Cleaning rolling brush cleaning device and semiconductor substrate cleaning equipment

Abstract

The utility model discloses a cleaning rolling brush cleaning device and machine table silicon wafer cleaning equipment, the cleaning rolling brush cleaning device comprises at least one group of detachable cleaning brush mechanisms and at least one group of spraying cleaning mechanisms, and the detachable cleaning brush mechanisms and the spraying cleaning mechanisms are in one-to-one correspondence with cleaning rolling brushes; the detachable cleaning brush structure comprises a fixed end arranged below the cleaning rolling brush and a cleaning brush detachably fixed to the fixed end, and the cleaning brush is in close contact with the corresponding cleaning rolling brush when working. The spraying cleaning mechanism comprises a liquid supply box and an automatic spraying assembly, the liquid inlet end of the automatic spraying assembly communicates with the liquid supply box through a pipeline, the automatic spraying assembly comprises an automatic spraying head and a resonator arranged on the automatic spraying head, and the spraying direction of the automatic spraying assembly faces the cleaning rolling brush corresponding to the automatic spraying assembly. The semiconductor substrate cleaning device has high cleaning efficiency of the cleaning rolling brush, the service life of the rolling brush is prevented from being shortened, and meanwhile secondary pollution of the semiconductor substrate is not prone to being caused.

Description

TECHNICAL FIELD

[0001] The utility model relates to a field of cleaning after grinding, especially relates to a cleaning roller brush cleaning device and semiconductor substrate cleaning equipment. BACKGROUND

[0002] Chemical mechanical planarization (CMP) technology is widely used in semiconductor integrated circuit production process, and is the most effective technology for wafer global planarization in semiconductor process. After grinding, the wafer surface will be left with grinding liquid, grinding particles or other impurities, so that defects are generated on the wafer, therefore, the wafer usually needs to be cleaned after grinding to remove the residual impurities. The specific cleaning process is that the two roller brushes and the wafer rotate at a certain speed to achieve the effect of removing the residual impurities on the wafer surface. However, because the impurities may exist in the opposite material of the roller brush potential, the residual impurities on the surface of the roller brush will stick to the wafer surface to form defects after a long time of use, thereby affecting the yield of the wafer. Therefore, the common practice in the industry is to shorten the replacement cycle of the roller brush, which increases the cost of consumables and time.

[0003] In view of the above problems, there are currently two types of solutions in the industry: one type is to set a quartz plate in the cleaning unit to remove the impurities adhered to the roller brush by extruding the roller brush, for example, Japanese Ebara machine, which has the advantages of simple operation and low cost, but the quartz plate itself is easy to accumulate impurities particles after a long time of use, thereby causing secondary pollution to the roller brush, and repeated extrusion deformation of the roller brush changes the plasticity of the roller brush, thereby affecting the service life of the brush. One type is to clean the roller brush by soaking in a chemical solution, which has the advantage of not considering the secondary pollution of the machine, and can use special strong acid and strong alkali cleaning solution, but this type of operation is complex, increases the process of disassembling and reinstalling the roller brush, and is easy to be secondarily polluted by the external environment and the operator.

[0004] Therefore, there is an urgent need for a cleaning roller brush cleaning device that can clean the roller brush in the semiconductor substrate cleaning equipment after grinding without causing secondary pollution. UTILITY MODEL CONTENT

[0005] The purpose of the present application is to provide a cleaning roller brush cleaning device and semiconductor substrate cleaning equipment to solve the problem that the existing cleaning method of the roller brush in the semiconductor substrate cleaning equipment after grinding easily reduces the service life of the roller brush and causes secondary pollution.

[0006] In the first aspect, the present application provides a cleaning roller brush cleaning device arranged below the cleaning roller brush after grinding, which includes at least one set of detachable cleaning brush mechanism and at least one set of spraying cleaning mechanism, and the detachable cleaning brush mechanism and the spraying cleaning mechanism are one-to-one corresponding to the cleaning roller brush.

[0007] The detachable cleaning brush structure comprises a fixed end arranged below the cleaning roller brush and a cleaning brush detachably fixed on the fixed end, and the cleaning brush is in close contact with the corresponding cleaning roller brush during operation;

[0008] The spray cleaning mechanism comprises a liquid supply tank and an automatic spray assembly in liquid communication with the liquid supply tank through a pipeline at a liquid inlet end, the automatic spray assembly comprises an automatic spray head and a resonator arranged on the automatic spray head, and the spray direction of the automatic spray assembly is towards the corresponding cleaning roller brush.

