Earphone monomer and headphone

Abstract

The utility model discloses an earphone single body and a headphone, the earphone single body comprises a main body, an ear cushioning piece and a phase change structure, and the ear cushioning piece is connected to the main body; and the phase change structure is arranged in the ear cushioning piece and is in heat conduction connection with the ear cushioning piece. According to the embodiment of the invention, the temperature of the ear pad can be directly adjusted through the arrangement of the phase change structure, so that the ear pad can be continuously maintained in a constant-temperature state, and when a user wears the earphone monomer, the phase change structure can continuously absorb the heat of the ear pad, or the phase change structure can continuously release the heat to the ear pad. The ear pad can be maintained in a proper temperature state, so that the temperature requirement of a user on the ear pad is met, and the use experience of the user is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to audio equipment field especially earphone monomer and head -wearing earphone. BACKGROUND

[0002] The skin type earphone that the skin type earphone that current market exists generally, the skin type earphone is for user wearing, earphone can be attached on ear use, for example head -wearing earphone, the skin type earphone often exists when wearing and lead to stuffy condition, lead to skin type earphone in the use process because of stuffy and influence wearing comfort, bring bad wearing experience to user, especially in summer hot environment more obvious. CONTENT OF UTILITY MODEL

[0003] The utility model aims at at least one of the technical problems existing in the prior art is solved.For this purpose, the utility model provides an earphone monomer and head -wearing earphone, which can improve user wearing experience.

[0004] According to the earphone monomer of the utility model first aspect embodiment, including:

[0005] Main body;

[0006] Ear pad, connect in the main body;

[0007] Phase change structure, the phase change structure is arranged in the ear pad, and the phase change structure is connected with the ear pad heat conduction.

[0008] According to some embodiments of the utility model, the ear pad includes an ear pad and a filling component, the filling component is embedded in the ear pad, and the ear pad is used for contacting the skin;

[0009] The phase change structure is arranged between the ear pad and the filling component; And / or, the phase change structure is arranged in the filling component.

[0010] According to some embodiments of the utility model, the earphone monomer includes a contact portion, the contact portion is arranged on the ear pad and is located on the side of the filling component away from the main body, and the phase change structure is arranged between the contact portion and the filling component; And / or,

[0011] The ear pad is formed into a ring structure, so that the middle part of the ear pad forms a containing space for accommodating the ear, and the side of the filling component towards the containing space is provided with the phase change structure.

[0012] According to some embodiments of the utility model, the ear pad is covered outside the filling component; And / or, the ear pad includes a containing cavity, the filling component is arranged in the containing cavity, and the phase change structure is arranged between the inner wall of the containing cavity and the filling component.

[0013] According to some embodiments of the present application, the phase change structure comprises a phase change material and a carrier, the carrier is connected with the gasket, the phase change material is arranged in the carrier, and the carrier is used for carrying the phase change material.

[0014] According to some embodiments of the present application, the carrier comprises a containing cavity, the containing cavity is arranged in a sealed mode, and the phase change material is arranged in the containing cavity.

[0015] According to some embodiments of the present application, the phase change structure is a phase change microcapsule, and a plurality of phase change microcapsules are arranged in the gasket.

[0016] According to some embodiments of the present application, the earphone monomer comprises a power supply and a temperature adjusting part, the power supply is connected with the main body, the temperature adjusting part is connected with the main body, the temperature adjusting part is electrically connected with the power supply, the temperature adjusting part is arranged between the gasket and the main body, and the temperature adjusting part is in thermal conduction connection with the phase change structure to adjust the temperature of the phase change structure.

[0017] According to some embodiments of the present application, the main body comprises a shell and a carrier, the shell is connected with the carrier, and the gasket is connected to a side of the carrier away from the shell.

[0018] The temperature adjusting part is connected to the carrier, and the gasket is connected to the temperature adjusting part, or the temperature adjusting part is connected between the shell and the carrier, and the temperature adjusting part is in thermal conduction connection with the phase change structure through the carrier.

[0019] According to some embodiments of the present application, the shape of the temperature adjusting part corresponds to the shape of the gasket, and / or the main body comprises a loudspeaker and a sound outlet hole, the temperature adjusting part is provided with a through hole in a direction from the main body to the gasket, the through hole is in communication with the sound outlet hole, and the sound outlet hole and the through hole are both arranged corresponding to the loudspeaker.

