Fin, radiator and electronic equipment

Abstract

The embodiment of the utility model provides a fin, a radiator and electronic equipment, the fin comprises a fin body and a tilting part arranged on the fin body, the tilting part comprises a first end and a second end which are opposite to each other, the first end is connected to the fin body, the second end tilts relative to the fin body, and the first end is connected to the fin body. The included angle between the arrangement direction of the first end and the second end and the reference plane is an acute angle, the tilting part comprises a first side edge and a second side edge which are opposite, the first side edge and the second side edge are connected to the second end, the first side edge is parallel to the second side edge, or the first side edge is parallel to the second side edge in the direction from the first end to the second end. The first side edge extends towards the direction close to the second side edge. According to the fin, the radiator and the electronic equipment provided by the embodiment of the invention, the problems that the fins cannot achieve a better heat dissipation improvement effect due to the fact that the bulges formed by stamping cannot meet the design requirements in some embodiments, or the bulges formed by stamping can meet the design requirements but are difficult to process, and the yield is easy to be poor can be solved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of electronic equipment, and in particular to a fin, a heat sink and an electronic device. BACKGROUND

[0002] With the increasing integration of internal components of electronic equipment, the demand for the heat dissipation performance of the internal heat sink of the electronic equipment is also increasing. In some embodiments, the heat sink is generally composed of multiple fins, and the fins are generally flat fins. The heat dissipation performance of the heat sink composed of flat fins is poor. CONTENT OF THE UTILITY MODEL

[0003] Embodiments of the present application provide a fin, a heat sink and an electronic device, which can solve the problem that the protrusion formed by stamping in some embodiments does not meet the design requirements, resulting in that the fin cannot achieve good heat dissipation improvement effect, or the protrusion formed by stamping can meet the design requirements but is difficult to process and is prone to poor yield.

[0004] To achieve the above-mentioned purpose, embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, the embodiments of the present application provide a fin for assembling a heat sink, comprising: a fin body, a raised portion, comprising opposite first and second ends, the first end is connected to the fin body, the second end is raised relative to the fin body, the included angle between the arrangement direction of the first end and the second end and the reference plane is an acute angle, the reference plane is perpendicular to the thickness direction of the fin body, the raised portion comprises opposite first and second side edges, the first and second side edges are connected to the second end, the first side edge is parallel to the second side edge, or in the direction from the first end to the second end, the first side edge extends toward the direction close to the second side edge.

[0006] The fin provided by the embodiments of the present application is provided with a raised portion on the fin body, the raised portion is arranged at an acute angle with the fin body, and the first side edge of the raised portion is parallel to the second side edge, or in the direction from the first end to the second end, the first side edge extends toward the direction close to the second side edge. When the gas flows from the first end to the second end, a vortex wake can be formed behind the second end, the included angle is reduced, and the heat exchange performance of the fin can be improved. In addition, the length of the raised portion in the arrangement direction of the first end and the second end can be adjusted according to specific working conditions, so that the raised portion meets the required height, and the problem that the protrusion formed by stamping in some embodiments does not meet the design requirements, resulting in that the fin cannot achieve good heat dissipation improvement effect, or the protrusion formed by stamping can meet the design requirements but is difficult to process and is prone to poor yield.

[0007] In a possible implementation, the fin body is provided with an opening, the opening penetrates through both sides of the fin body in the thickness direction, and the raised portion is connected to the edge of the opening.

[0008] In this way, the additional weight of the fins is not increased, which is conducive to reducing the weight of the heat sink, thereby facilitating the lightening of the electronic device. In addition, the opening allows heat exchange between the heat flows between each pair of fins in the heat sink, which is conducive to balancing the temperature in the heat sink and avoiding the occurrence of overheated areas, thereby improving the heat dissipation performance of the heat sink.

[0009] In a possible implementation, the raised portion and the fin body are an integral piece.

[0010] In a possible implementation, the raised portion is a plurality of raised portions, each of which has a field synergy improvement area, and the normal projections of the field synergy improvement areas corresponding to different raised portions on the reference plane do not overlap. The arrangement of the raised portions in this way allows the field synergy improvement areas to be closely connected and not interfere with each other, and as many raised portions as possible can be arranged on the fin body, thereby enhancing the heat exchange effect of the fins.

[0011] In a possible implementation, the raised portion and the field synergy improvement area corresponding thereto are arranged in a first direction, two adjacent raised portions in the first direction are a first raised portion and a second raised portion, the field synergy improvement area of the first raised portion is located between the first raised portion and the second raised portion, the spacing between the first raised portion and the second raised portion in the first direction is a first size, the size of the field synergy improvement area of the first raised portion in the first direction is a second size, and the first size is equal to the second size.

[0012] In a possible implementation, N columns of raised portions are arranged on the fin body in the first direction, N is a positive integer greater than or equal to 2, and two adjacent columns of raised portions are arranged staggered in a second direction, the second direction is perpendicular to the first direction, and the second direction is perpendicular to the thickness direction of the fin body.

[0013] In this way, as many raised portions as possible can be arranged on the fin body, thereby improving the energy conversion performance of the fins.

[0014] In a possible implementation, when N is greater than or equal to 3, three columns of raised portions adjacent in the first direction are a first column of raised portions, a second column of raised portions, and a third column of raised portions, each raised portion in the first column of raised portions has a gap with each raised portion in the second column of raised portions in the second direction, and the raised portions in the third column of raised portions are arranged in the gap.

[0015] In a possible implementation, the heat sink has opposite air inlet end and air outlet end, and the first end is connected to the fin body in a direction perpendicular to the air inlet end and pointing to the air outlet end. In this way, the spoiler effect of the raised portion can be enhanced.

[0016] In a possible implementation, the angle between the arrangement direction of the first end and the second end and the reference plane is greater than 0° and less than or equal to 45°. In this way, the flow resistance can be reduced.

[0017] In a possible implementation, the size between the first end and the second end is a third size, and the maximum size of the raised portion in a second direction is a fourth size, the ratio of the third size to the fourth size is less than or equal to 5, the second direction is perpendicular to the arrangement direction of the first end and the second end, and the second direction is perpendicular to the thickness direction of the fin body. In this way, the raised portion in the first direction can be prevented from being too long, and the heat conduction area of the fin body can be prevented from being occupied too much.

[0018] In a possible implementation, the heat sink has opposite air inlet end and air outlet end, and the first end is connected to the fin body in a direction parallel to the air inlet end and pointing to the air outlet end.

[0019] In a possible implementation, the heat sink has opposite air inlet end and air outlet end, and the first end is connected to the fin body in a direction parallel to the air inlet end and pointing to the air outlet end.

[0020] The heat sink provided by the embodiments of the present application can form a vortex wake on the side of the heat conduction rod away from the air outlet end when the gas flows from the air inlet end to the air outlet end, reduce the cooperative angle, and improve the heat exchange performance of the heat sink. In addition, since the heat conduction rod penetrates the fins in the heat sink, the distance between two adjacent fins is the height of the cooperative angle improvement structure, which can solve the problem that the protrusions formed by stamping do not meet the design requirements in some embodiments, so that the fins cannot achieve good heat dissipation improvement effect, or the protrusions formed by stamping meet the design requirements but are difficult to process and have poor yield.

[0021] In a possible implementation, the plurality of heat-conducting rods each have a field synergy improvement zone, and the field synergy improvement zones corresponding to different heat-conducting rods do not overlap in orthographic projection on the fins. The plurality of field synergy improvement zones of the heat-conducting rods arranged in this way are closely connected and do not interfere with or mix with each other, and the heat-conducting rods can be arranged on the fins as much as possible, thereby enhancing the heat exchange effect of the heat sink.

[0022] In a possible implementation, the heat-conducting rods and the field synergy improvement zones corresponding to the heat-conducting rods are arranged in a first direction, two adjacent heat-conducting rods in the first direction are a first heat-conducting rod and a second heat-conducting rod, the field synergy improvement zone of the first heat-conducting rod is located between the first heat-conducting rod and the second heat-conducting rod, the spacing between the first heat-conducting rod and the second heat-conducting rod in the first direction is a fifth size, and the size of the field synergy improvement zone of the first heat-conducting rod in the first direction is a sixth size. The fifth size is equal to the sixth size.

[0023] In a possible implementation, N columns of heat-conducting rods are arranged in the first direction in the heat sink, N is a positive integer greater than or equal to 2, and two adjacent columns of heat-conducting rods are arranged staggered in a second direction. The second direction is perpendicular to the first direction, and the second direction is perpendicular to the thickness direction of the fins. In this way, the heat-conducting rods can be arranged on the fins as much as possible, thereby improving the energy conversion performance of the heat sink.

[0024] In a possible implementation, when N is greater than or equal to 3, three columns of heat-conducting rods adjacent in the first direction are a first column of heat-conducting rods, a second column of heat-conducting rods, and a third column of heat-conducting rods. Each heat-conducting rod in the first column of heat-conducting rods has a gap with each heat-conducting rod in the second column of heat-conducting rods in the second direction, and the heat-conducting rods in the third column of heat-conducting rods are arranged in the gap.

