Heat dissipation device for air conditioner and air conditioner

Abstract

The utility model relates to the technical field of household appliances, and discloses a heat dissipation device for an air conditioner, the air conditioner comprises a refrigerant circulation loop and a to-be-cooled element, and the heat dissipation device comprises a heat dissipation part and a heat conduction part. The heat dissipation part is provided with a hollow cavity to form a heat dissipation flow channel, the heat dissipation flow channel communicates with the refrigerant circulation loop, heat dissipation ribs are arranged in the heat dissipation flow channel, and the heat dissipation ribs are arranged on the inner wall face of the heat dissipation flow channel in the length direction of the heat dissipation flow channel; the heat conduction part is provided with a heat dissipation surface corresponding to the element to be cooled, and the heat dissipation surface is in contact with the element to be cooled, so that heat transfer between the heat dissipation part and the element to be cooled is achieved. In this way, if the temperature of the element to be cooled in the air conditioner is larger than or equal to the temperature threshold value, the low-temperature refrigerant in the refrigerant circulation loop can flow into the cooling flow channel. Through the arrangement, the heat dissipation efficiency of the to-be-cooled element can be improved, and the to-be-cooled element is prevented from being in a high-temperature state. Meanwhile, the utility model further discloses the air conditioner.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of household appliances, for example to a heat dissipation device for an air conditioner and an air conditioner. BACKGROUND

[0002] At present, air conditioners have been widely used in people's daily life, and people can adjust the temperature in the room by air conditioners. However, with the development of society and the improvement of living standards, people's requirements for the quality of life are also getting higher and higher. For example, people will now set IPM (intelligent power module) and other main control boards in the air conditioner to integrate multiple functions into one module, thereby realizing more accurate and efficient control of the motor, which is crucial for variable frequency air conditioners. However, the above-mentioned main control board will generate heat and be in a high temperature state during use, and if it is in a high temperature state for a long time, its service life will be reduced.

[0003] In related technologies, a heat dissipation hole is generally arranged on the shell where the main control board is installed, and a fan is arranged at a position corresponding to the main control board of the air conditioner. In this way, if the temperature of the main control board is high, the fan can be turned on to make the air in the shell circulate through the heat dissipation hole, thereby achieving the effect of dissipating heat from the main control board.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:

[0005] In the related art, the existing air conditioner provided with a fan and a heat dissipation hole can only take away the heat generated by the main control board through air flow, and the heat dissipation effect is poor, and the main control board may still be in a high temperature state for a long time.

[0006] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present application, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. Invention content

[0007] In order to have a basic understanding of some aspects of the disclosed embodiments, the following is a simple summary. The summary is not a general review, nor does it determine the key / important elements or delineate the protection scope of these embodiments, but as a prelude to the detailed description below.

[0008] The embodiments of the present disclosure provide a heat dissipation device for an air conditioner and an air conditioner. In the air conditioner, when the temperature of the main control board and other heat dissipation elements is high, low-temperature refrigerant in the refrigerant circulation loop can be introduced into the heat dissipation device, and the heat dissipation device can be used to dissipate heat from the heat dissipation elements in the air conditioner. In this way, the heat dissipation efficiency of the heat dissipation elements can be improved, thereby avoiding the heat dissipation elements being in a high temperature state.

[0009] The embodiment of the present disclosure provides a heat dissipation device for an air conditioner, the air conditioner comprising a refrigerant circulation loop and a component to be cooled, the heat dissipation device comprising: a heat dissipation part and a heat conduction part. The heat dissipation part is provided with a hollow cavity to form a heat dissipation flow channel, the heat dissipation flow channel is in communication with the refrigerant circulation loop, and the heat dissipation flow channel is provided with a heat dissipation rib, which is arranged on the inner wall surface of the heat dissipation flow channel along the length direction of the heat dissipation flow channel; the heat conduction part is provided with a heat dissipation surface corresponding to the component to be cooled, and the heat dissipation surface is arranged in contact with the component to be cooled to realize heat transfer between the heat dissipation part and the component to be cooled.