[0020] The head-mounted earphone according to the second aspect of the present application comprises:

[0021] Two earphone monomers as described above;

[0022] A connecting part, two earphone monomers are respectively connected to opposite ends of the connecting part, two earphone monomers are arranged towards each other, and a wearing space is formed by two earphone monomers and the connecting part.

[0023] The earphone monomer has at least the following beneficial effects: the temperature of the ear pad piece can be directly adjusted through the setting of the phase change structure, so that the ear pad piece can be continuously maintained in a constant temperature state, the phase change structure can continuously absorb the heat of the ear pad piece or the phase change structure can continuously release heat to the ear pad piece when the user wears the earphone monomer, the ear pad piece can be maintained in a suitable temperature state, the temperature demand of the user for the ear pad piece is met, and the use experience of the user is improved.

[0024] Additional aspects and advantages of the present application will be given in part in the following description, become apparent from the following description, or be learned from the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0025] The present application will be further described below in combination with the drawings and embodiments.

[0026] Figure 1 is a structure schematic view of the earphone monomer of the first aspect embodiment of the present application;

[0027] Figure 2 is Figure 1 is a cross-sectional schematic view of A-A in one of the embodiments;

[0028] Figure 3 is Figure 2 is an enlarged schematic view of C in the embodiment;

[0029] Figure 4 is a structure schematic view of the phase change structure of the embodiment of the present application;

[0030] Figure 5 is an exploded schematic view of the earphone monomer of one of the embodiments of the present application;

[0031] Figure 6 is a structure schematic view of the headset of the second aspect embodiment of the present application.

[0032] BRIEF DESCRIPTION OF DRAWINGS: Headset 1, earphone monomer 10, connecting piece 20, main body 100, shell 110, loudspeaker 111, bearing piece 120, sound outlet hole 130, ear pad piece 200, ear pad 210, contact part 211, accommodating cavity 212, accommodating space 213, filling part 220, phase change structure 300, phase change material 310, carrier 320, containing cavity 321, temperature adjusting piece 400, through hole 410, wearing space 500. DETAILED DESCRIPTION

[0033] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary only, and are used only for explaining the present application, and cannot be understood as a limitation of the present application.

[0034] In the description of the present application, it should be understood that, in relation to the orientation description, for example, the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as a limitation of the present application.

[0035] In the description of the present application, the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, more than, etc. are understood as not including the number, above, below, etc. are understood as including the number. If it is described as first, second, it is only used for distinguishing technical features for the purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0036] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be understood in a broad sense, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical scheme.

[0037] In the description of the present application, the description of the reference terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, all the coupling / connection relationships involved in the present application do not mean that the components are directly connected, but means that the more optimal coupling / connection structure can be composed by adding or reducing the coupling / connection auxiliary components according to the specific implementation situation. In the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0038] The first aspect of the present application provides an earphone monomer 10, which is described with reference to Figures 1-5The earphone monomer 10 comprises a main body 100, a cushion 200 and a phase change structure 300, the cushion 200 is connected to the main body 100; the phase change structure 300 is arranged in the cushion 200, and the phase change structure 300 is in thermal conduction connection with the cushion 200. The main body 100 in the embodiment is provided with a horn 111 and the like, and the horn 111 can emit sound.

[0039] Specifically, the phase change structure 300 can absorb the temperature of the cushion 200 to realize the cooling of the cushion 200; the phase change structure 300 can increase the temperature of the cushion 200 by heat release to realize the temperature increase of the cushion 200. The part of the earphone monomer 10 that is attached to the ear / ear in use can be understood as the cushion 200 in the embodiment.

[0040] The phase change structure 300 in the embodiment can directly adjust the temperature of the cushion 200, so that the cushion 200 can be continuously maintained in a constant temperature state, the phase change structure 300 can continuously absorb the heat of the cushion 200 or continuously release heat to the cushion 200 when the user wears the earphone monomer 10, so that the cushion 200 can be maintained at a suitable temperature state, thereby meeting the temperature demand of the user for the cushion 200, and improving the user experience.

