Flip chip packaging machine

Abstract

The utility model relates to a flip chip packaging machine, which comprises a carrier receiving and releasing device for conveying a carrier from a discharging station to a receiving station by using a carrier conveying track; the chip packaging device is arranged between the discharging station and the receiving station, a liftable press-fit head is arranged above the carrier conveying track, a liftable press-fit platform is arranged below the carrier conveying track relative to the press-fit head, and the press-fit head and the press-fit platform are provided with heaters; the wafer platform is arranged on the side edge of the chip packaging device and can translate in the axial direction of the parallel carrier conveying track; and the chip picking device is used for arranging a picking head on a three-axis manipulator, and the picking head moves on a translation shaft, a lifting shaft and a rotating shaft of the vertical carrier conveying track by utilizing the three-axis manipulator so as to pick the chip from the wafer platform and transfer the chip to the pressing head. Therefore, the press-fit head and the press-fit platform are lifted in situ for press-fit packaging, and the press-fit head and the press-fit platform have the effects of improving the press-fit precision and the press-fit temperature stability.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of flip chip packaging machines, especially a kind of order pressing head and pressing platform in situ lifting are pressed and packaged, with the design of improving pressing precision and pressing temperature stability. BACKGROUND

[0002] TWI764188 / CN112218516B discloses a mounting device that mounts electronic components on mounting regions provided side by side on a tape-shaped circuit substrate, which includes a tape advancing unit having a conveying path on which the tape-shaped circuit substrate is placed and advancing the tape-shaped circuit substrate along a conveying route of the conveying path in a formal operation of mounting; a bonding platform capable of being disposed on the conveying route of the tape-shaped circuit substrate and supporting the tape-shaped circuit substrate from a lower surface; a bonding head that presses the electronic components on the mounting regions of the tape-shaped circuit substrate supported by the bonding platform and performs heating; and a heater that heats the bonding head or, in addition to the bonding head, heats the bonding platform, and as a conditioning operation before the formal operation, the bonding head and the bonding platform are moved to a position outside the tape-shaped circuit substrate deviated from the conveying route of the tape-shaped circuit substrate and maintained in contact or close to the position outside the tape-shaped circuit substrate, or repeatedly contact and separation or close and separation, while being heated by the heater.

[0003] The bonding head and the bonding platform must be moved to the position outside the tape-shaped circuit substrate deviated from the conveying route of the tape-shaped circuit substrate, and heated at the position outside the tape-shaped circuit substrate while transferring the electronic components using the bonding head and a pickup head for the electronic components; however, after the bonding head and the bonding platform are heated at the position outside the tape-shaped circuit substrate, they are returned to the mounting position to perform the mounting operation of the electronic components, which causes heat loss and unstable packaging temperature due to the movement of the bonding head and the bonding platform.

[0004] Therefore, there is an urgent need to design a flip chip packaging machine to solve the above problems. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a kind of flip chip packaging machine, solves the problem that previous technology will cause pressing precision and pressing temperature instability due to the movement of bonding head and bonding platform, and makes the bonding head and the bonding platform in situ lifting to press and package, with the function of improving pressing precision and pressing temperature stability.

[0006] To achieve the above-mentioned purpose, the specific technical scheme of the utility model is as follows: it includes:

[0007] A carrier receiving and releasing device has a releasing station, a carrier conveying track and a receiving station, and a carrier is conveyed from the releasing station to the receiving station by the carrier conveying track; a chip packaging device is arranged between the releasing station and the receiving station, a pressing head with a lifting function is arranged above the carrier conveying track, and a pressing platform with a lifting function is arranged below the carrier conveying track opposite the pressing head, and the pressing head and the pressing platform have heaters; a wafer platform is arranged at the side of the chip packaging device, and the wafer platform is arranged on a single-axis robot, and the wafer platform is translated in parallel to the axis of the carrier conveying track by the single-axis robot; and a chip picking device has a picking head arranged on a three-axis robot, and the picking head is moved on three axes of a translation axis, a lifting axis and a rotation axis perpendicular to the carrier conveying track by the three-axis robot, and the chip is picked from the wafer platform and handed over to the pressing head, and the pressing head and the pressing platform are used for pressing and packaging.

[0008] In addition, a wafer cassette platform and a wafer feeding device are further included, the wafer cassette platform is arranged at the side of the wafer platform, the wafer cassette is arranged on the wafer cassette platform, and the wafer feeding device is arranged between the wafer platform and the wafer cassette platform, and the wafer feeding device is used for taking out the wafer from the wafer cassette and moving the wafer to the wafer platform. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 It is an appearance structure schematic view of the utility model;

[0010] Figure 2 It is a top view structure schematic view of the utility model;

[0011] Figure 3 It is Figure 2 The structure appearance view of the middle circle note 3 area;

[0012] Figure 4 It is Figure 3 The partial enlarged view of the middle circle note 4 area;

[0013] Figure 5 It is corresponding Figure 4 The partial enlarged view of the chip picking device actuating state is explained.

