LED flexible circuit board system convenient to electroplate
By using flexible conductive pins on the LED flexible circuit board to contact the aluminum substrate, the problem of aluminum substrate electroplating is solved, achieving cost-saving and easy-to-weld electroplating effects.
Patent Information
- Application Number
- CN202422501325.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-10-16
AI Technical Summary
Existing LED flexible circuit boards are difficult to electroplate effectively on aluminum substrates that have been covered with insulating film and etched lines, resulting in high costs and difficult soldering.
The flexible conductive pins move relative to the flexible circuit board, maintaining contact with the exposed aluminum substrate through the solder holes, thus achieving electroplating within the solder holes and avoiding the need for a full-layer copper plating film, thereby reducing the amount of copper used.
It achieves excellent electroplating results, reduces copper usage, significantly saves costs, and facilitates component soldering.
Smart Images
Figure CN223472419U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to LED lamp strip technical field, especially a kind of LED flexible circuit board system of electroplating conveniently. BACKGROUND
[0002] The existing LED flexible circuit board generally adopts copper as conductive base material, but the price of copper is high, in order to reduce cost, someone replaces copper substrate with aluminum substrate, although aluminum substrate can realize conduction, but it is difficult to tin, and components are difficult to be welded to aluminum substrate, therefore, the prior art etches circuit by electroplating a layer of copper film on aluminum substrate. But the existing physical copper plating method can only be electroplated on aluminum substrate which is not covered with insulating film and not etched with circuit (at this time, there is no open circuit in the aluminum substrate), and cannot be electroplated on aluminum substrate which is covered with insulating film and etched with circuit. Because there is open circuit on the aluminum substrate at this time, and there are welding holes on the insulating film, the electroplating rod needs to contact the aluminum substrate at the welding hole, but since the insulating film has a certain thickness, the exposed aluminum substrate at the welding hole is lower than the surface of the insulating film, so the electroplating rod cannot be in good contact with the aluminum substrate at the welding hole, and it is difficult to realize copper plating. SUMMARY
[0003] The utility model is to solve at least one of the technical problems existing in the prior art, and provide a more cost-saving and electroplating-friendly LED flexible circuit board system.
[0004] The LED flexible circuit board system for electroplating conveniently according to the utility model embodiment comprises a flexible circuit board, the flexible circuit board comprises an aluminum substrate etched with a circuit and a first insulating film covering the aluminum substrate, a plurality of welding holes are formed in the first insulating film to expose part of the aluminum substrate, an elastic conductive needle electrically connected to a cathode, the elastic conductive needle is elastic to keep contact with the exposed aluminum substrate through the welding hole during relative movement with the flexible circuit board, so that a copper layer is electroplated in the welding hole.
[0005] The LED flexible circuit board system for electroplating conveniently according to the utility model embodiment has at least the following beneficial effects: since the aluminum substrate is etched with a circuit and covered with a first insulating film, and welding holes are formed in the first insulating film, if the existing physical copper plating method is used, since the insulating film has a certain thickness, the exposed aluminum substrate at the welding hole is lower than the surface of the first insulating film, so the electroplating rod cannot be in good contact with the aluminum substrate at the welding hole, and it is difficult to realize electroplating. The application uses an elastic conductive needle, since the conductive needle is elastic, it can keep good contact with the aluminum substrate in the welding hole during relative movement with the flexible circuit board, so that a copper layer is electroplated in the welding hole, the electroplating effect is good, and there is no need to electroplate a whole layer of copper film on the aluminum substrate, which effectively reduces the amount of copper used and significantly saves cost.
[0006] The additional aspects and advantages of the present application will be given in part in the following description, and will become apparent from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS
[0007] The specific embodiments of the present application will be further described with reference to the drawings;
[0008] Figure 1 is a first schematic view of the LED flexible circuit board;
[0009] Figure 2 is a second schematic view of the LED flexible circuit board;
[0010] Figure 3 is a longitudinal sectional view of the LED flexible circuit board;
[0011] Figure 4 is a transverse sectional view of the LED flexible circuit board;
[0012] Figure 5 is a plating schematic view of the LED flexible circuit board. DETAILED DESCRIPTION
[0013] This part will describe the specific embodiments of the present application in detail, the preferred embodiments of the present application are shown in the drawings, the role of the drawings is to supplement the description of the text part with figures, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the present application, but it cannot be understood as a limitation on the protection scope of the present application.
[0014] In the description of the present application, it is understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore it cannot be understood as a limitation on the present application.
[0015] In the description of the present application, the meaning of several is one or more, the meaning of multiple is more than two, greater than, less than, more than, etc. is not included in the number, above, below, etc. is included in the number. If it is described as first, second, it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.