[0009] In an embodiment of the present application, the detachable cleaning brush structure further comprises a lifting assembly, and the fixed end is fixed on a lifter of the lifting assembly.

[0010] When the cleaning roller brush is cleaned, the lifter of the lifting assembly is lifted to a working height so that the cleaning brush is in close contact with the cleaning roller brush.

[0011] When the cleaning roller brush is cleaned, the lifter of the lifting assembly is lowered to an idle height so that the cleaning brush is kept at a preset distance from the cleaning roller brush.

[0012] In an embodiment of the present application, the cleaning brush is a soft long strip-shaped brush structure, the cleaning brush is arranged in parallel with the cleaning roller brush, and the length of the cleaning brush is greater than or equal to the length of the cleaning roller brush.

[0013] In an embodiment of the present application, the material of the cleaning brush is PVA.

[0014] In an embodiment of the present application, a plurality of nozzles are arranged on the automatic spray head, and the spray surface formed by all the nozzles completely covers the lower side of the cleaning roller brush.

[0015] In an embodiment of the present application, the nozzles are MEG high-pressure fan-shaped nozzles.

[0016] In an embodiment of the present application, the liquid in the liquid supply tank is a cleaning roller brush cleaning liquid.

[0017] In a second aspect, the present application further provides a machine silicon wafer cleaning device, characterized in that it comprises a roller brush cleaning mechanism, a cleaning liquid spraying mechanism arranged above the roller brush cleaning mechanism, and a cleaning roller brush cleaning device arranged below the roller brush cleaning mechanism.

[0018] The roller brush cleaning mechanism comprises an upper roller brush structure for cleaning the upper surface of a semiconductor substrate and a lower roller brush structure for cleaning the lower surface, and the spray direction of the cleaning liquid spraying mechanism is towards the semiconductor substrate cleaning position between the upper roller brush structure and the lower roller brush structure.

[0019] In an embodiment of the present application, the upper rolling brush structure and the lower rolling brush structure each include a rolling brush fixing arm guide rail, a rolling brush fixing arm arranged on the rolling brush fixing arm guide rail, and a cleaning rolling brush arranged on the rolling brush fixing arm.

[0020] In an embodiment of the present application, the cleaning rolling brush is in a long tube structure, and a plurality of cylindrical protrusions are arranged on the surface of the cleaning rolling brush.

[0021] Compared with the prior art, one or more embodiments of the above scheme can have the following advantages or beneficial effects:

[0022] The cleaning rolling brush cleaning device provided by the embodiment of the present application can clean the cleaning rolling brush through the detachable cleaning brush mechanism, wherein the cleaning brush in the detachable cleaning brush mechanism is a detachable long strip-shaped brush structure, the long strip-shaped brush structure can clean the gap between the protrusions of the cleaning rolling brush, the detachable structure can ensure that the cleaning brush can be replaced in time, thereby reducing the secondary pollution problem of the cleaning rolling brush; the cleaning brush is arranged on the lifting assembly, the cleaning time of the cleaning brush on the cleaning rolling brush can be controlled at will, the cleaning process of the cleaning rolling brush on the semiconductor substrate is avoided from being affected, and the cleaning rolling brush is avoided from being damaged due to long-time cleaning by the cleaning brush; the cleaning liquid is sprayed to the cleaning rolling brush through the spraying cleaning mechanism, the electrical neutrality of the dirt on the cleaning rolling brush is realized, and the cleaning of the cleaning rolling brush is further realized; meanwhile, the resonator is arranged in the spraying cleaning mechanism, the cleaning liquid is additionally ultrasonically vibrated, and the cleaning efficiency of the cleaning rolling brush is further improved.

[0023] Other features and advantages of the present application will be set forth in the following description of the application, and in part will become apparent to those skilled in the art upon examination of the following or can be learned by practice of the application. The objects and other advantages of the application can be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings:

[0025] Figure 1 A position relationship schematic view of the cleaning rolling brush, the cleaning brush, and the automatic spray head in the cleaning rolling brush cleaning device is shown.

[0026] Figure 2 A structure schematic view of the semiconductor substrate cleaning equipment is shown.