[0041] The phase change structure 300 in the embodiment can be used to reduce the temperature of the cushion 200, so that the user can feel cool when wearing the earphone monomer 10; or can be used to increase the temperature of the cushion 200, so that the user can feel hot when wearing the earphone monomer 10. For example, in summer, due to the setting of the phase change structure 300, the temperature of the cushion 200 can be kept lower than the body temperature value, so that the user does not feel hot when wearing the earphone monomer 10; for example, in winter, due to the setting of the phase change structure 300, the temperature of the cushion 200 can be kept at a temperature value at which the user can feel warm when wearing the earphone monomer 10, so that the user does not feel cold when wearing the earphone monomer 10. That is, the phase change structure 300 in the embodiment only needs to meet the temperature reduction / increase of the cushion 200.

[0042] In addition, the existing earphone monomer 10 cannot adjust the temperature, so there is a large temperature fluctuation in the existing earphone monomer 10, which often causes the sound quality effect of the existing earphone monomer 10 to be unstable, thereby affecting the user experience. Since the earphone monomer 10 in the embodiment can be maintained in a constant temperature state, the sound quality effect of the earphone monomer 10 in the embodiment is better, thereby improving the user experience.

[0043] The embodiment is not limited to the shape of the earphone body 10, i.e., the earphone body 10 in the embodiment is limited to being worn on one ear, and the earphone body 10 in the embodiment can be, for example, one of the earphone bodies in the headphones 1, and the earphone body 10 in the embodiment can be, for example, an over-ear earphone (i.e., held on the ear by an ear hook) or the like, as long as the earphone body 10 can be attached to / next to the ear when in use.

[0044] In some embodiments, with reference to Figures 1-5 The ear pad 200 includes an ear pad 210 and a filling component 220, the filling component 220 is embedded in the ear pad 210, the ear pad 210 is used to contact the skin, and the filling component 220 is, for example, ear cotton, which can play a certain buffering role when the earphone body 10 is worn on the ear, improving the comfort of wearing. In the embodiment, the ear pad 210 is wrapped outside the filling component 220, so as to avoid water seepage of the filling component 220, improve the sealing performance of the ear pad 200, and ensure the stability of the phase change structure 300, thereby improving the user experience.

[0045] The phase change structure 300 is arranged between the ear pad 210 and the filling component 220, and the phase change structure 300 can be connected to the inner surface of the ear pad 210 or the outer surface of the filling component 220, so that the phase change structure 300 can directly adjust the temperature of the ear pad 210.

[0046] Specifically, the ear pad 210 includes a receiving cavity 212, the filling component 220 is arranged in the receiving cavity 212, and the phase change structure 300 is arranged between the inner wall of the receiving cavity 212 and the filling component 220, so that the phase change structure 300 can better contact the ear pad 210, so that the phase change structure 300 can better adjust the temperature of the ear pad 210, thereby improving the temperature transfer efficiency between the external heat and the phase change structure 300.

[0047] In addition, the phase change structure 300 can also be arranged in the filling component 220, so that the phase change structure 300 can adjust the temperature of the ear pad 210 by adjusting the temperature of the filling component 220. It can be understood that the filling component 220 generally has a larger volume and can carry more phase change structures 300, thereby effectively improving the temperature adjustment efficiency of the phase change structure 300. Specifically, the phase change structure 300 can be filled in the filling component in a mutually fused manner.

[0048] It can be understood that when the phase change structure 300 is arranged between the ear pad 210 and the filling component 220 and in the filling component 220, the heat absorption / heat release effect of the phase change structure 300 will be higher.

[0049] In some embodiments, with reference toFigures 1-5 The earphone unit 10 comprises a contact part 211 arranged on the ear pad 210 and located on the side of the filling part 220 away from the main body 100, and the phase change structure 300 is arranged between the contact part 211 and the filling part 220. It can be understood that the contact part 211 will generally contact the skin beside the ear when the earphone unit 10 is worn. In this embodiment, the phase change structure 300 is arranged at the position of the contact part 211, which can well adjust the temperature of the skin beside the ear, so that the heat transfer efficiency between the phase change structure 300 and the skin is higher, thereby improving the user's experience.

[0050] The ear pad 200 is annularly arranged to form an annular structure, so that the middle part of the ear pad 200 forms a containing space 213 for containing the ear, and the side of the filling part 220 facing the containing space 213 is provided with the phase change structure 300. Specifically, the phase change structure 300 can be connected to the inner wall of the ear pad 210 and located on the side of the filling part 220 facing the containing space 213, or can be connected to the surface of the filling part 220 facing the containing space 213, which is not limited herein; the middle part of the ear pad 200 is the central position of the ear pad 200, in other words, the containing space 213 is the space defined by the inner annular wall of the annular structure, which can be specifically referred to the schematic diagram of FIG. Figures 1-3 The containing space 213 is used for the ear to pass through, so that the ear can be contained in the containing space 213. In this embodiment, by arranging the phase change structure 300 on the side of the filling part 220 facing the containing space 213, the ear pad 200 can adjust the temperature of the ear in the containing space 213 when the user wears the earphone unit 10, so that the heat transfer efficiency between the phase change structure 300 and the ear is higher, thereby improving the user's experience.

[0051] In this embodiment, the phase change structure 300 can be connected to the surface of the ear pad 210 facing the filling part 220, or can be connected to the outer surface of the filling part 220.

[0052] In some embodiments, referring to Figure 3 The ear pad 210 covers the filling part 220, which can improve the sealing of the filling part 220. Since the phase change structure 300 is arranged between the filling part 220 and the ear pad 210, or the phase change structure 300 is arranged in the filling part 220, the sealing of the phase change structure 300 is guaranteed by the covering effect of the ear pad 210 on the filling part 220, so as to reduce the risk of water seepage in the ear pad 200, thereby improving the safety and stability of the phase change structure 300, thereby also improving the service life of the ear pad 200 and the user's experience.

[0053] In some embodiments, referring to Figure 4 , the phase change structure 300 comprises a phase change material 310 and a carrier 320, the carrier 320 is connected with the grommet 200, the phase change material 310 is arranged in the carrier 320, and the carrier 320 is used for carrying the phase change material 310. In this embodiment, the carrier 320 is used to carry the phase change material 310, which ensures the stability of the phase change material 310. The way the carrier 320 carries the phase change material 310 in this embodiment is not limited, as long as the phase change material 310 can be stably connected in the grommet 200. For example, the phase change material 310 is usually in a liquid state during heat absorption / heat release, so it is necessary to set the carrier 320 to avoid liquid leakage.

[0054] Specifically, the phase change material 310 is, for example, a phase change material that can be converted from a solid state to a liquid state when absorbing heat, and can be converted from a liquid state to a solid state when releasing heat. When the temperature of the grommet 200 is higher than the temperature of the phase change material, the phase change material can absorb the heat of the grommet 200, thereby achieving the effect of reducing the temperature of the grommet 200; when the temperature of the grommet 200 is lower than the temperature of the phase change material, the phase change material will release heat to the grommet 200 in the form of heat transfer, so as to increase the temperature of the grommet 200.

[0055] Further, in some embodiments, referring to Figure 4 , the carrier 320 comprises a containing cavity 321, the containing cavity 321 is arranged in a sealed manner, and the phase change material 310 is arranged in the containing cavity 321. Specifically, the phase change material 310 can exchange solid and liquid states in the containing cavity 321 during heat absorption / heat release.

[0056] In this embodiment, the phase change material 310 is arranged in the sealed containing cavity 321, so that when the phase change material 310 exists in the containing cavity 321 in the form of a liquid, the phase change material 310 will not leak, thereby ensuring the stability of the phase change material 310 during heat absorption / heat release.

[0057] In some embodiments, the phase change structure 300 is a phase change microcapsule, and the phase change microcapsule comprises a plurality of phase change microcapsules arranged in the grommet 200. Specifically, as Figure 3 , a coating layer formed by a plurality of phase change microcapsules is coated on the inner wall of the containing cavity 212.

[0058] The phase change microcapsule has the effect of long heat absorption / heat release time. The phase change structure 300 in the embodiment uses a phase change material to solve the problem that the user is prone to feel hot and stuffy when wearing the earphone monomer 10 in summer. The earphone monomer 10 greatly increases the time length of the phase change structure 300 for adjusting the skin temperature during wearing. Specifically, the phase change microcapsule is arranged in the capsule particle (i.e., the carrier 320) by the phase change material (i.e., the phase change structure). The phase change material changes from solid to liquid in the capsule particle during the heat absorption / heat release process. That is, when the temperature of the user's skin is higher than the temperature of the ear pad 200, the phase change microcapsule continuously absorbs heat. During the heat absorption process, the phase change material changes from solid to liquid in the capsule particle. In this way, the temperature of the ear pad 200 is absorbed, so that the user can continuously feel the cool feeling of the ear pad 200 when wearing the earphone monomer 10. The user does not feel hot and stuffy when wearing the earphone monomer 10 in a relatively hot environment, thereby improving the wearing experience of the user. When the temperature of the user's skin is lower than the temperature of the ear pad 200, the phase change material changes from liquid to solid in the capsule particle to release heat, thereby increasing the temperature of the ear pad 200, so that the user can feel the heat when wearing.

