Computer hardware cooling device

Abstract

The utility model discloses a computer hardware cooling device, which belongs to the technical field of cooling devices and comprises a shell, a temperature sensor is mounted at the top end in the shell, a semiconductor cooler is mounted on the inner wall of the left side of the shell, and a radiator is mounted on the left side of the semiconductor cooler. And an air outlet pipe is fixedly arranged between the two semiconductor coolers and communicates with the interior of the shell, a second cooling fan is installed in the air outlet pipe, an air inlet pipe communicating with the shell is fixedly arranged on the right side of the shell, and a first cooling fan is installed in the air inlet pipe. Through the structural design of the air outlet pipe, the air inlet pipe, the heat dissipation opening, the dustproof net, the first heat dissipation fan, the temperature sensor, the semiconductor cooler and the second heat dissipation fan, the semiconductor cooler can be started to generate cold air to quickly reduce the temperature in the shell, so that the quick cooling effect is achieved, and the heat dissipation effect is further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to cooling device technical field, specifically to a computer hardware cooling device. BACKGROUND

[0002] Electronic computer commonly known as computer is a kind of modern high-speed computing electronic computer, can carry out numerical calculation, logic calculation, has storage memory function, can be according to program operation, automatically, high-speed process mass data, computer is mainly composed of four parts, display, host computer, mouse and keyboard, the hardware of computer is usually installed in the inside of host computer case, and the mainboard, processor, processor cooling fan, display card, power supply, memory stick and hard disk are installed in the host computer case.

[0003] Through the retrieval, the patent announcement No.CN212181397U of China discloses a kind of computer hardware cooling device.The utility model discloses a plurality of suction fans a are installed on the top of the case body, it is convenient to suction fan a rotates and extracts the hot air accumulated in the top of the case body, accelerates the heat dissipation efficiency of the hardware in the case, improves the heat dissipation effect of the hardware in the case, in addition, fan control button on front panel can also control the rotation of suction fan a and suction fan b, it is convenient to close suction fan a and suction fan b when not needing heat dissipation, reduce the power of host computer;In the utility model, fixed pipe is installed on the inner bottom of the case body, and the opening end of the fixed pipe is installed suction fan b, it is convenient to suck the air outside the case body into the inside of the case body, then uniformly conveyed to the inside of the case body, it is convenient to uniformly heat the hardware in the case body, improve the heat dissipation effect of the hardware in the case body.

[0004] But the above design still has some shortcomings, although the above design can realize the cooling of computer hardware, when the temperature of outside air is higher, the heat dissipation effect is insufficient by air flow, it is easy to appear the situation that the operation of computer is affected because of not timely heat dissipation, and the use effect is poor.

[0005] The above information disclosed in the background art is only used to increase the understanding of the background art of the present application, and should not be regarded as recognizing or implying in any form that the information constitutes prior art known to those skilled in the art. UTILITY MODEL CONTENT

[0006] The utility model aims at providing a kind of computer hardware cooling device to solve the problems raised in the above background art.

[0007] To achieve the above object, the utility model provides the following technical scheme: A computer hardware cooling device, including the casing, the inside top of casing is installed with temperature sensor, the left side inner wall of casing is installed with semiconductor refrigerator, the left side of semiconductor refrigerator is installed with radiator, two semiconductor refrigerators are fixedly arranged with the air outlet pipe, and the air outlet pipe is connected with the inside of casing, the inside of air outlet pipe is installed with second radiating fan, the right side of casing is fixedly arranged with the air inlet pipe which is connected, the inside of air inlet pipe is installed with first radiating fan.

[0008] As a further scheme of the utility model: The air outlet pipe and the air inlet pipe are provided with threaded grooves at the pipe openings, and the threaded grooves are threadedly connected with threaded covers.

[0009] As a further scheme of the utility model: The surface of the threaded cover is provided with a heat dissipation opening, and the heat dissipation opening is fixedly connected with a dust screen.

[0010] As a further scheme of the utility model: The four corners of the bottom of the casing are fixedly connected with mounting blocks, and the lower surface of the mounting block extends to the inside to form a threaded hole.

[0011] As a further scheme of the utility model: The inner wall of the threaded hole is threadedly connected with a threaded column, and the bottom of the threaded column is fixedly connected with an anti-skid pad.

[0012] The utility model has the advantages of:

[0013] (1) The structure design of the air outlet pipe, the air inlet pipe, the heat dissipation opening, the dust screen, the first radiating fan, the temperature sensor, the semiconductor refrigerator and the second radiating fan can start the semiconductor refrigerator to generate cold air to quickly reduce the temperature inside the casing, thereby achieving the effect of rapid cooling and improving the heat dissipation effect.