[0025] In a possible implementation, the ratio of the maximum size of the heat-conducting rod in the first direction to the maximum size of the heat-conducting rod in the second direction is less than or equal to 5. In this way, the size of the heat-conducting rod in the first direction can be prevented from being too long, and the heat-conducting area of the fin body can be prevented from being occupied too much.

[0026] In a possible implementation, the fins are provided with through holes, and the heat-conducting rods are in interference fit with the through holes. In this way, the stability of the heat-conducting rods inserted into the fins can be improved.

[0027] In a fourth aspect, the embodiments of the present application provide an electronic device, including a main body and a heat sink as described above arranged in the main body.

[0028] In a possible implementation, the electronic device is a laptop computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of the structure of an electronic device provided in one embodiment of the present application;

[0030] Figure 2 for Figure 1 A schematic diagram of an electronic device in a folded state;

[0031] Figure 3 for Figure 1 A schematic diagram of the exploded structure of a keyboard host of an electronic device;

[0032] Figure 4 for Figure 2 A partial schematic diagram of the cross-sectional structure of the electronic device along the cutting line AA;

[0033] Figure 5 is a schematic structural diagram of a radiator in some embodiments;

[0034] Figure 6 Schematic diagram of thermal simulation of straight fins in some embodiments;

[0035] Figure 7 Schematic diagram of the structure of fins in some embodiments;

[0036] Figure 8 for Figure 7 Schematic diagram of the cross-section structure along the cutting line BB;

[0037] Figure 9 Schematic diagram of thermal simulation of protrusions provided on straight fins in some embodiments;

[0038] Figure 10 A schematic diagram of the structure of a radiator provided in one embodiment of the present application Figure 1 ;

[0039] Figure 11 for Figure 10 A schematic diagram of the structure of the fins in the radiator shown in FIG;

[0040] Figure 12 for Figure 11 Schematic diagram of the cross-section structure along the cutting line CC;

[0041] Figure 13 Schematic diagram of the vortex wake formed by the raised portion in the embodiment of the present application;

[0042] Figure 14 Schematic diagram of a raised portion that cannot form a vortex wake;

[0043] Figure 15Arrangement of the raised portion on the fin body in an embodiment of the present application Figure 1 ;

[0044] Figure 16 Arrangement of the raised portion on the fin body in an embodiment of the present application Figure 2 ;

[0045] Figure 17 Arrangement of the raised portion on the fin body in an embodiment of the present application Figure 1 ;

[0046] Figure 18 Arrangement of the raised portion on the fin body in an embodiment of the present application Figure 2 ;

[0047] Figure 19 Arrangement of the raised portion on the fin body in an embodiment of the present application Figure 3 ;

[0048] Figure 20 Arrangement of the raised portion on the fin body in an embodiment of the present application Figure 4 ;

[0049] Figure 21 Arrangement of the raised portion on the fin body in an embodiment of the present application Figure 5 ;

[0050] Figure 22 Arrangement of the raised portion on the fin body in an embodiment of the present application Figure 6 ;

[0051] Figure 23 Structure of the heat dissipation device provided in an embodiment of the present application Figure 2 ;

[0052] Figure 24 Structure of the heat dissipation device provided in an embodiment of the present application

[0053] Explanation of reference signs:

[0054] 1000 - heat dissipation device; 1100 - shell; 1110 - ventilation cavity; 1200 - fin; 1300 - air inlet end; 1400 - air outlet end

[0055] 2000 - fin; 2100 - protrusion

[0056] 100 - electronic device

[0057] 1 - display; 11 - display screen; 12 - back shell

[0058] 2-keyboard host; 21-housing; 21a-air inlet; 21b-air outlet; 22-keyboard; 23-circuit board; 24-heat dissipation fan; 24a-air outlet; 25-heat conducting member; 25a-first heat conducting section; 25b-second heat conducting section;

[0059] 3-rotary mechanism.

[0060] 200-radiator; 210-housing; 220-fins; 221-fins body; 222-raised portion; 222a-first end; 222b-second end; 222c-first side edge; 222d-second side edge; 223-opening; 230-ventilation channel; 240-air inlet end; 250-air outlet end; 260-ledge;

[0061] 300-radiator; 310-housing; 320-heat conducting rod; 321-first side face; 322-second side face; 330-fins; 340-ventilation channel; 350-air inlet end; 360-air outlet end. DETAILED DESCRIPTION

[0062] The terms used in the embodiments of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application. The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0063] The present application provides an electronic device, which includes but is not limited to a mobile phone, a pad, a laptop, a television, a smart wearable product (such as a smart watch, a smart bracelet, etc.), a virtual reality (VR) device, an augmented reality (AR) device, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), etc. The form of the electronic device in the embodiments of the present application is not specifically limited, as long as it can include the radiator shown below. For the convenience of understanding, the electronic device in the embodiments of the present application is taken as a laptop for illustration.

[0064] Figure 1 The structural schematic diagram of the electronic device 100 provided by an embodiment of the present application is shown in FIG. 1. As shown in FIG. 1, the electronic device 100 provided by the embodiments of the present application can include a display 1 (also referred to as a screen end), a keyboard host 2 (also referred to as a system end) and a rotary mechanism 3. Figure 1

[0065] ​The display 1 is used for displaying images, videos, etc. The display 1 comprises a display screen 11 and a back shell 12. The display screen 11 can be a flexible display screen or a rigid display screen. The back shell 12 is used for protecting the display screen 11. The back shell 12 can wrap around the edges of the display screen 11 and the back of the display screen 11.

[0066] The keyboard host 2 is used for inputting instructions and data, and controlling the display 1 to display images, videos, etc. according to the inputted instructions and data.

[0067] The keyboard host 2 and the display 1 are rotatably connected through the hinge mechanism 3. The rotatable connection between the keyboard host 2 and the display 1 enables the electronic device 100 to switch between an open state and a folded state. When the electronic device 100 is in the open state, the included angle a between the display 1 and the keyboard host 2 is greater than 0° and less than 360°. It should be noted that the "included angle a between the keyboard host 2 and the display 1" in the embodiments of the present application refers to the angle between the display surface of the display 1 and the keyboard surface of the keyboard host 2.

[0068] In order to facilitate the description of each of the following embodiments, an XYZ coordinate system is established for the keyboard host 2. Specifically, the extension direction of the rotation center line of the keyboard host 2 and the display 1 is defined as the X-axis direction, the thickness direction of the keyboard host 2 is defined as the Z-axis direction, and the direction perpendicular to both the X-axis and Z-axis directions is defined as the Y-axis direction. It can be understood that the coordinate system of the keyboard host 2 can be flexibly set according to actual needs, which is not limited here.

[0069] Please continue to refer to Figure 1 , the keyboard host 2 comprises a shell 21 and a keyboard 22.

[0070] The shell 21 serves as the support "skeleton" of the keyboard host 2, and is used for supporting and fixing the keyboard 22. The shell 21 has a containing space for containing circuit devices (not shown in the figure). The circuit devices include, but are not limited to, a circuit board 23, etc.

[0071] The keyboard 22 is installed on the side of the shell 21 close to the display 1 when the electronic device 100 is in the folded state. Exemplarily, the connection mode between the keyboard 22 and the shell 21 includes, but is not limited to, gluing, welding, clamping or screw connection. Instructions and data, etc. can be input to the keyboard host 2 through the keyboard 22.

[0072] Figure 2 For Figure 1 the schematic view of the electronic device 100 in the folded state, please refer to Figure 2When the electronic device 100 is in the folded state, the display 1 and the keyboard host 2 are arranged in a stacked manner. In this state, the volume of the electronic device 100 can be reduced, and the display surface of the display 1 and the keyboard surface of the keyboard host 2 can be protected from scratches and dust.

[0073] It is worth understanding that the electronic device 100 also has an intermediate opening state, which is any state between the fully open state and the folded state. When the electronic device 100 is in the intermediate opening state, the included angle α between the display 1 and the keyboard host 2 is smaller than the maximum opening angle in the fully open state and larger than 0° in the folded state. In other words, the intermediate opening state is on the switching path of the electronic device 100 between the folded state and the fully open state.

[0074] Figure 3 For Figure 1 the exploded structural view of the keyboard host 2 of the electronic device 100, Figure 4 For Figure 2 the exploded structural view of the electronic device 100, Figure 3 and Figure 4 As shown in FIGS. 1 and 2, the shell 21 has an air inlet 21a and an air outlet 21b. Exemplarily, the air inlet 21a is arranged on a side wall plate of the shell 21 away from the keyboard surface in the Z direction, and the air outlet 21b is arranged on a side wall plate of the shell 21 in the Y direction. The air inlet 21a and the air outlet 21b are both in communication with the accommodation space Q of the shell 21. In this way, external air can enter the interior of the shell 21 through the air inlet 21a, and after heat exchange with the circuit devices in the interior of the shell 21, the external air is discharged through the air outlet 21b to perform heat dissipation treatment on the keyboard host 2.

[0075] Please continue to refer to Figure 3 and Figure 4 The keyboard host 2 further includes a circuit board 23, a heat dissipation fan 24, a heat sink 200, and a heat conduction member 25.