[0059] It can be understood that the plurality of phase change microcapsules arranged in the ear pad 200 can be understood as follows: the phase change microcapsules can be coated on the inner wall of the ear pad 210, can be coated on the outer wall of the filling component 220, and can be filled in the filling component 220, which is not limited herein.

[0060] In some embodiments, referring to Figure 5 The earphone monomer 10 includes a power supply (not shown) and a temperature adjusting component 400. The power supply is connected to the main body 100. The temperature adjusting component 400 is electrically connected to the power supply. The temperature adjusting component 400 is connected to the main body 100. The power supply is used to supply power to the temperature adjusting component 400. The power supply is, for example, a battery. The temperature adjusting component 400 is arranged between the ear pad 200 and the main body 100. The temperature adjusting component 400 is in thermal conduction connection with the phase change structure 300 to adjust the temperature of the phase change structure 300.

[0061] The position of the power supply can be set according to actual needs. Therefore, the position of the power supply is not shown in the drawings. Those skilled in the art can determine the setting position of the power supply according to actual conditions. In the embodiment, as long as the power supply can supply power to the temperature adjusting component 400. The electrical connection between the power supply and the temperature adjusting component 400 can be realized by a circuit board. Therefore, no more details are given herein.

[0062] In this embodiment, the temperature of the phase change structure 300 is mainly adjusted by the temperature adjusting piece 400, so as to reduce the influence of the ambient temperature on the temperature of the ear pad piece 200, effectively increase the length of time for the phase change structure 300 to adjust the skin temperature when the earphone unit 10 is worn, and make the ear pad piece 200 be in a constant temperature state for a long time, thereby further improving the user experience. It can be understood that the temperature adjusting piece 400 can also directly adjust the temperature of the ear pad piece 200 to meet the temperature requirement of the user when the earphone unit 10 is worn.

[0063] Specifically, when the power supply supplies power to the temperature adjusting piece 400, the temperature adjusting piece 400 can absorb heat, thereby absorbing the heat of the ear pad piece 200 and reducing the temperature of the ear pad piece 200; or the temperature adjusting piece 400 can release heat, thereby conducting heat to the ear pad piece 200 and increasing the temperature of the ear pad piece 200.

[0064] For example, in the case of low ambient temperature, the temperature adjusting piece 400 can adjust the temperature of the phase change structure 300, so that the temperature of the phase change structure 300 can be in a constant temperature state, and the temperature of the ear pad piece 200 can be higher than the temperature of the ear when the user uses the earphone unit 10, so that the ear pad piece 200 does not bring an ice-cold stimulation to the ear when the user wears the earphone unit 10.

[0065] In this embodiment, the temperature adjusting piece 400 can only realize refrigeration and / or heating.

[0066] It can be understood that the temperature adjusting piece 400 is, for example, a semiconductor refrigeration structure, and the semiconductor refrigeration structure can realize refrigeration and / or heating of the temperature adjusting piece 400.

[0067] The shape of the semiconductor refrigeration structure is not limited here and is usually a sheet structure. Specifically, taking the temperature adjusting piece 400 as a semiconductor refrigeration sheet as an example: when the power supply provides a forward current for the semiconductor refrigeration sheet, the temperature of the side of the semiconductor refrigeration sheet facing the ear pad piece 200 will decrease; when the power supply provides a reverse current for the semiconductor refrigeration sheet, the temperature of the side of the semiconductor refrigeration sheet facing the ear pad piece 200 will increase. Therefore, by controlling the direction of the current, the refrigeration or heating function of the semiconductor refrigeration sheet can be realized, that is, when the current flows in the forward direction, the semiconductor refrigeration sheet starts to work in the refrigeration mode, and when the current flows in the reverse direction, the semiconductor refrigeration sheet starts to work in the heating mode. How to control the current direction is not described in detail here.

