Small-sized air freezing dryer

Abstract

The utility model discloses a small air freezing dryer which comprises a shell, a freezing drying box is fixedly installed in the shell, the top of the freezing drying box is provided with an air inlet nozzle and an air outlet nozzle which are communicated with the interior of the freezing drying box, and the bottom of the freezing drying box is provided with a liquid discharging nozzle communicated with the interior of the freezing drying box. A semiconductor chilling plate is fixedly embedded in one side of the cold drying box, the refrigerating surface of the semiconductor chilling plate is arranged inside the cold drying box, and the heating surface of the semiconductor chilling plate is arranged outside the cold drying box; by arranging the semiconductor chilling plate with an efficient refrigeration effect, the interior of the cold drying box can be directly refrigerated, water molecules, oil mist and the like in air can be quickly condensed into water drop liquid, the air drying and purifying effect is achieved, meanwhile, the purpose of equipment miniaturization is achieved, the overall structure is simple, and the manufacturing cost is low. The maintenance is convenient.

Description

Technical Field

[0001] This utility model relates to the field of air drying technology, and in particular to a small air refrigerated dryer. Background Technology

[0002] A refrigerated dryer uses a refrigeration device to lower the temperature of saturated compressed gas, causing some water vapor to be released and then separated and discharged through a gas-water separator. This lowers the dew point temperature of the compressed gas, thus drying it. It is a commonly used device for nitrogen purification.

[0003] For example, Chinese Patent No. CN207042198U discloses a heat exchanger for a refrigerated dryer, which includes a precooler, an evaporator, and a gas-liquid separation chamber. The precooler has a compressed air inlet and a compressed air outlet. The evaporator is connected to the precooler to receive compressed air flowing out of the precooler. The gas-liquid separation chamber is located between the precooler and the evaporator and is connected to both the evaporator and the precooler to dry the compressed air flowing out of the evaporator.

[0004] The water separation chamber of the aforementioned refrigerated dryer is no longer connected to the cooler as a head, but is set up independently. This allows the air-water separation chamber to be made into a larger volume as needed, avoiding the disadvantage of the air-water separation chamber being made smaller due to the limitation of the head size, which would increase the resistance to compressed air flow and reduce energy loss.

[0005] The aforementioned refrigerated dryer is relatively large in size, which poses a significant obstacle to the trend of pursuing compact and miniaturized equipment, and it is also inconvenient to modularly integrate it with other equipment (such as nitrogen generators).

[0006] Therefore, a small air-cooled dryer is proposed. Utility Model Content

[0007] The purpose of this invention is to provide a small air dryer that solves or at least alleviates one or more of the problems mentioned above and other problems existing in the prior art.

[0008] In order to achieve the above-mentioned purpose, the main technical solutions adopted by this utility model include:

[0009] A small air dryer includes a housing, inside which a refrigerated drying box is fixedly installed. The top of the refrigerated drying box has an air inlet and an air outlet communicating with the interior of the box. The bottom of the refrigerated drying box has a drain outlet communicating with the interior of the box. A semiconductor refrigeration chip is fixedly embedded on one side of the refrigerated drying box, with the cooling surface of the semiconductor refrigeration chip located inside the box and the heating surface located outside the box.

[0010] According to the present invention, a small air dryer is provided, wherein a plurality of equidistantly arrayed heat exchange plates are fixedly connected inside the dryer box, one side of the heat exchange plates is in contact with the cooling surface of the semiconductor refrigeration plate, and an exhaust channel and an air inlet channel are respectively provided on the heat exchange plates, the air inlet nozzle is connected to the air inlet channel, and the air outlet nozzle is connected to the exhaust channel.

[0011] In a small air dryer according to the present invention, the lower end of the interior of the dryer box is arc-shaped.

[0012] In a small air dryer according to the present invention, heat dissipation fins are fixedly installed inside the housing, and one side of the heat dissipation fins is in contact with the heating surface of the semiconductor cooling chip.

[0013] In a small air dryer according to the present invention, a thermally conductive silicone grease layer is provided between the heat dissipation fins and the heating surface of the semiconductor cooling chip.

[0014] In a small air dryer according to the present invention, a cooling fan for dissipating heat from the heat dissipation fins is fixedly installed inside the housing, and a heat dissipation vent is provided on the housing near the air outlet of the cooling fan.

[0015] In a small air dryer according to the present invention, a ventilation hole is provided on one side of the housing.

[0016] In a small air dryer according to the present invention, a voltage regulator module for providing stable voltage to the semiconductor cooling chip and the cooling fan is fixedly installed inside the housing.

[0017] In a small air dryer according to the present invention, a power switch is installed on one side of the housing.