[0076] The circuit board 23 is installed in the accommodation space Q. Exemplarily, the circuit board 23 can be installed in the accommodation space Q by means of adhesion, welding, clamping, or screw connection, etc.

[0077] The circuit board 23 can be a hard circuit board, a flexible circuit board, or a soft and hard combined circuit board. The circuit board 23 can adopt an FR-4 dielectric plate, a Rogers dielectric plate, a mixed dielectric plate of Rogers and FR-4, etc.

[0078] The circuit board 23 is used to integrate electronic components. The electronic components include, but are not limited to, central processing units (CPUs), graphics processing units (GPUs), resistors, capacitors, inductors, potentiometers, tubes, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, etc.

[0079] The heat dissipation fan 24 is installed in the accommodation space Q. In this example, the heat dissipation fan 24 can be installed in the accommodation space Q by means of adhesion, welding, clamping or screw connection, etc.

[0080] The heat dissipation fan 24 is used to make the air outside the shell 21 enter the accommodation space Q through the air inlet 21a, and then be discharged through the air outlet 21b to form an air flow. In some embodiments, the heat dissipation fan 24 can be a centrifugal fan, and the axial direction of the heat dissipation fan 24 is consistent with the Z-axis. The centrifugal fan has a small size along the axial direction, and occupies a small height in the shell 21, which is conducive to the thinning of the keyboard host 2. In other embodiments, the heat dissipation fan 24 can also be an axial fan or a cross-flow fan, etc., which is not specifically limited here.

[0081] On this basis, the number of heat dissipation fans 24 can be two. The air inlets 21a and the air outlets 21b are respectively two, and one heat dissipation fan 24 corresponds to one air inlet 21a and one air outlet 21b. Each heat dissipation fan 24 has an inlet and an air outlet 24a. The inlet of the heat dissipation fan 24 is opposite to and communicates with the corresponding air inlet 21a. The air outlet 24a of each heat dissipation fan 24 is opposite to and communicates with the corresponding air outlet 21b.

[0082] In other examples, the air inlets 21a and the heat dissipation fans 24 can not be in a one-to-one correspondence. The air outlets 21b and the heat dissipation fans 24 can also not be in a one-to-one correspondence. For example, the inlets of all heat dissipation fans 24 can be opposite to and communicate with the same air inlet 21a, and the air outlets 24a of all heat dissipation fans 24 can be opposite to and communicate with the same air outlet 21b.

[0083] In addition, the number of heat dissipation fans 24 can also not be limited to two. In other examples, the number of heat dissipation fans 24 can also be one, three or four.

[0084] The heat sink 200 is located in the accommodation space Q, and the heat sink 200 is between the air outlet 24a and the air outlet 21b. In this example, the number of heat sinks 200 corresponds to the number of heat dissipation fans 24, and the heat sink 200 is arranged at the air outlet 24a of each heat dissipation fan 24.

[0085] The heat conducting member 25 includes, but is not limited to, a vapor chamber or a heat pipe. The heat pipe includes a pipe shell, a wick, and an end cap. The pipe shell is formed as a hollow structure, and the wick is covered on the inner wall of the pipe shell. After the pipe shell is pumped to a negative pressure and filled with an appropriate amount of working liquid, the wick capillary porous material close to the inner wall of the pipe is filled with liquid, and then sealed by the end cap. When one end of the heat pipe (i.e. the evaporation section) is heated, the liquid in the wick vaporizes, and the vapor flows to the other end (i.e. the condensation section) under a small pressure difference, releases heat and condenses into liquid, and the liquid flows back to the evaporation section along the porous material under the action of capillary force. This cycle operates to achieve rapid heat transfer effect.

[0086] The vapor chamber, also known as the vapor chamber (VC), is a hollow cavity with a microstructure on the inner wall, usually made of copper, and filled with cooling liquid. When heat is conducted to the evaporation section from the heat source, the cooling liquid in the vacuum cavity begins to vaporize after being heated in a low vacuum environment. At this time, the heat energy is absorbed and the volume expands rapidly. The gas phase cooling medium quickly fills the entire hollow cavity. When the gas phase working medium contacts a relatively cold area, condensation occurs. The condensation releases the heat accumulated during evaporation. The condensed cooling liquid returns to the evaporation heat source through the microstructure capillary channel. This operation is repeated in the cavity to achieve rapid heat transfer effect.

[0087] The heat conducting member 25 is located on one side of the circuit board 23 in the Z-axis direction and is in thermal conduction connection with the circuit board 23.

[0088] Specifically, the heat conducting member 25 includes a first heat conducting section 25a and a second heat conducting section 25b.

[0089] The first heat conducting section 25a serves as the evaporation section of the heat conducting member 25, i.e. the first heat conducting section 25a serves as the section of the heat conducting member 25 that first contacts the heat source. Therefore, the heat conducting member 25 can be in thermal conduction connection with the circuit board 23 through the first heat conducting section 25a. Since the circuit board 23 is located in the accommodation space Q, the first heat conducting section 25a can be arranged in the accommodation space Q.

[0090] The second heat conducting section 25b is arranged in the plane formed by the X-axis and the Y-axis and connected with the first heat conducting section 25a. The second heat conducting section 25b serves as the condensation section of the heat conducting member 25, i.e. the section of the heat conducting member 25 for heat dissipation.

[0091] The heat sink 200 is fixed to the second heat conducting section 25b and is in thermal conduction connection with the second heat conducting section 25b. For example, the heat sink 200 can be welded, clamped or glued to the second heat conducting section 25b.

[0092] In this way, the heat generated by the electronic components on the circuit board 23 can be transferred to the first heat-conducting section 25a, and then further transferred to the second heat-conducting section 25b, and then to the heat sink 200. The heat is exchanged with the airflow flowing through the heat sink 200 in a forced convection manner by the cooling fan 24 at the heat sink 200, so as to achieve the purpose of cooling the electronic device 100.

[0093] The number of the second heat-conducting sections 25b on the single heat-conducting member 25 can be one or more than one, and Figure 3 In the embodiment shown, the number of the second heat-conducting sections 25b is two. The two second heat-conducting sections 25b are respectively located at the opposite ends of the first heat-conducting section 25a in the X-axis direction. The number of the heat sinks 200 is the same as the number of the second heat-conducting sections 25b, and one-to-one correspondence. Of course, the present application is not limited thereto. In other examples, when the heat sink 200 is one, the second heat-conducting section 25b is also one. Alternatively, a plurality of second heat-conducting sections 25b can also be connected to one heat sink 200 at the same time.

[0094] Figure 5 For the structural schematic diagram of the heat sink 1000 in some embodiments, please refer to Figure 5 In some embodiments, the heat sink 1000 includes a shell 1100 and a plurality of fins 1200. The shell 1100 has a ventilation cavity 1110, and the plurality of fins 1200 are arranged in parallel and at intervals in the ventilation cavity 1110. The ventilation cavity 1110 has an air inlet end 1300 and an air outlet end 1400, and the extending direction of the fins 1200 is parallel to the direction in which the air inlet end 1300 points to the air outlet end 1400, that is, the plurality of fins 1200 are arranged in parallel and at intervals in the X-axis direction in Figure 5 , and the extending direction of each fin 1200 is parallel to the Y-axis direction.

[0095] Please refer to Figure 5 and in combination with Figure 4 shown, if the heat sink 1000 in Figure 5 is applied to the electronic device 100, that is, the heat sink 1000 replaces the heat sink 200 in Figure 4 . The air inlet end 1300 of the heat sink 1000 can be arranged opposite to the air outlet 24a of the cooling fan 24, and the air outlet end 1400 of the heat sink 1000 can be arranged opposite to the air outlet 21b of the shell 21. When the heat generated by the electronic components on the circuit board 23 is transferred to the heat sink 1000 by the second heat-conducting section 25b. The heat is exchanged with the airflow flowing through the heat sink 1000 in a forced convection manner by the cooling fan 24 at the heat sink 1000. By increasing the heat dissipation area of the heat sink 1000 through the plurality of fins 1200, the heat generated by the circuit board 23 is efficiently discharged to the body of the electronic device 100, and the heat dissipation of the electronic device 100 is achieved.

[0096] However, the fins 1200 in some embodiments are generally flat, which cannot well play the heat dissipation performance of the fins 1200. Here, the special term "field synergy theory" and "synergy angle" are introduced.

[0097] The "field synergy theory" is a theoretical method for optimizing the convective heat transfer process, which explains the physical mechanism of convective heat transfer from the perspective of the cooperation of flow field and temperature field, and systematically discusses the field synergy strengthening and optimization theory of convective heat transfer. The core of the field synergy theory is the synergy of the velocity field and the temperature field in the process of convective heat transfer. The theory believes that the strength of convective heat transfer depends not only on the absolute values of the velocity field and the temperature field, but also on the included angle between them. When the included angle between the velocity field and the temperature gradient field is as small as possible, the convective heat transfer effect is best.

[0098] The "synergy angle" is a physical quantity describing the included angle between the temperature gradient and the velocity vector in the process of flow and heat transfer. It reflects the efficiency of heat transfer in the process of fluid flow. The smaller the synergy angle, the more consistent the direction of the temperature gradient and the velocity vector, and the higher the heat transfer effect.