[0016] REFERENCE Figures 1 to 5The utility model discloses a LED flexible circuit board system convenient for electroplating, which comprises a flexible circuit board and an elastic conductive needle 20 electrically connected with a cathode, the flexible circuit board comprises an aluminum substrate etched with a circuit and a first insulating film 110 covered on the aluminum substrate, and a plurality of welding holes are formed on the first insulating film 110 to expose part of the aluminum substrate; the elastic conductive needle 20 is elastic to keep contact with the exposed aluminum substrate through the welding hole during relative movement with the flexible circuit board, so that a copper layer is electroplated in the welding hole. Since the aluminum substrate is etched with a circuit and covered with the first insulating film 110, and the welding holes are formed on the first insulating film 110, if the existing physical copper plating method is used, the exposed aluminum substrate at the welding hole is lower than the surface of the first insulating film due to the certain thickness of the insulating film, the electroplating rod cannot be in good contact with the aluminum substrate at the welding hole, and it is difficult to realize electroplating. The application adopts the elastic conductive needle 20, since the conductive needle 21 is elastic, it can keep good contact with the aluminum substrate in the welding hole during relative movement with the flexible circuit board, so that a copper layer is electroplated in the welding hole, the electroplating effect is good, and it is not necessary to electroplate a whole copper film on the aluminum substrate, the amount of copper is effectively reduced, and the cost is obviously saved.
[0017] The flexible circuit board can include a single layer, double layer or multi-layer aluminum substrate. In some embodiments, the aluminum substrate includes a first aluminum substrate 11, a second aluminum substrate 12, a first insulating film 110 covering the first aluminum substrate 11, a second insulating film 120 provided between the first aluminum substrate 11 and the second aluminum substrate 12, the first aluminum substrate 11 being used for etching circuit connection of components, the second aluminum substrate 12 being used for etching conductive circuit, a through hole 111 being provided on the first aluminum substrate 11, the solder holes on the first insulating film 110 including component solder holes 112 and conductive solder holes 113 opposite to the through hole 111, the first aluminum substrate 11 being exposed at the component solder holes 112, a plurality of conductive connecting holes 121 being provided on the second insulating film 120 and opposite to the conductive solder holes 113 to expose the second aluminum substrate 12, the first aluminum substrate 11 and the second aluminum substrate 12 being electrically connected through the conductive connecting holes 121 to form a conductive loop; the elastic conductive needle 20 maintains contact with the exposed second aluminum substrate 12 through the conductive solder holes 113, the through hole 111 and the conductive connecting holes 121 during relative movement with the flexible circuit board, so that a copper layer 100 is electroplated in the component solder holes 112 and the conductive solder holes 113, and the copper layer 100 is respectively adsorbed on the corresponding exposed first aluminum substrate 11 and second aluminum substrate 12. Since the first aluminum substrate 11 and the second aluminum substrate 12 are respectively etched with circuit and covered with an insulating film, and the solder holes are provided on the first insulating film 110, if the existing physical copper plating method is used, since the insulating film has a certain thickness, the exposed first aluminum substrate 11 and second aluminum substrate 12 at the solder holes are lower than the surface of the first insulating film 110, and the electroplating rod cannot be in good contact with the aluminum substrate at the solder holes, so it is difficult to achieve electroplating. The first aluminum substrate 11 and the second aluminum substrate 12 at the conductive connecting holes 121 / conductive solder holes 113 are electrically connected in the present application, so that the first aluminum substrate 11 and the second aluminum substrate 12 etched with circuit are conductive to form a conductive loop, and then the elastic conductive needle 20 is used. Since the conductive needle 21 is elastic, it can maintain good contact with the second aluminum substrate 12 in the conductive solder holes 113 during relative movement with the flexible circuit board, so that a copper layer 100 is electroplated in the solder holes, the electroplating effect is good, and there is no need to electroplate a whole copper film on the aluminum substrate, which effectively reduces the amount of copper and significantly saves costs.
[0018] As shown in Figure 2 , the conductive solder holes 113 and the component solder holes 112 each have three or more rows, and each row has a plurality of conductive solder holes 113 and component solder holes 112, meeting various specification requirements.
[0019] As shown in Figure 3 and Figure 4As shown, in some embodiments, the area of the through hole 111 is smaller than the area of the conductive connection hole 121, and the first aluminum substrate 11 is pressed onto the second aluminum substrate 12 through the conductive connection hole 121, so that the first aluminum substrate 11 is in contact with the second aluminum substrate 12, and the elastic conductive needle 20 is electrically connected to the first aluminum substrate 11 and the second aluminum substrate 12 through the conductive connection hole 121, thereby forming a conductive loop, which facilitates the electroplating of the copper layer 100 at the solder hole.