[0010] In some embodiments, a plurality of heat dissipation ribs are arranged in the heat dissipation flow channel, and the plurality of heat dissipation ribs are uniformly arranged on the inner wall surface of the heat dissipation flow channel.

[0011] In some embodiments, the heat dissipation device for the air conditioner comprises a heat conduction substrate and a heat dissipation substrate. The heat conduction substrate is configured as a heat conduction part, and the heat conduction substrate forms a heat dissipation surface with a side wall surface corresponding to the component to be cooled; the heat dissipation substrate is configured as a heat dissipation part, and the heat dissipation substrate comprises a shell and a heat dissipation flow channel arranged in the shell; and the heat dissipation substrate is arranged in contact with the heat conduction substrate.

[0012] In some embodiments, the heat conduction substrate is further provided with a first fixing structure for fixing the component to be cooled to the heat dissipation surface of the heat conduction substrate.

[0013] In some embodiments, the heat conduction substrate and the heat dissipation substrate are further provided with a second fixing structure corresponding to each other, and the second fixing structure is used for fixing the heat dissipation substrate to the heat conduction substrate.

[0014] In some embodiments, a tubular cavity is arranged in the heat dissipation part to form a heat dissipation flow channel, and the heat dissipation flow channel is arranged in a bent form.

[0015] In some embodiments, the heat dissipation part is further provided with an inlet for connecting the refrigerant circulation loop and the heat dissipation flow channel; and the heat dissipation device further comprises a valve element. The valve element is arranged at the inlet and is used for unblocking or blocking the inlet.

[0016] In some embodiments, the heat dissipation device for the air conditioner further comprises a temperature sensor and a control part. The temperature sensor is used for acquiring the temperature of the component to be cooled; and the control part is electrically connected with the temperature sensor and the valve element respectively, so as to control the valve element to be unblocked or blocked according to the temperature of the component to be cooled.

[0017] In some embodiments, the heat dissipation device for the air conditioner further comprises a sealing device. The sealing device is arranged at the communication position of the heat dissipation flow channel and the refrigerant circulation loop.

[0018] The air conditioner provided by the embodiment of the present disclosure comprises: an air conditioner body and the heat dissipation device for the air conditioner. The air conditioner body comprises a component to be cooled and a refrigerant circulation loop; wherein the heat dissipation device for the air conditioner is installed at a position corresponding to the component to be cooled of the air conditioner body, and the refrigerant circulation loop is arranged in communication with the heat dissipation flow channel of the heat dissipation device.

[0019] The heat dissipation device for the air conditioner and the air conditioner provided by the embodiment of the present disclosure can achieve the following technical effects:

[0020] The heat dissipation device for the air conditioner provided by the embodiment of the present disclosure comprises: a heat dissipation part and a heat conduction part. The heat dissipation part is provided with a hollow cavity to form a heat dissipation flow channel, the heat dissipation flow channel is in communication with the refrigerant circulation loop, and the heat dissipation flow channel is provided with a heat dissipation rib, which is arranged on the inner wall surface of the heat dissipation flow channel along the length direction of the heat dissipation flow channel; the heat conduction part is provided with a heat dissipation surface corresponding to the component to be cooled, and the heat dissipation surface is arranged in contact with the component to be cooled to realize heat transfer between the heat dissipation part and the component to be cooled. In this way, if the temperature of the component to be cooled in the air conditioner is greater than or equal to the temperature threshold, the low-temperature refrigerant in the refrigerant circulation loop can flow into the heat dissipation flow channel. At this time, the low-temperature refrigerant in the heat dissipation part can absorb the heat of the component to be cooled to realize heat dissipation of the component to be cooled. In this way, the heat dissipation efficiency of the component to be cooled can be improved, and the component to be cooled can be prevented from being in a high-temperature state.