[0027] Wherein, 1 is a cleaning brush, 2 is an automatic spray head, 3 is a nozzle, 4 is a cleaning roller brush, 5 is a roller brush fixing arm, 6 is a roller brush fixing arm guide rail, 7 is a cylindrical protrusion, and 8 is a cleaning liquid spraying mechanism. DETAILED DESCRIPTION

[0028] The present application also can be implemented or applied in other different specific embodiments, and various modifications or changes can be made to the details of the present application based on different views and applications without departing from the spirit of the present application. It should be noted that the following examples and features in the examples can be combined with each other without conflict.

[0029] It should be noted that the diagrams provided in the following examples only schematically illustrate the basic concept of the present application, and only the components related to the present application are shown in the diagrams, not the number, shape and size of the components when actually implemented. The shapes, number and proportions of the components when actually implemented can be arbitrarily changed, and the layout pattern of the components can be more complex.

[0030] The following examples of the present application provide a cleaning roller brush cleaning device and a semiconductor substrate cleaning apparatus, which solve the problem that the existing post-grinding semiconductor substrate cleaning apparatus using a roller brush cleaning method easily reduces the service life of the roller brush and easily causes secondary pollution.

[0031] The principle and implementation of the cleaning roller brush cleaning device and the semiconductor substrate cleaning apparatus of the present embodiment will be described in detail below with reference to the accompanying drawings, so that those skilled in the art can understand the cleaning roller brush cleaning device and the semiconductor substrate cleaning apparatus of the present embodiment without creative labor.

[0032] Reference Figure 1 and Figure 2 As shown in FIGS. 1 to 8, the present embodiment provides a cleaning roller brush cleaning device for being arranged below the post-grinding substrate cleaning roller brush 4 to clean the cleaning roller brush 4. The specific cleaning roller brush cleaning device includes at least one set of detachable cleaning brush mechanism and at least one set of spraying cleaning mechanism, wherein the number of the detachable cleaning brush mechanism and the spraying cleaning mechanism is the same as the number of the cleaning roller brush 4 to be cleaned, i.e., the detachable cleaning brush mechanism and the spraying cleaning mechanism are arranged one-to-one corresponding to the cleaning roller brush 4.

[0033] Further, the detachable cleaning brush structure comprises a fixed end and a cleaning brush 1 arranged on the fixed end. The cleaning brush 1 is detachably fixed on the fixed end, so that a new cleaning brush 1 can be replaced conveniently; the cleaning brush 1 is cheap and can be replaced frequently as consumables, thereby reducing repeated pollution. The detachable fixing mode can be buckle fixing, Velcro fixing or zipper fixing, and the fixing is not limited herein. The fixed end can be directly fixed at a position below the cleaning roller brush 4, and the cleaning brush 1 is arranged in close contact with the corresponding cleaning roller brush 4, so that the cleaning brush 1 can continuously clean the cleaning roller brush 4. However, this cleaning method is easy to cause damage to the cleaning brush 1 and the cleaning roller brush 4, and long-time contact between the cleaning brush 1 and the cleaning roller brush 4 also increases the friction force of the cleaning roller brush 4 and affects the normal cleaning work of the cleaning roller brush 4 on the ground wafer.

[0034] In order to solve the above problems, in an embodiment, a lifting assembly is further arranged in the detachable cleaning brush structure, and the fixed end is fixed on the lifter of the lifting assembly. At this time, the cleaning brush 1 can clean the cleaning roller brush 4 on demand by controlling the lifting assembly. Specifically, when the cleaning roller brush 4 needs to be cleaned, the lifter of the lifting assembly is controlled to rise to a preset working height, at this time, the cleaning brush 1 is in close contact with the cleaning roller brush 4, and the cleaning of the cleaning roller brush 4 by the cleaning brush 1 can be realized by rotating the cleaning roller brush 4. When the cleaning of the cleaning roller brush 4 is completed, the lifter of the lifting assembly is controlled to descend to a preset idle height, at this time, the cleaning brush 1 keeps a preset distance from the cleaning roller brush 4, and the cleaning brush 1 does not affect the normal cleaning work of the cleaning roller brush 4.

[0035] In an embodiment, the cleaning brush 1 is arranged in a soft strip-shaped brush structure, and the cleaning roller brush 4 is usually arranged in a long tube structure. At this time, the cleaning brush 1 needs to be arranged in parallel with the cleaning roller brush 4, and in order to achieve comprehensive cleaning of the cleaning roller brush 4, the length of the cleaning brush 1 needs to be greater than or equal to the length of the cleaning roller brush 4.

[0036] In an embodiment, the cleaning brush 1 can be arranged in PVA material, which is soft in texture and can ensure that it deforms without deforming the cleaning roller brush 4 during cleaning, thereby achieving the purpose of fully cleaning the protrusion gap of the cleaning roller brush 4. Compared with the hard scraper structure of the cleaning brush 1, the hard scraper structure can deform the cleaning roller brush 4 and reduce the service life of the cleaning roller brush 4.

[0037] Further, the spraying cleaning mechanism specifically comprises a liquid supply tank and an automatic spraying assembly, the liquid inlet of the automatic spraying assembly is communicated with the liquid supply tank through a pipeline. The liquid supply tank is used for loading the cleaning liquid for the cleaning roller brush 4. The automatic spraying assembly can control the automatic spraying of the cleaning liquid through a switch. The spraying direction of the automatic spraying assembly is towards the corresponding cleaning roller brush 4. Still further, the automatic spraying assembly comprises an automatic nozzle 2 and a plurality of nozzles 3 arranged on the automatic nozzle 2, and the spraying surface formed by all the nozzles 3 completely covers the lower side of the cleaning roller brush 4, so as to realize the overall spraying cleaning of the cleaning roller brush 4 through the rolling of the cleaning roller brush 4. In order to enhance the spraying cleaning effect of the cleaning liquid on the cleaning roller brush 4, the automatic spraying assembly of the embodiment further comprises a resonator arranged on the automatic nozzle 2. The resonator can make the cleaning liquid sprayed out of the automatic nozzle 2 additionally vibrate with ultrasonic waves, so as to further improve the cleaning efficiency of the cleaning liquid on the cleaning roller brush 4.

[0038] In an embodiment, the nozzles 3 can be MEG high-pressure fan-shaped nozzles.

[0039] The working mode of the cleaning roller brush cleaning device is as follows: the cleaning roller brush cleaning device is correspondingly installed below the cleaning roller brush 4 of the machine table wafer cleaning equipment, so that the cleaning brush 1 can be in close contact with the corresponding cleaning roller brush 4 during cleaning, and the cleaning liquid sprayed by the nozzle of the spraying cleaning mechanism can realize the cleaning of the cleaning roller brush 4 through spraying. When it is necessary to clean the cleaning roller brush 4, the cleaning brush 1 is raised to the working height through the lifter, so that the cleaning brush 1 is in close contact with the cleaning roller brush 4, the cleaning roller brush 4 rotates, and the cleaning brush 1 starts to clean the cleaning roller brush 4; at the same time, the automatic nozzle 2 starts to spray the cleaning liquid, the resonator resonates to make the cleaning liquid sprayed out of the automatic nozzle 2 additionally vibrate with ultrasonic waves, and the impurities on the cleaning roller brush 4 are removed from the surface of the cleaning roller brush 4 through the double effects of PVA potential modification and mechanical force. When the cleaning is completed, the cleaning brush 1 is lowered to the idle height through the lifter to keep the cleaning brush 1 and the cleaning roller brush 4 at a preset distance; at the same time, the automatic nozzle 2 stops spraying the cleaning liquid, and the resonator stops resonating.

[0040] The cleaning roller brush cleaning device provided by the embodiment of the utility model can realize cleaning of the cleaning roller brush through the detachable cleaning brush mechanism, wherein the cleaning brush in the detachable cleaning brush mechanism is a detachable long strip-shaped brush structure, the long strip-shaped brush structure can clean the gap between the protrusions of the cleaning roller brush, the detachable structure can ensure that the cleaning brush can be replaced in time, and the problem of secondary pollution of the cleaning roller brush is reduced; the cleaning brush is arranged on the lifting assembly, the cleaning time of the cleaning brush on the cleaning roller brush can be controlled at will, the cleaning process of the cleaning roller brush on the semiconductor substrate is prevented from being affected, and the cleaning roller brush is prevented from being damaged due to long-time cleaning by the cleaning brush; the cleaning liquid is sprayed on the cleaning roller brush through the spraying cleaning mechanism, the electrical neutrality of the dirt on the cleaning roller brush is realized, and the cleaning of the cleaning roller brush is further realized; meanwhile, the resonator is arranged in the spraying cleaning mechanism, the cleaning liquid is additionally ultrasonically vibrated, and the cleaning efficiency of the cleaning roller brush is further improved.

[0041] As shown in Figure 2 The embodiment also provides a machine silicon wafer cleaning equipment, which specifically comprises a roller brush cleaning mechanism, a cleaning liquid spraying mechanism 8 and a cleaning roller brush cleaning device, the cleaning roller brush cleaning device is the cleaning roller brush cleaning device described in the above embodiment, and all the functions in the above embodiment can be realized, and thus the description is not repeated here.

[0042] The cleaning roller brush cleaning device is arranged below the roller brush cleaning mechanism and corresponds to the position of the cleaning roller brush 4 in the roller brush cleaning mechanism, so that the cleaning roller brush cleaning device can clean the roller brush in the roller brush cleaning mechanism. As shown in the drawings, the roller brush cleaning mechanism comprises an upper roller brush structure and a lower roller brush structure, the upper roller brush structure and the lower roller brush structure are arranged in axial symmetry, and a semiconductor substrate cleaning position is formed between the upper roller brush structure and the lower roller brush structure, for placing a semiconductor substrate to be cleaned. The upper roller brush structure is used for cleaning the upper surface of the semiconductor substrate, and the lower roller brush structure is used for cleaning the lower surface of the semiconductor substrate. The upper roller brush structure and the lower roller brush structure have the same structure and specifically comprise a roller brush fixing arm guide rail 6, a roller brush fixing arm 5 and a cleaning roller brush 4, wherein the roller brush fixing arm 5 is fixed to the roller brush fixing arm guide rail 6, and the cleaning roller brush 4 is fixed to the roller brush fixing arm 5. The cleaning roller brush 4 has a long cylinder structure, and a plurality of cylindrical protrusions 7 are arranged on the surface of the cleaning roller brush 4. In an embodiment, the cylindrical protrusions 7 can be provided with a diameter of 6-8 mm.

[0043] The material of the cleaning roller brush 4 can be PVA material, which has good water absorption, is flexible and porous and is easy to compress.

[0044] The cleaning liquid spraying mechanism 8 is a spray bar, which is a cleaning liquid spraying device of the machine, and sprays columnar liquid. The spraying direction of the cleaning liquid spraying mechanism 8 is towards the semiconductor wafer cleaning position between the two sets of rolling brush structures, so as to clean the semiconductor wafer during the cleaning process of the rolling brush cleaning mechanism, and remove the impurities on the surface of the semiconductor wafer through the double effects of PVA potential modification and mechanical force.

[0045] The working mode of the semiconductor wafer cleaning equipment of the embodiment is as follows: when the semiconductor wafer needs to be cleaned, the semiconductor wafer is placed on the semiconductor wafer cleaning position between the upper rolling brush structure and the lower rolling brush structure, and then the cleaning rolling brush 4 of the upper rolling brush structure and the lower rolling brush structure and the semiconductor wafer rotate at a certain speed to clean the residual impurities on the surface of the semiconductor wafer; at the same time, the cleaning liquid spraying mechanism 8 sprays cleaning liquid to the semiconductor wafer on the semiconductor wafer cleaning position, so that the impurities on the semiconductor wafer are removed from the surface of the semiconductor wafer through the double effects of PVA potential modification and mechanical force. When the cleaning rolling brush 4 needs to be cleaned, the cleaning brush in the cleaning brush cleaning device is lifted to the working height by the lifter, so that the cleaning brush is in close contact with the cleaning rolling brush 4, the cleaning rolling brush 4 rotates, and the cleaning brush starts to clean the cleaning rolling brush 4; at the same time, the automatic nozzle 2 starts to spray cleaning liquid, the resonator resonates to make the cleaning liquid sprayed out of the automatic nozzle 2 additionally vibrate, and the impurities on the cleaning rolling brush 4 are removed from the surface of the cleaning rolling brush 4 through the double effects of PVA potential modification and mechanical force. When the cleaning is completed, the cleaning brush is lowered to the idle height by the lifter to keep the cleaning brush away from the cleaning rolling brush 4 by a predetermined distance; at the same time, the automatic nozzle 2 stops spraying cleaning liquid, and the resonator stops resonating.