[0020] In some embodiments, the first aluminum substrate 11 and the second aluminum substrate 12 are connected by ultrasonic breakdown, and the elastic conductive needle 20 is electrically connected to the first aluminum substrate 11 and the second aluminum substrate 12 through the conductive connection hole 121, thereby forming a conductive loop, which facilitates the electroplating of the copper layer 100 at the welding hole.
[0021] In some embodiments, a conventional conductive clamp is included, one end of the conductive clamp contacts the first aluminum substrate 11 at the through hole 111, and the other end of the conductive clamp contacts the second aluminum substrate 12 at the conductive connection hole 121, so that the first aluminum substrate 11 and the second aluminum substrate 12 are conductive, and the elastic conductive needle 20 is electrically connected to the first aluminum substrate 11 and the second aluminum substrate 12 through the conductive connection hole 121, thereby forming a conductive loop, which facilitates the electroplating of the copper layer 100 at the solder hole.
[0022] like Figure 4 As shown, the elastic conductive needle 20 includes a conductive needle 21, a connector 22 and an elastic component 23. The conductive needle 21 has at least two conductive needles 21 connected to the bottom of the connector 22 respectively. The elastic component 23 is arranged above the connector 22. The elastic component 23 can be a spring. Figure 5 There is plating solution and anode copper rod in the electroplating tank, the flexible circuit board moves from left to right, the elastic conductive needle 20 is located outside the electroplating tank, and when the conductive needle 21 contacts the first insulating film 110 of the flexible circuit board, the elastic component 23 is compressed. When the conductive needle 21 moves to the recessed conductive welding hole 113, the elastic component 23 extends into the conductive welding hole 113 to make good contact with the second aluminum substrate 12, thereby achieving a good electroplating effect.
[0023] It is easy for those skilled in the art to understand that, under the premise of no conflict, the above preferred embodiments can be freely combined and superimposed.
[0024] The above are only preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the utility model concept, or directly or indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. An LED flexible wiring board system for facilitating electroplating, characterized by, The application relates to a flexible circuit board, which comprises an aluminum substrate etched with circuits and a first insulating film (110) covering the aluminum substrate, a plurality of solder holes being formed in the first insulating film (110) to expose part of the aluminum substrate; an elastic conductive needle (20) electrically connected to a cathode, the elastic conductive needle (20) being elastic to keep contact with the exposed aluminum substrate through the solder holes during relative movement with the flexible circuit board, so that a copper layer (100) is electroplated in the solder holes. The aluminum substrate comprises a first aluminum substrate (11) and a second aluminum substrate (12), the first aluminum substrate (11) being covered with the first insulating film (110), a second insulating film (120) being arranged between the first aluminum substrate (11) and the second aluminum substrate (12), the first aluminum substrate (11) being used for etching circuit lines connected with components, the second aluminum substrate (12) being used for etching conductive lines, a through hole (111) being formed in the first aluminum substrate (11), the solder holes comprising component solder holes (112) and conductive solder holes (113) opposite to the through hole (111), part of the first aluminum substrate (11) being exposed at the component solder holes (112), a plurality of conductive connecting holes (121) opposite to the conductive solder holes (113) being formed in the second insulating film (120) to expose part of the second aluminum substrate (12), the first aluminum substrate (11) and the second aluminum substrate (12) being electrically connected through the conductive connecting holes (121) to form a conductive loop; the elastic conductive needle (20) keeps contact with the exposed second aluminum substrate (12) through the conductive solder holes (113), the through hole (111) and the conductive connecting holes (121) during relative movement with the flexible circuit board, so that the copper layer (100) is electroplated in the component solder holes (112) and the conductive solder holes (113). The area of the through hole (111) is smaller than the area of the conductive connecting hole (121), and the first aluminum substrate (11) is pressed onto the second aluminum substrate (12) through the conductive connecting hole (121).
2. The LED flexible circuit board system for facilitating electroplating of claim 1, wherein: The first aluminum substrate (11) and the second aluminum substrate (12) are conductive through ultrasonic wave breakdown.
3. The LED flexible circuit board system for facilitating electroplating of claim 2, wherein: The conductive clamp is arranged in contact with the first aluminum substrate (11) at one end and in contact with the second aluminum substrate (12) at the other end, so that the first aluminum substrate (11) and the second aluminum substrate (12) are conductive.
4. The LED flexible circuit board system for facilitating electroplating of claim 2, wherein: 5. The LED flexible circuit board system for facilitating electroplating of claim 2, wherein: