 803, and the heat is transferred to the inside of the communication pipe 804 to form air flow heat conversion. The heat dissipation area is expanded to the area close to the two sides of the industrial host box 1. The heat in the screw disc pipe 801 is discharged through the air flow ports 802 and the heat dissipation cover 2, so that the heat conduction is more thorough.

[0029] Embodiment two:

[0030] Please refer to Figures 1-5 , and further combined with embodiment one, it is further obtained that the heat dissipation auxiliary mechanism 9 comprises a hanging block 901 which is slidingly connected to the inner wall of the heat dissipation cover 2. The outer wall of the hanging block 901 is fixedly connected with a sliding box 902. The upper side of the heat dissipation cover 2 is fixedly connected with a diffusion box 903. One side of the sliding box 902 is fixedly connected with a sliding block 904. The outer wall of the sliding block 904 is slidingly connected with a fluid box 905. The fluid box 905 is sealingly and slidingly connected with the sliding box 902. The two sides of the upper end of the sliding box 902 are provided with flow guide ports 906. The upper side of the heat dissipation cover 2 is fixedly connected with a hanging rod 907. The hanging rod 907 extends through the diffusion box 903 and the upper side of the sliding box 902 and extends to the inside of the fluid box 905. The bottom of the hanging rod 907 and the upper surface of the fluid box 905 are fixedly connected with an elastic element 908. The fluid box 905 is in a suspended state. It is not necessary to disassemble the heat dissipation assembly connected with the heat dissipation cover 2 every time the industrial host box 1 is opened. The mechanism can still be in close contact with the heat dissipation element at all times and can directly absorb the heat of the heat dissipation element. The liquid in the fluid box 905 is a heat-expandable liquid. When the liquid in the fluid box 905 expands due to heat, the sliding box 902 is lifted, so that the liquid can enter the inside of the diffusion box 903, thereby increasing the contact area of the liquid with the outside, further dispersing the heat, and avoiding the defect that the existing stacked heat dissipation structure cannot be in close contact with the heat dissipation cover 2 at all times to increase the effect of conducting heat.

[0031] Further, a square opening is arranged on the lower side of the diffusion box 903, and grooves are arranged on the two sides of the middle of the diffusion box 903. The grooves are the same size as the flow guide ports 906.

[0032] Further, the heat dissipation cover 2 and the fluid box 905 are provided with sliding ports.

[0033] In actual operation process, when the device is used, the user can put the industrial control host box 1 to the ventilated place to increase the cooling effect, and the inside of the industrial control host box 1 is sealed and will not affect the function of the industrial control host box 1, the airflow passes through the screw coil pipe 801 to the inside of the industrial control host box 1 through the airflow port 802, the airflow takes away the heat of the CPU 4 in the communicating pipe 804 and flows out from the other side of the airflow port 802, the user can put the thermal expansion liquid in the fluid tank 905, after the liquid thermal expansion, the excess liquid is sent into the diffusion tank 903 through the sliding box 902, and the heat conduction effect is increased.

[0034] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another, without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

Claims

1. A heat dissipation structure for a fanless embedded computer, comprising an industrial control mainframe box (1), a heat dissipation cover (2) connected to the upper surface of the industrial control mainframe box (1) by fasteners, a PCB board (3) threadedly connected to the internal of the industrial control mainframe box (1), a CPU (4) fixedly connected to the PCB board (3), a heat dissipation block (5) fixedly connected to the upper surface of the CPU (4), a copper tube (6) fixedly connected to the internal of the heat dissipation block (5), and a high-conductivity heat dissipation sheet (7) fixedly connected to the upper surface of the heat dissipation block (5), characterized in that: The inside of the industrial host box (1) is provided with a circulating space heat dissipation mechanism (8), and the upper side of the circulating space heat dissipation mechanism (8) is provided with an enhanced heat dissipation auxiliary mechanism (9).

2. The heat dissipation structure for fanless embedded computer according to claim 1, wherein: The circulating space heat dissipation mechanism (8) comprises a spiral disc pipeline (801), which is fixedly connected inside the industrial host box (1). The two sides of the spiral disc pipeline (801) are provided with air flow ports (802). The upper surface of the high-conductivity heat dissipation fin (7) is fixedly connected with a heat dissipation fin (803). The inside of the heat dissipation fin (803) is fixedly connected with a communication pipe (804). The inside of the industrial host box (1) is fixedly connected with an air flow connector (805). The air flow connector (805) is in communication with the spiral disc pipeline (801). The spiral disc pipeline (801) and the communication pipe (804) are in communication with a gas guide pipe (806) on one side. The spiral disc pipeline (801) and the communication pipe (804) are in communication with a circulating pipe (807) on the other side.

3. The heat dissipation structure for fanless embedded computer according to claim 2, wherein: The inside of the industrial host box (1) is provided with a slot with a square cross section, and the slot is provided with a cylindrical port which is uniformly distributed on the two sides of the spiral disc pipeline (801).

4. The heat dissipation structure for fanless embedded computer according to claim 2, wherein: The communication pipes (804) are sequentially connected with each other. The two sides of the spiral disc pipeline (801) form an air flow loop through the gas guide pipe (806) and the circulating pipe (807) and are in communication with the outside of the industrial host box (1) through the air flow ports (802) on the two sides of the spiral disc pipeline (801).

5. The heat dissipation structure for fanless embedded computer according to claim 1, wherein: The enhanced heat dissipation auxiliary mechanism (9) comprises a hanging block (901), which is slidingly connected to the inner wall of the heat dissipation cover (2). The outer wall of the hanging block (901) is fixedly connected with a sliding box (902). The upper inside of the heat dissipation cover (2) is fixedly connected with a diffusion box (903). One side of the sliding box (902) is fixedly connected with a sliding block (904). The outer wall of the sliding block (904) is slidingly connected with a fluid box (905). The fluid box (905) is sealingly slidingly connected with the sliding box (902). The two sides of the upper end of the sliding box (902) are provided with flow guide ports (906). The upper side of the heat dissipation cover (2) is fixedly connected with a hanging rod (907). The hanging rod (907) extends through the diffusion box (903) and the upper side of the sliding box (902) to the inside of the fluid box (905). The bottom of the hanging rod (907) and the upper surface of the fluid box (905) are fixedly connected with an elastic member (908).

6. The heat dissipation structure for fanless embedded computer according to claim 5, wherein: The lower middle of the diffusion box (903) is provided with a square opening. The two sides of the middle of the diffusion box (903) are provided with slots, and the size of the slots is the same as that of the flow guide ports (906).

7. The heat dissipation structure for fanless embedded computer according to claim 5, wherein: The heat dissipation cover (2) and the fluid box (905) are provided with sliding ports inside.

Images