[0021] The general description above and the following description below are exemplary and explanatory only and are not intended to be limiting. BRIEF DESCRIPTION OF DRAWINGS

[0022] One or more embodiments are illustrated by way of example with reference to the accompanying drawings, which are schematic and are not intended to be limiting of the embodiments, in which like reference numerals refer to like elements in the drawings and in which:

[0023] Figure 1 Fig. 1 is a structural schematic diagram of a heat dissipation device for an air conditioner provided by an embodiment of the present disclosure;

[0024] Figure 2 Fig. 2 is a structural schematic diagram of a heat dissipation part provided by an embodiment of the present disclosure;

[0025] Figure 3 Fig. 3 is a partial structural schematic diagram of the heat dissipation part provided by an embodiment of the present disclosure;

[0026] Figure 4 Fig. 4 is a sectional view of the heat dissipation part provided by an embodiment of the present disclosure;

[0027] Figure 5is another partial structure schematic diagram of a heat dissipation part provided by an embodiment of the present disclosure;

[0028] Figure 6 is another partial structure schematic diagram of a heat dissipation part provided by an embodiment of the present disclosure;

[0029] Figure 7 is a refrigerant flow direction diagram in a heat dissipation flow channel provided by an embodiment of the present disclosure;

[0030] Figure 8 is a structure schematic diagram of a heat conduction part provided by an embodiment of the present disclosure.

[0031] Reference signs:

[0032] 11: element to be cooled; 12: refrigerant circulation loop;

[0033] 20: heat dissipation part; 21: heat dissipation flow channel; 211: heat dissipation rib; 22: liquid inlet; 23: liquid outlet; 24: sealing device; 25: valve element;

[0034] 30: heat conduction part; 31: heat dissipation surface; 32: first fixing structure. DETAILED DESCRIPTION

[0035] In order to enable a more detailed understanding of the features and technical content of the embodiments of the present disclosure, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the drawings, which are only used for reference and do not limit the embodiments of the present disclosure. In the following technical description, in order to facilitate explanation, a plurality of details are provided to provide a full understanding of the disclosed embodiments. However, one or more embodiments can still be implemented without these details. In other cases, in order to simplify the drawings, well-known structures and devices can be simplified.

[0036] The terms "first", "second", and the like in the specification and claims of the embodiments of the present disclosure and the above drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present disclosure described herein can be implemented. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.

[0037] In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "back" and the like indicate the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the embodiments of the present disclosure and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation. In addition, in addition to indicating the orientation or positional relationship, the above-mentioned part of the terms can also be used to represent other meanings, for example, the term "upper" can also be used to represent a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0038] In addition, the terms "set", "connected", "fixed" should be broadly understood. For example, "connected" can be fixedly connected, detachably connected, or integrally configured; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0039] Unless otherwise specified, the term "a plurality of" means two or more.

[0040] In the embodiments of the present disclosure, the character " / " represents an "or" relationship between the objects before and after it. For example, A / B means: A or B.

[0041] The term "and / or" is a description of the association between objects, which means that there can be three relationships. For example, A and / or B means: A or B, or, A and B, the three relationships.

[0042] It should be noted that the embodiments in the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0043] As shown in Figure 1 and Figure 8 The embodiments of the present disclosure provide a heat dissipation device for an air conditioner and an air conditioner. In the air conditioner, when the temperature of the waiting heat dissipation element 11 of the main control board is high, the low-temperature refrigerant in the refrigerant circulation loop 12 can be introduced into the heat dissipation device, and the waiting heat dissipation element 11 in the air conditioner can be cooled by the heat dissipation device. In this way, the heat dissipation efficiency of the waiting heat dissipation element 11 can be improved, and the waiting heat dissipation element 11 can be prevented from being in a high-temperature state.

[0044] As shown in Figure 1 and Figure 8As shown, an embodiment of the present disclosure provides a heat dissipation device for an air conditioner, the air conditioner including a refrigerant circulation loop 12 and a heat dissipation element 11, and the heat dissipation device includes: a heat dissipation portion 20 and a heat conducting portion 30. The heat dissipation portion 20 is provided with a hollow cavity to form a heat dissipation channel 21, the heat dissipation channel 21 is connected to the refrigerant circulation loop 12, and heat dissipation ribs 211 are provided in the heat dissipation channel 21, and the heat dissipation ribs 211 are provided on the inner wall surface of the heat dissipation channel 21 along the length direction of the heat dissipation channel 21; the heat conducting portion 30 is provided with a heat dissipation surface 31 corresponding to the heat dissipation element 11, and the heat dissipation surface 31 is provided in contact with the heat dissipation element 11 to achieve heat transfer between the heat dissipation portion 20 and the heat dissipation element 11.