[0014] (2) The structure design of the mounting block, the anti-skid pad, the threaded hole and the threaded column can support the device through the anti-skid pad, and can rotate the anti-skid pad to drive the threaded column to rotate. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a three-dimensional partial schematic view of the overall structure of the utility model;

[0016] Figure 2It is a side view schematic diagram of the partial structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the local structure of the screw hole and the threaded column of the utility model;

[0018] Figure 4 This is a partial structural diagram of the first and second cooling fans of the present invention;

[0019] Figure 5 This is a partial structural diagram of the temperature sensor and semiconductor refrigerator mainly embodied in the present invention.

[0020] In the figure: 1. Shell; 2. Exhaust pipe; 3. Mounting block; 4. Inlet pipe; 5. Radiator; 6. Heat dissipation port; 7. Dust screen; 8. Anti-slip pad; 9. Screw hole; 10. Threaded column; 11. Threaded cover; 12. Threaded groove; 13. First cooling fan; 14. Temperature sensor; 15. Semiconductor refrigerator; 16. Second cooling fan. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is described in detail below with reference to the accompanying drawings. The description in this part is only exemplary and explanatory and should not have any limiting effect on the scope of protection of the present invention.

[0022] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.

[0023] It should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate and simplify the description of the utility model and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely for distinction and description and should not be construed as indicating or implying relative importance.

[0024] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0025] In the description of the utility model, still need explaining, unless another explicit provision and limitation, term " set ", " install ", " link ", " connect " should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can indirectly connect through intermediate medium, can be two element inside communication。For ordinary skilled person in the art, can understand the concrete meaning of above-mentioned term in the utility model with specific situation.

[0026] Please refer to Figures 1-5 The utility model provides a kind of computer hardware cooling device in an embodiment provided by the utility model: the inside top of shell 1 is equipped with temperature sensor 14, the left side inner wall of shell 1 is equipped with semiconductor refrigerator 15, the left side of semiconductor refrigerator 15 is equipped with radiator 5, two semiconductor refrigerators 15 are fixedly provided with air outlet pipe 2, and air outlet pipe 2 is communicated with the inside of shell 1, the inside of air outlet pipe 2 is equipped with second radiating fan 16, the right side of shell 1 is fixedly provided with the air inlet pipe 4 of intercommunication, the inside of air inlet pipe 4 is equipped with first radiating fan 13, and the pipe mouth of air outlet pipe 2 and air inlet pipe 4 is equipped with screw groove 12, and the inner wall of screw groove 12 is screw-connected with screw cover 11, and the surface of screw cover 11 is equipped with the radiating port 6 of penetration, and the inside of radiating port 6 is fixedly connected with dust screen 7;

[0027] Specifically, as Figure 1 、 Figure 2 、 Figure 4 And Figure 5As shown, in use, the temperature inside the shell 1 can be detected in real time by the temperature sensor 14, when the temperature inside the shell reaches the pre-set value, the first heat dissipation fan 13 and the second heat dissipation fan 16 can be matched to realize the rapid exchange of high-temperature gas inside the shell and cooler air outside, so as to achieve the purpose of rapid heat dissipation, and when the temperature inside the shell reaches the pre-set value and is higher than the above-mentioned set value, the temperature sensor 14 can send a signal to the external controller, the external controller controls the semiconductor cooler 15 to start, the semiconductor cooler 15 can generate cold air to rapidly reduce the temperature inside the shell, thereby achieving the effect of rapid cooling, thereby improving the effect of heat dissipation, and after a period of time, the threaded cap 11 can be rotated until the threaded cap 11 is separated from the air outlet pipe 2 or the air inlet pipe 4, then the dust screen 7 on the threaded cap 11 is cleaned, and after cleaning, the threaded cap 11 is screwed into the threaded groove 12 on the air outlet pipe 2 or the air inlet pipe 4, the dust screen 7 can be easily disassembled, cleaned and installed, which can effectively ensure the filtering efficiency, and solve the problem that although the computer hardware can be cooled, when the ambient temperature is high, only air flow is used for heat dissipation, the heat dissipation effect is insufficient, and the computer operation is easily affected due to the lack of timely heat dissipation, and the use effect is poor.

[0028] The mounting block 3 is fixedly connected at the four corners of the bottom of the shell 1, the lower surface of the mounting block 3 extends to the inside to form a threaded hole 9, and a threaded column 10 is threadedly connected to the inner wall of the threaded hole 9, and the bottom of the threaded column 10 is fixedly connected with an anti-skid pad 8;

[0029] Specifically, as shown in Figure 1 and Figure 3 in use, the device can be supported by the anti-skid pad 8, and the anti-skid pad 8 can be rotated to drive the threaded column 10 to rotate, and the length of the threaded column 10 in the threaded hole 9 can be adjusted to meet the placement requirements of different placement surfaces, thereby improving the practicability of the device.

