Mounting structure of electronic device

Abstract

The utility model relates to a mounting structure of an electronic device. The mounting structure of the electronic device comprises a circuit board, a ceramic capacitor and a conduction frame, the circuit board is provided with a first bonding pad area and a second bonding pad area, and a first end of the ceramic capacitor is arranged in the first bonding pad area; the second end of the ceramic capacitor is arranged on the conduction frame, and the conduction frame is arranged in the second bonding pad area. According to the scheme provided by the invention, mechanical resonance generated by the ceramic capacitor and the circuit board can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to display screen technical field, especially an installation structure of electronic device. BACKGROUND

[0002] At present, ceramic capacitors are widely used in display screens, which play a role of filtering. However, the two electrodes of the current ceramic capacitor are welded on the circuit board at the same time, which will produce mechanical resonance with the circuit board under high-frequency working state, emit noise, not only affect the normal work of the display screen, but also may cause interference to other components. SUMMARY

[0003] The utility model discloses an installation structure of electronic device, which can reduce the mechanical resonance of the ceramic capacitor and the circuit board.

[0004] The utility model discloses an installation structure of electronic device, which can reduce the mechanical resonance of the ceramic capacitor and the circuit board.

[0005] The utility model discloses an installation structure of electronic device, which can reduce the mechanical resonance of the ceramic capacitor and the circuit board.

[0006] The through frame has a "Z" type cross section structure.

[0007] The utility model discloses an installation structure of electronic device, which can reduce the mechanical resonance of the ceramic capacitor and the circuit board.

[0008] The utility model discloses an installation structure of electronic device, which can reduce the mechanical resonance of the ceramic capacitor and the circuit board.

[0009] The utility model discloses an installation structure of electronic device, which can reduce the mechanical resonance of the ceramic capacitor and the circuit board.

[0010] The utility model discloses an installation structure of electronic device, which can reduce the mechanical resonance of the ceramic capacitor and the circuit board.

[0011] The utility model discloses an installation structure of electronic device, which can reduce the mechanical resonance of the ceramic capacitor and the circuit board.

[0012] The width of the first soldering pad area is same with the width of the second electrode.

[0013] The first soldering pad area and the second soldering pad area are parallel to each other.

[0014] The first pad region and the second pad region each have a rectangular cross-sectional structure.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] Through setting up the lead-through frame, the original ceramic capacitor is changed into the upright assembly, on one hand, the contact area of the ceramic capacitor and the circuit board can be reduced, and the mechanical resonance can be reduced, on the other hand, the heat dissipation efficiency can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments.

[0018] Figure 1 It is the structural schematic diagram of the mounting structure of the electronic device in an embodiment of the utility model;

[0019] Figure 2 It is the structural schematic diagram of the circuit board in an embodiment of the utility model. DETAILED DESCRIPTION

[0020] The embodiments of the present application will be described in detail with reference to the drawings. Although the embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0021] It should be understood that although the terms "first", "second", "third" and the like can be used to describe various information in the present application, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information without departing from the scope of the present application. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0022] Unless otherwise defined, the terms "mounting", "connected", "connecting", "fixed", and the like are to be construed as broad terms, for example, can be fixed connection, can also be detachable connection or integral; can be mechanical connection, can also be electrical connection; can be direct connection, can also be indirect connection through an intermediate medium, can be internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0023] At present, ceramic capacitors are widely used in display screens, which play a role of filtering and the like. However, the two electrodes of the ceramic capacitor at the present stage are simultaneously welded on the circuit board, and mechanical resonance will be generated with the circuit board in the high-frequency working state, noise is emitted, which not only affects the normal work of the display screen, but also can cause interference to other components.

[0024] In view of the above problems, the embodiment of the present application provides a mounting structure of an electronic device, which can reduce the mechanical resonance generated by the ceramic capacitor and the circuit board.

[0025] The technical scheme of the embodiment of the present application is described in detail below with reference to the drawings.

[0026] Please refer to Figure 1 and Figure 2 A mounting structure of an electronic device, comprising: a circuit board 100, a ceramic capacitor 200 and a through frame 300, the circuit board 100 is provided with a first pad area 110 and a second pad area 120, the first end of the ceramic capacitor 200 is arranged in the first pad area 110; the second end of the ceramic capacitor 200 is arranged on the through frame 300, and the through frame 300 is arranged in the second pad area 120.

[0027] It should be noted that by arranging the through frame 300, the original ceramic capacitor 200 is changed to vertical assembly, which can reduce the contact area of the ceramic capacitor 200 and the circuit board 100 on the one hand, and reduce the mechanical resonance; on the other hand, since the original ceramic capacitor 200 is installed parallel to the circuit board 100, the vertical assembly can improve the heat dissipation efficiency.