[0045] Specifically, the heat dissipation element 11 can be a computer board, a chip or other component that generates heat. The heat dissipation device is provided with a liquid inlet 22 and a liquid outlet 23, and the refrigerant circulation loop 12 is connected to the heat dissipation channel 21 through the liquid inlet 22 and the liquid outlet 23. Low-temperature refrigerant flows in the pipe section of the refrigerant circulation loop 12 corresponding to the liquid inlet 22, and the flow direction of the refrigerant in the heat dissipation channel 21 is limited to flowing from the liquid inlet 22 to the liquid outlet 23. The side wall surface of the heat conducting portion 30 facing the heat dissipation element 11 constitutes a heat dissipation surface 31, and the heat dissipation element 11 is arranged in contact with the heat dissipation surface 31 to achieve heat exchange between the heat dissipation portion 20 and the heat dissipation element 11. The heat dissipation ribs 211 are arranged along the length direction of the heat dissipation channel 21, and the length of the heat dissipation ribs 211 is the same as the length of the heat dissipation channel 21, so as to increase the contact area between the refrigerant and the heat dissipation portion 20, thereby increasing the heat exchange efficiency between the heat dissipation portion 20 and the refrigerant.

[0046] like Figure 7 As shown, when the temperature of the heat dissipation element 11 is high, the low-temperature refrigerant in the refrigerant circulation loop 12 can flow into the heat dissipation channel 21 through the liquid inlet 22 and flow toward the liquid outlet 23. At this time, the low-temperature refrigerant in the heat dissipation channel 21 can absorb the heat of the heat dissipation element 11 through the heat conduction portion 30, thereby achieving rapid heat dissipation of the heat dissipation element 11. After the low-temperature refrigerant in the heat dissipation channel 21 has completed absorbing the heat of the heat dissipation element 11, the low-temperature refrigerant can flow toward the liquid outlet 23 and re-flow into the refrigerant circulation loop 12 through the liquid outlet 23, completing the refrigerant cycle.

[0047] With this arrangement, the heat of the heat dissipation element 11 can be directly absorbed by the low-temperature refrigerant to achieve rapid heat dissipation of the heat dissipation element 11, thereby improving the heat dissipation efficiency of the heat dissipation element 11 and preventing the heat dissipation element 11 from being in a high temperature state.

[0048] In practical applications, the size and shape of the heat dissipation flow channel 21 can be set according to the actual needs of the user. For example, the user can determine the size and shape of the heat dissipation flow channel 21 according to the size and shape of the element 11 to be cooled, as long as the range of heat absorption of the refrigerant in the heat dissipation flow channel 21 is greater than or equal to the size of the element 11 to be cooled.

[0049] Optionally, a heat-conducting silicone grease is applied between the element 11 to be cooled and the heat dissipation surface 31 to improve the heat exchange efficiency between the element 11 to be cooled and the heat conduction part 30.

[0050] As shown in Figure 4 and Figure 5 In some embodiments, a plurality of heat dissipation ribs 211 are arranged in the heat dissipation flow channel 21, and the plurality of heat dissipation ribs 211 are uniformly arranged on the inner wall surface of the heat dissipation flow channel 21.

[0051] Specifically, the plurality of heat dissipation ribs 211 in the heat dissipation flow channel 21 are arranged along the circumference of the heat dissipation flow channel 21, and the distance between adjacent two heat dissipation ribs 211 is the same, so as to further increase the contact area of the refrigerant and the heat dissipation part 20.

[0052] In practical applications, the number of heat dissipation ribs 211 can be set according to the actual needs of the user. For example, the number of heat dissipation ribs 211 can be 3, 5, 10, 15 or 20.

[0053] As shown in Figure 1 In some embodiments, the heat dissipation device for an air conditioner comprises a heat conduction substrate and a heat dissipation substrate. The heat conduction substrate is configured as the heat conduction part 30, and the side wall surface of the heat conduction substrate corresponding to the element 11 to be cooled constitutes the heat dissipation surface 31; the heat dissipation substrate is configured as the heat dissipation part 20, and the heat dissipation substrate comprises a housing and a heat dissipation flow channel 21 arranged in the housing; wherein the heat dissipation substrate is in contact with the heat conduction substrate.

[0054] Specifically, the heat dissipation substrate and the heat conduction substrate are respectively configured as the heat dissipation part 20 and the heat conduction part 30, and the heat dissipation substrate and the heat conduction substrate are arranged in a mutually independent form. The heat dissipation substrate and the heat conduction substrate are made of materials with good heat conduction performance, especially aluminum.

[0055] In some practical applications, the heat conduction substrate and the heat dissipation substrate are respectively configured as a cuboid or a square structure. The side wall surface of the heat dissipation substrate facing the heat conduction substrate constitutes a first heat conduction surface, and the side wall surface of the heat conduction substrate facing the heat dissipation substrate constitutes a second heat conduction surface. The first heat conduction surface and the second heat conduction surface are arranged in close contact with each other, and the first heat conduction surface and / or the second heat conduction surface is coated with a heat-conducting silicone grease to increase the heat exchange efficiency between the heat conduction part 30 and the heat dissipation part 20.

[0056] It can be understood that the heat dissipation part 20 and the heat conduction part 30 are configured as independent structures, and the user can produce or process the heat dissipation substrate and the heat conduction substrate respectively, so as to be more convenient for the user to produce or process the heat dissipation substrate and the heat conduction substrate.

[0057] As shown in Figure 1 and Figure 8 In some embodiments, the heat conduction substrate is also provided with a first fixing structure 32 for fixing the element to be cooled 11 to the heat dissipation surface 31 of the heat conduction substrate.

[0058] Specifically, the heat dissipation surface 31 of the heat conduction substrate is provided with a buckle or other clamping structure to form the first fixing structure 32, and the element to be cooled 11 can be clamped to the buckle to fix the element to be cooled 11 to the heat dissipation surface 31 of the heat conduction substrate. Alternatively, the heat conduction substrate is also provided with a fixing plate to form the first fixing structure 32, and the side of the fixing plate facing the heat dissipation surface 31 is provided with a buckle to clamp the element to be cooled 11 to the fixing plate, and the fixing plate can be fixed to the heat dissipation surface 31 by screws or bolts and the like, thereby clamping the element to be cooled 11 to the heat dissipation surface 31.

[0059] In some embodiments, the heat conduction substrate and the heat dissipation substrate are also correspondingly provided with a second fixing structure for fixing the heat dissipation substrate to the heat conduction substrate.

[0060] Specifically, the heat conduction substrate and the heat dissipation substrate are correspondingly provided with screw holes to fix the heat dissipation substrate to the heat conduction substrate by screws or bolts and the like. Alternatively, the heat conduction substrate and / or the heat dissipation substrate are correspondingly provided with clamping structures to clamp the heat dissipation substrate to the heat conduction substrate.

[0061] As shown in Figure 4 and Figure 7 In some embodiments, a tubular cavity is provided in the heat dissipation part 20 to form the heat dissipation flow channel 21, and the heat dissipation flow channel 21 is arranged in a bent form.

[0062] Specifically, a ring-shaped or S-shaped bent tubular cavity is formed in the heat dissipation part 20 to form the heat dissipation flow channel 21, and the heat dissipation surface 31 formed by the heat dissipation flow channel 21 has an area greater than or equal to that of the element to be cooled 11. In this way, the flow path of the refrigerant in the heat dissipation part 20 can be increased, thereby ensuring sufficient heat exchange between the refrigerant and the heat dissipation part 20.

[0063] In the above embodiments, the heat dissipation surface 31 of the heat dissipation flow channel 21 refers to the cross-sectional area formed between the four edges of the heat dissipation flow channel 21, which can effectively exchange heat with the heat conduction part 30.

[0064] As shown in Figure 4 and Figure 6As shown, in some embodiments, the heat dissipation unit 20 is further provided with a liquid inlet 22 for connecting the refrigerant circulation loop 12 and the heat dissipation flow channel 21; and the heat dissipation device further comprises a valve element 25. The valve element 25 is arranged at the liquid inlet 22 for opening or blocking the liquid inlet 22.

[0065] Specifically, when the temperature of the element to be cooled 11 is greater than or equal to the temperature threshold, the valve element 25 can be opened to open the liquid inlet 22. At this time, the low-temperature refrigerant in the refrigerant circulation loop 12 can flow into the heat dissipation flow channel 21 through the liquid inlet 22.

[0066] Meanwhile, when the valve element 25 is opened, the opening degree of the valve element 25 can be controlled to control the refrigerant flow at the liquid inlet 22, thereby controlling the heat dissipation efficiency of the heat dissipation device on the element to be cooled 11.

[0067] It can be understood that, when the valve element 25 is opened, the low-temperature refrigerant in the refrigerant circulation loop 12 will be branched by the heat dissipation device. Therefore, the user can control the opening degree of the valve element 25 according to the operation of the air conditioner to avoid the influence of the heat dissipation device on the refrigeration or heating efficiency of the air conditioner.

[0068] In some embodiments, the heat dissipation device for the air conditioner further comprises a temperature sensor and a control unit. The temperature sensor is used to obtain the temperature of the element to be cooled 11; and the control unit is electrically connected with the temperature sensor and the valve element 25 respectively to control the valve element 25 to open or block the liquid inlet according to the temperature of the element to be cooled 11.

[0069] Specifically, the temperature sensor is arranged at a position corresponding to the heat dissipation device and the element to be cooled 11, for example, the temperature sensor can be installed on the heat dissipation surface 31 to facilitate the temperature sensor to obtain the temperature of the element to be cooled 11.

[0070] When the temperature sensor obtains the temperature of the element to be cooled 11 greater than or equal to the temperature threshold, the temperature sensor can send a high-temperature signal to the control unit. After the control unit receives the high-temperature signal, the control unit opens the valve element 25 to open the liquid inlet 22.

[0071] Meanwhile, when the valve element 25 is opened, the control unit can also adjust the opening degree of the valve element 25 according to the temperature of the element to be cooled 11 to realize dynamic adjustment of the refrigerant flow at the liquid inlet 22.

[0072] When the temperature sensor obtains the temperature of the element to be cooled 11 less than or equal to the temperature threshold, the temperature sensor can send a low-temperature signal to the control unit. After the control unit receives the low-temperature signal, the control unit closes the valve element 25 to block the liquid inlet 22.

[0073] As Figure 3As shown, in some embodiments, the heat dissipation device for air conditioner further comprises a sealing device 24. The sealing device 24 is arranged at the communication position of the heat dissipation flow channel 21 and the refrigerant circulation loop 12.

[0074] Specifically, the inlet 22 and the outlet 23 of the heat dissipation part 20 are provided with sealing rings to seal the communication position of the heat dissipation flow channel 21 and the refrigerant circulation loop 12, thereby avoiding the leakage of refrigerant.

[0075] The embodiments of the present disclosure further provide an air conditioner comprising an air conditioner body and the heat dissipation device for air conditioner. The air conditioner body comprises a component to be cooled 11 and a refrigerant circulation loop 12; wherein the heat dissipation device for air conditioner is installed at the position corresponding to the component to be cooled 11 of the air conditioner body, and the refrigerant circulation loop 12 is arranged in communication with the heat dissipation flow channel 21 of the heat dissipation device.

[0076] Specifically, the air conditioner body comprises a casing and a refrigeration system, wherein the refrigeration system comprises the refrigerant circulation loop 12. The heat dissipation device for air conditioner is fixedly installed on the casing of the air conditioner body and arranged corresponding to the component to be cooled 11. The refrigerant circulation loop 12 is arranged in communication with the heat dissipation flow channel 21 of the heat dissipation device, so that the low-temperature refrigerant can flow into the heat dissipation flow channel 21.