[0099] Figure 6 For the thermal simulation diagram of the flat fin in some embodiments, refer to Figure 6 The simulation results show that when the heat sink 1000 is working, the synergy angle of the flat fin 1200 is generally 90°, which is in the worst state of heat dissipation.

[0100] Theoretical results and experimental results prove that the heat transfer capacity of the flat fin 1200 can be improved by using the field synergy principle. For example, the flow direction of the air flow can be changed by setting a convex on the flat fin 1200, and vortexes can be created to change the synergy angle, which can effectively improve the heat transfer capacity of the fin 1200 and improve the heat dissipation performance of the electronic device 100.

[0101] In order to achieve the purpose of improving the heat transfer capacity of the flat fin by using the field synergy principle, Figure 7 For the structure diagram of the fin 2000 in some embodiments, Figure 8 For Figure 7 The cross-sectional structure diagram along the cutting line B-B in the fin 2000 is shown in Figure 7 And Figure 8 A plurality of protrusions 2100 are arranged on the fin 2000. Figure 9 For the thermal simulation diagram of the flat fin with protrusions in some embodiments, refer to Figure 9 The flow direction of the air flow can be changed by the protrusions 2100, vortexes can be created to reduce the synergy angle, and the heat transfer capacity of the fin 2000 can be improved. In order not to increase the weight of the fin 2000 and simplify the process flow of forming the protrusions 2100, the protrusions 2100 can be made by stamping process.

[0102] However, due to the development trend of thin and light electronic devices, the fins are generally made of metal materials with a thickness of 0.1 mm or less. Due to the excessively thin fins, the height and shape of the protrusions formed by stamping are greatly limited, and the stamping yield is also poor. The height of the protrusions has a great influence on the heat dissipation performance of the fins. If the protrusions cannot meet a certain height, the heat dissipation performance of the fins will be limited. Based on the reason that the fins are too thin, the protrusions formed by stamping often fail to meet the design requirements, resulting in that the fins cannot achieve good heat dissipation improvement effect, or the protrusions formed by stamping can meet the design requirements but are difficult to process and prone to poor yield.

[0103] To solve the above problems, the fin and the heat sink provided by the embodiments of the present application can solve the problem that the protrusions on the fins fail to meet the design height, resulting in that the fins cannot achieve good heat dissipation performance improvement effect, or the protrusions formed by stamping can meet the design requirements but are difficult to process and prone to poor yield.

[0104] The fin and the heat sink provided by the embodiments of the present application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0105] Figure 10 Structure diagram of the heat sink 200 provided by an embodiment of the present application Figure 1 , as shown in Figure 10 , the heat sink 200 provided by the embodiments of the present application includes a shell 210 and at least one fin 220 arranged in the shell 210, Figure 10 The fin 220 is exemplarily illustrated as a plurality of fins.

[0106] The shell 210 can include a top plate, a bottom plate, and two side plates connected to the top plate and the bottom plate, and the top plate, the bottom plate, and the two side plates form a ventilation channel 230 that can allow air to flow. The shell 210 is open at both ends in the first direction, and the two end openings are respectively an air inlet end 240 and an air outlet end 250. In the present application, the Y-axis positive direction in the three-dimensional coordinate system established with respect to the electronic device 100 is defined as the first direction. The plurality of fins 220 are arranged in the heat sink 200 parallel to the first direction. In combination with Figure 4 , the air inlet end 240 can be arranged opposite to the air outlet 24a of the heat dissipation fan 24, and the air outlet end 250 can be arranged opposite to the air outlet 21b of the shell 21 of the electronic device 100. The shell 210 also has a boss 260. The boss 260 is arranged to adapt to the shape of the shell 21 of the electronic device 100, to increase the volume of the heat sink 200 as much as possible, thereby improving the heat dissipation performance of the heat sink 200. Of course, in other embodiments, the heat sink 200 can also be a regular shape such as a rectangular body, a trapezoidal body, a cylindrical body, etc., and can also be an irregular shape. The shape of the heat sink 200 is not limited in the embodiments of the present application.

[0107] Figure 11 for Figure 10 For a schematic diagram of the structure of the fin 220 in the heat sink 200, please refer to Figure 11 Combined with Figure 10 As shown, the fin 220 includes a fin body 221 , and the fin body 221 is arranged parallel to the first direction.

[0108] Figure 12 for Figure 11 For the cross-sectional structure diagram along the cutting line CC, please refer to Figure 12 Combined with Figure 11 As shown, the fin 220 further includes a raised portion 222, which has a first end 222a and a second end 222b opposite to each other. The first end 222a is connected to the fin body 221, and the second end 222b is raised relative to the fin body 221. The angle between the arrangement direction of the first end 222a and the second end 222b and the reference plane is an acute angle, wherein the reference plane is perpendicular to the thickness direction of the fin body 221, that is, Figure 12 When air flows into the air inlet end 240 of the heat sink 200 , the air flows from the first end 222 a of the tilted portion 222 to the second end 222 b.

[0109] The tilting portion 222 has a first side 222c and a second side 222d opposite to each other. The first side 222c and the second side 222d are both connected to the second end 222b. In the direction from the first end 222a to the second end 222b of the tilting portion 222, the first side 222c can extend toward the direction close to the second side 222d. It can be understood that on the tilting portion 222, the two opposite sides connected to the second end 222b are in a gathered shape. For example, Figure 11 In the figure, the raised portion 222 can be triangular, such as an equilateral triangle. The base of the equilateral triangle raised portion 222 is the first end 222a of the raised portion 222, and the vertex of the equilateral triangle raised portion 222 is the second end 222b. The two sides of the equilateral triangle near the second end 222b converge at the vertex, which can also be seen as extending from the first end 222a to the second end 222b, with the first side 222c extending toward the second side 222d. The convergent sides can guide the airflow. Because the raised portion 222 is arranged at an acute angle to a reference plane perpendicular to the thickness direction of the fin body 221, a vortex wake can be formed behind the second end 222b of the raised portion 222 in accordance with the airflow direction. The area where the vortex wake exists is the field synergy improvement zone. The vortex wake can reduce the field synergy angle and improve the heat exchange capacity of the fin 220.

[0110] Of course, in some embodiments of the present application, the first side edge 222c can also be parallel to the second side edge 222d, that is, the two side edges of the raised portion 222 close to and connected to the second end 222b are parallel, for example Figure 13 As shown in the examples, Figure 13 Three cases in which the vortex wake can be formed behind the second end 222b of the raised portion 222 are exemplified, which are a circular raised portion 222, a triangular raised portion 222 and a rectangular raised portion 222, and the common point of the three examples is that the two side edges of the raised portion 222 close to and connected to the second end 222b are parallel or convergent, so that the raised portion 222 can form a vortex wake behind the second end 222b. As Figure 14 In the examples, the two side edges of the raised portion 222 close to and connected to the second end 222b are divergent, and the case that the vortex wake cannot be formed behind the second end 222b is not applicable to the embodiments of the present application.

[0111] Based on the above, the shape of the raised portion 222 is not specifically limited in the embodiments of the present application, for example, the raised portion 222 can be triangular, rectangular, diamond-shaped, trapezoidal, circular or semicircular, etc., as long as the first side edge 222c is parallel to the second side edge 222d, or in the direction from the first end 222a to the second end 222b, the first side edge 222c extends towards the direction close to the second side edge 222d.

[0112] It can be understood that the fin 220 provided by the embodiments of the present application can form a vortex wake behind the second end 222b when the gas flows from the first end 222a to the second end 222b, reduce the cooperative angle, and improve the heat exchange performance of the fin 220 by setting the raised portion 222 on the fin body 221, the raised portion 222 is set at an acute angle with the fin body 221, and the first side edge 222c of the raised portion 222 is parallel to the second side edge 222d, or in the direction from the first end 222a to the second end 222b, the first side edge 222c extends towards the direction close to the second side edge 222d. Furthermore, the length of the raised portion 222 in the arrangement direction of the first end 222a and the second end 222b can be adjusted according to specific working conditions, so that the raised portion 222 meets the required height, and the problem that the protrusion formed by stamping in some embodiments does not meet the design requirements, resulting in that the fin 220 cannot obtain better heat dissipation improvement effect, or the protrusion formed by stamping meets the design requirements but is difficult to process and is prone to poor yield can be solved.

[0113] It should be noted that the fin 220 provided by the embodiments of the present application can be configured to be used in the heat sink 200, a plurality of fins 220 can form a fin group for use, and a single fin 220 can also be used.

[0114] In the fin 220 provided in the embodiment of the present application, the raised portion 222 can be formed by welding, clamping, bonding, etc. on the basis of the straight fin. Figure 11 and Figure 12 As shown, in some embodiments of the present application, an opening 223 is provided on the fin body 220. The opening 223 extends through both sides of the fin body 220 in the thickness direction, and the raised portion 222 is connected to the edge of the opening. Regarding the formation of the opening 223, for example, the shape of the raised portion 222 can be cut out on the fin body 221 and the raised portion 222 is bent to form the opening 223. It can be understood that the raised portion 222 and the fin body 221 are integral and the raised portion 222 is "peeled off" from the fin body 221. In this way, there is no need to add additional weight to the fin 220, which helps reduce the weight of the heat sink 200 and thus contributes to the lightweighting of the electronic device 100. In addition, the opening 223 allows heat flow between the two fins 220 in the heat sink 200 to exchange heat, which helps to achieve temperature balance among various locations in the heat sink 200 and avoid the occurrence of overheated areas, thereby improving the heat dissipation performance of the heat sink 200.