[0018] In a small air dryer according to the present invention, an electromagnetic valve is fixedly installed inside the housing, and the liquid inlet of the electromagnetic valve is connected to the liquid outlet through a pipeline.

[0019] The utility model has at least the following beneficial effects:

[0020] This invention utilizes a semiconductor cooling chip with high-efficiency cooling effect to directly cool the interior of the cold drying box, thereby quickly condensing water molecules and oil mist in the air into liquid water droplets, achieving the function of drying and purifying the air. It also achieves the goal of miniaturization of the equipment, and the overall structure is simple and easy to maintain.

[0021] The heat exchange fins arranged in an equidistant array inside the refrigerated drying box increase the heat exchange area and further improve the air drying effect. At the same time, the arc-shaped design at the lower end of the refrigerated drying box is conducive to the accumulation and discharge of condensate. Attached Figure Description

[0022] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0023] Figure 1 This is a schematic diagram of the structure of the small air dryer of this utility model;

[0024] Figure 2 This is one of the partial structural schematic diagrams of the small air-cooled dryer of this utility model;

[0025] Figure 3 This is a partial structural schematic diagram of the refrigerated drying box of this utility model;

[0026] Figure 4 This is a schematic diagram of the air intake and air outlet channels of this utility model;

[0027] Figure 5 This is the second partial structural schematic diagram of the small air-cooled dryer of this utility model;

[0028] Figure 6 This is the third partial structural schematic diagram of the small air-cooled dryer of this utility model.

[0029] Description of Figure Numbers:

[0030] 1. Housing; 101. Ventilation hole; 102. Power switch; 103. Heat dissipation vent;

[0031] 2. Refrigerated drying box; 201. Air inlet nozzle; 202. Air outlet nozzle; 203. Drain nozzle; 204. Heat exchange fins; 2041. Exhaust passage; 2042. Air inlet passage; 205. Semiconductor refrigeration chip; 206. Heat sink fins; 207. Solenoid valve;

[0032] 3. Voltage regulated power supply module; 4. Cooling fan. Detailed Implementation

[0033] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0034] Please refer to Figures 1 to 6As shown, this embodiment provides a small air dryer with overall dimensions of 1000mm (length) × 540mm (width) × 1010mm (height). It includes a housing 1, with a ventilation hole 101 on one side of the housing 1. A refrigerated drying box 2 is fixedly installed inside the housing 1. The top of the refrigerated drying box 2 is provided with an air inlet 201 and an air outlet 202 that communicate with the inside of the refrigerated drying box 2. The bottom of the refrigerated drying box 2 is provided with a drain nozzle 203 that communicates with the inside of the refrigerated drying box 2. A semiconductor cooling chip 205 is fixedly embedded on one side of the refrigerated drying box 2. The cooling surface of the semiconductor cooling chip 205 is located inside the refrigerated drying box 2, and the heating surface of the semiconductor cooling chip 205 is located outside the refrigerated drying box 2.

[0035] By adopting the above technical solution, the semiconductor cooling chip 205 with high-efficiency cooling effect can directly cool the inside of the cold drying box 2, so as to quickly condense water molecules and oil mist in the air into water droplets, thereby achieving the function of drying and purifying the air, while realizing the purpose of miniaturization of the equipment.

[0036] In this embodiment, a plurality of equidistantly arrayed heat exchange plates 204 are fixedly connected inside the refrigerated drying box 2. One side of the heat exchange plate 204 is in contact with the cooling surface of the semiconductor cooling chip 205. The heat exchange plate 204 is provided with an exhaust channel 2041 and an air inlet channel 2042. The air inlet nozzle 201 is connected to the air inlet channel 2042, and the air outlet nozzle 202 is connected to the exhaust channel 2041. By using the plurality of equidistantly arrayed heat exchange plates 204 in conjunction with the exhaust channel 2041 and the air inlet channel 2042, the air entering the refrigerated drying box 2 through the air inlet nozzle 201 needs to enter the exhaust channel 2041 through the gap between the two heat exchange plates 204 via the air inlet channel 2042. This allows the heat exchange plates 204 to have sufficient heat exchange with the air, so as to quickly condense water molecules and oil mist in the air into water droplets, thereby achieving the effect of drying and purifying the air, effectively improving the heat exchange efficiency and ensuring the air drying effect.

[0037] In this embodiment, the lower end of the interior of the refrigerated drying box 2 is arc-shaped. The arc-shaped design of the lower end of the interior of the refrigerated drying box 2 is conducive to the accumulation and discharge of condensate.