[0030] Working principle: in the application, the temperature inside the shell 1 can be detected in real time by the temperature sensor 14, when the temperature inside the shell reaches the pre-set value, the mutual cooperation of the first cooling fan 13 and the second cooling fan 16 can realize the rapid exchange of high-heat gas inside the shell and the relatively cold air outside, so as to achieve the purpose of rapid cooling, and when the temperature inside the shell reaches the pre-set value and is higher than the above-mentioned set value, the temperature sensor 14 can send a signal to the external controller, the external controller controls the semiconductor cooler 15 to start, the semiconductor cooler 15 can generate cold air to rapidly reduce the temperature inside the shell, so as to achieve the effect of rapid cooling, thereby improving the effect of heat dissipation, and after a period of time, the threaded cover 11 can be rotated until the threaded cover 11 is separated from the air outlet pipe 2 or the air inlet pipe 4, then the dust screen 7 on the threaded cover 11 is cleaned, and after cleaning, the threaded cover 11 is screwed into the threaded groove 12 on the air outlet pipe 2 or the air inlet pipe 4, the dust screen 7 can be easily disassembled, cleaned and installed, which can effectively ensure the filtering efficiency, and the anti-skid pad 8 can support the device, and the anti-skid pad 8 can be rotated to drive the threaded column 10 to rotate, the length of the threaded column 10 in the threaded hole 9 can be adjusted to meet the placement requirements of different placement surfaces, thereby improving the practicability of the device.

[0031] The standard parts used in the application file can be purchased from the market, and can be customized according to the description and drawings, and the specific connection mode of each part adopts the conventional bolt, rivet, welding and other conventional means in the prior art, the mechanical, parts and equipment adopt the conventional type in the prior art, and the electrical elements appearing in the application are externally connected to the power supply and control switch during use, the control mode is automatically controlled by the controller, and the control circuit of the controller can be realized by simple programming of the person skilled in the art, which belongs to the common knowledge in the art, so the control mode and circuit connection of the application will not be explained in detail, and the external controller mentioned in the description can control the electrical elements mentioned in the text, and the external controller is a conventional known device.

[0032] It should be noted that in this paper, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device.

[0033] The principle and implementation mode of the present application are described by using specific examples herein, and the above examples are only used for helping to understand the method and core idea of the present application. The above is only the preferred implementation mode of the present application, and it should be pointed out that, due to the limited nature of the expression, there are objectively infinite specific structures, and for ordinary skilled persons in the technical field, without departing from the principle of the present application, a number of improvements, refinements or changes can be made, and the above technical features can be combined in an appropriate manner; the improvements, refinements, changes or combinations, or the direct application of the concept and technical solution of the present application to other occasions without improvement, should be regarded as the protection scope of the present application.

Claims

1. A computer hardware cooling device comprising a housing (1), characterized in that: The inside top end of the shell (1) is provided with a temperature sensor (14), the left inner wall of the shell (1) is provided with a semiconductor refrigerator (15), the left side of the semiconductor refrigerator (15) is provided with a heat sink (5), two semiconductor refrigerators (15) are fixedly provided with an air outlet pipe (2), the air outlet pipe (2) is communicated with the inside of the shell (1), the inside of the air outlet pipe (2) is provided with a second cooling fan (16), the right side of the shell (1) is fixedly provided with an air inlet pipe (4) communicated, and the inside of the air inlet pipe (4) is provided with a first cooling fan (13).

2. The computer hardware cooling device of claim 1, wherein: Threaded grooves (12) are arranged at the pipe openings of the air outlet pipe (2) and the air inlet pipe (4), and threaded covers (11) are threadedly connected to the inner walls of the threaded grooves (12).

3. The computer hardware cooling device of claim 2, wherein: The surface of the threaded cover (11) is provided with a heat dissipation opening (6), and the inside of the heat dissipation opening (6) is fixedly connected with a dust screen (7).

4. The computer hardware cooling device of claim 1, wherein: The bottom of the shell (1) is fixedly connected with mounting blocks (3) at four corners, and screw holes (9) are arranged in the lower surface of the mounting block (3) and extend to the inside.

5. The computer hardware cooling device of claim 4, wherein: The inner wall of the screw hole (9) is threadedly connected with a threaded column (10), and the bottom of the threaded column (10) is fixedly connected with an anti-skid pad (8).

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