[0115] In other embodiments of the present application, the fin body 221 may be stamped by a stamping process so that the fin body 221 is not completely broken to form the raised portion 222. Figure 7 and Figure 8 In the illustrated embodiment, the height of the raised portion 222 formed by stamping can be adjusted according to specific working conditions, so that the height of the raised portion 222 meets the design requirements without causing poor yield. In addition, the processing flow of the raised portion 222 is simple, which can reduce the processing flow and cost of the fin 220.

[0116] Please continue to refer to Figure 11 As shown, in order to enhance the turbulence effect of the raised portion 222, in some embodiments of the present application, the connection boundary between the first end 222a of the raised portion 222 and the fin body 221 is perpendicular to the first direction, that is, the connection boundary between the first end 222a of the raised portion 222 and the fin body 221 is perpendicular to the flow direction of the airflow.

[0117] In addition, in some embodiments of the present application, the dimension between the first end 222a and the second end 222b of the tilted portion 222 is a third dimension, m, and the maximum dimension of the tilted portion 222 in the second direction is a fourth dimension, n. In this application, the positive Z-axis direction in the three-dimensional coordinate system established for the electronic device 100 is defined as the second direction. The ratio of m to n can be set to less than or equal to 5 to prevent the tilted portion 222 from being too long in the first direction (positive Y-axis direction) and from occupying too much of the heat conduction area of ​​the fin body 221.

[0118] When the angle between the tilted portion 222 and the fin body 221 is too large, the slope of the tilted portion 222 is too large, which will increase the flow resistance to the airflow. Figure 12 As shown, in order to reduce flow resistance, in some embodiments of the present application, the angle β between the arrangement direction of the first end 222a and the second end 222b of the raised portion 222 and the reference plane perpendicular to the thickness direction of the fin body 221 can be set to be greater than 0° and less than or equal to 45°.

[0119] When there are multiple raised portions 222, regarding the arrangement of the raised portions 222 on the fin body 221, in some embodiments of the present application, the raised portions 222 can be arranged in an array on the fin body 221, and there is a preset distance between two adjacent raised portions 222 in the first direction (positive direction of the Y axis), and the preset distance is the size of the field synergy improvement zone corresponding to the raised portion 222 in the first direction (positive direction of the Y axis). Based on the above description, a vortex wake will be formed on the side of the raised portion 222 away from the air inlet end 240. The area where the vortex wake exists is the field synergy improvement zone. The shape and size of the field synergy improvement zone will vary depending on the shape and size of the raised portion 222. A thermal simulation test can be performed on a raised portion 222 of a certain shape and size to obtain the shape and size of the field synergy improvement zone, and then the raised portions 222 of the same shape and size can be arranged in an array in the above manner. The tilted portions 222 arranged in this way have multiple field synergy improvement areas that are closely connected and do not interfere with or mix with each other. As many tilted portions 222 as possible can be arranged on the fin body 221 , thereby enhancing the heat exchange effect of the fin 220 .

[0120] For example, Figure 15 As shown in FIG, the plurality of tilting portions 222 can be arranged in a rectangular array, or as shown in FIG. Figure 16 As shown in , the plurality of tilting portions 222 are arranged in a triangular array. The present application does not limit the shape of the array formed by the plurality of tilting portions 222, which can be a regular shape such as a circle, rectangle, triangle, trapezoid, etc., or an irregular shape.

[0121] refer to Figure 15 and Figure 16 As shown, in some embodiments of the present application, the orthographic projections of the field synergy improvement areas corresponding to different raised portions 222 on a reference plane perpendicular to the fin body 221 can be made non-overlapping, so that as many raised portions 222 as possible can be arranged on the fin body 221, thereby improving the heat exchange function of the fin body 221.

[0122] The above “a predetermined distance exists between two adjacent tilting portions 222 in the first direction (positive direction of the Y axis)” means that Figure 15 and Figure 16The raised portion 222 and its corresponding field synergy improvement area are arranged in the first direction, and the two adjacent raised portions in the first direction (positive direction of the Y axis) are respectively the first raised portion and the second raised portion. The field synergy improvement area of ​​the first raised portion is located between the first raised portion and the second raised portion. The distance between the first raised portion and the second raised portion in the first direction is the first dimension L1. The dimension of the field synergy improvement area of ​​the first raised portion in the first direction (positive direction of the Y axis) is the second dimension L2. The first dimension L1 is equal to the second dimension L2.

[0123] In some embodiments of the present application, N rows of raised portions may be arranged along the first direction on the fin body 221, where N is a positive integer greater than or equal to 2, and two adjacent rows of raised portions are staggered in the second direction (positive direction of the Z axis), for example Figure 16 As shown in , the triangular matrix arrangement is an example.

[0124] In some embodiments of the present application, N rows of raised portions 222 may be arranged on the fin body 221 along the first direction (positive direction of the Y axis), where N is a positive integer greater than or equal to 2, and the number of raised portions 222 in the first row is M. The field synergy improvement region corresponding to each raised portion 222 in the first row of raised portions 222 is a first non-field synergy improvement region on both sides of the second direction, and the number of first non-field synergy improvement regions is 2M. The number of raised portions 222 in the second row is 2M, and the 2M raised portions 222 are arranged one-to-one in the 2M first non-field synergy improvement regions. Each raised portion 222 in the second row of raised portions 222 The corresponding field synergy improvement zone is a third non-field synergy improvement zone on both sides of the second direction. There are 4M third non-field synergy improvement zones. This rule is followed until the Lth column cannot arrange the raised portion 222. There are M raised portions 222 in the Lth column. Each raised portion 222 in the Lth column is arranged one by one at the end of the field synergy improvement zone corresponding to the first column of raised portions 222 away from the first column of raised portions 222. This rule is repeated until the raised portion 222 cannot be arranged on the fin body 221 in the first direction.

[0125] For example, Figure 17 As shown in FIG, the first row of raised portions 222 may be one, two, three, etc. Figure 18 As shown, the first row of raised portions 222 is used as one for illustration. The field synergy improvement region corresponding to the first row of raised portions 222 has two first non-field synergy improvement regions on both sides in the second direction (positive direction of the Z axis).

[0126] refer to Figure 19 and combined Figure 18As shown in FIG. 2, the second column of the raised portions 222 is two, and the two raised portions 222 are arranged one by one in the two first non-field synergy improvement areas. The field synergy improvement area corresponding to each of the second column of the raised portions 222 has two second non-field synergy improvement areas on both sides in the second direction. It should be noted that the shape and size of each of the raised portions 222 can be the same or different. When the shape and size of each of the raised portions 222 are the same, the sum of the sizes of the first column of the raised portions 222 in the second direction should not exceed one third of the size of the fin body 221 in the second direction, because the first column of the raised portions 222 can be regarded as staggered with the second column of the raised portions 222, and the second column of the raised portions 222 has a three-fold spreading size of the first column of the raised portions 222 in the second direction on the fin body 221. If the sum of the sizes of the first column of the raised portions 222 in the second direction exceeds one third of the size of the fin body 221 in the second direction, the second column of the raised portions 222 cannot be arranged. If the size of a single raised portion 222 in the first column of the raised portions 222 in the second direction exceeds one third of the size of the fin body 221 in the second direction, only the first column of the raised portions 222 is arranged, and only one raised portion 222 is arranged.

[0127] Reference Figure 20 and in combination Figure 19 As shown in FIG. 2, the second column of the raised portions 222 is two, and the two raised portions 222 are arranged one by one in the two first non-field synergy improvement areas. The field synergy improvement area corresponding to each of the second column of the raised portions 222 has two second non-field synergy improvement areas on both sides in the second direction. It should be noted that the shape and size of each of the raised portions 222 can be the same or different. When the shape and size of each of the raised portions 222 are the same, the sum of the sizes of the first column of the raised portions 222 in the second direction should not exceed one third of the size of the fin body 221 in the second direction, because the first column of the raised portions 222 can be regarded as staggered with the second column of the raised portions 222, and the second column of the raised portions 222 has a three-fold spreading size of the first column of the raised portions 222 in the second direction on the fin body 221. If the sum of the sizes of the first column of the raised portions 222 in the second direction exceeds one third of the size of the fin body 221 in the second direction, the second column of the raised portions 222 cannot be arranged. If the size of a single raised portion 222 in the first column of the raised portions 222 in the second direction exceeds one third of the size of the fin body 221 in the second direction, only the first column of the raised portions 222 is arranged, and only one raised portion 222 is arranged.

[0128] Reference Figure 21 and in combination Figure 20 As shown in FIG. 2, the second column of the raised portions 222 is two, and the two raised portions 222 are arranged one by one in the two first non-field synergy improvement areas. The field synergy improvement area corresponding to each of the second column of the raised portions 222 has two second non-field synergy improvement areas on both sides in the second direction. It should be noted that the shape and size of each of the raised portions 222 can be the same or different. When the shape and size of each of the raised portions 222 are the same, the sum of the sizes of the first column of the raised portions 222 in the second direction should not exceed one third of the size of the fin body 221 in the second direction, because the first column of the raised portions 222 can be regarded as staggered with the second column of the raised portions 222, and the second column of the raised portions 222 has a three-fold spreading size of the first column of the raised portions 222 in the second direction on the fin body 221. If the sum of the sizes of the first column of the raised portions 222 in the second direction exceeds one third of the size of the fin body 221 in the second direction, the second column of the raised portions 222 cannot be arranged. If the size of a single raised portion 222 in the first column of the raised portions 222 in the second direction exceeds one third of the size of the fin body 221 in the second direction, only the first column of the raised portions 222 is arranged, and only one raised portion 222 is arranged.

[0129] Reference Figure 22 As shown in FIG. 2, the second column of the raised portions 222 is two, and the two raised portions 222 are arranged one by one in the two first non-field synergy improvement areas. The field synergy improvement area corresponding to each of the second column of the raised portions 222 has two second non-field synergy improvement areas on both sides in the second direction. It should be noted that the shape and size of each of the raised portions 222 can be the same or different. When the shape and size of each of the raised portions 222 are the same, the sum of the sizes of the first column of the raised portions 222 in the second direction should not exceed one third of the size of the fin body 221 in the second direction, because the first column of the raised portions 222 can be regarded as staggered with the second column of the raised portions 222, and the second column of the raised portions 222 has a three-fold spreading size of the first column of the raised portions 222 in the second direction on the fin body 221. If the sum of the sizes of the first column of the raised portions 222 in the second direction exceeds one third of the size of the fin body 221 in the second direction, the second column of the raised portions 222 cannot be arranged. If the size of a single raised portion 222 in the first column of the raised portions 222 in the second direction exceeds one third of the size of the fin body 221 in the second direction, only the first column of the raised portions 222 is arranged, and only one raised portion 222 is arranged.

[0130] Based on this, Figure 22The arrangement rule of the middle raised portions 222 is that if three columns of adjacent raised portions in the first direction (Y-axis positive direction) are respectively a first column of raised portions, a second column of raised portions and a third column of raised portions, then Figure 22 For example, the first three columns from left to right, each raised portion 222 in the first column of raised portions has a gap G in the second direction (Z-axis positive direction) with each raised portion 222 in the second column of raised portions, and the raised portions in the third column of raised portions are arranged in the gap G. In this way, on the one hand, the coverage of the field synergy improvement area on the fin body 221 can be improved, and on the other hand, the flow resistance to the airflow can be reduced as much as possible, and the size of the raised portion 222 in the second direction of the fin body 221 can be reduced to avoid blocking the airflow.

[0131] Table 1 is a comparison table of the heat dissipation device provided by an embodiment of the present application and the simulation benefits of the flat fin heat dissipation device in some embodiments. Table 2 is a comparison table of the heat dissipation device provided by an embodiment of the present application and the measured benefits of the flat fin heat dissipation device in a notebook computer. According to Table 1 and Table 2, the comprehensive heat exchange evaluation index (PEC) benefit of the raised portion fin heat dissipation device can be improved by 16.9% compared with the flat fin heat dissipation device. When applied in a notebook computer, the junction temperature and thermal resistance of the central processing unit (CPU) and the graphics processing unit (GPU) are reduced to a certain extent, and the average temperature of the notebook computer shell is also reduced to a certain extent. Compared with the heat dissipation device in some embodiments, the raised portion heat dissipation device provided by the embodiment of the present application can further improve the heat dissipation performance.

[0132] Table 1

[0133]

[0134]

[0135] Table 2

[0136]

[0137] Of course, the present application is not limited to this, and the embodiment of the present application also provides a heat dissipation device, Figure 23 The structure of the heat dissipation device provided by an embodiment of the present application Figure 2 , as shown in Figure 23 , the heat dissipation device 300 provided by the embodiment of the present application can include a shell 310, a heat conduction rod 320 and a plurality of fins 330 arranged in the shell 310. The number of heat conduction rods 320 can be one or more than two.

[0138] The shell 310 can include a top plate, a bottom plate, and two side plates connecting the top plate and the bottom plate, which enclose a ventilation channel 340 through which air can flow. The shell 310 is open at both ends in the first direction, which are respectively an air inlet end 350 and an air outlet end 360, and a plurality of fins 330 are arranged in the heat sink 300 parallel to the first direction. As shown in Figure 4 The air inlet end 350 can be arranged opposite the air outlet 24a of the heat dissipation fan 24, and the air outlet end 360 can be arranged opposite the air outlet of the shell 21 of the electronic device 100. The shell 310 also has a boss, which is to adapt to the shape of the shell 21 of the electronic device 100, and to increase the volume of the heat sink 300 as much as possible, thereby improving the heat dissipation performance of the heat sink 300. Of course, in other embodiments, the heat sink 300 can also be a regular shape such as a rectangular body, a trapezoidal body, a cylindrical body, etc., and can also be an irregular shape. The shape of the heat sink 300 is not limited in the embodiments of the present application.

[0139] The plurality of fins 330 are arranged at intervals in the shell. The heat conduction rod 320 penetrates the fins 330 in the heat sink 300 in a direction perpendicular to the fins 330. In some embodiments of the present application, a through hole is formed in the fin 330, and the heat conduction rod 320 is in interference fit with the through hole, thereby improving the stability of the heat conduction rod 320 penetrating the fin 330. And the same as the above-mentioned principle of the raised portion, referring to Figure 24 As shown, the heat conduction rod 320 includes opposite first and second side surfaces 321 and 322, which are connected to one side of the heat conduction rod 320 close to the air outlet end 360. The first and second side surfaces 321 and 322 can be parallel, or in the direction from the air inlet end 350 to the air outlet end 360, the first side surface 321 extends toward the direction close to the second side surface 322. Figure 24 For example, in the direction from the air inlet end 350 to the air outlet end 360, the first side surface 321 extends toward the direction close to the second side surface 322.

[0140] It can be understood that the opposite two boundaries of the heat conduction rod 320 close to the air outlet end 360 in the second direction are parallel or converging. For example, the radial cross section of the heat conduction rod 320 is circular, elliptical, rectangular, diamond-shaped, trapezoidal, or drop-shaped, etc. The material used by the heat conduction rod 320 can be the same as the material used by the fin 330, or can be different. The heat conduction rod 320 can be a solid heat conduction rod 320 or a hollow heat conduction rod 320 according to the structural strength requirement or the weight reduction requirement of the heat sink 300.

[0141] It can be understood that the heat dissipation device 300 provided by the embodiments of the present application can form a vortex wake on the side of the heat conduction rod 320 away from the air outlet end 360 when the gas flows from the air inlet end 350 to the air outlet end 360, reduce the cooperative angle, and improve the heat exchange performance of the heat dissipation device 300, because the two opposite edges of the heat conduction rod 320 close to the air outlet end 360 are parallel or convergent. In addition, because the heat conduction rod 320 penetrates through the fins 330 in the heat dissipation device 300, the distance between the two adjacent fins 330 is the height of the cooperative angle improvement structure, which can solve the problem that the protrusions formed by stamping in some embodiments cannot meet the design requirements, so that the fins 330 cannot achieve good heat dissipation improvement effect, or the protrusions formed by stamping can meet the design requirements but are difficult to process and prone to poor yield.

[0142] Based on the above description of the raised portion, the ratio of the size of the heat conduction rod 320 in the first direction (Y-axis positive direction) to the size of the heat conduction rod 320 in the second direction (Z-axis positive direction) is less than or equal to 5, which can avoid the heat conduction rod 320 being too long in the second direction and occupying too much heat conduction area of the fins 330.

[0143] The arrangement of the heat conduction rod 320 on the fins 330 can refer to the arrangement of the raised portion on the fin body, which can refer to Figures 15 to 22 When the heat conduction rod 320 is multiple, regarding the arrangement of the heat conduction rod 320 on the fins 330, in some embodiments of the present application, the heat conduction rod 320 can be arranged in an array on the fins 330, and there is a preset distance between two adjacent heat conduction rods 320 in the first direction (Y-axis positive direction), which is the size of the field cooperative improvement area corresponding to the heat conduction rod 320 in the first direction (Y-axis positive direction). Based on the above description, a vortex wake will be formed on the side of the heat conduction rod 320 away from the air inlet end 350, and the area where the vortex wake exists is the field cooperative improvement area. The shape and size of the field cooperative improvement area will be different according to the shape and size of the heat conduction rod 320. First, a heat simulation test is performed on a heat conduction rod 320 of a certain shape and size to obtain the shape and size of the field cooperative improvement area, and then the heat conduction rod 320 of the same shape and size is arranged in an array in the above manner. The multiple field cooperative improvement areas of the heat conduction rod 320 arranged in this way are closely connected and do not interfere with each other, so that the heat conduction rod 320 can be arranged as much as possible on the fins 330, thereby enhancing the heat exchange effect of the heat dissipation device 300.

[0144] Exemplarily, as shown in Figure 15 , the multiple heat conduction rods 320 can be arranged in a rectangular array, or as shown in Figure 16 , the multiple heat conduction rods 320 can be arranged in a triangular array. The present application does not limit the shape of the array formed by the multiple heat conduction rods 320, which can be, for example, a regular shape such as a circle, a rectangle, a triangle, a trapezoid, etc., or an irregular shape.

[0145] Reference Figure 15 and Figure 16 As shown in FIG. 1, in some embodiments of the present application, the field synergy improvement zones corresponding to different heat-conducting rods 320 do not overlap in the normal projection of the reference plane perpendicular to the fins 330, so that as many heat-conducting rods 320 as possible are arranged on the fins 330, thereby improving the heat exchange function of the heat sink 300.

[0146] In the above, the "predetermined distance between two heat-conducting rods 320 adjacent in the first direction (Y-axis positive direction)" means that, as shown in FIG. 2, the field synergy improvement zones corresponding to the heat-conducting rods 320 are arranged in the first direction (Y-axis positive direction), and the two heat-conducting rods adjacent in the first direction are respectively a first heat-conducting rod and a second heat-conducting rod. The field synergy improvement zone of the first heat-conducting rod is located between the first heat-conducting rod and the second heat-conducting rod. The distance between the first heat-conducting rod and the second heat-conducting rod in the first direction is a first size L1. The size of the field synergy improvement zone of the first heat-conducting rod in the first direction (Y-axis positive direction) is a second size L2. The first size L1 is equal to the second size L2. Figure 15 and Figure 16 As shown in FIG. 2, the heat-conducting rods 320 and the field synergy improvement zones corresponding thereto are arranged in the first direction. The two heat-conducting rods adjacent in the first direction are respectively a first heat-conducting rod and a second heat-conducting rod. The field synergy improvement zone of the first heat-conducting rod is located between the first heat-conducting rod and the second heat-conducting rod. The distance between the first heat-conducting rod and the second heat-conducting rod in the first direction is a first size L1. The size of the field synergy improvement zone of the first heat-conducting rod in the first direction (Y-axis positive direction) is a second size L2. The first size L1 is equal to the second size L2.

[0147] In some embodiments of the present application, N columns of heat-conducting rods can be arranged on the fins 330 in the first direction. N is a positive integer greater than or equal to 2. Two adjacent columns of heat-conducting rods are arranged staggered in the second direction (Z-axis positive direction), for example, as shown in FIG. 3. Figure 16 As shown in FIG. 3, the triangular matrix arrangement is an example.

[0148] In some embodiments of the present application, N columns of heat-conducting rods 320 can be arranged on the fins 330 in the first direction (Y-axis positive direction). N is a positive integer greater than or equal to 2. The first column of heat-conducting rods 320 is M. The field synergy improvement zone corresponding to each heat-conducting rod 320 in the first column of heat-conducting rods 320 has two sides in the second direction (Z-axis positive direction) which are first non-field synergy improvement zones. The first non-field synergy improvement zones are 2M. The second column of heat-conducting rods 320 is 2M. The 2M heat-conducting rods 320 are one-to-one arranged in the 2M first non-field synergy improvement zones. The field synergy improvement zone corresponding to each heat-conducting rod 320 in the second column of heat-conducting rods 320 has two sides in the second direction which are third non-field synergy improvement zones. The third non-field synergy improvement zones are 4M. The arrangement is repeated until the Lth column of heat-conducting rods 320 cannot be arranged. The Lth column of heat-conducting rods 320 is M. Each heat-conducting rod 320 in the Lth column of heat-conducting rods 320 is one-to-one arranged at the end of the field synergy improvement zone corresponding to the heat-conducting rod 320 in the first column of heat-conducting rods 320 away from the first column of heat-conducting rods 320.

[0149] For example, Figure 17 As shown in FIG, the first column of heat conducting bars 320 may be one, two, three, etc. Figure 18 As shown, the first row of thermally conductive rods 320 is used as one for illustration. The field synergy improvement area corresponding to the first row of thermally conductive rods 320 has two first non-field synergy improvement areas on both sides in the second direction (positive direction of the Z axis).

[0150] refer to Figure 19 Combined with Figure 18 As shown in , there are two thermally conductive rods 320 in the second column, and the two thermally conductive rods 320 are arranged in two first non-field synergistic improvement areas in a one-to-one correspondence. The field synergistic improvement areas corresponding to each thermally conductive rod 320 in the second column of thermally conductive rods 320 are second non-field synergistic improvement areas on both sides of the second direction, and there are four second non-field synergistic improvement areas. It should be noted here that the shape and size of each thermally conductive rod 320 can be the same or different. When the shape and size of each thermally conductive rod 320 are the same, it should be ensured that the sum of the dimensions of the first column of thermally conductive rods 320 in the second direction does not exceed one-third of the dimension of the fin 330 in the second direction, because the first column of thermally conductive rods 320 can be regarded as staggered with the second column of thermally conductive rods 320, and the spread size of the second column of thermally conductive rods 320 on the fin 330 along the second direction is three times that of the first column of thermally conductive rods 320. If the sum of the dimensions of the first column of thermally conductive rods 320 in the second direction exceeds one-third of the dimension of the fin 330 in the second direction, the second column of thermally conductive rods 320 cannot be arranged. If the size of a single heat conducting rod 320 in the first row of heat conducting rods 320 in the second direction exceeds one third of the size of the fin 330 in the second direction, only the first row of heat conducting rods 320 and only one heat conducting rod 320 are arranged.

[0151] refer to Figure 20 Combined with Figure 19 As shown, there are four thermally conductive rods 320 in the third column, and the four thermally conductive rods 320 are arranged in four second non-field synergy improvement zones in a one-to-one correspondence. The field synergy improvement zones corresponding to each thermally conductive rod 320 in the third column 320 are third non-field synergy improvement zones on both sides in the second direction, and there are eight third non-field synergy improvement zones.

[0152] refer to Figure 21 Combined with Figure 20 As shown, the third non-field synergy improvement zone is not large enough to accommodate the thermally conductive rod 320. Therefore, starting from the fourth row of thermally conductive rods 320, the number of thermally conductive rods 320 is the same as that of the first row of thermally conductive rods 320, i.e., one. The fourth row of thermally conductive rods 320 is correspondingly disposed at the end of the field synergy improvement zone corresponding to the first row of thermally conductive rods 320, away from the first row of thermally conductive rods 320.

[0153] refer to Figure 22As shown, the arrangement of the first column to the third column of the heat conduction rods 320 is repeated according to the above rule until the fins 330 cannot arrange the heat conduction rods 320 in the first direction. In this way, on the one hand, the coverage of the field synergy improvement zone on the fins 330 can be improved, and on the other hand, the flow resistance to the airflow can be reduced as much as possible, and the size of the heat conduction rods 320 in the second direction of the fins 330 is prevented from being too large to block the airflow.

[0154] Based on this, Figure 22 The arrangement rule of the heat conduction rods 320 is that if three columns of heat conduction rods adjacent in the first direction (Y-axis positive direction) are respectively the first column of heat conduction rods, the second column of heat conduction rods and the third column of heat conduction rods, the first column of heat conduction rods is arranged according to the above rule, and the second column of heat conduction rods is arranged according to the above rule. Figure 22 For example, the first three columns from left to right, each heat conduction rod 320 in the first column of heat conduction rods has a gap G in the second direction (Z-axis positive direction) with each heat conduction rod 320 in the second column of heat conduction rods, and the heat conduction rod in the third column of heat conduction rods is arranged in the gap G. In this way, on the one hand, the coverage of the field synergy improvement zone on the fins 330 can be improved, and on the other hand, the flow resistance to the airflow can be reduced as much as possible, and the size of the heat conduction rods 320 in the second direction of the fins 330 is prevented from being too large to block the airflow.

[0155] The combination of the heat conduction rods 320 with the shell 310 and the fins 330 can take a series of steps: first, a through hole is formed on the flat fin, the shape of the hole is consistent with the shape of the heat conduction rod 320, and the size of the hole can be slightly smaller than the size of the heat conduction rod 320. Then, before the fin 330 clamping process to form the heat sink 300, the heat conduction rod 320 is inserted into the clamping jig, and during the fin 330 clamping process, the combination of the heat conduction rod 320 with the shell 310 and the fin 330 can be completed through the interference fit of the fin 330 and the heat conduction rod 320.

[0156] Table three is a simulation benefit comparison table of the heat sink with heat conduction rods provided by an embodiment of the present application, some embodiments of the convex fin heat sink and some embodiments of the flat fin heat sink. Table four is a measured benefit comparison table of the notebook computer using the heat sink with heat conduction rods provided by an embodiment of the present application and using some embodiments of the flat fin heat sink. According to table three and table four, the comprehensive heat exchange evaluation index (PEC) benefit of the heat conduction rod heat sink can be improved by 16.9 compared with the flat fin heat sink. And when applied in a notebook computer, the junction temperature and thermal resistance of the central processing unit (CPU) and the graphics processing unit (GPU) are reduced to a certain extent, and the average temperature of the notebook computer shell is also reduced to a certain extent. The heat sink with heat conduction rods provided by the embodiment of the present application is further improved in heat dissipation performance compared with the heat sink in some embodiments.