[0077] In this way, the heat of the component to be cooled 11 can be directly absorbed by the low-temperature refrigerant to achieve rapid heat dissipation of the component to be cooled 11, thereby improving the heat dissipation efficiency of the component to be cooled 11 and avoiding the component to be cooled 11 in a high-temperature state.

[0078] The above description and drawings sufficiently illustrate the embodiments of the present disclosure to enable one skilled in the art to practice them. Other embodiments can include structural and other changes. The embodiments are merely representative of the possible variations. Individual components and functions are optional unless explicitly required, and the order of operations can be changed. Parts and features of some embodiments can be included or replaced by parts and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A heat dissipating device for an air conditioner, the air conditioner including a refrigerant circulation circuit and an element to be cooled, characterized by, The heat dissipation device comprises: a heat dissipation part provided with a hollow cavity to form a heat dissipation flow channel, the heat dissipation flow channel being in communication with a refrigerant circulation loop, and a heat dissipation rib being arranged in the heat dissipation flow channel along the length direction of the heat dissipation flow channel and arranged on the inner wall surface of the heat dissipation flow channel; and a heat conduction part provided with a heat dissipation surface corresponding to the element to be cooled, the heat dissipation surface being arranged in contact with the element to be cooled to realize heat transfer between the heat dissipation part and the element to be cooled.

2. The heat dissipation device according to claim 1, wherein a plurality of heat dissipation ribs are arranged in the heat dissipation flow channel, and the plurality of heat dissipation ribs are uniformly arranged on the inner wall surface of the heat dissipation flow channel.

3. The heat dissipating device of claim 1, wherein comprises: a heat conduction substrate configured as the heat conduction part, the heat conduction substrate constituting the heat dissipation surface corresponding to the side wall surface of the element to be cooled; and a heat dissipation substrate configured as the heat dissipation part, the heat dissipation substrate comprising a housing and a heat dissipation flow channel arranged in the housing; wherein the heat dissipation substrate is arranged in contact with the heat conduction substrate.

4. The heat dissipation device according to claim 3, wherein the heat conduction substrate is further provided with a first fixing structure for fixing the element to be cooled on the heat dissipation surface of the heat conduction substrate.

5. The heat dissipation device according to claim 3, wherein the heat conduction substrate and the heat dissipation substrate are further provided with a second fixing structure corresponding to each other, the second fixing structure being used for fixing the heat dissipation substrate to the heat conduction substrate.

6. The heat dissipation device according to claim 1, wherein the heat dissipation part is provided with a tubular cavity to form the heat dissipation flow channel, and the heat dissipation flow channel is arranged in a bent form.

7. The heat dissipating device according to any one of claims 1 to 6, wherein The heat dissipation part is further provided with a liquid inlet, the liquid inlet being used for connecting the refrigerant circulation loop and the heat dissipation flow channel. The heat dissipation device further comprises: a valve element arranged at the liquid inlet for unblocking or blocking the liquid inlet.

8. The heat dissipating device according to claim 7, wherein Further comprising: a temperature sensor for acquiring the temperature of the element to be cooled; and a control part electrically connected with the temperature sensor and the valve element respectively, so as to control the valve element to unblock or block the liquid inlet according to the temperature of the element to be cooled.

9. The heat dissipating device according to any one of claims 1 to 6, wherein Further comprising: a sealing device arranged at the communication position between the heat dissipation flow channel and the refrigerant circulation loop.

10. An air conditioner characterized by comprising: comprises: an air conditioner body comprising the element to be cooled and the refrigerant circulation loop; and the heat dissipation device for the air conditioner according to any one of claims 1 to 9; wherein The heat dissipation device for the air conditioner is arranged at a position corresponding to the element to be cooled of the air conditioner body, and the refrigerant circulation loop is arranged in communication with the heat dissipation flow channel of the heat dissipation device.

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