[0014] Marked in the figure:

[0015] 10 carrier receiving and releasing device;

[0016] 11 releasing station;

[0017] 12 carrier conveying track;

[0018] 13 receiving station;

[0019] 20 chip packaging device;

[0020] 21 press head;

[0021] 22 press platform;

[0022] 30 wafer platform;

[0023] 40 chip pick-up device;

[0024] 41 pick-up head;

[0025] 42 three-axis robot;

[0026] 50 wafer cassette platform;

[0027] 60 wafer loading device. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0029] Those skilled in the art can understand that, although some embodiments herein include certain features included in other embodiments rather than other features, the combination of features of different embodiments means to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0030] Reference will now be made to the drawings, in which Figures 1 to 5The utility model discloses a kind of flip chip packaging machines. The utility model includes: a carrier receiving and releasing device 10 has a material station 11, a carrier conveying track 12 with a receiving station 13, and carrier (can be material belt, carrier plate...) is conveyed by the material station 11 to the receiving station 13 using the carrier conveying track 12;A chip packaging device 20 is arranged between the material station 11 and the receiving station 13, a pressing head 21 with lifting function (can utilize lifting manipulator, lifting cylinder...) is arranged above the carrier conveying track 12, and a pressing platform 22 with lifting function (can utilize lifting manipulator, lifting cylinder...) is arranged below the carrier conveying track 12 relative to the pressing head 21, the pressing head 21 and the pressing platform 22 have heater;A wafer platform 30 is arranged at the side of the chip packaging device 20, and the wafer platform 30 is arranged on a single-axis manipulator (not shown in figure), the wafer platform 30 utilizes the single-axis manipulator to translate in the axial direction parallel to the carrier conveying track 12;A chip pick-up device 40, a pick-up head 41 is arranged on a three-axis manipulator 42, the pick-up head 41 utilizes the three-axis manipulator 42 to move in three axes of translation axis perpendicular to the carrier conveying track, lifting shaft and rotation axis, and picks up chip from the wafer platform 30, and hands over chip to the pressing head 21, and utilizes the pressing head 21 and the pressing platform 22 to press and package;A wafer cassette platform 50 is arranged at the side of the wafer platform 30, and wafer cassette 51 is placed on the wafer cassette platform 50;And a wafer loading device 60 is arranged between the wafer platform 30 and the wafer cassette platform 50, and utilizes the wafer loading device 60 to take out wafer from wafer cassette 51 and moves to the wafer platform 30.

[0031] Based on the configuration, the wafer cassette 51 is placed on the wafer cassette platform 50, the wafer loading device 60 is used to take out wafer from wafer cassette 51 and moves to the wafer platform 30, the pick-up head 41 of the chip pick-up device 40 picks up chip from the wafer of the wafer platform 30 (such as the state shown in Fig. Figure 4 The wafer is handed over to the pressing head 21 (such as the state shown in Fig. Figure 5 Then, the wafer is packaged on the carrier by the pressing head 21 and the pressing platform 22; thereby, the wafer is picked up from the wafer platform 30 by the pick-up head 41 of the chip pick-up device 40, and the wafer is handed over to the pressing head 21, the design can make the pressing head 21 and the pressing platform 22 lift in situ to press and package, and has the effect of improving pressing precision and pressing temperature stability.

[0032] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. For those skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, it is not necessary and also impossible to exhaust all the implementation modes. Any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application claims.

Claims

1. A flip chip bonder, characterized by comprising: The application comprises: a carrier loading and unloading device, having a loading station, a carrier conveying track and an unloading station, wherein the carrier conveying track is used to convey the carrier from the loading station to the unloading station; a chip packaging device, arranged between the loading station and the unloading station, wherein a pressing head with lifting function is arranged above the carrier conveying track, and a pressing platform with lifting function is arranged below the carrier conveying track opposite to the pressing head, and the pressing head and the pressing platform are provided with a heater; a wafer platform, arranged at the side of the chip packaging device, wherein the wafer platform is arranged on a single-axis robot, and the wafer platform is translated in the axial direction parallel to the carrier conveying track by the single-axis robot; and a chip picking device, wherein a picking head is arranged on a three-axis robot, and the picking head is moved in three axes, i.e. the translation axis, the lifting axis and the rotation axis, perpendicular to the carrier conveying track by the three-axis robot, so as to pick the chip from the wafer platform and transfer the chip to the pressing head, and the chip is packaged by the pressing head and the pressing platform.

2. The flip chip package of claim 1, wherein, The application comprises a wafer cassette platform and a wafer loading device, wherein the wafer cassette platform is arranged at the side of the wafer platform, the wafer cassette is placed on the wafer cassette platform, and the wafer loading device is arranged between the wafer platform and the wafer cassette platform, and the wafer loading device is used to take the wafer from the wafer cassette and transfer the wafer to the wafer platform.

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