[0068] Specifically, when a forward current is input to the semiconductor cooling sheet, the semiconductor cooling sheet starts to work in cooling mode towards the side of the gasket 200, so that the temperature of the semiconductor cooling sheet is lower than that of the phase change structure 300, thereby transferring the heat of the phase change structure 300 to the semiconductor cooling sheet, so as to reduce the temperature of the phase change structure 300, achieving the purpose of cooling the phase change structure 300; when a reverse current is input to the semiconductor cooling sheet, the semiconductor cooling sheet starts to work in heating mode towards the side of the gasket 200, so that the temperature of the semiconductor cooling sheet is higher than that of the phase change structure 300, therefore, the phase change structure 300 will absorb the heat of the semiconductor cooling sheet, thereby increasing the temperature of the phase change structure 300, and further increasing the temperature of the gasket 200.

[0069] In some embodiments, with reference to Figure 5 The main body 100 further comprises a shell 110 and a carrier 120, the shell 110 is connected with the carrier 120, and the gasket 200 is connected to the side of the carrier 120 away from the shell 110. Specifically, the shell 110 is provided with a horn 111, and can also be provided with power supply components and the like.

[0070] The temperature adjusting component 400 is connected to the carrier 120, and the gasket 200 is connected to the temperature adjusting component 400. In this way, the temperature adjusting component 400 can be in direct contact with the gasket 200, and the temperature adjusting component 400 of the present embodiment has high working efficiency and low energy loss.

[0071] Alternatively, the temperature adjusting component 400 is connected between the shell 110 and the carrier 120, and the temperature adjusting component 400 is in thermal conduction connection with the phase change structure 300 through the carrier 120. The present embodiment provides an implementation manner of the specific connection position of the temperature adjusting component 400. In the present embodiment, the temperature of the gasket 200 is adjusted by adjusting the temperature of the carrier 120. Since the power supply component is usually arranged in the shell 110, the power supply component and the temperature adjusting component 400 need to be connected by wires. In the present embodiment, the temperature adjusting component 400 is arranged on the side of the carrier 120 facing the shell 110. It can be understood that the electrical connection between the power supply component and the temperature adjusting component 400 is usually realized by wires. The arrangement of the present embodiment can reduce the difficulty of wire layout, thereby reducing the production difficulty. Alternatively, the temperature adjusting component 400 can be connected to the shell 110 or the carrier 120, which is not limited herein.

[0072] It can be understood that the present embodiment adjusts the temperature of the gasket 200 by adjusting the temperature of the carrier 120, which avoids the direct contact between the temperature adjusting component 400 and the gasket 200, and makes the earphone safer.

[0073] In some embodiments, with reference to Figure 5The shape of the temperature adjusting piece 400 corresponds to the shape of the ear pad piece 200, that is, the shape of the ear pad piece 200 is a ring structure, and the shape of the temperature adjusting piece 400 is also a ring structure, so that the temperature adjusting piece 400 can more uniformly adjust the temperature of the ear pad piece 200, and the wearing experience of the user is improved.

[0074] The main body 100 includes a sound outlet hole 130 and a loudspeaker 111, the temperature adjusting piece 400 is provided with a through hole 410 in the direction from the main body 100 to the ear pad piece 200, the through hole 410 is in communication with the sound outlet hole 130, the sound outlet hole 130 is used for diffusing sound in the main body 100 to the environment, and the positions of the sound outlet hole 130 and the through hole 410 correspond to the loudspeaker 111, so that the sound emitted by the loudspeaker 111 can smoothly pass through the sound outlet hole 130 and the through hole 410. Specifically, the middle part of the bearing piece 120 is provided with a through sound outlet hole 130 in the direction from the main body 100 to the ear pad piece 200.

[0075] The number of the through holes 410 is not limited here, and the through holes 410 can be arranged to enable the sound diffused from the sound outlet hole 130 to smoothly pass through the temperature adjusting piece 400 and be conducted into the ear, so that the temperature adjusting piece 400 can ensure the acoustic performance of the earphone unit 10 when adjusting the temperature of the ear pad piece 200, and the use experience of the user is ensured.

[0076] The shape of the ear pad piece 200 is, for example, oval, circular or ring-shaped, so that the ear pad piece 200 can be better attached to / next to the ear, and the sealing performance of the ear pad piece 200 on the ear is ensured.