[0038] In this embodiment, a heat dissipation fin 206 is fixedly installed inside the housing 1. One side of the heat dissipation fin 206 is in contact with the heating surface of the thermoelectric cooler 205. To ensure that the heat dissipation fin 206 and the heating surface of the thermoelectric cooler 205 are in full contact, a thermally conductive silicone grease layer is provided between the heat dissipation fin 206 and the heating surface of the thermoelectric cooler 205. A cooling fan 4 for dissipating heat from the heat dissipation fin 206 is fixedly installed inside the housing 1. A heat dissipation vent 103 is provided at the air outlet of the housing 1 near the cooling fan 4. Through the above arrangement, the thermoelectric cooler 205 can be quickly cooled to ensure that the thermoelectric cooler 205 can operate continuously and stably.

[0039] In this embodiment, a voltage regulator module 3 for providing stable voltage to the semiconductor cooling chip 205 and the cooling fan 4 is fixedly installed inside the housing 1, and a power switch 102 is installed on one side of the housing 1.

[0040] In order to facilitate the orderly discharge of condensate inside the refrigerated drying box 2, a solenoid valve 207 is fixedly installed inside the shell 1. The inlet of the solenoid valve 207 is connected to the drain nozzle 203 through a pipeline. By controlling the opening and closing of the solenoid valve 207, the condensate inside the refrigerated drying box 2 can be discharged in an orderly manner.

[0041] To facilitate understanding of the above-mentioned technical solutions of this utility model, the working principle or operation method of this utility model in actual process will be described in detail below.

[0042] Working principle: For example, in use, by integrating a small air dryer into a nitrogen generator, the air compressor inlet of the nitrogen generator is connected to the air inlet nozzle 201 through a pipeline. Then, the semiconductor cooling chip 205 is activated to pre-cool the inside of the dryer box 2. Then, the compressor is activated, and outside air enters the dryer box 2 through the air inlet nozzle 201. The air entering the dryer box 2 needs to pass through the air intake channel 2042 and enter the exhaust channel 2041 through the gap between the two heat exchange plates 204. This allows the heat exchange plates 204 to have sufficient heat exchange with the air, so as to quickly condense water molecules and oil mist in the air into water droplets.

[0043] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A small air-cooled dryer, characterized in that, The device includes a housing (1), inside which a refrigerated drying box (2) is fixedly installed. The top of the refrigerated drying box (2) is provided with an air inlet (201) and an air outlet (202) that communicate with the inside of the refrigerated drying box (2). The bottom of the refrigerated drying box (2) is provided with a drain outlet (203) that communicates with the inside of the refrigerated drying box (2). A semiconductor cooling chip (205) is fixedly embedded on one side of the refrigerated drying box (2). The cooling surface of the semiconductor cooling chip (205) is located inside the refrigerated drying box (2), and the heating surface of the semiconductor cooling chip (205) is located outside the refrigerated drying box (2). The refrigerated drying box (2) has several equidistant array heat exchange plates (204) fixedly connected inside. One side of the heat exchange plate (204) is in contact with the cooling surface of the semiconductor cooling chip (205). The heat exchange plate (204) is provided with an exhaust channel (2041) and an intake channel (2042). The intake nozzle (201) is connected to the intake channel (2042), and the exhaust nozzle (202) is connected to the exhaust channel (2041).

2. A small air dryer according to claim 1, characterized in that: The lower interior of the cold drying box (2) is arc-shaped.

3. A small air dryer according to claim 2, characterized in that: The heat dissipation fins (206) are fixedly installed inside the housing (1), and one side of the heat dissipation fins (206) is in contact with the heating surface of the semiconductor cooling chip (205).

4. A small air dryer according to claim 3, characterized in that: A thermally conductive silicone grease layer is provided between the heat dissipation fins (206) and the heating surface of the semiconductor cooling chip (205).

5. A small air dryer according to claim 4, characterized in that: A cooling fan (4) for dissipating heat from the heat dissipation fins (206) is fixedly installed inside the housing (1), and a heat dissipation vent (103) is provided on the housing (1) near the air outlet of the cooling fan (4).

6. A small air dryer according to claim 5, characterized in that: A ventilation hole (101) is provided on one side of the housing (1).

7. A small air dryer according to claim 6, characterized in that: A voltage regulator module (3) for providing stable voltage to the semiconductor cooling chip (205) and the cooling fan (4) is fixedly installed inside the housing (1).

8. A small air dryer according to claim 7, characterized in that: A power switch (102) is installed on one side of the housing (1).

9. A small air dryer according to claim 8, characterized in that: A solenoid valve (207) is fixedly installed inside the housing (1), and the inlet of the solenoid valve (207) is connected to the drain nozzle (203) through a pipeline.

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