[0028] Please refer to Figure 1 In an embodiment, the through frame 300 has a "Z"-shaped cross-sectional structure.

[0029] It should be noted that the through frame 300 is a "Z"-shaped copper alloy support, the copper alloy has good electrical conductivity, and the "Z"-shaped structure has good mechanical stability, and can be stably assembled in the second pad area 120 when the ceramic capacitor 200 vibrates.

[0030] Please refer to Figure 1In an embodiment, the mounting structure of the electronic device further comprises a first electrode 400 disposed on the first end of the ceramic capacitor 200. Specifically, the mounting structure of the electronic device further comprises a second electrode 500 disposed on the second end of the ceramic capacitor 200. Specifically, the mounting structure of the electronic device further comprises a first solder layer 600, a first end of the first solder layer 600 is disposed on the first electrode 400, and a second end of the first solder layer 600 is disposed on the through-lead frame 300. Specifically, the mounting structure of the electronic device further comprises a second solder layer 700, a first end of the second solder layer 700 is disposed on the second electrode 500, and a second end of the second solder layer 700 is disposed in the first pad area 110. Specifically, the mounting structure of the electronic device further comprises a third solder layer 800, a first end of the third solder layer 800 is disposed on the through-lead frame 300, and a second end of the third solder layer 800 is disposed in the second pad area 120.

[0031] It should be noted that the solder layer is a tin paste layer, and the ceramic capacitor 200 is connected to the through-lead frame 300 through the first electrode 400.

[0032] Preferably, the width of the first pad area 110 is the same as the width of the second electrode 500.

[0033] Preferably, the first pad area 110 and the second pad area 120 are parallel to each other.

[0034] Preferably, the first pad area 110 and the second pad area 120 each have a rectangular cross-sectional structure.

[0035] It should be noted that the first pad area 110 and the second pad area 120 have a smaller spacing than the conventional pad area, which is beneficial to reduce the space occupancy rate, thereby facilitating wiring.

[0036] The scheme of the present application has been described in detail above with reference to the drawings. In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments. It should also be known by those skilled in the art that the actions and modules involved in the specification are not necessarily required by the present application. In addition, it can be understood that the steps in the method of the embodiments of the present application can be adjusted, combined and reduced in sequence according to actual needs, and the modules in the device of the embodiments of the present application can be combined, divided and reduced according to actual needs.

[0037] Having described various embodiments of the application, it is to be understood that the above description is meant not to limit and not to encompass all of the possible embodiments. Many modifications and variations of this application can be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. It is intended that the scope of the application be defined by the scope of the patent and by the claims as allowed by the patent office, which can include adaptations based on the description, equivalents, and / or substitutions of elements individually or collectively to the entire disclosure.

Claims

1. An installation structure of an electronic device, characterized by comprising: Comprising: a circuit board, a first pad area and a second pad area are opened on the circuit board; a ceramic capacitor, a first end of the ceramic capacitor is arranged in the first pad area; a lead-through frame, a second end of the ceramic capacitor is arranged on the lead-through frame, and the lead-through frame is arranged in the second pad area.

2. The mounting structure for an electronic device according to claim 1, wherein The lead-through frame has a "Z" type cross-sectional structure.

3. The mounting structure for an electronic device according to claim 1, wherein Further comprising a first electrode, the first electrode is arranged on the first end of the ceramic capacitor.

4. The mounting structure for an electronic device according to claim 3, wherein Further comprising a second electrode, the second electrode is arranged on the second end of the ceramic capacitor.

5. The mounting structure for an electronic device according to claim 4, wherein Further comprising a first solder layer, a first end of the first solder layer is arranged on the first electrode, and a second end of the first solder layer is arranged on the lead-through frame.

6. The mounting structure for an electronic device according to claim 5, wherein Further comprising a second solder layer, a first end of the second solder layer is arranged on the second electrode, and a second end of the second solder layer is arranged in the first pad area.

7. The mounting structure for an electronic device according to claim 1, wherein Further comprising a third solder layer, a first end of the third solder layer is arranged on the lead-through frame, and a second end of the third solder layer is arranged in the second pad area.

8. The mounting structure for electronic devices according to claim 4, wherein The width of the first pad area is the same as the width of the second electrode.

9. The mounting structure for electronic devices according to claim 1, wherein The first pad area and the second pad area are parallel to each other.

10. The mounting structure for an electronic device according to claim 1, wherein The first pad area and the second pad area both have a rectangular cross-sectional structure.

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