[0077] The second aspect of the utility model provides a kind of headset 1, for reference Figure 6 The headset 1 includes a connecting piece 20 and two earphone units 10 described above, the two earphone units 10 are respectively connected to the opposite ends of the connecting piece 20, and the two earphone units 10 are oppositely arranged, and the two earphone units 10 and the connecting piece 20 together enclose a wearing space 500, and the user can wear the headset 1 on the head through the wearing space 500.

[0078] In the embodiment, since the two earphone units 10 of the headset 1 both have temperature adjusting function, the headset 1 of the embodiment can adjust the temperature of the left and right ears, and better wearing experience is brought to the left and right ears of the user.

[0079] The two earphone units 10 are oppositely arranged, that is, the two earphone units 10 are assembled on the two ends of the connecting piece 20 in opposite directions, so that the two earphone units 10 can be correspondingly worn on the left and right ears.

[0080] The utility model embodiment makes the detailed explanation in combination with the drawing, but the utility model is not limited to the above -mentioned embodiment, still can make various changes in the knowledge range that the person skilled in the art has possesses without departing from the utility model's tenet under the precondition that the knowledge range that the person skilled in the art has possesses.

Claims

1. An earphone unit characterized by comprising: include: main body; an ear pad connected to the main body; a phase change structure, the phase change structure being disposed in the ear pad and being thermally conductively connected to the ear pad; The earphone unit includes a power supply and a temperature control component, the power supply is connected to the main body, the temperature control component is connected to the main body, the temperature control component is electrically connected to the power supply, the temperature control component is arranged between the ear pad and the main body, and the temperature control component is thermally conductively connected to the phase change structure to adjust the temperature of the phase change structure.

2. The earphone unit according to claim 1, wherein The ear pad comprises an ear pad and a filling component, wherein the filling component is embedded in the ear pad, and the ear pad is used to contact the skin; The phase change structure is arranged between the ear pad and the filling component; and / or, the phase change structure is arranged inside the filling component.

3. The earphone monomer according to claim 2, characterized in that, The earphone unit includes a contact portion, the contact portion is provided on the ear pad and is located on a side of the filling component away from the main body, and the phase change structure is provided between the contact portion and the filling component; and / or, The ear pad is surrounded to form an annular structure, so that a receiving space for accommodating the ear is formed in the middle of the ear pad, and the phase change structure is provided on a side of the filling component facing the receiving space.

4. The earphone unit according to claim 2, wherein The ear pad is covered on the outside of the filling component; and / or the ear pad includes a accommodating cavity, the filling component is arranged in the accommodating cavity, and the phase change structure is arranged between the inner wall of the accommodating cavity and the filling component.

5. The earphone unit according to claim 1, wherein The phase change structure includes a phase change material and a carrier. The carrier is connected to the ear pad. The phase change material is arranged in the carrier. The carrier is used to carry the phase change material.

6. The earphone unit according to claim 5, wherein The carrier includes a containing cavity, the containing cavity is sealed, and the phase change material is arranged in the containing cavity.

7. The earphone monomer according to any one of claims 1-6, characterized in that, The phase change structure is a phase change microcapsule, and the phase change microcapsule includes a plurality of phase change microcapsules.

8. The earphone monomer according to claim 1, wherein, The main body includes a shell and a carrier, the shell is connected to the carrier, and the ear pad is connected to a side of the carrier away from the shell; The temperature regulating element is connected to the supporting element, and the ear pad is connected to the temperature regulating element; or, the temperature regulating element is connected between the shell and the supporting element, and the temperature regulating element is thermally connected to the phase change structure through the supporting element.

9. The earphone monomer according to claim 1, wherein, The shape of the temperature regulating component corresponds to the shape of the ear pad, and / or the main body includes a speaker and a sound hole, the temperature regulating component is provided with a through hole along the main body toward the ear pad, the through hole is connected to the sound hole, and the positions of the sound hole and the through hole correspond to the speaker setting.

10. Headset, characterized in that include: Two earphone monomers according to any one of claims 1 to 9; A connecting piece, wherein the two earphone monomers are respectively connected to opposite ends of the connecting piece, the two earphone monomers are arranged facing each other, and the two earphone monomers and the connecting piece together enclose a wearing space.

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