Turntable mechanism for transporting silicon wafers

Abstract

The utility model discloses a turntable mechanism for transporting silicon wafers, which comprises a fixed frame, a rotating platform is mounted at the top of the fixed frame, a driving motor is connected to the bottom of the rotating platform, and a rotating connecting plate is mounted at the output end above the rotating platform. An air slip ring assembly is arranged at the position, corresponding to the output end of the rotating platform, of the top of the rotating connecting plate, an electromagnetic valve assembly is arranged on the air slip ring assembly and fixed to a supporting rod at the top of the air slip ring assembly through a pneumatic element panel, and double-suction-cup assemblies are symmetrically installed at the two ends of the rotating connecting plate. According to the utility model, the non-contact Bernoulli sucker is adopted to prevent sucker traces from being generated on the surface of the silicon wafer, and the photoelectric switch on the side surface of the rotating platform provides positioning in the process of transferring the silicon wafer, so that the repeated positioning precision of silicon wafer transportation is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to photovoltaic product manufacturing technical field, in particular to a kind of turntable mechanism for silicon wafer transportation. BACKGROUND

[0002] The silicon wafer used in photovoltaic field, usually will experience phosphorus extension processing, passivation treatment and cell preparation link, and these links can increase the structure vulnerable to damage on the surface of silicon wafer, these treated silicon wafers in the process of transportation, usually need to be transferred to other conveyor operation, and the conventional suction cup transposition structure is transferred, but the existing structure lacks positioning, and the silicon wafer after transfer can deviate from the axis of conveyor, and the conventional contact suction cup can produce suction cup trace on the surface of silicon wafer, causing the decline of cell performance. SUMMARY

[0003] According to the above-mentioned technical problem to be solved, a kind of turntable mechanism for silicon wafer transportation is provided.

[0004] To achieve the above object, the utility model discloses a kind of turntable mechanism for silicon wafer transportation, including fixed frame, the fixed frame top is installed with rotating platform, rotating platform bottom is connected with drive motor, rotating platform top output is installed with rotating connecting plate, rotating connecting plate top is provided with air slide ring assembly in position corresponding rotating platform output, air slide ring assembly is provided with solenoid valve assembly, solenoid valve assembly is fixed on the support rod on the top of air slide ring assembly by pneumatic element panel, rotating connecting plate both ends are symmetrically installed with double suction cup assembly.

[0005] Further, the air slide ring assembly includes a fixed block fixedly connected with the rotating connecting plate, a precision air path slide ring and a dust cover are sequentially installed on the top of the fixed block, and a support rod is fixedly arranged on the top of the dust cover.

[0006] Further, the pneumatic element panel of the solenoid valve assembly is provided with a solenoid valve and a pressure regulating valve, and a terminal plate is installed on the edge of the pneumatic element panel.

[0007] Further, the double suction cup assembly is provided with a horizontal suction cup fixing plate on the top, and the suction cup fixing plate is fixedly connected with the rotating connecting plate through a connecting piece above the suction cup fixing plate.

[0008] Further, the Bernoulli suction cup includes a suction cup connecting plate connected with the suction cup fixing plate, and a suction cup body connected with the suction cup connecting plate through an equal-height column below the suction cup connecting plate.

[0009] Further, the connecting piece and the fixed position of the rotating connecting plate are provided with a linear waist-shaped groove structure for adjusting the distance between the double-suction disc assemblies, and the connecting position of the connecting piece and the suction disc fixing plate is provided with a ring-shaped waist-shaped groove structure for fine adjustment of the angle of the double-suction disc assemblies.

[0010] Further, the fixed rack side close to the rotating platform is fixed with a sensor mounting seat, the outer side of the sensor mounting seat is connected with a photoelectric switch with an induction groove, and the bottom of the rotating connecting plate is provided with an induction sheet corresponding to the position of the induction groove.

[0011] Compared with the prior art, the utility model discloses a rotating disc mechanism for silicon wafer transportation, adopts a non-contact Bernoulli suction disc to avoid leaving suction disc marks on the surface of the silicon wafer, and the photoelectric switch on the side of the rotating platform provides positioning in the process of transferring the silicon wafer, thereby guaranteeing the repeated positioning accuracy of the silicon wafer transportation. BRIEF DESCRIPTION OF DRAWINGS

[0012] The utility model will be further explained in detail in combination with the drawings and specific embodiments.

[0013] Figure 1 It is the whole structure schematic diagram of the utility model.

[0014] Figure 2 It is the air slide ring assembly structure schematic diagram of the utility model.

[0015] Figure 3 It is the Bernoulli suction disc structure schematic diagram of the utility model.

[0016] Figure 4 It is the double-suction disc assembly connection schematic diagram of the utility model.

[0017] Figure 5 It is the partial view A in the utility model Figure 1

[0018] In the drawing: 1 is fixed rack, 2 is rotating platform, 3 is drive motor, 4 is rotating connecting plate, 5 is air slide ring assembly, 51 is fixed block, 52 is precision air path slide ring, 53 is dust cover, 54 is support rod, 6 is electromagnetic valve assembly, 61 is pneumatic element panel, 62 is pressure regulating valve, 63 is electromagnetic valve, 64 is terminal board, 7 is connecting piece, 8 is suction disc fixing plate, 9 is double-suction disc assembly, 91 is suction disc connecting plate, 92 is equal-height column, 93 is suction disc main body, 94 is sponge pad, 10 is sensor mounting seat, 11 is photoelectric switch, 12 is induction sheet. DETAILED DESCRIPTION

[0019] ​With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0020] An embodiment of the present application is shown in the drawings, Figure 1 and Figure 2 As shown in the drawings, the top of the fixed rack 1 is provided with a rotating platform 2, the bottom of the rotating platform 2 is connected with a driving motor 3, the output end of the rotating platform 2 is provided with a rotating connecting plate 4, the top of the rotating connecting plate 4 is provided with an air slip ring assembly 5 corresponding to the position of the output end of the rotating platform 2, the air slip ring assembly 5 is provided with an electromagnetic valve assembly 6, the electromagnetic valve assembly 6 is fixed on the support rod 54 on the top of the air slip ring assembly 5 through a pneumatic element panel 61, the both ends of the rotating connecting plate 4 are symmetrically provided with a double-suction disc assembly 9, a non-contact Bernoulli suction disc is adopted to avoid leaving suction disc marks on the surface of the silicon wafer, and photoelectric switches on the side of the rotating platform provide positioning in the process of transferring the silicon wafer, so as to ensure the repeated positioning accuracy of the silicon wafer transportation.

[0021] The air slip ring assembly 5 comprises a fixed block 51 fixedly connected with the rotating connecting plate 4, the top of the fixed block 51 is sequentially provided with a precise air path slip ring 52 and a dustproof cover 53, the top of the dustproof cover 53 is fixedly provided with a vertically arranged support rod 54, and the precision of pneumatic control is improved.

[0022] The pneumatic element panel 61 of the electromagnetic valve assembly 6 is provided with an electromagnetic valve 63 and a pressure regulating valve 62, and the edge of the pneumatic element panel 61 is provided with a terminal plate 64 to provide power for the double-suction disc assembly 9.

[0023] The top of the double-suction disc assembly 9 is provided with a horizontal suction disc fixing plate 8, the top of the suction disc fixing plate 8 is fixedly connected with the rotating connecting plate 4 through a connecting piece 7, the double-suction disc assembly 9 is composed of two groups of parallel Bernoulli suction discs, the Bernoulli suction disc comprises a suction disc connecting plate 91 connected with the suction disc fixing plate 8, the suction disc connecting plate 91 is connected with a suction disc main body 93 through an equal-height column 92 below, a plurality of sponge pads 94 are arranged in the grooves in the bottom of the suction disc main body 93, and air holes are arranged between the sponge pads 94, the Bernoulli suction disc is a non-contact suction disc based on the Bernoulli principle, when the Bernoulli suction disc works, the external compressed air flows at high speed in the small gap between the suction disc and the surface of the object to be transported, due to the increase of the air flow velocity, the Bernoulli principle causes the air pressure flowing through the gap to drop, so that a low-pressure area is formed between the suction disc and the object, but the surrounding air pressure is relatively high, so that the silicon wafer is pushed to the low-pressure area, so that the silicon wafer can be adsorbed without direct contact.

[0024] The connecting piece 7 is provided with a straight waist groove structure for adjusting the distance between the double suction disc assembly 9 at the fixed position of the rotating connecting plate 4, and the connecting piece 7 is provided with a ring-shaped waist groove structure for fine adjustment of the angle of the double suction disc assembly 9 at the connecting position of the suction disc fixing plate 8, thereby improving the applicability and meeting the requirements of silicon wafer transportation under different conditions.

[0025] The sensor mounting seat 10 is fixed on the side of the fixed frame 1 close to the rotating platform 2, the photoelectric switch 11 with a sensing groove is connected to the outside of the sensor mounting seat 10, and the sensing sheet 12 corresponding to the position of the sensing groove is installed at the bottom of the rotating connecting plate 4, thereby providing positioning and ensuring the repeated positioning accuracy of the silicon wafer transportation, and the stable transportation of the silicon wafer can be realized between the transmission belts arranged in a collinear or staggered manner.

[0026] The working principle of the embodiment is that the double suction disc assemblies are symmetrically installed at both ends of the rotating connecting plate, the non-contact Bernoulli suction disc is adopted to avoid leaving suction disc marks on the surface of the silicon wafer, the photoelectric switch on the side of the rotating platform provides positioning during the transfer of the silicon wafer, the Bernoulli suction disc is a non-contact suction disc based on the Bernoulli principle, when the Bernoulli suction disc works, the external compressed air flows at a high speed in the small gap between the suction disc and the surface of the object to be transported, due to the increase of the air flow speed, the Bernoulli principle causes the air pressure flowing through the gap to decrease, and thus a low-pressure area is formed between the suction disc and the object, but the pressure of the surrounding air is relatively high, so that the silicon wafer is pushed to the low-pressure area, and thus the silicon wafer can be adsorbed without direct contact.

[0027] The points to be explained are as follows: firstly, in the description of the present application, it is necessary to explain that, unless otherwise specified and limited, the terms "mounting", "connection" and "connection" should be understood in a broad sense, which can be mechanical connection or electrical connection, or the communication between two elements, or direct connection, and "up", "down", "left", "right" and the like are only used to represent the relative positional relationship, and when the absolute position of the described object changes, the relative positional relationship may change; secondly, in this paper, the relationship terms such as first and second are only used to distinguish one entity from another, and do not necessarily require or imply any actual relationship or order between the entities.

[0028] The above examples are only illustrative of the present application and do not constitute a limitation on the protection scope of the present application, and any design identical or similar to the present application belongs to the protection scope of the present application.

Claims

1. A turntable mechanism for silicon wafer transportation, comprising a stationary frame (1), characterized in that, The fixed rack (1) top is provided with a rotating platform (2), the rotating platform (2) bottom is connected with a drive motor (3), the rotating platform (2) top output is provided with a rotating connecting plate (4), the rotating connecting plate (4) top is provided with a gas slip ring assembly (5) corresponding to the rotating platform (2) output position, the gas slip ring assembly (5) is provided with a solenoid valve assembly (6), the solenoid valve assembly (6) is fixed on the support rod (54) on the top of the gas slip ring assembly (5) through the pneumatic element panel (61), and the rotating connecting plate (4) both ends are symmetrically provided with double suction disc assemblies (9).

2. A turntable mechanism for transporting silicon wafers as defined in claim 1, wherein The gas slip ring assembly (5) includes a fixed block (51) fixedly connected with the rotating connecting plate (4), the fixed block (51) top is provided with a precision gas path slip ring (52) and a dust cover (53) in sequence, and the dust cover (53) top is fixedly provided with a vertical support rod (54).

3. A turntable mechanism for transporting silicon wafers as defined in claim 1, wherein The pneumatic element panel (61) of the solenoid valve assembly (6) is provided with a solenoid valve (63) and a pressure regulating valve (62), and the edge of the pneumatic element panel (61) is provided with a terminal plate (64).

4. A turntable mechanism for silicon wafer transport as defined in claim 1, wherein, The double suction disc assembly (9) top is provided with a horizontal suction disc fixing plate (8), and the suction disc fixing plate (8) top is fixedly connected with the rotating connecting plate (4) through a connecting piece (7); the double suction disc assembly (9) is composed of two groups of parallel Bernoulli suction discs.

5. A turntable mechanism for transporting silicon wafers as defined in claim 4, wherein The Bernoulli suction disc includes a suction disc connecting plate (91) connected with the suction disc fixing plate (8), and the suction disc connecting plate (91) is connected with a suction disc main body (93) through an equal-height column (92) below the suction disc connecting plate (91); a plurality of sponge pads (94) are arranged in the recess at the bottom of the suction disc main body (93), and air holes are arranged between the sponge pads (94).

6. A turntable mechanism for transporting silicon wafers as defined in claim 4, wherein The fixed position of the connecting piece (7) and the rotating connecting plate (4) is provided with a straight waist groove structure for adjusting the spacing of the double suction disc assembly (9), and the connecting position of the connecting piece (7) and the suction disc fixing plate (8) is provided with an annular waist groove structure for fine-tuning the angle of the double suction disc assembly (9).

7. A turntable mechanism for silicon wafer transport as defined in claim 1, wherein The fixed rack (1) side near the rotating platform (2) is fixedly provided with a sensor mounting seat (10), the sensor mounting seat (10) outer side is connected with a photoelectric switch (11) with an induction groove, and the rotating connecting plate (4) bottom is provided with an induction sheet (12) corresponding to the position of the induction groove.

Images