[0157] Table three

[0158]

[0159] Table Four

[0160]

[0161] In the present embodiments, the terms "exemplary" or "for example" are used as illustrative only and not to imply or create any preference for the embodiments or designs described. Any embodiment or design described as "exemplary" or "for example" is not necessarily to be construed as preferred or advantageous over other embodiments or designs.

[0162] In the description of the present embodiments, the term "at least one" means one or more and the term "multiple" means two or more. The phrase "at least one of' or the like, refers to any one of the items in the list, including individual items in the list or combinations of items in the list. For example, "at least one of a, b, and c" can refer to only a, only b, only c, a and b, a and c, b and c, or a and b and c, where a, b, and c can be individual items or a plurality of items.

[0163] In the description of the present embodiments, "parallel," "perpendicular," "equal," and "co-planar" include the recited condition and conditions that are approximately the recited condition within an acceptable range of deviation, where the acceptable range of deviation is determined by those of ordinary skill in the art considering the measurements at issue and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable range of deviation for approximately parallel can be, for example, within ±10° or ±5°. "Perpendicular" includes absolute perpendicular and approximately perpendicular, where the acceptable range of deviation for approximately perpendicular can be, for example, within ±10° or ±5°; "equal" includes absolute equality and approximate equality, where the acceptable range of deviation for approximately equal can be, for example, a difference between the two that is less than or equal to 5% of either. For example, an included angle between two components of 180° includes absolute 180° and approximately 180°, where the acceptable range of deviation for approximately 180° can be, for example, within ±10° or ±5°; for example, an included angle between two components of 0° includes absolute 0° and approximately 0°, where the acceptable range of deviation for approximately 0° can be, for example, within ±10° or ±5°. For example, an included angle between two components of 90° includes absolute 90° and approximately 90°, where the acceptable range of deviation for approximately 90° can be, for example, within ±10° or ±5°.

[0164] In the embodiments of the present application, the terms "comprising", "containing" or any other variant thereof are intended to cover a non-exclusive inclusion, so that a process, method, article or apparatus that comprises a list of elements not only includes those elements, but also includes other elements not expressly listed or inherent to such process, method, article or apparatus. Without more limitations, the element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, method, article or apparatus that includes the element.

[0165] The orientation terms mentioned in the embodiments of the present application, such as "inner", "outer" and the like, are only the directions of the reference drawings, therefore, the orientation terms used are for better and clearer illustration and understanding of the embodiments of the present application, and do not indicate or imply that the devices or elements referred to must have a particular orientation, and a particular orientation configuration and operation, therefore, cannot be understood as a limitation on the embodiments of the present application. In addition, unless otherwise stated in the present application, "a plurality of" in the present application means two or more.

[0166] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects have an "or" relationship.

[0167] In the description of the embodiments of the present application, it should be explained that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, it can be fixed connection, or indirect connection through an intermediate medium, or internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0168] The terms "first", "second", "third", "fourth" and the like (if any) in the claims, specification and drawings of the embodiments of the present application are used to distinguish similar objects, and do not necessarily describe a specific order or sequence.

[0169] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0170] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the embodiments of the present application are described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A fin for assembling a heat sink, characterized by, The fin includes: a fin body; a raised portion including opposite first and second ends, the first end being connected to the fin body, the second end being raised relative to the fin body, an included angle between an arrangement direction of the first and second ends and a reference plane being an acute angle, the reference plane being perpendicular to a thickness direction of the fin body; the raised portion including opposite first and second side edges, the first and second side edges being connected to the second end, the first side edge being parallel to the second side edge, or in a direction from the first end to the second end, the first side edge extending toward a direction close to the second side edge.

2. The fin of claim 1, wherein the fin body being provided with an opening, the opening penetrating through two side surfaces in the thickness direction of the fin body, the raised portion being connected to an edge of the opening.

3. The fin according to claim 2, characterized in that the raised portion and the fin body being an integral piece.

4. The fin according to any one of claims 1-3, characterized in that the raised portion being a plurality of raised portions, each raised portion having a field synergy improvement region, the field synergy improvement regions corresponding to different raised portions not overlapping in orthographic projection on the reference plane.

5. The fin of claim 4, wherein the raised portions and the field synergy improvement regions corresponding thereto being arranged in a first direction; two adjacent raised portions in the first direction being a first raised portion and a second raised portion respectively, the field synergy improvement region of the first raised portion being located between the first raised portion and the second raised portion, a spacing of the first raised portion and the second raised portion in the first direction being a first size, a size of the field synergy improvement region of the first raised portion in the first direction being a second size, the first size being equal to the second size.

6. The fin of claim 5, wherein the fin body being provided with N columns of raised portions arranged in the first direction, N being a positive integer greater than or equal to 2; two adjacent columns of raised portions being arranged staggered in a second direction, the second direction being perpendicular to the first direction and perpendicular to the thickness direction of the fin body.

7. The fin according to claim 6, wherein, when N is greater than or equal to 3, three adjacent columns of raised portions in the first direction being a first column of raised portions, a second column of raised portions and a third column of raised portions respectively, each raised portion in the first column of raised portions and each raised portion in the second column of raised portions having a gap in the second direction, the raised portions in the third column of raised portions being arranged in the gap.

8. The fin of any one of claims 1-7, wherein, the heat sink having opposite air inlet and air outlet ends, a connection boundary of the first end and the fin body being perpendicular to a direction from the air inlet end to the air outlet end.

9. The fin of any one of claims 1-8, wherein, an included angle between an arrangement direction of the first and second ends and the reference plane being greater than 0° and less than or equal to 45°.

10. The fin of any one of claims 1-9, wherein, a size between the first and second ends being a third size, a maximum size of the raised portion in a second direction being a fourth size, a ratio of the third size to the fourth size being less than or equal to 5, the second direction being perpendicular to the arrangement direction of the first and second ends and perpendicular to the thickness direction of the fin body.

11. A heat spreader, comprising: The heat sink comprises a shell and at least one fin as claimed in any one of claims 1-10 arranged in the shell. The shell has an air inlet end and an air outlet end arranged oppositely, and the fins are arranged in parallel to the air inlet end and directed to the air outlet end.

12. A heat spreader, comprising: The heat sink comprises a shell, a heat-conducting rod and a plurality of fins arranged in the shell. The shell has an air inlet end and an air outlet end arranged oppositely, and the fins are arranged in parallel to the air inlet end and directed to the air outlet end. The heat-conducting rod penetrates the plurality of fins in a direction perpendicular to the fins, and the heat-conducting rod comprises opposite first and second sides, each of the first and second sides being connected to a side of the heat-conducting rod close to the air outlet end, the first side being parallel to the second side, or in a direction from the air inlet end to the air outlet end, the first side extends towards a direction close to the second side. The heat-conducting rods each have a field synergy improvement zone, and the field synergy improvement zones corresponding to different heat-conducting rods do not overlap in orthographic projection on the fins.

13. The heat spreader of claim 12, wherein, The heat-conducting rods and the field synergy improvement zones corresponding thereto are arranged in a first direction.

14. The heat spreader of claim 13, wherein, Two adjacent heat-conducting rods in the first direction are a first heat-conducting rod and a second heat-conducting rod, the field synergy improvement zone of the first heat-conducting rod is located between the first heat-conducting rod and the second heat-conducting rod, the distance between the first heat-conducting rod and the second heat-conducting rod in the first direction is a fifth dimension, and the size of the field synergy improvement zone of the first heat-conducting rod in the first direction is a sixth dimension, the fifth dimension is equal to the sixth dimension. The heat sink has N columns of heat-conducting rods arranged in the first direction, N is a positive integer greater than or equal to 2.

15. The heat spreader of claim 14, wherein, Two adjacent columns of heat-conducting rods are arranged staggered in a second direction, the second direction is perpendicular to the first direction, and the second direction is perpendicular to the thickness direction of the fins.

16. The heat sink of claim 15, wherein When N is greater than or equal to 3, three adjacent columns of heat-conducting rods in the first direction are a first column of heat-conducting rods, a second column of heat-conducting rods and a third column of heat-conducting rods, each heat-conducting rod in the first column of heat-conducting rods has a gap with each heat-conducting rod in the second column of heat-conducting rods in the second direction, and the heat-conducting rods in the third column of heat-conducting rods are arranged in the gaps. The ratio of the maximum dimension of the heat-conducting rod in the first direction to the maximum dimension of the heat-conducting rod in the second direction is less than or equal to 5.

17. The heat spreader of claim 15, wherein, The fins are provided with through holes, and the heat-conducting rods are in interference fit with the through holes.

18. The heat sink of any of claims 12-17, wherein, The heat sink comprises a main body and a heat sink as claimed in any one of claims 11-18 arranged in the main body.

19. An electronic device, comprising: The electronic device is a notebook computer.

20. The electronic device of claim 19, wherein, ​

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