[0046] The semiconductor wafer cleaning equipment of the embodiment removes the impurities on the cleaning rolling brush through the double effects of PVA potential modification and mechanical force by the rolling brush cleaning mechanism and the cleaning brush cleaning device. The cleaning brush in the detachable cleaning brush mechanism of the cleaning brush cleaning device is a detachable long strip brush structure, which can clean the gap between the protrusions of the cleaning rolling brush. The detachable structure can ensure that the cleaning brush can be replaced in time, reducing the problem of secondary pollution of the cleaning rolling brush. The cleaning brush is arranged on the lifting assembly, so that the cleaning time of the cleaning brush on the cleaning rolling brush can be controlled at will, avoiding affecting the cleaning process of the cleaning rolling brush on the semiconductor wafer and avoiding damaging the cleaning rolling brush due to long-time cleaning of the cleaning brush. The spraying cleaning mechanism sprays cleaning liquid to the cleaning rolling brush to electrically neutralize the impurities on the cleaning rolling brush, and further clean the cleaning rolling brush. The resonator is arranged in the spraying cleaning mechanism to additionally vibrate the cleaning liquid, further improving the cleaning efficiency of the cleaning rolling brush.

[0047] Although the disclosed embodiments of the present application are as above, the content is only for the purpose of facilitating the understanding of the present application and is not intended to limit the present application. Any person skilled in the art to which the present application belongs, without departing from the spirit and scope of the present application, can make any modification and change in the form and details of the implementation, but the protection scope of the present application shall be subject to the scope defined by the appended claims.

Claims

1. A cleaning roller brush cleaning device characterized by, The cleaning device is arranged below the cleaning roller brush after grinding and includes at least one set of detachable cleaning brush mechanism and at least one set of spraying cleaning mechanism, which are in one-to-one correspondence with the cleaning roller brush. The detachable cleaning brush mechanism includes a fixed end arranged below the cleaning roller brush and a cleaning brush detachably fixed on the fixed end. The spraying cleaning mechanism includes a liquid supply tank and an automatic spraying assembly in communication with the liquid supply tank through a pipeline at a liquid inlet end.

2. The cleaning device of claim 1, wherein The detachable cleaning brush mechanism further includes a lifting assembly, and the fixed end is fixed on a lifter of the lifting assembly. When the cleaning roller brush is cleaned, the lifter of the lifting assembly is lifted to a working height so that the cleaning brush is in close contact with the cleaning roller brush. When the cleaning roller brush is cleaned, the lifter of the lifting assembly is lowered to an idle height so that the cleaning brush is kept at a preset distance from the cleaning roller brush.

3. The cleaning device of claim 1, wherein The cleaning brush is a soft long strip-shaped brush structure, which is arranged in parallel with the cleaning roller brush and has a length greater than or equal to that of the cleaning roller brush.

4. The cleaning device of claim 3, wherein The cleaning brush is made of PVA material.

5. The cleaning device of claim 1, wherein The automatic spraying head is provided with a plurality of nozzles, and a spraying surface formed by all the nozzles completely covers the lower side of the cleaning roller brush.

6. The cleaning device of claim 5, wherein The nozzles are MEG high-pressure fan-shaped nozzles.

7. The cleaning device of claim 1, wherein The liquid in the liquid supply tank is a cleaning roller brush cleaning liquid.

8. A semiconductor substrate cleaning apparatus, characterized by comprising: The device includes a roller brush cleaning mechanism, a cleaning liquid spraying mechanism arranged above the roller brush cleaning mechanism, and the cleaning device of any one of claims 1-7 arranged below the roller brush cleaning mechanism. The roller brush cleaning mechanism includes an upper roller brush structure for cleaning the upper surface of the semiconductor substrate and a lower roller brush structure for cleaning the lower surface of the semiconductor substrate, and the spraying direction of the cleaning liquid spraying mechanism is toward the semiconductor substrate cleaning position between the upper roller brush structure and the lower roller brush structure.

9. The cleaning apparatus of claim 8, wherein The upper roller brush structure and the lower roller brush structure each include a roller brush fixing arm guide rail, a roller brush fixing arm arranged on the roller brush fixing arm guide rail, and a cleaning roller brush arranged on the roller brush fixing arm.

10. The cleaning apparatus of claim 8, wherein The cleaning roller brush is a long cylinder structure, and the surface of the cleaning roller brush is arranged with a plurality of cylindrical protrusions.

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